JPH06256068A - Method for joining ceramic - Google Patents

Abstract

PURPOSE:To reduce the irregularity in the strength of a joined product and improve its air tightness by pressing ceramics through a metal fluoride mica disposed therebetween at a high temperature. CONSTITUTION:A ceramic 2 and a ceramic 2 are joined through a metal fluoride mica 1 disposed between the joining interface 50 of the ceramic 2 and the joining interface 50 of the ceramic 2 wi th a joining pressure of 0.01-0.2kgf/mm<2> at 1200-1400 deg.C.

Description

Detailed Description of the Invention

[0001]

The present invention relates to a solid electrolyte fuel cell (S
The present invention relates to a method for joining ceramics applied when manufacturing high-temperature equipment such as OFC) and precision equipment such as electronic parts.

[0002]

2. Description of the Related Art As a conventional solid-phase joining technique, as shown in FIG. 4, titanium (Ti) or copper (Cu) is provided between materials to be joined 2.
Excessive such that the material to be welded 2 is plastically deformed 20 by pressure-bonding it under high temperature vacuum with a metal-based intermediate material 10 interposed, or by polishing the bonding interface 50 into a mirror surface as shown in FIG. They were joined under high temperature vacuum with various loads.

[0003]

In the conventional method, when a metal-based intermediate material is interposed, the metal-based intermediate material is softened in a high temperature range exceeding 900 ° C., so that the strength is low and the functions such as airtightness can be achieved. There wasn't. Further, the method of mirror-polishing the bonding interface and bonding with an excessive load requires high-precision processing and requires a large-sized bonding apparatus, which is costly and difficult to mass-produce.

In view of the above-mentioned state of the art, the present invention aims to provide a method for joining ceramics which does not have the problems of the conventional methods.

[0005]

According to the present invention, when bonding ceramics to each other, fluorine phlogopite (Si-Al-Mg-O-F) is used as an intermediate material between the ceramics.
Ceramics) and pressurization at high temperature with interposition of ceramics).

The high temperature pressurizing condition in the present invention is not limited, but it is generally 1000 to 1000 in air or vacuum.
It is carried out at a high temperature of 1600 ° C. and a pressure of 0.01 to ² kgf / mm ² .

[0007]

[Function] Since fluorphlogopite (Si-Al-Mg-O-F ceramics) shows remarkable plastic deformation in a region exceeding 1000 ° C, the surface roughness of the ceramic to be bonded is about 5 µm Also in the case of (3), a complete bond is obtained, and a bonded body between the intermediate material and the ceramic is obtained.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 shows structural ceramics 2 such as Al ₂ O ₃ and YSZ (yttria-stabilized zirconia), and fluorophlogopite (Si-Al-Mg-O-F ceramics) 1.
FIG. 2 is a diagram showing an example in which the Al ₂
FIG. 4 is a diagram showing an example in which structural ceramics 2 such as O ₃ or YSZ and conductive ceramics 3 such as La-based oxide ceramics are bonded via fluorophlogopite 1, and FIG.
FIG. 3 is a diagram showing an example in which a thin film metal 4 such as platinum is arranged in place of the conductive ceramic 3 and the structural ceramics 2 such as Al ₂ O ₃ and YSZ are bonded by the fluorophlogopite 1.

The bonding temperature in each of the above embodiments is 1200 to 14
00 ° C., the joining pressure is 0.01 to 0.2 kgf / mm ² , and the initial thickness of the fluorophlogopite mica, which is an intermediate material, is 0.6.
mm, and the thickness after joining was about 50 μm.

[0010]

According to the present invention, since the fluorophlogopite is plastically deformed and adheres to the ceramic to be bonded, the strength of the bonded body is small, and stable strength and high airtightness can be obtained. Further, the mirror-finishing of the ceramic bonding surface is unnecessary, and the cost can be reduced. Further, fluorophlogopite has an electrical insulating property, and even when a conductive material is arranged on the joint surface, long-term deterioration due to energization can be prevented.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of an embodiment of the present invention.

FIG. 2 is an explanatory view of another embodiment of the present invention.

FIG. 3 is an explanatory diagram of still another embodiment of the present invention.

FIG. 4 is an explanatory view of one embodiment of a conventional ceramics joining method.

FIG. 5 is an explanatory view of another aspect of the conventional ceramics joining method.

Claims (1)

[Claims] 1. A method of joining ceramics, characterized in that when joining ceramics to each other, fluorine phlogopite is interposed as an intermediate material between the ceramics and high temperature pressurization is performed.