JPH06255166A - Multiple stylus recording head - Google Patents

Abstract

PURPOSE:To prevent inferior connection in soldering from occurring when wire rods for recording electrode are bundled each group and connected to a wiring substrate. CONSTITUTION:A part drawn out from an electrode supporting block 14 of wire rods 15 constituting the first and the second recording electrodes 11, 12 is bundled each number of rods capable of being grouped. In a multiple stylus recording head wherein the bundled part 17 is once connected to a wiring substrate 18 and connected to an external driving circuit thereafter, the bundled part 17 is fixed to an auxiliary substrate 16, and conducted to be fixed to the wiring substrate 18 via the auxiliary substrate 16. In that case, inferiority in soldering is almost gone by being compared with direct soldering to the wiring substrate 18.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-needle recording head suitable as an electrostatic recording type recording head. More specifically, the present invention relates to an improvement in the connection structure of recording electrodes of a multi-needle recording head to a wiring board.

[0002]

2. Description of the Related Art A multi-needle recording head used in an electrostatic recording system, for example, a same-plane control multi-needle recording head is generally
As shown in FIG. 8, 2 arranged at high density with a constant pitch
The row recording electrodes 101a and 101b and the two corresponding control electrodes 102a and 102b are fixed by an electrode supporting block 103 made of an electrically insulating resin or the like. For example, with M (= 128) lines as one set, N (= 5)
5) M × N (= 7040) first recording electrodes 101a in a set, and M × N (= 7040) second recording electrodes 101b arranged in parallel with the first recording electrodes 101a.
And a control electrode 10 disposed outside the row along the row of the first and second recording electrodes 101a and 101b.
2a and 102b are provided so that their respective end faces are exposed to the surface of the resin block / electrode support block 103 made of an insulating resin.

Here, the first and second recording electrodes 101
In order to simplify the driving circuit, a and 101b are arranged once for each wiring electrode which can be grouped and are once arranged on the wiring substrate 10.
4 is provided, and then each group is connected to the drive circuit. For example, in the case of the M × N first recording electrodes 101a described above, a wire rod (hereinafter, referred to as a recording electrode wire rod or simply a wire rod) 310 that constitutes a recording electrode belonging to the same group from N recording electrode groups is used. N pieces are collected and connected to one terminal of the corresponding wiring board 104, and are gathered into terminals 105a, ..., 105m composed of M through holes.

Such a multi-needle recording head can be efficiently manufactured by using, for example, a winding machine and a molding die 301 as shown in FIG. The molding die 301 has a cavity groove 3 in which the control electrode 102a (or 102b) is set and resin is poured.
05, a wire rod holding groove 309 for arranging the wire rods 310 at a fixed pitch on the jetty portions 306, 307, 308 at the edge of the cavity groove 305, and the wire rods on both side wall surfaces of the molding die 301. 310
It is provided with an orientation pin 302, a bundling pin 303 and a turn pin 304 for hooking and pulling it in an arbitrary direction and position. After one control electrode 102a or the like is set in the cavity groove 305 of the molding die 301, one wire 310 is attached to the pins 302, 303, 3 on both sides.
No. 04 is alternately entwined and continuously wound so as to cross the cavity groove 305, and the wire rods of the recording electrodes belonging to the same group are entwined with the same bundling pin 303 and turn pin 304, and the M × N first pieces are arranged at a constant pitch. Recording electrode 10
All the wire rods 310 constituting 1a are stretched over the cavity groove 305.

The wire rod 310 is wound around the forming die 301 by applying reciprocating linear motion of the wire rod guide means 311 in the axial direction and swinging of the forming die 301 while applying a certain amount of tension to the wire rod 310. Pins 302, 303, 30
4 and the wire rod holding grooves 309, ..., 309 by hooking the wire rod 310 mechanically. And
Similarly, the other control electrode 102b and the second recording electrode 1
The electrode supporting block 103 is formed by abutting against another molding die (not shown) in which the wire constituting 01b is set, and pouring resin into one space formed between the two abutting cavity grooves 305, 305. To do.
The first and second recording electrodes 101a, 1a are formed in the space formed by the butted cavity grooves 305, 305.
01b and the control electrodes 102a and 102b are parallel to each other and arranged in the center with a fixed positional relationship, and the resin forming the electrode support block 103 is injected around them.

In the multi-needle recording head obtained in this way, the bundle of wire rods 310 is removed from the turn pin 304 and the mold 3 is formed.
It is taken out from 01. After that, the connection of the recording electrodes 101a and 101b of the multi-needle recording head to the wiring board 104 is
The ends of the recording electrode wire rods 310 bundled for each group are twisted and then dipped in a solder dip bath, and the circuit board 1
Terminals 105a, ...
It is carried out by directly inserting each one into m and soldering.

[0007]

However, in this connection structure, it is not easy to insert the binding portion of the recording electrode wire 310 having solder attached to the terminals 105a, ..., 105m of the small through holes of the circuit board 104. For,
The work is complicated and troublesome wiring is likely to occur. In addition, since the solder cannot be fixed in the state where the recording electrode wire rod is attached to the molding die 310, the binding portion of the recording electrode wire rod 310 must be removed from the turn pin 304 of the molding die 310 and soldered one by one. . Therefore, when the recording electrode wire rod 310 is removed from the turn pin 304 of the molding die 310, the recording electrode wire rod 310 contracts in different directions due to the tension, and the binding relationship is broken or the recording electrode wire rod 310 itself becomes complicated. , Corresponding connection points / terminals 105a, ..., 1 of the circuit board 104
There is a problem of losing sight of 05m.

Therefore, an object of the present invention is to provide a multi-needle recording head having a structure in which solder defects are unlikely to occur when the recording electrode wires are bundled in groups and connected to a wiring board.

[0009]

In order to achieve the above object, the present invention provides M.times.N first recording electrodes consisting of N sets with M sets as one set and a predetermined interval in parallel therewith. The M × N second recording electrodes arranged in parallel are arranged at a constant pitch and fixed by the electrode support block.
In the multi-needle recording head in which the portions of the wire rods constituting the respective recording electrodes, which are pulled out from the electrode support block, are grouped into N groups that can be grouped, and the binding portions are once connected to the wiring substrate and then connected to the external drive circuit, The bundling portion is fixed to the auxiliary board and is electrically connected and fixed to the wiring board through the auxiliary board.

The auxiliary substrate is not limited to any particular wiring substrate as long as it can fix the binding portions in which the recording electrode wire rods are grouped together without separating them. The binding portions are not particularly limited. A cross-sectional shape for accommodating a semicircular through-groove provided or 2 so as to be orthogonal to the binding portion
It is preferable to use a through-hole having a semicircular through-hole when the sheets are arranged facing each other. In addition, a through hole may be formed in the auxiliary substrate.

[0011]

Therefore, if the auxiliary substrate is inserted between the forming die near each binding portion and each recording electrode wire while the N recording electrode wires to be grouped are hung on the forming die, the recording electrodes can be formed. The binding portion and the auxiliary electrode can be soldered before the wire material is removed from the mold. As a result, even if the recording electrode wire is removed from the molding die, since the recording electrode wire is soldered to the auxiliary substrate, the binding relationship and the fixing relationship do not become apart.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The structure of the present invention will be described in detail below with reference to the embodiments shown in the drawings.

FIG. 1 shows an embodiment of the multi-needle recording head of the present invention. This multi-needle recording head is a same-plane control type multi-needle recording head, and M (= 128) is set as one set and N (=
55) sets of M × N (= 7040) first recording electrodes (hereinafter, also referred to as ODD side recording electrodes) 11 and M × N (arranged in parallel in a zigzag pattern at predetermined intervals). =
7040) Two second recording electrodes (hereinafter, also referred to as EVEN-side recording electrodes) 12 and control electrodes 13 arranged on the outside along the rows of the recording electrodes 11 and 12 are arranged at a constant pitch and insulated from each other. Is solidified by the electrode support block 14 made of a conductive resin or the like.
The end faces of the electrodes 11, 12 and 13 are provided so as to be exposed from the surface of the.

In order to simplify the drive circuit, the first and second recording electrodes 11 and 12 are grouped together for each recording electrode that can be grouped and connected to an external circuit. Therefore, the recording electrodes 11 and 12 are composed of a long wire 15 for recording electrodes, and the portions extracted from the electrode support block 14 are bundled for each recording electrode that can be grouped and soldered to the wiring board 18. At this time, the wire 15
The part that is bundled for each group (hereinafter referred to as the binding part)
The auxiliary board 16 is soldered to the wiring board 17, and the auxiliary board 16 is further soldered to the wiring board 18, so that the recording electrodes 11 and 12 are grouped into the wiring board 18 respectively.
It is connected to the. Here, as the recording electrode wire material 15, a urethane-coated wire is usually adopted.
Therefore, when the molten solder is dripped on it, the urethane coating is peeled off and the wire inside is soldered.

For example, as shown in FIG. 5A, the auxiliary substrate 16 is formed by arranging a large number of semicircular through grooves 23 at a constant pitch. Here, the pitch of the through-grooves 23 is the turn pin 9 _R for bundling the wire rods 15 of the mold, for example, the mold 1 shown in FIG.
It is preferable to provide the pitch equal to 9 _L. In this case, turn pin 9 _R (or 9 _L ) and orientation pin 8
Simply by inserting the auxiliary substrate 16 between the wire 15 and the molding die 1 (under the wire 15) hung between _R (or 8 _L ) and standing up, the bundling portion 1 is formed in the through groove 23 of the auxiliary substrate 16.
7 can be inserted. Also, one auxiliary board 16
The number of through-grooves 23 provided in is not particularly limited, but it is preferable that the number is 32 rows that are connected to one connector 20 on the wiring board 18. In this case, as shown in FIG. 3, it is suitable when the binding portions 17 are alternately arranged on the right and left sides of the molding die 1 in every 32 groups and wound. In addition, the binding portion 17 of the recording electrode wire 15 is soldered around the through groove 23 of the auxiliary substrate 16 so that the auxiliary substrate 16
A wiring pattern 24 is formed to extend to the bottom of the. The wiring pattern 24 is formed on the inner surface and the periphery of the through groove 23. In this case, as shown in FIG. 6A, the binding portion 17 of the wire 15 can be sufficiently connected to the auxiliary substrate 16 by being joined to the wiring pattern 24 portion at the edge of the through groove 23 with the solder 25. FIG. 6B
The end surface of the wire 15 and the auxiliary substrate 16 cut as shown in FIG.
If the solder 25 is used for joining, the connection can be made more reliably. Further, as shown in FIG. 5B, the pressing plate 26 having a flat surface may be soldered and pressed onto the through groove 23 of the auxiliary substrate 16. in this case,
Since the lifting of the binding portion 17 can be suppressed, the soldering can be performed more reliably. Further, as shown in FIG. 5 (C), each has a through groove 23 having a semicircular cross section.
One auxiliary board 1 is prepared by preparing a number of auxiliary boards 16 and 16 ′.
6, the other auxiliary substrate 16 ′ is provided with the through grooves 23, ..., 2
When the soldering is performed so that the binding portions 17 are pressed down from above, the auxiliary substrates 1
Through holes can be formed between 6'and the through grooves 23, 23 of the lower auxiliary substrate 16, and the binding portion 17 can be soldered through the through holes. This joined state is shown in FIG. Reference numeral 19a in FIG. 1 is a terminal for connecting the binding portion 17 of the wire rods 15 bundled for each group, 19b is a wiring pattern, and 20 is a grouped recording electrode for each arbitrary number of terminals. It is a connector for separately connecting to an external drive circuit. Further, as shown in FIG. 7A, a through hole 23 ′ is provided in the auxiliary substrate 16 by punching.
The binding portion 17 may be housed by 3 '.
In this case, as shown in FIG. 7B, the auxiliary board 16 and the wiring board 18 are soldered on one plane by abutting the end surfaces of the auxiliary board 16 and the wiring board 18, respectively.

The multi-needle recording head having such a structure is manufactured, for example, as follows.

First, the molding die 1 will be described. The molding die 1 shown in this embodiment is a two-cavity molding die that simultaneously obtains two multi-needle recording heads, and two molding dies of the same structure that are split molds are butted and multi-needle recording is performed between them. It constitutes a cavity forming the electrode support block 14 of the head.

The molding die 1 has cavity grooves 2 and 3 for accommodating the control electrode 13 and for injecting a resin for hardening the control electrode 13 and the wire material 15 serving as the recording electrode, and the cavity grooves 2 and 3 are formed in parallel with each other. A wire rod holding groove 3 for holding the wire rod 15 serving as a recording electrode in the jetty portions 4, 5, 6 at the edge of the
Are formed at a constant pitch. And one mold 1
The control electrode 13 and the recording electrode wire 15 housed in
In addition to the DD side, the control electrode 13 and the recording electrode wire 15 housed in the other mold 1 are on the EVEN side. It should be noted that, as shown in FIG. 2, the cavity groove 2 is provided with a control electrode 1 previously soldered to the printed circuit board 21.
3 is arranged at a predetermined position by the control electrode support plate 22.

As shown in FIG. 3, on the upper surfaces of the jetty portions 4, 5 and 6, there are N sets of M sets in a direction traversing the cavity groove 2 (direction orthogonal to the axial direction of the molding die 1). M × N wire rod holding grooves 3 are formed. For example, 55 sets (a total of 7040 lines) of wire rod holding grooves 3 are formed with 128 sets as one set. The wire rod holding groove 3 is provided with a wire rod 15.
Is formed in a substantially V shape having a groove pitch substantially equal to twice the diameter of the wire and a depth and width substantially equal to the diameter, and M × N wire rods fitted with the wire rod 15 wound around the forming die 1 are fitted. 1
5 are aligned and held in parallel at a constant pitch.

Further, on the outer sides of the jetty portions 5 and 6 on both sides, the direction pins 7 _L and 7 _R on the ODD side and the EVEN side for orienting the wire rod 15, and the wire rod 15 of the same kind divided for each block. Bundling pins 8 _L and 8 _R on the ODD side and EVEN side that are grouped and bundled, and turn pins 9 _L and 9 _R on the ODD side and EVEN side that entangle and rotate the wire 15 are provided,
These pins 7 _L , 7 _R on the ODD side and the EVEN side,
8 _L , 8 _R , 9 _L , and 9 _R are used to change the position and direction of the wire rod 15 to be stretched. The wire 15
It is stretched across the cavity groove 2 between the orientation pins 7 _L and 7 _R , and the jetty portion 4 between the cavity groove 2 and the cavity groove 3 and the jetty portions 5 and 6 outside the both cavity grooves 2 are provided. It is held by the formed wire rod holding groove 3. The molding die 1 is provided with a rotary shaft 10 for swingably supporting the molding die 1 on a wire rod winding machine or the like.

The orientation pins 7 _L and 7 _R are provided by 2M (= 256) each by the wire rod holding groove 3. The wire bundle pins 8 _L and 8 _R are respectively M (= 12
8) Each book is provided. Each pin 8 _R, 9 _R of ODD side, as shown in FIG. 3, four groups A ₁ of each 32, A _2, A _3, is divided into A _4, the groups A ₁ to A ₄ Are provided with a gap C occupied by 32 pins at the same pitch. Similarly, the pins 8 _L and 9 _L on the EVEN side are similarly divided into _four groups B ₁ , B ₂ , B ₃ , and B ₄ each having 32 gaps, and the pins 8 _R and O _D on the ODD side. 9 _R groups A _{1 to} A ₄
It is provided so that it may be located in the clearance C between them. Therefore, the pins 8 _R , 9 _R on the ODD side and the pins on the EVEN side,
The bundles of wire rods bundled with 8 _L and 9 _L are arranged so as not to overlap each other when they are superposed on one plane.

A multi-needle recording head is obtained in the following manner using the molding die 1 constructed as described above.

First, before starting to wind the wire 15 around the pair of molding dies 1 and 1, necessary parts such as the control electrode 13 are housed in predetermined positions of the cavity grooves 2 of the respective molding dies 1 and 1.

Then, for example, by using a winding machine as shown in FIG. 9, the pins 7 _L , 7 _R , 8 _L , 8 _R , 9 _L , 9 _R on the ODD side and the EVEN side of each molding die 1, 1 are formed. By winding or hooking the wire rods 15 on the wire rods 15, the wire rods 15 are fitted in the M × N wire rod holding grooves 3 and aligned so as to be arranged at a constant pitch so as to extend across the cavity grooves 2. These pins 7 _L , 7 _R , 8 _L , 8 _R , 9 _L , 9 _R
The wire rod 15 is hung on the first turn pin 9 _R on the ODD side so that the wire rod 15 installed in the 55th wire rod holding groove 3 of 1,129, 257, ... , 1,129,257, ..., 6913 The wire rod 15 is routed using the orientation pin 7 _R and the first wire rod bundling pin 8 _R near the 13th wire rod holding groove 3. At this time, on the EVEN side, the first on the ODD side
55 recording electrodes are hung on the first turn pin 9 _L on the EVEN side, which is the 33rd turn pin counted from the turn pin 9 _R. Next, the wire 15 is moved to the second ODD-side turn pin 9 _R and wound in order by the same procedure, and a total of 5,130,258 ,.
The wire rod 15 is dropped into the wire rod holding grooves 3 at five locations. By repeating such work, M × N (7040) wires 1
Wrap all 5 around. This state is shown in FIG. In addition, the wire rod 1 is also attached to the other forming die 1 on the other side which is similarly paired.
5 is wound, and M × N wire rods are fitted into the predetermined wire rod holding grooves 3. In order to make the winding of the wire more reliable, a member applied with a pressure that does not cut the wire slides axially on the jetty 4 at the center and does not engage with the groove 3. When there is 15, it is preferable to drop this into the groove 3. Then, when the end of the wire rod 15 is fixed, the wire rod 15 pulled out from the nozzle 17 is cut.

Then, when the M × N wire rods in the respective molding dies 1 and 1 are aligned, the wire rod binding portion 17 between the bundling pins 8 _R and 8 _L and the turn pins 9 _R and 9 _L is placed. The auxiliary board 16 is installed, and the terminal portion of the auxiliary board 16 and the binding portion 17 of the wire 15 are soldered. The auxiliary substrate 16 is simply inserted by standing it up between the wire 15 hung between the turn pins 9 _R and 9 _L and the orientation pins 8 _R and 8 _L and the molding die 1 (below the wire 15). The binding portion 17 can be fitted into the through groove 23 of the. Therefore, when soldering is performed, the insulating coating of the wire 15 is melted, and the wire 15 and the wiring pattern 24 portion of the auxiliary board 16 are soldered.

Next, a pair of these molding dies 1 and 1 are shown in FIG.
The cavity groove 2 and the jetty portions 4, 5 and 6 are butted so as to face each other as shown in FIG. At this time, a spacer (not shown) for maintaining a predetermined gap between the recording electrodes is interposed between the pair of butted molds 1, 1 and is interposed between the opposing jetty portions 4, 5, 6 and one of them is formed. The wire 15 forming the recording electrode of the mold 1 and the wire 15 forming the recording electrode of the other mold 1 are divided by a half pitch of the diameter of the wire 15 (P
/ 2) are arranged so that they are arranged in a staggered pattern. After that, a member (not shown) that closes both end openings of the cavity groove 2 and forms a part of the molding die is attached to both end surfaces of both the molding dies 1 and 1, and is melted alternately from the resin injection port to the cavity groove 2. Insulating resin is injected and the electrode support block 1
4 is formed and each wire 15 and the control electrode 13 etc. are fixed.

After the casting is completed, the auxiliary board 16 and the turn pin 9
_The multi-needle recording head is taken out from the molding die by cutting the wire 15 between _R and 9 _L. Then, by fixing the auxiliary board 16 to the main wiring board 18, the wiring of the binding portion 17 of each wire 15 to the wiring board 18 is completed. Then, predetermined processing such as polishing of the head surface is performed to complete the multi-needle recording head.

It should be noted that the above-mentioned embodiment is an example of the preferred embodiment of the present invention, but the present invention is not limited to this, and various modifications can be made without departing from the gist of the present invention. For example, in the present embodiment, the ODD side recording electrode and the EVEN
32 side recording electrodes are joined to the auxiliary substrate 16 in groups of 32, and then the connector 2 of the main wiring substrate 18
Although the number of binding portions 17 is 0 or less, the number of binding portions 17 is less than or equal to that of the auxiliary substrate 1
You may make it bundle with 6. Further, when the auxiliary board 16 as shown in FIG. 7A is used, the work of housing the binding portion 17 of the wire 15 in the through hole 23 ′ of the auxiliary board 16 is performed after the winding is completed. This is performed after removing the binding portion 17 from the pins 9 _R and 9 _L.

[0029]

As is apparent from the above description, in the multi-needle recording head of the present invention, the binding portion is fixed to the auxiliary substrate, and the wiring substrate is electrically conductively fixed through the auxiliary substrate. Compared to the case of soldering directly through the through holes of the board, solder defects are almost eliminated.

According to the multi-needle recording head of the present invention,
Before removing the recording electrode wire rod from the molding die, insert the auxiliary substrate between the molding die near the binding part and each recording electrode wire rod while the N recording electrode wire rods to be grouped are hung over the molding die. Since the binding part and the auxiliary electrode can be soldered to, even if the recording electrode wire is removed from the molding die pin, the relationship of all wires is fixed by the auxiliary board, and the group relationship and fixed position relationship will change. There is no.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a multi-needle recording head of the present invention.

FIG. 2 is a partial cross-sectional front view of a molding die for explaining the manufacturing process of the multi-needle recording head.

FIG. 3 is a development view of a molding die showing an example of an array of recording wires.

FIG. 4 is an explanatory view showing a state in which an auxiliary substrate is placed on a molding die.

5A to 5C are perspective views showing an example of an auxiliary substrate.

6A to 6C are side views showing a joined state of the auxiliary substrate and the recording electrode wire.

7A and 7B are views showing another embodiment of the auxiliary board, FIG. 7A is a perspective view of the auxiliary board, and FIG. 7B is a perspective view showing a connection state of the auxiliary board and the wiring board.

FIG. 8 is a perspective view showing an example of a conventional multi-needle recording head.

9 is a perspective view showing an example of a molding die for manufacturing the multi-needle recording head of FIG.

[Explanation of symbols]

 11 First Recording Electrode 12 Second Recording Electrode 15 Recording Electrode Wire Rod 16 Auxiliary Electrode 17 Bundling Section 18 Main Wiring Board 23 Through Groove 23 'Through Hole

─────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] November 5, 1993

[Procedure Amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0006

[Correction method] Change

[Correction content]

The multi-needle recording head thus obtained is
The bundle of wires 310 is removed from the turn pin 304 and taken out from the molding die 301. After that, in order to connect the recording electrodes 101a and 101b of the multi-needle recording head to the wiring board 104, the tips of the recording electrode wire rods 310 bundled for each group are twisted and then immersed in a solder dip bath, and the wiring substrate The terminals 105a composed of through holes of the plate 104, ..., 1
This is done by directly inserting each one into the 05m and soldering.

[Procedure Amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0007

[Correction method] Change

[Correction content]

[0007]

However, in this wiring structure, it is not easy to insert the binding portion of the recording electrode wire 310 having solder attached to the terminals 105a, ..., 105m of the small through holes of the wiring board 104. For,
The work is complicated and troublesome wiring is likely to occur. Further, since a state of attaching the recording electrode wire into the mold 301 can not solder fixed, it must be carried out one by one soldered by removing the binding portion of the recording electrode wire 310 from Tanpin 304 of the mold 301 . Therefore, when the recording electrode wire rod 310 is removed from the turn pin 304 of the molding die 301 , the recording electrode wire rod 310 contracts in different directions due to the tension, and the binding relationship is broken or the recording electrode wire rod 310 itself becomes complicated. And corresponding connection points / terminals 105a, ..., 1 of the wiring board 104
There is a problem of losing sight of 05m.

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0011

[Correction method] Change

[Correction content]

[0011]

Therefore, if the auxiliary substrate is inserted between the forming die near each binding portion and each recording electrode wire while the N recording electrode wires to be grouped are hung on the forming die, the recording electrodes can be formed. The binding portion and the auxiliary board can be soldered before the wire material is removed from the mold. As a result, even if the recording electrode wire is removed from the molding die, since the recording electrode wire is soldered to the auxiliary substrate, the binding relationship and the fixing relationship do not become apart.

[Procedure amendment 4]

[Document name to be amended] Statement

[Name of item to be corrected] 0030

[Correction method] Change

[Correction content]

Further, according to the multi-needle recording head of the present invention, the auxiliary substrate for the forming die and each recording electrode is provided in the vicinity of the bundling portion while the N recording electrode wires to be grouped are hung over the forming die. Since the binding part and the auxiliary board can be soldered before inserting the wire for recording electrode from the forming die by inserting it between the wire and the wire, even if the wire for recording electrode is detached from the pin of the forming die, the relation of all the wire is maintained. It is fixed by the auxiliary board, and the group relationship and fixed position relationship do not change.

[Procedure Amendment 5]

[Document name to be amended] Statement

[Name of item to be corrected] Brief description of the drawing

[Correction method] Change

[Correction content]

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a multi-needle recording head of the present invention.

FIG. 2 is a partial cross-sectional front view of a molding die for explaining the manufacturing process of the multi-needle recording head.

FIG. 3 is a development view of a molding die showing an example of an array of recording wires.

FIG. 4 is an explanatory view showing a state in which an auxiliary substrate is placed on a molding die.

5A to 5C are perspective views showing an example of an auxiliary substrate.

6A to 6C are side views showing a joined state of the auxiliary substrate and the recording electrode wire.

7A and 7B are views showing another embodiment of the auxiliary board, FIG. 7A is a perspective view of the auxiliary board, and FIG. 7B is a perspective view showing a connection state of the auxiliary board and the wiring board.

FIG. 8 is a perspective view showing an example of a conventional multi-needle recording head.

9 is a perspective view showing an example of a molding die for manufacturing the multi-needle recording head of FIG.

[Description of Reference Signs] 11 first recording electrode 12 second recording electrode 15 recording electrode wire 16 auxiliary substrate 17 bundling portion 18 main wiring substrate 23 through groove 23 'through hole

Claims (4)

[Claims] 1. M × N first recording electrodes consisting of N sets with M sets as one set, and M × N second recording electrodes arranged in parallel with the first recording electrodes at a predetermined interval. Are arranged at a fixed pitch and are fixed by an electrode support block.
In a multi-needle recording head in which the portions of the wire rods forming the recording electrodes are grouped into N groups that can be grouped and the binding portions are once connected to a wiring board and then connected to an external drive circuit. A multi-needle recording head, wherein the binding portion is fixed to an auxiliary substrate, and is electrically connected and fixed to a wiring substrate via the auxiliary substrate. 2. The multi-needle recording head according to claim 1, wherein the auxiliary substrate is provided with a through groove having a semicircular cross-section for accommodating the binding portion. 3. The multi-needle according to claim 1, wherein two auxiliary substrates are arranged so as to face each other so as to be orthogonal to the binding portion, and a through hole is constituted by the semicircular through groove. Recording head. 4. The multi-needle recording head according to claim 1, wherein the auxiliary substrate is provided with a through hole for accommodating the binding portion.