JPH06268336A - Position correcting system - Google Patents

Abstract

PURPOSE:To provide a position correcting system which can carry out aligning work well without damaging the body to be aligned. CONSTITUTION:A pneumatic pressure source 40 is coupled with first and second solenoid valves 41, 42 which are coupled, respectively, with first and second nozzles 43, 44. The nozzles are disposed at such positions as the air is blown toward a notch 18 made in the outer periphery of a stem 1 arranged on a supporting jig 20. The first and second nozzles 43, 44 have openings directing in the directions for rotating the stem 1, respectively, counterclockwise and clockwise. The solenoid valves 41, 42 blow the air alternately through the nozzles 43, 44. The stem 1 is rotated by the air blows out alternately through the first and second nozzles 43, 44 to shift the notch 18 in the peripheral direction thus fitting the notch 18 to a positioning protrusion 28 of the supporting jig.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to position correction devices, and in particular to
The present invention relates to a position correction device used when aligning an object to be aligned with a predetermined position on a jig, for example, when aligning a concave portion formed on the outer periphery of a stem of an optoelectronic device with a convex portion on the jig. Related to effective technology.

[0002]

2. Description of the Related Art Semiconductor laser devices of various structures have been developed as light sources for optical communication or light sources for information processing devices such as digital audio discs and video discs. For example, as a light source for an information processing device such as a digital audio disc and a video disc, "Nikkei Electronics", published by Nikkei McGraw-Hill, September 1, 1981
A semiconductor laser device as described in the fourth issue, P138 to P152 is known.

Generally, in this type of semiconductor laser device, a semiconductor laser element (laser chip) is fixed to a heat sink provided at the center of the main surface of the stem via a submount, and a light receiving element attached to the main surface of the stem. The laser light intensity is monitored by. The laser light used is emitted outside the package through the window in which the transparent body of the ceiling portion of the cap attached to the stem main surface is fitted.

By the way, when assembling such a semiconductor laser device, the assembly in the process of manufacturing the semiconductor laser device is arranged at a predetermined position on the jig. At this time, the concave portion formed on the outer periphery of the stem of the assembly is inserted into the convex portion formed on the jig, so that the assembly is positioned on the jig.

As an example in which the semiconductor laser device is described, there is JP-A-55-148483.

[0006]

When the assembly is placed on the jig, the position of the recess of the assembly is displaced with respect to the projection of the jig, and a part of the assembly is projected on the jig. In the case of being mounted on a section, conventionally, the assembly work is performed by pushing the assembly horizontally with a mechanically driven pusher to insert the recess of the assembly into the projection of the jig.

However, in the above-mentioned alignment work, the pusher pushes the assembly in the radial direction, so it is difficult to rotate the assembly, which is disadvantageous in correcting the position of the positional deviation in the rotational direction, and the pusher pushes the assembly during pressing. There was also a problem that the solid was damaged.

SUMMARY OF THE INVENTION An object of the present invention is to provide a position correcting device which can favorably perform a positioning operation and can avoid damaging an object to be positioned.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0010]

The typical ones of the inventions disclosed in the present application will be outlined below.

That is, a position correcting device for correcting the positional deviation of the positioning portion formed on the peripheral surface of the body to be aligned, aiming at the positioning portion formed on the peripheral surface of the body to be aligned. It is provided with a pair of nozzles for injecting air, and the openings of these nozzles are arranged so as to rotate the object to be aligned in mutually opposite directions, and are configured to inject air alternately. It is characterized by

[0012]

According to the above-mentioned means, the aligned body is rotated in the clockwise and counterclockwise directions by the air which is alternately jetted from the nozzle aiming at the positioning portion formed on the peripheral surface of the aligned body. Is rotated.

Therefore, when the positioning portion of the aligning body is slightly deviated in the clockwise direction with respect to the other positioning portion, the aligning body is rotated counterclockwise by the air jetted from the nozzle. At this time, the positioning portion of the aligned body rotates counterclockwise and moves to the position of the counterpart positioning portion, whereby the positioning portion of the aligned body is inserted into the counterpart positioning portion.

If the positioning portion of the body to be aligned is slightly deviated in the counterclockwise direction from the positioning portion of the other body, the body to be aligned is rotated clockwise by the air jetted from the nozzle. When this is done, the positioning portion of the body to be aligned is rotated clockwise and moved to the position of the positioning portion of the other party, whereby the positioning portion of the body to be aligned is inserted into the positioning portion of the other party.

As described above, since the position-adjusted body is rotated by the air pressure to perform the position-adjustment, the position-adjusted body is not damaged during the position-adjustment work, and the position-adjustment is performed well.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a plan view showing a position correcting device according to an embodiment of the present invention together with a supporting jig and the like. Figure 2 (a)
Is a plan view showing a supporting jig, (b) is an enlarged view showing a part thereof, and (c) is a sectional view taken along line cc of (b) showing a state in which an assembly is inserted. FIG. 3 is a partially cutaway perspective view showing the semiconductor laser device.

In this embodiment, the position correcting device according to the present invention is configured so that the stem is properly attached to the supporting jig during assembly of the semiconductor laser device serving as the light source for the compact disc.

As shown in FIG. 3, the semiconductor laser device includes a plate-shaped stem 1 which is a main component of the assembly, and a cap 2 which is airtightly fixed to the main surface side of the stem 1. The stem 1 is a circular metal plate having a thickness of several mm, and a copper heat sink 3 is fixed to the central portion of the main surface (upper surface) thereof with a wax material or the like. A semiconductor laser element (laser chip) 5 is fixed to the side surface of the heat sink 3 via a submount 4. The laser chip 5 has, for example, a width of 400 μm and a length of 30.
The resonator, which has a height of 0 μm and a height of 100 μm and emits the laser light 6, is 3 to 5 μm from the surface of the laser chip 5.
It is located at a depth of about m.

On the other hand, a laser chip 5 is formed on the main surface of the stem 1.
The laser light 6 emitted from the lower end of the
The light receiving element 7 for monitoring the optical output of is fixed. The light receiving element 7 is fixed to an inclined surface coined on the main surface of the stem 1, for example, an inclined surface 8 having an angle of 7 degrees via a bonding material not shown. The reason why the light receiving element 7 is tilted is that the reflected light of the laser light 6 emitted from the laser chip 5 on the light receiving surface of the light receiving element 7 is prevented from entering the window of the cap, which will be described later. This is to prevent the image from being disturbed.

On the other hand, the stem 1 has three leads 9, 10
And 11 are fixed. One lead 9 is electrically and mechanically fixed to the back surface of the stem 1, and the other two leads 10 and 11 penetrate the stem 1 and a glass 12 as a sealing material having an insulating property. It is electrically insulated and fixed to the stem 1 via the. Stem 1
The upper ends of the two leads 10 and 11 projecting from the main surface of are connected to the electrodes of the laser chip 5 and the light receiving element 7 via wires 13 and 14, respectively.

In this embodiment, a conical portion 15 is provided at the tip of the lead 11 electrically connected to the light receiving element 7.
Is integrally formed in an umbrella shape, and the apex angle of the conical portion 15 is set so that its inclined surface is parallel to the inclination of the light receiving element 7. By the way, this conical part 15
After the round bar material is cut, it is integrally formed by press working in which one end is relatively pressed against a mortar-shaped female die. Then, one end of the wire 14 is bonded to the inclined surface of the conical portion 15 by a wire bonding operation.

A metal cap 2 having a window 16 is hermetically fixed to the main surface of the stem 1, and the cap 2 hermetically seals the laser chip 5 and the heat sink 3. The window 16 is formed by hermetically closing a circular hole provided in the ceiling portion of the cap 2 with a transparent glass plate 16a. Therefore, the laser light 6 emitted from the upper end of the laser chip 5 passes through the transparent glass plate 16a and is emitted to the outside of the package formed by the stem 1 and the cap 2.

On the outer peripheral portion of the stem 1, a pair of V-shaped notches 17 and a rectangular notch 1 are provided so as to face each other.
8 is provided and is used for positioning during assembly. The rectangular cutout 18 is used for positioning with respect to the support jig 20 described later.

The assembling work of the laser chip 5 will be described below. The supporting jig 20 shown in FIG. 2 is used for the assembling work of the laser chip 5. This support jig 2
Reference numeral 0 is provided with a strip-shaped metal frame 21 and holding portions 23 inserted into attachment holes 22 formed at equal intervals along the center of the frame 21. The holding portion 23 is formed in a substantially stepped disc shape, and the small diameter portion 24 at the lower portion thereof is inserted into the mounting hole 22. The mounting hole 22 is formed in a semicircular shape, and the cross-sectional shape of the small diameter portion 24 is also formed in a shape corresponding to this. Small diameter part 24
Is inserted into the mounting hole 22, the small diameter portion 24 does not rotate, and the holding portion 23 is positioned with high accuracy. An E-shaped retaining ring 25 is attached to a portion of the small diameter portion 24 protruding downward from the attachment hole 22.
The holding portion 23 is fixed to 1.

A pair of arc-shaped projections 26 and 27 are formed on the outer peripheral edge of the upper surface of the holding portion 23 at positions facing each other along the outer circumference of the holding portion 23. A positioning convex portion 28 as a stem positioning portion is formed on the inner circumference so as to project inward. The inner peripheral surfaces of the pair of protrusions 26, 27 are arranged on the same circle, and the diameter dimension thereof is slightly larger than the outer diameter of the stem 1. In addition, the positioning protrusion 2 of the one protrusion 26
8 is formed in such a size that the rectangular notch 18 of the stem 1 fits in the circumferential direction and the radial direction.

On the other hand, the holding portion 23 has a semicircular accommodating portion 2
9 is formed so as to penetrate in the axial direction. Also, the holding unit 2
A concave portion 30 is formed on the upper surface of the portion near the accommodation portion 29 in 3, and a permanent magnet 31 is inserted and fixed in the concave portion 30. Therefore, the leads 9, 10 and 11 are inserted into the housing portion 29, and the stem 1 having the back surface placed on the holding portion 23 is magnetically attached to the holding portion 23 by the magnetic force of the permanent magnet 31. The magnetic force of the permanent magnet 31 is strong, and even when the stem 1 is in the posture of extending in the vertical direction, its position is changed with respect to the holding portion 23,
Or do not drop out. Further, the stem 1 fixed to the holding portion 23 by the magnetic force of the permanent magnet 31 can be easily pulled out manually or by an automatic machine without damaging the stem 1 or the like.

Guide holes 32 are formed on both sides of the frame 20 so as to correspond to the mounting holes 22, and these guide holes 32 are used as guide holes for feeding and positioning when moving on a conveying path or the like. It is a thing.

An assembly 33, which is an intermediate product of a laser semiconductor device to which the laser chip 5 is bonded, is shown in FIG.
2 is set on the supporting jig 20 shown in FIG.
), And is housed in an actual cartridge (not shown) in the loader section of the bonding apparatus.

The assembly 33 of the laser semiconductor device as the work for the laser chip bonding work is supported by the supporting jig 20.
The laser semiconductor device assembly 3 in the state of being set to
The rectangular notch 18 formed in the outer periphery of the stem 1 in No. 3 is set in the positioned state by being inserted into the positioning protrusion 28 provided in the holding portion 23 of the support jig 20. .

Next, a description will be given of the work of aligning and accommodating the assembly 33 of the laser semiconductor device in the support jig 20.
The alignment device shown in FIG. 1 is used for this alignment storage work.

The alignment device comprises a pneumatic source 40. A first solenoid valve 41 and a second solenoid valve 42 are connected to the air pressure source 40, and these solenoid valves 41,
A first nozzle 43 and a second nozzle 44 are connected to 42, respectively. First nozzle 43 and second nozzle 4
4 are arranged and fixed at positions where the rectangular notch 18 of the stem 1 arranged on the support jig 20 is aimed at and blows out air. The opening of the first nozzle 43 is arranged in the direction of rotating the stem 1 on the supporting jig 20 in the counterclockwise direction, and the opening of the second nozzle 44 is in the direction of rotating the stem 1 on the supporting jig 20 in the clockwise direction. It is arranged.

Then, the first solenoid valve 41 and the second solenoid valve 42
Are configured so that the flow to the first nozzle 43 and the second nozzle 44 is alternately opened and closed. For example, first, the first solenoid valve 41 is opened and the first nozzle 43 is opened.
Air is blown from the second solenoid valve 42 and the second solenoid valve 42 is opened at the same time as the first solenoid valve 41 is closed.
The air is blown out from.

In the assembly 33 as a work in the positioning and storing work, the leads 9, 10 and 11 are inserted into the housing portion 29 of the holding portion 23 of the supporting jig 20, and the back surface of the stem 1 is on the holding portion 23. Can be posted on.

At this time, the rectangular notch 1 on the outer periphery of the stem 1
When 8 is not inserted in the positioning protrusion 28 provided on the upper surface of the holding portion 23 of the support jig 20, for example, as shown in FIG. Is slightly deviated from the positioning protrusion 28 of the holding portion 23 of the support jig 20 in the clockwise direction, a part of the stem 1 is placed on the positioning protrusion 28 of the holding portion 23. In this state, the supporting portion 23 is supported by the holding portion 23.

In this state, the position of the assembly 33 is corrected by the aligning device and set at a predetermined position on the support jig 20. That is, first, air is blown out from the first nozzle 43 in the alignment device.
Then, the air blown out from the first nozzle 43 hits the cutout portion 18 of the stem 1, and the stem 1 is rotated counterclockwise around the housing portion 29. When the stem 1 is rotated counterclockwise and the notch 18 of the stem 1 is moved to the position of the positioning protrusion 28 of the holding part 23, the notch 18 of the stem 1 is positioned at the position of the positioning protrusion 28 of the holding part 23. The stem 1 is inserted into the portion 28 and positioned, and the stem 1 is fixed on the holding portion 23 by the magnetic force of the permanent magnet 31.

When the cutout portion 18 of the stem 1 is slightly deviated in the counterclockwise direction from the positioning convex portion 28 of the holding portion 23 of the supporting jig 20, first, air is blown out from the first nozzle 43, The stem 1 is rotated counterclockwise. Next, as the air is blown out from the second nozzle 44, the stem 1 is rotated clockwise around the storage portion 29, and the cutout portion 18 of the stem 1 is located at the position of the positioning convex portion 28 of the holding portion 23. Be moved. Then at that position,
The notch 18 of the stem 1 is the positioning protrusion 28 of the holder 23.
The stem 1 is fixed on the holding portion 23 by the magnetic force of the permanent magnet 31 while being inserted and positioned.

When the stem 1 is fixed on the holding portion 23 by the magnetic force of the permanent magnet 23, the first nozzle 43 is attached to the stem 1.
Even if air is blown by the second nozzle 44, the stem 1 does not move on the holding portion 23. As described above, the assembly 33 is positioned and held on the support jig 20.

Then, the support jig 20 in which the assembly 33 is positioned and held by the holding portion 23 is housed in an actual cartridge and fed to the loading device in the bonding device. In the loading device, the support jig 2 sent out from the actual cartridge by the pusher
0 is intermittently transferred onto the bonding stage by the transfer mechanism to bond the laser chip 5 to the supporting jig 20.
Performed on all the above assemblies 33 (not shown).

According to the above-mentioned embodiment, the following effects can be obtained. There is provided a pair of nozzles 43, 44 for injecting air by aiming at the notch 18 formed on the outer periphery of the stem 1, and the openings of these nozzles are such that the stems 1 are rotated in opposite directions. Are arranged in the same direction, and are configured so that air is alternately jetted, so that the stem 1 is rotated by the air pressure and the support jig 20 is rotated.
Since the notch 18 of the stem 1 is aligned with the upper positioning protrusion 28, the stem 1 or the like is not damaged during the alignment, and the alignment work of the stem with respect to the support jig can be properly performed. .

The stem 1 is the holding portion 23 of the supporting jig 20.
Since it is held in a state of being accurately positioned, the bonding work for the stem 1 via the support jig 20 can be performed accurately and appropriately.

The invention made by the present inventor has been specifically described based on the embodiments, but the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, the positioning portion formed on the body to be aligned is not limited to the concave portion, but may be formed on the convex portion. Further, the positioning portion may be arranged not only on the outer circumference but also on the inner circumference.

In the above embodiment, the example in which the present invention is used for the positioning operation of the stem during the laser chip bonding operation has been described, but the positioning operation during other assembly operations, for example, the wire bonding operation, etc. Of course, the above-mentioned alignment device can be used.

In the above description, the case where the invention made by the present inventor is mainly applied at the time of assembling work of the semiconductor laser device which is the field of application which is the background has been described, but the invention is not limited thereto and other It can be applied to alignment work in electronic devices and alignment work in other semiconductor devices and electronic components.

[0045]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

There is provided a pair of nozzles through which air is jetted aiming at the positioning portion formed on the peripheral surface of the body to be aligned, and these nozzles have openings whose directions are opposite to each other. It is arranged in the direction to be rotated and the air is alternately ejected, so that the position of the position-adjusted body is adjusted by air pressure. The alignment can be properly performed without damage.

[Brief description of drawings]

FIG. 1 is a plan view showing a position correcting device according to an embodiment of the present invention together with a supporting jig and the like.

FIG. 2 shows a supporting jig, (a) is a plan view,
(B) is an enlarged plan view showing a part thereof, and (c) is a sectional view taken along line cc of (b) showing a state in which the assembly is inserted.

FIG. 3 is a partially cutaway perspective view showing a semiconductor laser device.

[Explanation of symbols]

1 ... Stem (object to be aligned), 2 ... Cap, 3 ... Heat sink, 4 ... Submount, 5 ... Semiconductor laser element (laser chip), 6 ... Laser light, 7 ... Light receiving element, 8 ...
Inclined surface, 9, 10, 11 ... Lead, 12 ... Lead sealing glass, 13, 14 ... Wire, 15 ... Cone shaped portion, 16
... window, 16a ... glass plate, 17 ... V-shaped notch, 18 ...
Rectangular notch (positioning part), 20 ... Support jig, 21 ...
Frame, 22 ... Mounting hole, 23 ... Holding part, 24 ... Small diameter part, 25 ... E-shaped retaining ring, 26, 27 ... Projection, 28 ... Positioning convex part (counterpart positioning part), 29 ... Housing part, 30 ...
Recesses, 31 ... Permanent magnets, 32 ... Guide holes, 33 ... Assembly, 40 ... Air pressure source, 41, 42 ... Solenoid valves, 43, 44
…nozzle.

Claims (3)

[Claims] 1. A position correcting device for correcting a positional deviation of a positioning portion formed on a peripheral surface of a body to be aligned, which is aimed at the positioning portion formed on the peripheral surface of the body to be aligned. A pair of nozzles through which air is jetted is provided, and the openings of these nozzles are arranged in directions to rotate the aligned body in mutually opposite directions,
A position correcting device characterized in that air is alternately jetted. 2. The positioning target is supported by a support jig so as to be rotatable about a housing portion formed on the support jig, and the positioning portion is positioned on the opposite side by the positioning jig. The position correcting device according to claim 1, wherein the position correcting device is formed so as to engage with the portion. 3. The body to be aligned is a disc-shaped stem, the positioning portion is a notch formed in the outer periphery of the stem, the stem is a supporting jig, and a part thereof is a supporting jig. The support jig is rotatably inserted and rotatably supported in the accommodating portion, and the notch is configured to engage with the positioning protrusion formed around the accommodating portion of the supporting jig. The position correction device according to claim 1, wherein the position correction device is provided.