JPH0626229B2 - Gripping device - Google Patents
Gripping deviceInfo
- Publication number
- JPH0626229B2 JPH0626229B2 JP60044793A JP4479385A JPH0626229B2 JP H0626229 B2 JPH0626229 B2 JP H0626229B2 JP 60044793 A JP60044793 A JP 60044793A JP 4479385 A JP4479385 A JP 4479385A JP H0626229 B2 JPH0626229 B2 JP H0626229B2
- Authority
- JP
- Japan
- Prior art keywords
- gripping
- shape memory
- memory alloy
- semiconductor substrate
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Feeding Of Workpieces (AREA)
- Manipulator (AREA)
Description
【発明の詳細な説明】 〔発明の利用分野〕 本発明は把持装置に係り、特に半導体素子の製造に用い
られる半導体基板を把持するに好適な把持装置に関す
る。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a gripping device, and more particularly to a gripping device suitable for gripping a semiconductor substrate used for manufacturing a semiconductor element.
近年、半導体製造工場では半導体基板の大型化と半導体
集積密度の向上にともない、極度な清浄度の維持を必要
としており、作業員から発生する塵埃が問題となりつつ
ある。そこで特にバツチ処理を行うプロセス間における
半導体基板のハンドリングの無人化に対するニーズが高
い。一般に半導体基板のハンドリングには真空吸着方式
が用いられているが、この方式の場合には吸着部にクリ
ーンルーム内の塵埃が集まるという問題があり、半導体
基板の表面上の清浄度維持のためには問題がある。一
方、機械的な把持装置では、例えば特開昭５８−６４０
４１号公報のように半導体基板の裏面に爪を滑りこませ
て水平に移しかえる方式があるが、この方式では半導体
基盤の姿勢変更を必要とする移しかえには使用できな
い。そこで半導体基板の周縁部を爪，ピン等で確保する
把持装置が種々提案されている（特開昭５８−７５８４
４号公報、特開昭５８−１５５７３６号公報）。2. Description of the Related Art In recent years, as semiconductor substrates have become larger and semiconductor integration density has increased in semiconductor manufacturing factories, it is necessary to maintain an extremely clean level, and dust generated by workers is becoming a problem. Therefore, there is a great need for unmanned handling of semiconductor substrates, particularly during the batch processing. Generally, a vacuum suction method is used for handling a semiconductor substrate. However, in this method, there is a problem that dust in a clean room collects in the suction part, and in order to maintain cleanliness on the surface of the semiconductor substrate, There's a problem. On the other hand, in a mechanical gripping device, for example, JP-A-58-640 is used.
There is a method of sliding a nail on the back surface of a semiconductor substrate and moving it horizontally as in Japanese Patent No. 41, but this method cannot be used for transferring which requires a posture change of a semiconductor substrate. Therefore, various gripping devices for securing the peripheral portion of the semiconductor substrate with claws, pins, etc. have been proposed (Japanese Patent Laid-Open No. 58-7584).
4 and JP-A-58-155736).
しかし、上記の把持装置では発塵源となる機械摺動部を
備えているため、半導体基板の表面上の清浄度を高く維
持することができないのが現状である。However, since the above-mentioned gripping device is provided with a mechanical sliding portion which is a dust source, the cleanliness on the surface of the semiconductor substrate cannot be kept high at present.
本発明の目的は発塵を生じないクリーンな把持装置を提
供することにある。An object of the present invention is to provide a clean gripping device that does not generate dust.
本発明の特徴とするところは、半導体基板を把持する把
持装置において、把持基部と、半導体基板を把持する少
くとも２つ以上の把持体と、この把持体を開方向に付勢
するように把持基部に弾性支持する弾性体と、把持体と
把持基部との間に設けた形状記憶合金と、この形状記憶
合金に通電する通電手段とを備え形状記憶合金への通電
により加熱冷却することによつて把持体を開閉動作させ
るようにしたものである。A feature of the present invention is that in a gripping device for gripping a semiconductor substrate, a gripping base, at least two or more gripping bodies that grip the semiconductor substrate, and gripping so as to bias the gripping bodies in the opening direction. An elastic body elastically supported by the base portion, a shape memory alloy provided between the gripping body and the gripping base portion, and an energizing means for energizing the shape memory alloy are provided to heat and cool the shape memory alloy by energizing the shape memory alloy. Then, the gripping body is opened and closed.
このように構成したことにより、把持装置は発塵源とな
る機械摺動部を備えていないため、半導体基板の把持動
作においてその表面上の清浄度を高く維持することがで
きる。With this configuration, since the gripping device does not include the mechanical sliding portion that is a dust source, the cleanliness of the surface of the semiconductor substrate can be maintained high during the gripping operation of the semiconductor substrate.
以下、本発明の実施例を図面を用いて詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
第１図は本発明の把持装置の一実施例を示すもので、こ
の第１図において、Ｗは把持される半導体基板である。
１は把持装置の基部で、この基部１はたとえばロボツト
の手首（図示せず）に装着される。2aおよび２ｂは１対
の把持体で、この把持体２ａ，２ｂは四沸化エチレン
等、適度な硬度、固体潤滑性及び耐薬品性を備えた材料
で形成されている。３ａおよび３ｂは把持体２ａ，２ｂ
を基部１に弾性支持する弾性体で、この弾性体３ａ，３
ｂは常時把持体３ａ，３ｂを開く方向に弾性力が付勢さ
れている。４ａ，４ｂはコイル状に形成された形状記憶
合金体で、この形状記憶合金体４ａ，４ｂの端部はそれ
ぞれ基部１の固定部５ａ，５ｂおよび把持体２ａ，２ｂ
の固定部６ａ，６ｂに結合されている。７ａ，７ｂはそ
れぞれ把持体２ａ，２ｂ側における弾性体３ａ，３ｂの
端部と形状記憶合金体４ａ，４ｂの端部とを接続する導
線である。一方、基部１側における弾性体３ａ，３ｂの
端部および形状記憶合金体４ａ，４ｂの端部はそれぞれ
導線８ａ，８ｂ，９ａ，９ｂによつて通電手段１０に接
続している。前述した把持体２ａ，２ｂはそれぞれ第２
図に示すように半導体基板Ｗの周縁を把持拘束する溝１
１ａ，１１ｂを備えている。FIG. 1 shows an embodiment of a gripping device of the present invention. In FIG. 1, W is a semiconductor substrate to be gripped.
Reference numeral 1 is a base portion of the gripping device, and the base portion 1 is attached to, for example, a wrist (not shown) of a robot. 2a and 2b are a pair of gripping bodies, and these gripping bodies 2a and 2b are made of a material having appropriate hardness, solid lubricity and chemical resistance, such as tetrafluoroethylene. 3a and 3b are grippers 2a and 2b
Is an elastic body that elastically supports the base 1 on the elastic body 3a, 3
The elastic force of b is always urged in the direction of opening the grippers 3a and 3b. Reference numerals 4a and 4b denote shape memory alloy bodies formed in a coil shape, and end portions of the shape memory alloy bodies 4a and 4b are fixed portions 5a and 5b of the base portion 1 and gripping bodies 2a and 2b, respectively.
Are fixed to the fixed portions 6a and 6b. Reference numerals 7a and 7b are conductors that connect the ends of the elastic bodies 3a and 3b and the ends of the shape memory alloy bodies 4a and 4b on the gripping bodies 2a and 2b side, respectively. On the other hand, the end portions of the elastic bodies 3a and 3b and the end portions of the shape memory alloy bodies 4a and 4b on the side of the base portion 1 are connected to the energizing means 10 by conducting wires 8a, 8b, 9a and 9b, respectively. The gripping bodies 2a and 2b described above are respectively the second
As shown in the figure, the groove 1 for holding and restraining the peripheral edge of the semiconductor substrate W
1a and 11b are provided.
次に上述した本発明の把持装置の一実施例の動作を説明
する。Next, the operation of the above-described embodiment of the gripping device of the present invention will be described.
いま、通電手段１０によつて形状記憶合金体４ａ，４ｂ
に電圧を印加しない状態では把持体２ａ，２ｂは弾性体
３ａ，３ｂによつて開かれている。この状態において形
状記憶合金体４ａ，４ｂに電圧を印加し、形状記憶合金
体４ａ，４ｂに通電すると、コイル状の形状記憶合金体
４ａ，４ｂはジユール発熱によつて温度が上昇し、形状
記憶効果によつて収縮し把持体２ａ，２ｂを閉じる。こ
れにより、半導体基板Ｗを把持することができる。本発
明の把持装置においては上述したように機械摺動部を備
えていないので、上述の把持動作において発塵を生じな
い。このため、クリーンルーム内および半導体基板に対
する清浄度を高く維持することができる。Now, by means of the energizing means 10, the shape memory alloy bodies 4a and 4b are
When no voltage is applied to the grippers 2a and 2b, the grippers 2a and 2b are opened by the elastic bodies 3a and 3b. In this state, when a voltage is applied to the shape memory alloy bodies 4a and 4b and the shape memory alloy bodies 4a and 4b are energized, the temperature of the coil shape memory alloy bodies 4a and 4b rises due to the heat generation of the gas, and the shape memory alloy bodies 4a and 4b are heated. Due to the effect, it contracts and closes the grippers 2a, 2b. Thereby, the semiconductor substrate W can be gripped. Since the gripping device of the present invention does not include the mechanical sliding portion as described above, dust is not generated in the above gripping operation. Therefore, the cleanliness of the clean room and the semiconductor substrate can be maintained high.
なお、上述の実施例においては形状記憶合金体４ａ，４
ｂをコイル状に形成したが、これに限られるものではな
い。また、把持体２ａ，２ｂの開度を規制するためのメ
カニカルストツパを付加しても本発明の主旨に反しない
し、把持体を３本以上にして、第１図と直角方向から半
導体基板の周縁部を把持するように機構を構成すること
も可能である。In the above-mentioned embodiment, the shape memory alloy bodies 4a, 4
Although b is formed in a coil shape, it is not limited to this. Further, even if a mechanical stopper for restricting the opening degree of the gripping bodies 2a, 2b is added, it does not violate the gist of the present invention, and the number of gripping bodies is three or more, and the semiconductor substrate is viewed from the direction perpendicular to FIG. It is also possible to configure the mechanism to grip the peripheral portion of the.
以上述べたように本発明によれば機械的摺動部がないた
め、発塵が皆無であるので、クリーンルーム内での半導
体基板のハンドリングするのに好適な把持装置を提供す
ることができると共に、塵の付着による半導体基板の不
良率を少くすることができる。As described above, according to the present invention, since there is no mechanical sliding portion, there is no dust generation, so that it is possible to provide a gripping device suitable for handling a semiconductor substrate in a clean room, The defect rate of the semiconductor substrate due to the adhesion of dust can be reduced.
第１図は本発明の把持装置の一実施例を示す正面図、第
２図は第１図に示す把持装置における把持体をII−II矢
視線から見た横断面図である。 １……基部、２ａ，２ｂ……把持体、３ａ，３ｂ……弾
性体、４ａ，４ｂ……形状記憶合金体、１０……通電手
段、Ｗ……半導体基板。FIG. 1 is a front view showing an embodiment of the gripping device of the present invention, and FIG. 2 is a cross-sectional view of a gripping body in the gripping device shown in FIG. 1 as seen from the line II-II. 1 ... Base, 2a, 2b ... Gripping body, 3a, 3b ... Elastic body, 4a, 4b ... Shape memory alloy body, 10 ... Energizing means, W ... Semiconductor substrate.
Claims (1)
把持体を形状記憶合金によって開閉動させる把持装置に
おいて、把持装置の把持基部と、前記半導体基板を把持
する少なくとも２つの把持体と、前記把持基部と前記把
持体の基部との間に設けられ、前記把持体を開方向に付
勢する弾性力を有する板状の弾性体と、この弾性体の内
側における前記把持基部と前記把持体の基部との間に設
けた形状記憶合金と、前記形状記憶合金の把持体基部側
端と前記弾性体の把持体基部側端とを接続する導線と、
前記形状記憶合金の把持基部側端と前記弾性体の把持基
部側端とを通電手段に接続する導線とを備えたことを特
徴とする把持装置。1. A gripping device comprising a gripping body for gripping a semiconductor substrate, wherein the gripping body is opened and closed by a shape memory alloy, and a gripping base of the gripping device, and at least two gripping bodies for gripping the semiconductor substrate. A plate-shaped elastic body provided between the grip base and the base of the grip body and having an elastic force for urging the grip body in the opening direction, and the grip base and the grip body inside the elastic body. A shape memory alloy provided between the shape memory alloy and the base, and a lead wire connecting the gripping body base side end of the shape memory alloy and the gripping body base side end of the elastic body,
A gripping device comprising: a conducting wire that connects a gripping base side end of the shape memory alloy and a gripping base side end of the elastic body to an energizing means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60044793A JPH0626229B2 (en) | 1985-03-08 | 1985-03-08 | Gripping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60044793A JPH0626229B2 (en) | 1985-03-08 | 1985-03-08 | Gripping device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61204947A JPS61204947A (en) | 1986-09-11 |
| JPH0626229B2 true JPH0626229B2 (en) | 1994-04-06 |
Family
ID=12701293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60044793A Expired - Lifetime JPH0626229B2 (en) | 1985-03-08 | 1985-03-08 | Gripping device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0626229B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100397563C (en) * | 2003-04-03 | 2008-06-25 | 应用材料股份有限公司 | Method and apparatus for vertical transfer of semiconductor substrates between cleaning modules |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0825122B2 (en) * | 1988-01-08 | 1996-03-13 | 九州電子金属株式会社 | Positioning device for the thin disk-shaped workpiece with respect to the pressure plate |
| CN111791244A (en) * | 2020-06-01 | 2020-10-20 | 广州大学 | Mechanical finger and mechanical arm |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59695A (en) * | 1982-06-26 | 1984-01-05 | 原子燃料工業株式会社 | Impurity recovering device |
| JPS591583U (en) * | 1982-06-28 | 1984-01-07 | オムロン株式会社 | industrial robot arm |
-
1985
- 1985-03-08 JP JP60044793A patent/JPH0626229B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100397563C (en) * | 2003-04-03 | 2008-06-25 | 应用材料股份有限公司 | Method and apparatus for vertical transfer of semiconductor substrates between cleaning modules |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61204947A (en) | 1986-09-11 |
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