JPH06255165A - Multiple stylus recording head - Google Patents

Abstract

PURPOSE:To lessen catching of wire rods for recording electrodes in a mounting operation of a head by a method wherein a binding relation of the wire rod for recording electrode is enabled to be maintained even though the binding relation is detached from a pin of a form block. CONSTITUTION:MXN pieces of the first electrodes 11 composed of N sets by taking M pieces as one set, and MXN pieces of the second recording electrodes 12 to be arranged at a specific interval in parallel therewith are arranged at a specific pitch, and fastened with an electrode supporting block 14. Wire rods 15 constituting the first and the second respective recording electrodes 11, 12 are drawn out from the electrode supporting block 14, bundled into one bundle each N pieces capable of being grouped, connected to a wiring substrate 18, and connected to an external driving circuit thereafter. Respective wire rods for recording electrode 15 are fixed to each other with at least an intersecting part 16 of the wire rod 15 for recording electrode. Though the wire rod 15 for recording electrode is detached from a pin of a form block, a relation of all the wire rods 15 is fixed with an intersected part 16 between a part 17 of which a tip is at least bundled and the electrode supporting block 14.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-needle recording head suitable as an electrostatic recording type recording head. More specifically, the present invention relates to an improvement in the connection structure of recording electrodes of a multi-needle recording head to a wiring board.

[0002]

2. Description of the Related Art A multi-needle recording head used in an electrostatic recording system, for example, a same-plane control multi-needle recording head is generally
As shown in FIG. 5, 2 arranged at high density with a constant pitch
The row recording electrodes 101a and 101b and the corresponding two rows of control electrodes 102a and 102b are fixed by an electrode support block 103 made of an electrically insulating resin or the like. For example, M (= 128) sets of N (= 55) sets of M × N (= 7040) first recording electrodes 101a.
And M × N arranged at a predetermined interval in parallel with this
(= 7040) second recording electrodes 101b and control electrodes 102a and 10a arranged along the columns of the first and second recording electrodes 101a and 101b, respectively, outside the columns.
2b are provided so that their respective end faces are exposed on the surface of the resin block / electrode support block 103 made of an insulating resin.

Here, the first and second recording electrodes 101
In order to simplify the driving circuit, a and 101b are arranged once for each wiring electrode which can be grouped and are once arranged on the wiring substrate 10.
4 is provided, and then each group is connected to the drive circuit. For example, in the case of the M × N first recording electrodes 101a described above, a wire rod (hereinafter, referred to as a recording electrode wire rod or simply a wire rod) 310 that constitutes a recording electrode belonging to the same group from N recording electrode groups is used. N terminals 105a, ..., 1 are collected so that each terminal is connected to one terminal of the wiring board 104.
It is aggregated to 05m. As the recording electrode wire 310, a wire having an electrically insulating coating, for example, a wire with a urethane coating is generally used, which is drawn from the electrode support block 103, bundled into groups, and soldered to the wiring board 104.

Such a multi-needle recording head can be efficiently manufactured, for example, by using two molding dies 301 as shown in FIG. The molding die 301 includes a control electrode 102a (or 10
Cavity groove 305 into which 2b) is set and resin is poured
And the wire rod 3 on the jetty portions 306, 307, 308 at the edge of the cavity groove 305 so as to cross the cavity groove 305.
Wire rod holding groove 30 for arranging 10 at a constant pitch
9 and the orientation pin 302, the bundling pin 303, and the turn pin 3 for hooking the wire rod 310 on both side wall surfaces of the molding die 301 and allowing the wire rod 310 to be routed in an arbitrary direction and position.
It is equipped with 04. Cavity groove 3 of this mold 301
After setting one control electrode 102a or the like in 05, one wire 310 is attached to the pins 302, 303, 304 on both sides.
The wire rods of the recording electrodes belonging to the same group are continuously wound so as to cross the cavity groove 305 and are entwined with the same bundling pin 303 and the turn pin 304, and the M × N first wires are arranged at a constant pitch. Recording electrode 101a
All the wire rods 310 constituting the above are stretched over the cavity groove 305.

To wind the wire rod 310 around the forming die 301, as shown in FIG. 6, reciprocating linear motion of the wire rod guide means 311 in the axial direction and swing of the forming die 301 are utilized.
While applying a certain amount of tension to the wire rod 310,
02, 303, 304 and wire rod holding grooves 309, ..., 3
This is done mechanically by hooking the wire rod 310 on 09. Then, similarly, the other control electrode 102b
And a second mold (not shown) on which the wire material that constitutes the second recording electrode 101b is set, and the resin is poured into one space formed between the two cavity grooves 305, 305 that are abutted. The electrode support block 103 is formed. Butted cavity groove 30
5, 305 in the space formed by the first and second recording electrodes 101a and 101b and the control electrodes 102a and 10b.
2b are parallel to each other and arranged in the center with a fixed positional relationship, and the resin forming the electrode support block 103 is injected around the center. After the head material is obtained in this manner, the bundle of wire rods 310 is removed from the turn pin 304 and the multi-needle recording head is taken out from the molding die 301.

[0006]

However, in this conventional wiring structure, since N sets of wire rods 310 distributed from one end to the other end of the electrode support block are bundled in groups, M * N wire rods are always required. A portion 312 is formed where 310 intersects. Moreover, the wire rod 310 is wound around the molding die 301 while applying a constant tension. Therefore, when the bundle of wire rods 310 is removed from the turn pin 304, the wire rods 310 bundled for each group are arbitrarily shrunk and drawn into the complicated intersecting wire rod group, and which pin has the wire rod caught on? However, there is a possibility that it may not be known which group of recording electrodes constitutes the recording electrode.
This is because the length from the electrode support holder is different for each wire material, so that the amount of shrinkage is also different and the wire material does not shrink uniformly. For this reason,
It sometimes becomes difficult to accurately connect the wires bundled for each group to the corresponding connector parts.

Further, since 10,000 or more thousands of wire rods 310 are crossed with each other and are disjointed, there is a risk that the wire rods may be broken by hooking a tool or the like on the wire rod group during the connection work. , I do not notice it until all the wiring work is completed and the inspection is done, or it involves difficult work to identify the disconnection.

In order to solve this problem, the wire rods 310 are preliminarily divided into groups and are not wound around a molding die, but the wire rods 3
It is considered that the wire rods are divided into groups after the electrode support holders 103 harden the wire rods 10. However, 0.1-
It is extremely difficult to divide a specific tens of wires out of 10,000 or more wires that are densely packed at a pitch of 0.2 mm, which requires a huge amount of time and labor, and is not industrially practical.

The present invention is to provide a multi-needle recording head which can maintain the binding relationship of the recording electrode wires bundled for each group even if the recording electrode wires are removed from the pins, and in which the recording electrode wires are not caught when the head is assembled. To aim.

[0010]

In order to achieve the above object, the present invention provides M.times.N first recording electrodes consisting of N sets with M sets as one set and a predetermined interval in parallel therewith. The M × N second recording electrodes arranged in parallel are arranged at a constant pitch and fixed by the electrode support block.
In a multi-needle recording head in which the wire rods for each of the recording electrodes are drawn out from the electrode support block and can be grouped together, every N wire rods for the recording electrode are gathered together and connected to a wiring board, and then connected to an external drive circuit. The recording electrode wire rods are fixed to each other at least at the intersecting portions of the recording electrode wire rods.

[0011]

Therefore, even if the recording electrode wire rods bundled for each group are removed from the pins of the molding die, the relationship of all the wire rods is at least at the intersection between the bundled portion at the tip and the electrode support block. Since they are fixed, the positional relationship of the bundle of wire rods grouped on the distal end side does not change.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The structure of the present invention will be described in detail below with reference to the embodiments shown in the drawings.

FIG. 1 shows an embodiment of the multi-needle recording head of the present invention. This multi-needle recording head is a same-plane control type multi-needle recording head, and M (= 128) is set as one set and N (=
55) sets of M × N (= 7040) first recording electrodes (hereinafter, also referred to as ODD side recording electrodes) 11 and M × N (arranged in parallel in a zigzag pattern at predetermined intervals). =
7040) Two second recording electrodes (hereinafter, also referred to as EVEN-side recording electrodes) 12 and control electrodes 13 arranged on the outside along the rows of the recording electrodes 11 and 12 are arranged at a constant pitch and insulated from each other. Is solidified by the electrode support block 14 made of a conductive resin or the like.
The end faces of the electrodes 11, 12 and 13 are provided so as to be exposed from the surface of the. First and second recording electrodes 11, 1
In order to simplify the driving circuit, the groups 2 are grouped together for each recording electrode that can be grouped and connected to an external circuit. Therefore, the recording electrodes 11 and 12 are composed of the wire material 15, and the portions extracted from the electrode support block 14 are bundled for each recording electrode that can be grouped, and the wiring substrate 18 is formed.
Is soldered to. Then, the recording electrodes 11 and 12
Part 1 where the wire rods 15 intersect to bundle the groups into groups
In 6, the wires are fixed to each other. The wires 15 may be fixed to each other over all the wires 15, or the wires 15 bundled for each group may be fixed. Further, the wires 15 may be connected to each other one by one, or an adhesive film may be formed and connected to the whole. Further, the fixation of the wire rods is not limited to the portion 16 where the wire rods 15 intersect with each other, but may be spread to a portion (hereinafter, referred to as a binding portion) 17 bundled for each group. In this case, the wire 15
This is advantageous because the bundling does not collapse when it is attached to the solder bath. In the figure, reference numeral 19a is a terminal for connecting the binding portions 17 of the wire rods 15 bundled for each group, 19b is a wiring pattern, and 20 is a grouped recording electrode is further divided into groups for each arbitrary number of terminals. Connector for connecting to an external drive circuit.

Here, for example, a self-bonding wire is used as the recording electrode wire 15. Examples of the self-bonding wire include a wire with a bond and the like. When the self-bonding wire is used, the wires are fixed to each other by wire 1.
This is easily done by applying alcohol to the portion 16 where 5 intersects and drying it. It is also possible to adopt a normal urethane-coated wire as the wire material 15 and to solidify the intersecting portion 16 with an insulating adhesive such as silicon rubber. Further, as the adhesive, an ultraviolet curable adhesive or the like can be used.

The multi-needle recording head having such a structure is manufactured, for example, as follows.

First, the mold 1 will be described. The molding die 1 shown in this embodiment is a two-cavity molding die that simultaneously obtains two multi-needle recording heads, and two molding dies of the same structure that are split molds are butted and multi-needle recording is performed between them. It constitutes a cavity forming the electrode support block 14 of the head.

The mold 1 is formed with a cavity groove 2 for accommodating the control electrode 13 and injecting a resin for hardening the control electrode 13 and the wire material 15 serving as a recording electrode in parallel, and the edge of the cavity groove 2 is formed. The wire retaining grooves 3 for holding the wire 15 to be the recording electrode are formed in the jetty portions 4, 5 and 6 at a constant pitch. The control electrode 13 and the recording electrode wire 15 housed in one molding die 1 are on the ODD side, and the control electrode 1 housed in the other molding die 1 is
3 and the recording electrode wire 15 are on the EVEN side.
As shown in FIG. 2, the control electrode 13 previously soldered to the printed board 21 is arranged in the cavity groove 2 at a predetermined position by the control electrode support plate 22.

As shown in FIG. 3, on the upper surfaces of the jetty portions 4, 5 and 6, there are N sets of M sets in a direction crossing the cavity groove 2 (direction orthogonal to the axial direction of the molding die 1). M × N wire rod holding grooves 3 are formed. For example, 55 sets (a total of 7040 lines) of wire rod holding grooves 3 are formed with 128 sets as one set. The wire rod holding groove 3 is provided with a wire rod 15.
Is formed in a substantially V shape having a groove pitch substantially equal to twice the diameter of the wire and a depth and width substantially equal to the diameter, and M × N wire rods fitted with the wire rod 15 wound around the forming die 1 are fitted. 1
5 are aligned and held in parallel at a constant pitch.

Further, on the outer sides of the jetty portions 5 and 6 on both sides, the direction pins 7 _L and 7 _R on the ODD side and the EVEN side for orienting the wire 15 and the wire 15 of the same kind divided for each block are provided. Bundling pins 8 _L and 8 _R on the ODD side and EVEN side that are grouped and bundled, and turn pins 9 _L and 9 _R on the ODD side and EVEN side that entangle and rotate the wire 15 are provided,
These pins 7 _L , 7 _R on the ODD side and the EVEN side,
8 _L , 8 _R , 9 _L , and 9 _R are used to change the position and direction of the wire rod 15 to be stretched. The wire 15
It is stretched across the cavity groove 2 between the orientation pins 7 _L and 7 _R , and the jetty portion 4 between the cavity groove 2 and the cavity groove 3 and the jetty portions 5 and 6 outside the both cavity grooves 2 are provided. It is held by the formed wire rod holding groove 3. The molding die 1 is provided with a rotary shaft 10 for swingably supporting the molding die 1 on a wire rod winding machine or the like.

The orientation pins 7 _L and 7 _R are provided by 2M (= 256) each by the wire rod holding groove 3. The wire bundle pins 8 _L and 8 _R are respectively M (= 12
8) Each book is provided. Each pin 8 _R, 9 _R of ODD side, as shown in FIG. 3, four groups A ₁ of each 32, A _2, A _3, is divided into A _4, the groups A ₁ to A ₄ Are provided with a gap C occupied by 32 pins at the same pitch. Similarly, the pins 8 _L and 9 _L on the EVEN side are similarly divided into _four groups B ₁ , B ₂ , B ₃ , and B ₄ each having 32 gaps, and the pins 8 _R and O _D on the ODD side. 9 _R groups A _{1 to} A ₄
It is provided so that it may be located in the clearance C between them. Therefore, the pins 8 _R , 9 _R on the ODD side and the pins on the EVEN side,
The bundles of wire rods bundled with 8 _L and 9 _L are arranged so as not to overlap each other when they are superposed on one plane.

A multi-needle recording head is obtained in the following manner using the molding die 1 constructed as described above.

First, before starting to wind the wire 15 around the pair of molding dies 1 and 1, necessary parts such as the control electrode 13 are housed in predetermined positions in the cavity grooves 2 of the respective molding dies 1 and 1.

Then, for example, by using a winding machine as shown in FIG. 6, the pins 7 _L , 7 _R , 8 _L , 8 _R , 9 _L , 9 _R on the ODD side and the EVEN side of each molding die 1, 1 are formed. By winding or hooking the wire rods 15 on the wire rods 15, the wire rods 15 are fitted in the M × N wire rod holding grooves 3 and aligned so as to be arranged at a constant pitch so as to extend across the cavity grooves 2. These pins 7 _L , 7 _R , 8 _L , 8 _R , 9 _L , 9 _R
The wire rod 15 is hung on the first turn pin 9 _R on the ODD side so that the wire rod 15 installed in the 55th wire rod holding groove 3 of 1,129, 257, ... , 1,129,257, ..., 6913 The wire rod 15 is routed using the orientation pin 7 _R and the first wire rod bundling pin 8 _R near the 13th wire rod holding groove 3. At this time, on the EVEN side, the first on the ODD side
55 recording electrodes are hung on the first turn pin 9 _L on the EVEN side, which is the 33rd turn pin counted from the turn pin 9 _R. Next, the wire 15 is moved to the second ODD-side turn pin 9 _R and wound in order by the same procedure, and a total of 5,130,258 ,.
The wire rod 15 is dropped into the wire rod holding grooves 3 at five locations. By repeating such work, M × N (7040) wires 1
Wrap all 5 around. This state is shown in FIG. In addition, the wire rod 1 is also attached to the other forming die 1 on the other side which is similarly paired.
5 is wound, and M × N wire rods are fitted into the predetermined wire rod holding grooves 3. In order to make the winding of the wire more reliable, a member applied with a pressure that does not cut the wire slides axially on the jetty 4 at the center and does not engage with the groove 3. When there is 15, it is preferable to drop this into the groove 3.

When the M × N wire rods in each of the molding dies 1 and 1 are aligned, at least the portion 16 where the wire rods 15 intersect (the orientation pins 7 _R , 7 _L and the bundling pins 8 _R , The wire rod 15 of 8 _L ) is fixed. When a wire with a bond is used as the wire rod 15, this work is performed by applying alcohol to the intersecting portions 16 and then drying and solidifying. Further, when using a urethane-coated wire which is usually used for the wire material 15, silicon rubber or the like is attached to the intersecting portion 16 and hardened, or after the ultraviolet curable adhesive is applied to the portion. It is also possible to harden it by irradiating it with ultraviolet rays. In addition, the N applied to the turn pins 7 _{R to} 9 _L on the ODD side and the EVEN side, respectively.
(= 55) Fix the bundled portions 17 of the M bundles of the wire rods 15 with the quick-drying adhesive at the portions near the turn pins 9 _R and 9 _{L so} that the bundle of the N wire rods 15 will not be separated. Is more preferable. Then, when the wire rod 15 is fixed, the wire rod 15 pulled out from the nozzle 17 is cut.

Next, after the intersecting portions 16 of the wire 15 are solidified, the pair of molding dies 1 and 1 are attached to each other as shown in FIGS.
The cavity groove 2 and the jetty portions 4, 5 and 6 are butted so as to face each other as shown in FIG. At this time, a spacer (not shown) for maintaining a predetermined gap between the recording electrodes is interposed between the pair of butted molds 1, 1 and is interposed between the opposing jetty portions 4, 5, 6 and one of them is formed. The wire 15 forming the recording electrode of the mold 1 and the wire 15 forming the recording electrode of the other mold 1 are divided by a half pitch of the diameter of the wire 15 (P
/ 2) are arranged so that they are arranged in a staggered pattern. After that, a member (not shown) that closes both end openings of the cavity groove 2 and forms a part of the molding die is attached to both end surfaces of both the molding dies 1 and 1, and is melted alternately from the resin injection port to the cavity groove 2. Insulating resin is injected and the electrode support block 1
4 is formed and each wire 15 and the control electrode 13 etc. are fixed.

After the completion of the casting, the binding parts 17 of the wire 15 wound around the turn pins 9 _L and 9 _R are removed, and then the molding dies 1 and 1 are divided. The solidified head material is taken out together with the control electrode holding plate and the like. Then, predetermined processing such as polishing of the head surface is performed to complete the multi-needle recording head. It should be noted that there is no problem if the order of the fixation of the wire rod crossing portion 16 and the casting process is reversed.

As shown in FIG. 1, the multi-needle recording head obtained as described above has an ODD side recording electrode (first recording electrode 11) and an EVEN side recording electrode (second recording electrode 1).
Since the bundles of the M sets of wire rods 15 constituting 2) are solidified at the intersecting portions 16, the positional relations of the wire rods 15 and the bundled group relations are held without being exchanged with each other. Therefore, the binding portion 1 of the wire 15 is provided for each group.
7 is connected to the terminal portions 19a at 2M positions on the wiring board 18.

It should be noted that the above-mentioned embodiment is an example of the preferred embodiment of the present invention, but the present invention is not limited to this, and various modifications can be made without departing from the gist of the present invention.

[0029]

As is clear from the above description, in the multi-needle recording head of the present invention, the recording electrode wire rods are fixed to each other at least at the intersecting portions of the recording electrode wire rods bundled for each group. Even if the recording electrode wire rods bundled for each group are removed from the mold pins, the relationship of all the wire rods is fixed at the intersection between the bundled portion of the tip and the electrode support block. The positional relationship of the bundle of wire rods grouped on the leading end side does not change. Therefore, even if a part of the wire material is peeled from the binding portion during the soldering operation of the binding portion to the wiring board, the wire portion is not drawn into the intersecting portion, so that the relevant binding portion can be immediately known and corrected. Further, in the multi-needle recording head of the present invention, since the intersections of 10,000 or more wire rods intricately entangled with each other are fixed to each other, there is no mistake in breaking the wire rods by a tool or the like when the head is assembled. .

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a multi-needle recording head of the present invention.

FIG. 2 is a partial cross-sectional front view showing an example of a molding die used when manufacturing the multi-needle recording head of the present invention.

FIG. 3 is a development view of a molding die showing an example of an array of recording wires.

FIG. 4 is a perspective view showing a state of a pair of molding dies immediately before die matching.

FIG. 5 is a perspective view showing an example of a conventional multi-needle recording head.

6 is a perspective view showing an example of a molding die for manufacturing the multi-needle recording head of FIG.

[Explanation of symbols]

 11 First Recording Electrode 12 Second Recording Electrode 14 Electrode Support Block 15 Recording Electrode Wire Rod 16 Intersection of Wire Rod 17 Bundling Part

Claims (2)

[Claims] 1. M × N first recording electrodes consisting of N sets with M sets as one set, and M × N second recording electrodes arranged in parallel with the first recording electrodes at a predetermined interval. Are arranged at a fixed pitch and are fixed by an electrode support block.
The multi-needle recording in which the wires forming the respective recording electrodes are drawn out from the electrode support block and can be grouped into N wire members for recording electrodes which are collectively connected to a wiring board and then connected to an external drive circuit. In the head, a multi-needle recording head is characterized in that the recording electrode wire materials are fixed to each other at least at an intersecting portion of the recording electrode wire material. 2. The multi-needle recording head according to claim 1, wherein the wire is a self-bonding wire.