JPS61204947A - Holding device - Google Patents
Holding deviceInfo
- Publication number
- JPS61204947A JPS61204947A JP4479385A JP4479385A JPS61204947A JP S61204947 A JPS61204947 A JP S61204947A JP 4479385 A JP4479385 A JP 4479385A JP 4479385 A JP4479385 A JP 4479385A JP S61204947 A JPS61204947 A JP S61204947A
- Authority
- JP
- Japan
- Prior art keywords
- gripping
- bodies
- parts
- holding
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Feeding Of Workpieces (AREA)
- Manipulator (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は把持装置に係り、特に半導体素子の製造に用い
られる半導体基板を把持するに好適な把持装置に関する
。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a gripping device, and more particularly to a gripping device suitable for gripping a semiconductor substrate used in the manufacture of semiconductor devices.
近年、半導体製造工場では半導体基板の大型化と半導体
集積密度の向上にともない、極度な清浄度の維持を必要
としており、作業員から発生する塵埃が問題となりつつ
ある。そこで特にパッチ処理を８行うプロセス間におけ
る半導体基板のハンドリングの無人化に対するニーズが
高い。一般に半導体基板のハンドリングには真空吸着方
式が用いられているが、この方式の場合には吸着部にり
ＩＪ−ンルーム内の塵埃が集まるという問題があり、半
導体基板の表面上の清浄度維持のためには問題がある。In recent years, semiconductor manufacturing factories have become required to maintain extremely high levels of cleanliness as semiconductor substrates have become larger and semiconductor integration density has increased, and dust generated by workers is becoming a problem. Therefore, there is a strong need for unmanned handling of semiconductor substrates, especially between processes where patch processing is performed. Generally, a vacuum suction method is used to handle semiconductor substrates, but this method has the problem that dust from the IJ chamber collects on the suction part, making it difficult to maintain cleanliness on the surface of the semiconductor substrate. There is a problem with that.
一方、機械的な把持装置では、例えば特開昭５８−６４
０４１号公報のように半導体基板の裏面に爪を滑りこま
せて水平に移しかえる方式があるが、この方式では半導
体基板の姿勢変更を必要μ＋７＋姪１−Ａ−キＩ７１峠
繍田〒冬ち１八 、シｒマー姪這仕ＳＸ仮の周縁部を爪
、ビン等で確保する把持装置が種々提案されている（特
開昭５８〜７５８４４号公報、特開昭５８−１５５７３
６ 号公報）。On the other hand, with a mechanical gripping device, for example, Japanese Patent Laid-Open No. 58-64
There is a method, as in Publication No. 041, in which the semiconductor substrate is moved horizontally by sliding a nail into the back surface of the semiconductor substrate, but this method requires changing the posture of the semiconductor substrate. 18. Various gripping devices have been proposed for securing the temporary periphery of the shimmer SX with claws, bottles, etc.
Publication No. 6).
１２かし、上記の把持装置では発塵源となる機械摺動部
を備えている几め、半導体基板の表面上の清浄賞を高く
維持することができないのが現状である。However, the above-mentioned gripping device is currently unable to maintain a high level of cleanliness on the surface of the semiconductor substrate because it is equipped with a mechanical sliding part that is a source of dust generation.
本発明の目的は発塵を生じないりＩＪ−ンな把持装（べ
を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a gripping device that does not generate dust.
本発明の特徴とするところは、半導体基板を把持する把
持装置において、把持基部と、半導体基板を把持する少
くとも２つ以上の把持体と、この把持体′ｆｃ開方向に
付勢するように把持基部知弾性支持する弾性体と、把持
体と把持基部との間に設けた形状記憶合金と、この形状
記憶合金に通電する通電手段とを備え形状記憶合金への
通電により加熱冷却することによって把持体を開閉動作
させるようにしたもので夕、る。The present invention is characterized in that a gripping device for gripping a semiconductor substrate includes a gripping base, at least two or more gripping bodies for gripping the semiconductor substrate, and a gripper for urging the gripping bodies in the opening direction. The grip base includes an elastic body that elastically supports the grip base, a shape memory alloy provided between the grip body and the grip base, and an energizing means for energizing the shape memory alloy. The grip is designed to open and close.
このように構成し、たことにより、把持装置はイへ塵源
となる機械摺動部を備えていないため、半導体基板の把
持動作においてその表面上の清浄度を高く維持すること
ができる。With this structure, the gripping device does not have a mechanical sliding part that can be a source of dust, so it is possible to maintain a high level of cleanliness on the surface during the gripping operation of the semiconductor substrate.
以下、本発明の実施例を図面を用いて詳細に説明する。 Embodiments of the present invention will be described in detail below with reference to the drawings.
第１図は本発明の把持装置の一実施例を示すもので、こ
の第１図において、Ｗは杷持坏力、る≠導体基板である
。１は把持装置の基部で、この、基部１はたとえばロボ
ットの手首（図示せず）に装着される。２ａおよび２ｂ
は１対の把持体で、この把持体２ａ、２ｂは四沸化ゴチ
レン等、適度な硬度、固体潤滑性及び耐薬品性を備え友
材料で形成されている。３ａおよび３ｂは把持体２ａ、
２ｂを基部１に弾性支持する弾性体で、この弾性体３ａ
。FIG. 1 shows an embodiment of the gripping device of the present invention. In FIG. 1, W represents the holding force, and ru≠conductor substrate. Reference numeral 1 denotes a base of a gripping device, and this base 1 is attached to, for example, a robot's wrist (not shown). 2a and 2b
are a pair of gripping bodies, and the gripping bodies 2a and 2b are made of a material having appropriate hardness, solid lubricity, and chemical resistance, such as tetrafluoroethylene. 3a and 3b are gripping bodies 2a;
2b to the base 1, and this elastic body 3a
.
３ｂは常時把持体３ａ、３ｂを開く方向に弾性力が付勢
されている。４ａ、４ｂはコイル状に形成された形状記
憶合金体で、この形状記憶合金体４ａ、４ｔ）の端部は
それぞれ基部１の固定部５３゜５ｂおよび把持体２ａ、
２ｂの固定部６ａ、６ｂに結合されている。、７ａ、７
ｂばそれぞれ把持体２ａ、 ２ｂ側における弾性体３８
１，３ｂの端部と形状記憶合金体４ａ、４ｂの端部とを
接続する導線である。一方、基部１側における弾性体３
ａ。3b is always biased with elastic force in the direction of opening the grips 3a, 3b. 4a, 4b are shape memory alloy bodies formed in a coil shape, and the ends of these shape memory alloy bodies 4a, 4t) are respectively attached to the fixing part 53° 5b of the base 1, the grip body 2a,
2b is connected to the fixing parts 6a and 6b. ,7a,7
Elastic bodies 38 on the gripping bodies 2a and 2b sides, respectively.
This is a conductive wire that connects the ends of the shape memory alloy bodies 4a and 4b. On the other hand, the elastic body 3 on the base 1 side
a.
３ｂの端部および形状記憶合金体４ａ、４ｔ）の端部は
それぞれ導線８ａ、８ｂ、９３．９ｂによって通電手段
１０に接続１７ている。前述し友把持体２ａ、２ｂはそ
れぞれ第２図に示すように半導体基板Ｗの周縁を把持拘
束する溝１１．ａ、ｌｌｂを備えている。3b and the ends of the shape memory alloy bodies 4a, 4t) are connected 17 to the current supply means 10 by conducting wires 8a, 8b, 93.9b, respectively. The aforementioned friend gripping bodies 2a and 2b each have a groove 11. which grips and restrains the peripheral edge of the semiconductor substrate W, as shown in FIG. It is equipped with a, llb.
次に上述した本・発明の把持装置の一実施例の動作を説
明する。Next, the operation of one embodiment of the above-mentioned gripping device of the present invention will be described.
いま、通電手段１０によって形状記憶合金体４ａ、４ｂ
Ｋ’ＦＪ！圧を印加しない状態では把持体２ａ、２ｂは
弾性体３ａ、３ｂによって開かれている。この状態にお
いて形状記憶合金体４ａ。Now, the shape memory alloy bodies 4a, 4b are turned on by the current supply means 10.
K'FJ! When no pressure is applied, the grips 2a and 2b are held open by the elastic bodies 3a and 3b. In this state, the shape memory alloy body 4a.
４ｈＫ電圧を印加し、形状記憶合金体４ａ、４ｂに通電
すると、コイル状の形状記憶合金体４ａ。When a 4hK voltage is applied and the shape memory alloy bodies 4a and 4b are energized, the shape memory alloy body 4a becomes coiled.
記憶効果によって収縮し把持体２ａ、２ｂを閉じる。こ
れにより、半導体基板Ｗを把持する仁とができる。本発
明の把持装置においては上述し２次ように機械摺動部を
備えていないので、上述の把持動作において発塵を生じ
ない。このｔめ、り１）−ンルーム内および半導体基板
に対する清浄度を高く維持することができる。It contracts due to the memory effect and closes the gripping bodies 2a and 2b. As a result, a pad for gripping the semiconductor substrate W is formed. Since the gripping device of the present invention does not include a mechanical sliding part as described above, dust is not generated during the above-mentioned gripping operation. As a result, the cleanliness of the inside of the room and the semiconductor substrate can be maintained at a high level.
なお、上述の実施例においては形状記憶合金体４ａ、４
ｂをコイル状に形成したが、これに限られるものではな
い。ま几、把持体２ａ、２ｂの開度を規制する次めのメ
カニカルストッパを付加しても本発明の主旨に反しない
し、把持体を３本以上にして、第１図と直角方向がら半
導体基板の周縁部を把持するように機構を構成すること
も可能である。In addition, in the above-mentioned embodiment, the shape memory alloy bodies 4a, 4
Although b is formed into a coil shape, it is not limited to this. It does not go against the gist of the present invention to add a mechanical stopper for regulating the opening degree of the holding bodies 2a and 2b. It is also possible to configure the mechanism to grip the periphery of the substrate.
以上述べたように本発明によれば機械的摺動部がないｆ
（め、発塵が皆無であるので、クリーンルーム内での半
導体基板のハンドリングするのに好の付着による半導体
基板の不良率を少くすることができる。As described above, according to the present invention, there is no mechanical sliding part.
(Meanwhile, since there is no dust generation, it is possible to reduce the defective rate of semiconductor substrates due to adhesion, which is suitable for handling semiconductor substrates in a clean room.
第１図は本発明の把持装置の一実施例を示す正面図、第
２図は第１図に示す把持装置における把持体をＩ−１矢
視線から見た横断面図である。
１・・・基部、２ａ、２ｂ・・・把持体、３ａ、３ｂ・
・・弾性体、４ａ、４ｂ・・・形状記憶合金体、１０・
・・通電手段、Ｗ・・・半導体基板。FIG. 1 is a front view showing an embodiment of the gripping device of the present invention, and FIG. 2 is a cross-sectional view of the gripping body in the gripping device shown in FIG. 1, viewed from the line of arrow I-1. 1... Base, 2a, 2b... Gripping body, 3a, 3b.
... Elastic body, 4a, 4b... Shape memory alloy body, 10.
...Electricity means, W...semiconductor substrate.
Claims (1)
と、半導体基板を把持する少くとも２つ以上の把持体と
、この把持体を開方向に付勢するように把持基部に弾性
支持する弾性体と、把持体と把持基部との間に設けた形
状記憶合金と、この形状記憶合金に通電する通電手段と
を備えたことを特徴とする把持装置。 ２、特許請求の範囲第１項記載の把持装置において、前
記弾性体は湾曲した板状体であり、把持体を開方向に付
勢する弾性力を備えたことを特徴とする把持装置。 ３、特許請求の範囲第２項記載の把持装置において、弾
性体はその把持体側端部をリード線により形状記憶合金
体の把持体側端部に接続し、その把持体側端部を通電手
段に接続したことを特徴とする把持装置。[Claims] 1. A gripping device for gripping a semiconductor substrate, which includes a gripping base, at least two or more gripping bodies that grip the semiconductor substrate, and a gripping base configured to bias the gripping bodies in the opening direction. 1. A gripping device comprising: an elastic body that elastically supports the gripping body; a shape memory alloy provided between the gripper and the gripping base; and an energizing means for energizing the shape memory alloy. 2. The gripping device according to claim 1, wherein the elastic body is a curved plate-like body and has an elastic force that biases the gripping body in the opening direction. 3. In the gripping device according to claim 2, the elastic body has its gripping body side end connected to the gripping body side end of the shape memory alloy body by a lead wire, and its gripping body side end is connected to the energizing means. A gripping device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60044793A JPH0626229B2 (en) | 1985-03-08 | 1985-03-08 | Gripping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60044793A JPH0626229B2 (en) | 1985-03-08 | 1985-03-08 | Gripping device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61204947A true JPS61204947A (en) | 1986-09-11 |
| JPH0626229B2 JPH0626229B2 (en) | 1994-04-06 |
Family
ID=12701293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60044793A Expired - Lifetime JPH0626229B2 (en) | 1985-03-08 | 1985-03-08 | Gripping device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0626229B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01177941A (en) * | 1988-01-08 | 1989-07-14 | Kyushu Electron Metal Co Ltd | Positioning device for pressing board for work piece of thin circular plate form |
| CN111791244A (en) * | 2020-06-01 | 2020-10-20 | 广州大学 | Mechanical finger and mechanical arm |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040197179A1 (en) * | 2003-04-03 | 2004-10-07 | Applied Materials, Inc. | Method and apparatus for vertical transfer of semiconductor substrates between cleaning modules |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59695A (en) * | 1982-06-26 | 1984-01-05 | 原子燃料工業株式会社 | Impurity recovering device |
| JPS591583U (en) * | 1982-06-28 | 1984-01-07 | オムロン株式会社 | industrial robot arm |
-
1985
- 1985-03-08 JP JP60044793A patent/JPH0626229B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59695A (en) * | 1982-06-26 | 1984-01-05 | 原子燃料工業株式会社 | Impurity recovering device |
| JPS591583U (en) * | 1982-06-28 | 1984-01-07 | オムロン株式会社 | industrial robot arm |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01177941A (en) * | 1988-01-08 | 1989-07-14 | Kyushu Electron Metal Co Ltd | Positioning device for pressing board for work piece of thin circular plate form |
| CN111791244A (en) * | 2020-06-01 | 2020-10-20 | 广州大学 | Mechanical finger and mechanical arm |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0626229B2 (en) | 1994-04-06 |
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