JPH0625694B2 - Optical receiver module - Google Patents
Optical receiver moduleInfo
- Publication number
- JPH0625694B2 JPH0625694B2 JP1277044A JP27704489A JPH0625694B2 JP H0625694 B2 JPH0625694 B2 JP H0625694B2 JP 1277044 A JP1277044 A JP 1277044A JP 27704489 A JP27704489 A JP 27704489A JP H0625694 B2 JPH0625694 B2 JP H0625694B2
- Authority
- JP
- Japan
- Prior art keywords
- package
- receiver module
- photoelectric conversion
- optical receiver
- conversion element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
Landscapes
- Light Receiving Elements (AREA)
- Optical Communication System (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、光通信あるいは光情報処理に使用される光受
信モジュールに関し、特に伝送速度が１ギガビット（Gb
/s）を越える超高速動作領域に対応する光受信モジュー
ルに関する。Description: TECHNICAL FIELD The present invention relates to an optical receiver module used for optical communication or optical information processing, and particularly to a transmission speed of 1 gigabit (Gb).
The present invention relates to an optical receiver module compatible with an ultra-high speed operation area exceeding / s).
［従来の技術］ 従来、この種の光受信モジュールは、第２図(a) に示す
様に金属部材よりなるパッケージ１を備え、このパッケ
ージ１内には光電気変換素子２を搭載したサブキャリァ
３および増幅回路ＩＣ５を搭載した混成ＩＣ４（以下Ｈ
ＩＣと記す）が半田材により固着搭載されている。[Prior Art] Conventionally, an optical receiving module of this type is provided with a package 1 made of a metal member as shown in FIG. 2 (a), and in this package 1 a subcarrier 3 having a photoelectric conversion element 2 mounted therein. And a hybrid IC4 (hereinafter referred to as H
IC) is fixedly mounted by a solder material.
さらに、パッケージの一端には円柱状の金属パイプ８が
設けられ、金属パイプ８内には光集束用のレンズ６およ
び光フアィバー７が固定されている。Further, a cylindrical metal pipe 8 is provided at one end of the package, and a lens 6 for converging light and an optical fiber 7 are fixed in the metal pipe 8.
従来の光受信モジュールにおいて、光フアィバー７を通
して入力された信号光は、レンズ６により集束された
後、光電気変換素子２に入力される一方、光電気変換素
子２によって電気信号に変換された入力信号は、増幅回
路ＩＣ５によって増幅された後、第２図(b) に示す様に
パッケージ側面に設けられたガラス端子９を介して外部
に出力される。In the conventional optical receiving module, the signal light input through the optical fiber 7 is converged by the lens 6 and then input into the photoelectric conversion element 2, and the input converted into an electric signal by the photoelectric conversion element 2. After being amplified by the amplifier circuit IC5, the signal is output to the outside through the glass terminal 9 provided on the side surface of the package as shown in FIG. 2 (b).
［発明が解決しようとする課題］ 上述したパツケージ側面に設けられたガラス端子は底面
から２〜３ミリの位置に設けられ、これらガラス端子９
を介して、光電気変換素子２に対するバイアス供給、増
幅回路ＩＣ５の電源供給および出力信号の取り出しが行
なわれる。[Problems to be Solved by the Invention] The glass terminals provided on the side surface of the package described above are provided at a position of 2 to 3 mm from the bottom surface.
Via, the bias is supplied to the photoelectric conversion element 2, the power is supplied to the amplifier circuit IC5, and the output signal is taken out.
各ガラス端子９は底面から離れているため、光受信モジ
ュールをプリント基板に実装する際、第３図に示す様に
プリント基板の一部を切欠き、プリント基板表面に、光
受信モジュールをリード位置がくる様に実装する必要が
あった。この様な実装を行なうことによって、次段の増
幅回路との接続部に寄生するインダクタンスによる特性
劣化を抑えることができる。Since each glass terminal 9 is separated from the bottom surface, when mounting the optical receiver module on the printed circuit board, a part of the printed circuit board is cut out as shown in FIG. It was necessary to implement it so that it would come. By implementing such a mounting, it is possible to suppress the characteristic deterioration due to the parasitic inductance in the connection portion with the amplifier circuit of the next stage.
上記したような実装を行なった場合、プリント基板の実
装設計上、また組立上で大きな欠点になっていた。When the above-mentioned mounting is carried out, it is a big defect in the mounting design and assembly of the printed circuit board.
また、従来の光受信モジュールでは、プリント基板実装
時に、プリント基板と光受信モジュールのパッケージ
（金属部材）の熱膨張率の差によってガラス端子に応力
が集中するため、第３図に示す様にプリント基板とパッ
ケージの間を３ミリ程度離して実装する必要があった。In the conventional optical receiver module, when the printed circuit board is mounted, stress concentrates on the glass terminals due to the difference in the coefficient of thermal expansion between the printed circuit board and the package (metal member) of the optical receiver module. Therefore, as shown in FIG. It was necessary to mount the board and the package at a distance of about 3 mm.
このため、接続部のリードに寄生するインダクタンスが
大きく、次段増幅回路との接続時に反射による特性劣化
を引き起こすという欠点があった それ故に、本発明の課題は、上記の様な欠点を除去し、
プリント基板上にパッケージを直接、実装することがで
き、且つ、次段の増幅回路との接続時に、インピーダン
ス整合がとれて、電気的な反射による特性劣化を防ぐこ
とが可能な光受信モジュールを提供することにある。Therefore, there is a disadvantage that the inductance of the lead of the connecting portion is large and the characteristic deterioration due to reflection occurs at the time of connection with the next-stage amplifier circuit.Therefore, the object of the present invention is to eliminate the above-mentioned disadvantages. ,
(EN) Provided is an optical receiver module which can mount a package directly on a printed circuit board, can have impedance matching at the time of connection with an amplifier circuit in the next stage, and can prevent characteristic deterioration due to electrical reflection. To do.
［課題を解決するための手段］ 本発明による光受信モジュールのパッケージは、セラミ
ック部材よりなり、パッケージの底面にはセラミックと
熱膨張率が、ほぼ同等のフラットリードが固定されてお
り、且つ、パッケージの底面とフラットリードの底面
は、ほぼ同一のレベルに構成されている。[Means for Solving the Problems] A package of an optical receiver module according to the present invention is made of a ceramic member, and a flat lead having a thermal expansion coefficient substantially equal to that of ceramic is fixed to the bottom surface of the package, and the package is The bottom surface of the flat lead and the bottom surface of the flat lead are arranged at substantially the same level.
また、光電気変換素子により電気信号に変換された入力
信号を増幅する増幅回路ＩＣの出力パターンと、フラッ
トリードとを接続するパッケージの内層パターンは、入
力インピーダンスと整合する様に一定（実施例では50
Ω）の特性インピーダンスを有している。Further, the output pattern of the amplifier circuit IC that amplifies the input signal converted into the electric signal by the photoelectric conversion element and the inner layer pattern of the package that connects the flat lead are fixed (in the embodiment, the pattern is constant). 50
Ω) characteristic impedance.
［作用］ 本発明による光受信モジュールをプリント基板に実装す
る場合、電気的な特性劣化対策として、従来、実施して
きたプリント基板の前加工を削除し、直接、プリント基
板上に実装することができる。[Operation] When the optical receiving module according to the present invention is mounted on a printed circuit board, it is possible to directly mount it on the printed circuit board as a countermeasure against electrical characteristic deterioration by removing the pre-processing of the printed circuit board that has been conventionally performed. .
［実施例］ 第１図は本発明の一実施例の断面図である。本発明の光
受信モジュールにおいて、光電気変換素子２を搭載した
サブキャリァ１４は、セラミック部材よりなり、パッケ
ージ底面に蝋付けされた金属板１１に、ＹＡＧ（イツトリウム
・アルミニウム・ガ-ネツト）レーザー溶接によって固定される。[Embodiment] FIG. 1 is a sectional view of an embodiment of the present invention. In the optical receiver module of the present invention, the subcarrier 14 on which the photoelectric conversion element 2 is mounted is made of a ceramic member and is welded to the metal plate 11 brazed to the bottom surface of the package by YAG (yttrium aluminum aluminum net) laser welding. Fixed.
一方、増幅回路ＩＣ５と固着搭載したＨＩＣ４は、パッ
ケージ底面に蝋付けされた金属ベース１２上に半田材に
より固定される。On the other hand, the HIC 4 fixedly mounted on the amplifier circuit IC 5 is fixed by a solder material on the metal base 12 brazed to the bottom surface of the package.
また、入力信号光は、光フアィバー７を介してレンズ６
により光電気変換素子２の受光面に集束される。In addition, the input signal light is transmitted through the optical fiber 7 to the lens 6
Are focused on the light receiving surface of the photoelectric conversion element 2.
光電気変換素子２で電気信号に変換された入力信号は、
サブキャリァ１４の側面および上面に形成されたメタラ
イズ・パターンを介し、サブキャリァ１４とＨＩＣ４を
接続するワイヤを通して増幅回路ＩＣ５に入力される。The input signal converted into an electric signal by the photoelectric conversion element 2 is
It is inputted to the amplifier circuit IC5 through a wire connecting the subcarrier 14 and the HIC4 via a metallization pattern formed on the side surface and the upper surface of the subcarrier 14.
増幅回路ＩＣ５の出力は、ＨＩＣ４上に形成された出力
のメタライズ・パターンおよびボンデングワイヤを通し
て、パッケージ内に形成されたステッチに接続され、パ
ッケージの内層パターンおよび側面メタライズ・パター
ンによって、パッケージの底面に設けられたフラットリ
ード１３に接続される。The output of the amplifier circuit IC5 is connected to the stitch formed in the package through the output metallization pattern and the bonding wire formed on the HIC4, and is connected to the bottom surface of the package by the inner layer pattern and the side surface metallization pattern of the package. It is connected to the provided flat lead 13.
光受信モジュール内部は、サブキャリァ１４とＨＩＣ４
を搭載しボンデングを完了した後、シーム溶接により気
密封止される。本実施例では、パッケージのフラットリ
ード１３はセラミックと熱膨張率を合わせるために、コ
バール（鉄，Ni,Co の合金）を使用し、パッケージ底面
とリード底面が、ほぼ同一面になる様にパッケージに蝋
付けされている。Inside the optical receiver module, the subcarrier 14 and the HIC 4
After mounting and completing the bonding, it is hermetically sealed by seam welding. In this embodiment, the flat lead 13 of the package is made of Kovar (alloy of iron, Ni, Co) in order to match the coefficient of thermal expansion with that of ceramic, and the package bottom surface and the lead bottom surface are almost flush with each other. Is brazed to.
さらに、光フアィバー７およびレンズ６を固定する金属
パイプ８の先端には、気密封止用のサファイア・ガラス
１５を有している。Further, a metal pipe 8 for fixing the optical fiber 7 and the lens 6 has a sapphire glass 15 for hermetic sealing at the tip thereof.
［発明の効果］ 以上、説明した様に本発明は、光受信モジュール・パッ
ケージのリードを、パッケージ底面と同じ高さから引き
出すフラットリードとすることにより、増幅回路接続部
に寄生するインダクタンスを減少させることができる
で、プリント基板上へ直接、パッケージの実装が可能と
なり、プリント基板への実装が簡単にできるという効果
がある また、パッケージの出力リード側の内層パターンを、特
性インピーダンス５０Ωとすることにより、次段の増幅
回路との接続時に、インピーダンス整合をとることが可
能となり、電気的な反射による特性劣化を抑える効果が
ある。[Effects of the Invention] As described above, according to the present invention, the leads of the optical receiver module package are flat leads that are pulled out from the same height as the package bottom surface, thereby reducing the parasitic inductance in the amplifier circuit connecting portion. As a result, it is possible to mount the package directly on the printed circuit board, and it is easy to mount it on the printed circuit board. Also, by setting the inner layer pattern on the output lead side of the package to have a characteristic impedance of 50Ω. , Impedance matching can be achieved at the time of connection with the amplifier circuit of the next stage, and there is an effect of suppressing characteristic deterioration due to electrical reflection.
第１図は本発明の一実施例を示す断面図，第２図(a),
(b) は従来の光受信モジュールの断面図，第３図は従来
の光受信モジュールの一実施例を示す図である。 １……従来例のパッケージ ２……光電気変換素子 ３……従来例のサブキャリァ ４……ＨＩＣ ５……増幅回路ＩＣ ６……レンズ ７……光フアィバー ８……パイプ ９……ガラス端子 １０……本実施例のパッケージ １１……金属板 １２……金属ベース １３……フラットリード １４……本実施例のサブキャリァ １５……サファイア・ガラス １６……プリント基板 １７……シャーシーFIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 (a),
(b) is a cross-sectional view of a conventional optical receiver module, and FIG. 3 is a diagram showing an embodiment of a conventional optical receiver module. 1 ... Conventional package 2 ... Photoelectric conversion element 3 ... Conventional subcarrier 4 ... HIC 5 ... Amplifying circuit IC 6 ... Lens 7 ... Optical fiber 8 ... Pipe 9 ... Glass terminal 10 ...... Package of this embodiment 11 ...... Metal plate 12 ...... Metal base 13 ...... Flat lead 14 ...... Sub carrier of this embodiment 15 ...... Sapphire glass 16 ...... Printed circuit board 17 ...... Chassis
Claims (2)
に、光電気変換素子を搭載するサブキャリァと、前記光
電気変換素子の出力を増幅する増幅回路ＩＣを搭載する
混成ＩＣと、前記光電気変換素子に入力信号光を集束さ
せる光学系を有する光受信モジュールにおいて、前記パ
ッケージはセラミック部材と同等の熱膨張率を有するフ
ラットリードを、該パッケージの底面に有することを特
徴とする光受信モジュール。1. A subcarrier for mounting a photoelectric conversion element, a hybrid IC for mounting an amplifier circuit IC for amplifying an output of the photoelectric conversion element, and a photoelectric conversion element inside a package made of a ceramic member. An optical receiving module having an optical system for focusing input signal light, wherein the package has a flat lead having a coefficient of thermal expansion equivalent to that of a ceramic member on a bottom surface of the package.
ターンと、前記パッケージの底面に設けられているフラ
ットリードの間を接続する、前記パッケージの内層およ
びメタライズ・パターンは、入力インピーダンスに応じ
た一定の特性インピーダンスを有することを特徴とする
特許請求の範囲第１項記載の光受信モジュール。2. The inner layer of the package and the metallization pattern for connecting between the output signal metallization pattern of the hybrid IC and the flat lead provided on the bottom surface of the package are constant according to the input impedance. The optical receiver module according to claim 1, which has the characteristic impedance of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1277044A JPH0625694B2 (en) | 1989-10-26 | 1989-10-26 | Optical receiver module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1277044A JPH0625694B2 (en) | 1989-10-26 | 1989-10-26 | Optical receiver module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03140824A JPH03140824A (en) | 1991-06-14 |
| JPH0625694B2 true JPH0625694B2 (en) | 1994-04-06 |
Family
ID=17578005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1277044A Expired - Lifetime JPH0625694B2 (en) | 1989-10-26 | 1989-10-26 | Optical receiver module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0625694B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6071016A (en) * | 1997-03-04 | 2000-06-06 | Hamamatsu Photonics K.K. | Light receiving module for optical communication and light receiving unit thereof |
| JPH11354833A (en) * | 1998-06-11 | 1999-12-24 | Sumitomo Electric Ind Ltd | Optical module |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6159757A (en) * | 1984-08-13 | 1986-03-27 | ア−ルシ−エ− コ−ポレ−ション | Semiconductor chip package |
| JPS61225842A (en) * | 1985-03-30 | 1986-10-07 | Fujitsu Ltd | Semiconductor device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0412696Y2 (en) * | 1985-03-14 | 1992-03-26 |
-
1989
- 1989-10-26 JP JP1277044A patent/JPH0625694B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6159757A (en) * | 1984-08-13 | 1986-03-27 | ア−ルシ−エ− コ−ポレ−ション | Semiconductor chip package |
| JPS61225842A (en) * | 1985-03-30 | 1986-10-07 | Fujitsu Ltd | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03140824A (en) | 1991-06-14 |
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