JPS60113877U - removal tool - Google Patents
removal toolInfo
- Publication number
- JPS60113877U JPS60113877U JP46884U JP46884U JPS60113877U JP S60113877 U JPS60113877 U JP S60113877U JP 46884 U JP46884 U JP 46884U JP 46884 U JP46884 U JP 46884U JP S60113877 U JPS60113877 U JP S60113877U
- Authority
- JP
- Japan
- Prior art keywords
- removal tool
- grip parts
- parts
- whose
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Hand Tools For Fitting Together And Separating, Or Other Hand Tools (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案による取外し工具の一実施例を示す斜視
図、第２図乃至第７図は第１図の取外し工具の加熱要素
の先端の変形例を示す平面図である。
１．１′・・・グリップ部ミ２・・・軸、３，３′・・
・加熱要素。 、FIG. 1 is a perspective view showing an embodiment of the removal tool according to the present invention, and FIGS. 2 to 7 are plan views showing modifications of the tip of the heating element of the removal tool shown in FIG. 1.1'...Grip part M2...Shaft, 3,3'...
・Heating element. ,
Claims (1)
付与されている二つのグリップ部と、該グリップ部の各
々の他端に取付けられており先端が該グリップ部の閉じ
た状態で取外すべき部品の外周の半田付部分に対応する
形構成するように形成されていて且つ半田溶融温度以上
に加熱され得る加熱要素とを含んでいることを特徴とす
る、基板に半田付されたチップキャリア、各種チップ部
品、ＤＩＰ ＩＣ等を該基板から取外すための取外し工
具。Two grip parts whose one ends are pivotally connected to each other and are provided with a tendency to disengage by a spring, and which are attached to the other end of each of the grip parts, and whose tips should be removed when the grip parts are closed. A chip carrier soldered to a substrate, characterized in that it includes a heating element formed to correspond to the soldered portion on the outer periphery of the component and capable of being heated above the solder melting temperature. A removal tool for removing various chip parts, DIP ICs, etc. from the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP46884U JPS60113877U (en) | 1984-01-06 | 1984-01-06 | removal tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP46884U JPS60113877U (en) | 1984-01-06 | 1984-01-06 | removal tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60113877U true JPS60113877U (en) | 1985-08-01 |
Family
ID=30472336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP46884U Pending JPS60113877U (en) | 1984-01-06 | 1984-01-06 | removal tool |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60113877U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62183971U (en) * | 1986-05-13 | 1987-11-21 | ||
| JPS62183972U (en) * | 1986-05-13 | 1987-11-21 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5144266A (en) * | 1974-08-01 | 1976-04-15 | Doein Paamaa Harorudo | SHUSEKIKAIROBUROTSUKUHIKINUKIKOGU |
| JPS5368871A (en) * | 1976-11-30 | 1978-06-19 | Fortune William S | Tool for pulling or inserting soldered part |
-
1984
- 1984-01-06 JP JP46884U patent/JPS60113877U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5144266A (en) * | 1974-08-01 | 1976-04-15 | Doein Paamaa Harorudo | SHUSEKIKAIROBUROTSUKUHIKINUKIKOGU |
| JPS5368871A (en) * | 1976-11-30 | 1978-06-19 | Fortune William S | Tool for pulling or inserting soldered part |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62183971U (en) * | 1986-05-13 | 1987-11-21 | ||
| JPS62183972U (en) * | 1986-05-13 | 1987-11-21 |
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