JPH06268059A - Dicing device - Google Patents

Abstract

PURPOSE:To surely prevent the shortening of the life of a blade by abnormal abrasion or the abnormal cutting of a semiconductor wafer by raising the cooling efficiency of the dicing blade, in a dicing device. CONSTITUTION:A dicing blade 2 for dividing a semiconductor wafer 1 is fastened by a flange 3, and this flange 3 is provided, along the periphery, with holes 4 extending in radial directions. At dicing, to prevent the abnormal heating by the abrasion of a cutting part, it is supplied with cooling water from a cooling water supply port 7. The cooling water flows along the flange 3, and is reserved once in the holes 4 provided at the flange 3. The cooling wafer inside these holes 4 is discharged by the centrifugal force of the flange 3, and hits upon the dicing blade 2 again, whereby the quantity of cooling water hitting upon the dicing blade 2 increases, and the cooling effect improves.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dicing technique, and more particularly to a technique effectively applied to a dicing device for dividing and cutting a semiconductor wafer of a semiconductor integrated circuit device.

[0002]

2. Description of the Related Art In a process of assembling a semiconductor integrated circuit device, chips formed on a semiconductor wafer are individually divided and cut by dicing.

In this dicing, diamond particles are hardened with metal or resin and have a thickness of about 30 μm to 100 μm.
The semiconductor wafer is divided and cut by rotating a dicing blade at a high speed. Further, since the cutting portion becomes hot, cooling water is sprayed to cool the blade.

[0004]

However, with this dicing method, even if the cooling water is sprayed onto the dicing blade, the cooling water is immediately scattered from the dicing blade, and a sufficient cooling effect cannot be obtained.

For example, in the case of a dicing blade having a thickness of about 100 μm, since the cooling water does not reach the central portion of the dicing blade, the central portion has an abnormally high temperature. Therefore, the wear of the dicing blade is accelerated, and as shown in FIG. 5, only the central portion of the dicing blade is chipped, resulting in an abnormal cut surface of the semiconductor wafer or shortening the life of the dicing blade. There was a problem of shrinking.

An object of the present invention is to provide a dicing apparatus which improves the cooling efficiency of the dicing blade and prevents a short life of the dicing blade and abnormal cutting of the semiconductor wafer due to abnormal wear.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0008]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

That is, the dicing blade is effectively cooled by forming a hole or groove in the flange portion holding the dicing blade.

[0010]

According to the above-mentioned dicing method, the cooling water is collected by the hole or groove provided in the flange portion holding the dicing blade, and the cooling water is again contacted with the dicing blade by the centrifugal effect during cutting, so that the dicing blade is cooled. Done effectively. As a result, it is possible to prevent a short life of the dicing blade and abnormal cutting of the semiconductor wafer due to abnormal wear.

[0011]

Embodiment 1 FIG. 1 is a side sectional view of a flange portion in a dicing apparatus according to Embodiment 1 of the present invention, and FIG. 2 is a plane sectional view of a flange portion in a dicing apparatus according to Embodiment 1 of the present invention. .

In the first embodiment, the dicing blade 2 for dividing and cutting the semiconductor wafer 1 is fastened and fixed by the flange 3. The flange 3 is provided with a large number of holes 4 radially extending in the radial direction on the outer peripheral surface of the flange 3.

A spindle 5 is inserted and fixed in the center of the flange 3, and the dicing blade 2 and the flange 3 rotate when the spindle 5 rotates at a high speed. Below the dicing blade 2, a wafer feed table 6 for fixing the semiconductor wafer 1 during dicing is provided.

A cooling water supply port 7 for supplying cooling water toward the outer peripheral surface of the dicing blade 2 is provided beside the dicing blade 2. Further, a cutting water supply port 8 for supplying cutting water is provided in the dicing part for dividing and cutting the semiconductor wafer 1.

The parts of the dicing blade 2 and the flange 3 are covered with a flange cover 9, and the cooling water and cutting water supply port 8 supplied from the cooling water supply port 7 are provided.
Prevents the scattering of cutting water supplied from the company.

Next, the operation of this embodiment will be described.

The semiconductor wafer 1 is fixed by the wafer feed table 6, and the semiconductor wafer 1 is divided and cut into pellets with a fine cutting width by the dicing blade 2 rotating at high speed.

At this time, cooling water is supplied from the cooling water supply port 7 in order to prevent abnormal heat generation due to friction at the cutting portion. Further, cutting water for removing cutting dust of the semiconductor wafer 1 is supplied from the cutting water supply port 8. The cooling water sprayed from the cooling water supply port 7 to the dicing blade 2 flows along the flange 3 and is temporarily stored in the hole 4 provided in the flange 3.

The cooling water stored in the hole 4 is discharged to the outside of the hole 4 by the centrifugal force generated by the rotation of the flange 3. The discharged cooling water hits the dicing blade 2 again, so that the amount of cooling water hitting the dicing blade 2 increases.

As a result, according to the first embodiment, the cooling effect is improved by increasing the amount of cooling water that hits the dicing blade 2, so that the life of the dicing blade 2 can be prevented from being shortened. Further, since the abnormal cut surface of the semiconductor wafer 1 due to the abnormal friction of the dicing blade 2 is eliminated, the reliability of the semiconductor integrated circuit device is improved,
Production efficiency will also improve.

[0021]

[Embodiment 2] FIG. 3 is a side sectional view of a flange portion in a dicing apparatus according to Embodiment 2 of the present invention, and FIG. 4 is a plan view of the flange portion in a dicing apparatus according to Embodiment 2 of the present invention.

In the second embodiment, a large number of grooves 10 radially extending in the radial direction of the flange 3 are provided on both outer side surfaces 3a of the flange 3 of the dicing device. This groove 10
Thus, the cooling water sprayed from the cooling water supply port 7 to the dicing blade 2 flows along the side surface 3a of the flange 3 and is temporarily stored in the groove 10 provided in the flange 3.

The cooling water stored in the groove 10 is generated by centrifugal force generated by the rotation of the flange 3 in the groove 1.
Emitted along 0. The discharged cooling water hits the dicing blade 2 again, so that the amount of cooling water hitting the dicing blade 2 increases.

As a result, according to the second embodiment, the cooling effect is improved by increasing the amount of cooling water that hits the dicing blade 2, so that the life of the dicing blade 2 can be prevented from being shortened. Further, since the abnormal cut surface of the semiconductor wafer 1 due to the abnormal friction of the dicing blade 2 is eliminated, the reliability of the semiconductor integrated circuit device is improved,
Production efficiency will also improve.

The invention made by the present inventor has been described above based on the embodiments, but the present invention is not limited to the embodiments, and various modifications can be made without departing from the scope of the invention. There is no end.

For example, the cooling water may be supplied at a supply place other than the above-mentioned embodiment, and not only the dicing blade 2 may be sprayed but also the cooling water may be supplied to the main body of the flange 3.

The object to be processed may be other than the semiconductor wafer of the above-mentioned embodiment, and may be a magnetic head, ceramics or the like.

[0028]

Of the inventions disclosed by the present invention,
The following is a brief description of the effects obtained by the typical ones.

(1) According to the present invention, since the amount of cooling water that hits the dicing blade is increased, the cooling effect is improved and the life of the dicing blade can be prevented from being shortened.

(2) Further, according to the above (1), since the abnormal cut surface of the semiconductor wafer due to the abnormal friction of the dicing blade is eliminated, the reliability of the semiconductor integrated circuit device is improved and the production efficiency is improved.

[Brief description of drawings]

FIG. 1 is a side sectional view of a flange portion in a dicing apparatus according to a first embodiment of the present invention.

FIG. 2 is a plan sectional view of a flange portion in the dicing apparatus according to the first embodiment of the present invention.

FIG. 3 is a side sectional view of a flange portion in a dicing apparatus according to a second embodiment of the present invention.

FIG. 4 is a plan view of a flange portion in the dicing device according to the second embodiment of the present invention.

FIG. 5 is a cross-sectional view of a dicing blade showing abnormal friction of a conventional dicing device.

[Explanation of symbols]

 1 Semiconductor Wafer 2 Dicing Blade 3 Flange 3a Side 4 Hole 5 Spindle 6 Wafer Feeding Plate 7 Cooling Water Supply Port 8 Cutting Water Supply Port 9 Flange Cover 10 Groove

Claims (3)

[Claims] 1. A dicing apparatus for dividing and cutting an object to be processed, wherein a flange portion holding a dicing blade is provided with a hole or a groove. 2. The dicing apparatus according to claim 1, wherein a plurality of the holes or grooves are provided radially on both sides of the dicing blade in the radial direction of the flange portion. 3. The dicing apparatus according to claim 1, wherein the object to be processed is a semiconductor wafer.