JPH06252574A - Heat dissipating structure of printed board having heat sink - Google Patents
Heat dissipating structure of printed board having heat sinkInfo
- Publication number
- JPH06252574A JPH06252574A JP3797793A JP3797793A JPH06252574A JP H06252574 A JPH06252574 A JP H06252574A JP 3797793 A JP3797793 A JP 3797793A JP 3797793 A JP3797793 A JP 3797793A JP H06252574 A JPH06252574 A JP H06252574A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat sink
- sink
- connector
- guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ヒートシンク付プリン
ト基板の放熱構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiation structure for a printed circuit board with a heat sink.
【０００２】[0002]
【従来の技術】従来は図３に示すようにヒートシンク付
プリント基板１上の発熱部品２をヒートシンク１１から
ヒートシンク１１とガイド４間をクサビ機能をもったク
サビ型クランプ３の押圧接触によりシャーシ５に放熱さ
せる構造において、ヒートシンク付プリント基板側コネ
クタ６とマザーボード１４上のマザーボード側コネクタ
１０は、それぞれリジッドに固定されていたため、コネ
クタのかん合位置に合わせてヒートシンク１１とガイド
４間の接触部にすき間が生じないようガイド４を位置決
めして放熱させる構造であった。2. Description of the Related Art Conventionally, as shown in FIG. 3, a heat-generating component 2 on a printed circuit board 1 with a heat sink is mounted on a chassis 5 from a heat sink 11 to a heat sink 11 by pressing contact of a wedge type clamp 3 having a wedge function. In the structure for radiating heat, the printed circuit board-side connector 6 with the heat sink and the motherboard-side connector 10 on the motherboard 14 are fixed to the respective rigid, so that there is a gap in the contact portion between the heat sink 11 and the guide 4 according to the mating position of the connector. The guide 4 is positioned and heat is radiated to prevent the occurrence of heat.
【０００３】[0003]
【発明が解決しようとする課題】この従来の放熱構造で
は、ヒートシンク付プリント基板側コネクタとマザーボ
ード側コネクタがかん合したとき、ヒートシンクとガイ
ドがすき間なく接触するようにガイドの位置決めをしな
ければならない欠点があった。In this conventional heat dissipation structure, the guides must be positioned so that when the printed circuit board side connector with heat sink and the motherboard side connector are mated, the heat sink and the guides come into contact with each other without leaving a gap. There was a flaw.
【０００４】もしガイドの位置が正確でなかった場合に
は、ヒートシンクとガイドが接触しないため、所定の放
熱径路が得られず、発熱部品が過熱し破損したり、クサ
ビを無理に締め込むことによってコネクタに過大な力が
加わり、コネクタの破損を招く等の欠点があった。If the position of the guide is not correct, the heat sink and the guide do not come into contact with each other, so that a predetermined heat radiation path cannot be obtained, the heat generating component is overheated and damaged, or the wedge is forcibly tightened. There was a defect that excessive force was applied to the connector and the connector was damaged.
【０００５】そこで、本発明は、前記従来の技術の欠点
を改良して、ヒートシンクとガイドとの押圧接触を確実
に行い、また、ヒートシンク付プリント基板側コネクタ
及びマザーボード側コネクタの破損を防止しようとする
ものである。Therefore, the present invention aims to improve the above-mentioned drawbacks of the prior art so as to ensure the pressure contact between the heat sink and the guide, and prevent the damage of the printed circuit board side connector with the heat sink and the motherboard side connector. To do.
【０００６】[0006]
【課題を解決するための手段】本発明は、前記課題を解
決するため、ヒートシンク付プリント基板上の発熱部品
の熱を、ヒートシンクとガイド間をクサビ構造により押
圧接触させて、シャーシに伝導させる放熱構造におい
て、ヒートシンクの内部にフレキシブル基板を積層し、
ヒートシンク付プリント基板側コネクタを設けられたヒ
ートシンクの一部が、ガイドに押圧接触するヒートシン
クの他部に対して可動性をもつようにしたヒートシンク
付プリント基板の放熱構造を構成する。SUMMARY OF THE INVENTION In order to solve the above problems, the present invention radiates heat from a heat-generating component on a printed circuit board with a heat sink to a chassis by pressing the heat contact between the heat sink and a guide by a wedge structure. In the structure, the flexible board is laminated inside the heat sink,
A part of the heat sink provided with the printed circuit board side connector with the heat sink is movable with respect to the other part of the heat sink that presses and contacts the guide, and constitutes a heat dissipation structure of the printed circuit board with heat sink.
【０００７】[0007]
【実施例】次に本発明の実施例について図面を参照して
説明する。Embodiments of the present invention will now be described with reference to the drawings.
【０００８】図１は、本発明の一実施例を示す。FIG. 1 shows an embodiment of the present invention.
【０００９】ヒートシンク付プリント基板１と一体のヒ
ートシンク上部１２に設けられた発熱部品２から発生す
る熱は、ヒートシンク上部１２上に設けられたクサビ型
クランプ３のクサビ構造による押圧接触力によりガイド
４に伝導され、更に、シャーシ５に伝導されて放熱され
る。The heat generated from the heat-generating component 2 provided on the heat sink upper part 12 integrated with the heat sink printed circuit board 1 is applied to the guide 4 by the pressing contact force of the wedge structure of the wedge type clamp 3 provided on the heat sink upper part 12. It is conducted, and further conducted to the chassis 5 and radiated.
【００１０】ヒートシンク上部１２及びヒートシンク下
部１３の内部には、図２に示すようにフレキシブル基板
７が積層され、前記上下両部１２，１３を接続してい
る。Inside the heat sink upper part 12 and the heat sink lower part 13, a flexible substrate 7 is laminated as shown in FIG. 2 to connect the upper and lower parts 12, 13 to each other.
【００１１】ヒートシンク下部１３にはヒートシンク付
プリント基板側コネクタ６を設け、ヒートシンク上部１
２の２箇所にネジ（図示せず）により固定した一対のブ
ロック８とヒートシンク下部１３とを、図１（Ｄ）のよ
うに根元の付近にはネジが切られていない一対の特殊ネ
ジ９によりすき間ａを生じさせて固定する。このすき間
ａを生じさせる理由は、ヒートシンク付プリント基板側
コネクタ６に左右方向の可動性をもたせるためである。A printed circuit board-side connector 6 with a heat sink is provided on the lower part of the heat sink 13, and an upper part of the heat sink 1
The pair of blocks 8 and the heat sink lower portion 13 fixed by two screws (not shown) at 2 are provided by a pair of special screws 9 which are not threaded near the root as shown in FIG. 1 (D). A gap a is created and fixed. The reason why the gap a is generated is to make the printed circuit board-side connector 6 with a heat sink movable in the left-right direction.
【００１２】前記のように、ヒートシンク付プリント基
板側コネクタ６が左右方向の可動性をもってマザーボー
ド１４上のマザーボード側コネクタ１０にかん合するか
ら、クサビ型クランプ３のクサビ構造によりヒートシン
ク上部１２をガイド４に押圧接触させたとき、フレキシ
ブル基板７がたわみ、ヒートシンク上部１２とガイド４
間の接触位置誤差を吸収することができる。As described above, since the printed circuit board-side connector 6 with a heat sink engages with the mother board-side connector 10 on the mother board 14 with left-right movability, the wedge structure of the wedge type clamp 3 guides the upper portion 12 of the heat sink. The flexible substrate 7 bends when pressed against the heat sink upper part 12 and the guide 4
It is possible to absorb the contact position error between them.
【００１３】したがって、ヒートシンク上部１２とガイ
ド４との確実な押圧接触力が得られ、また、ヒートシン
ク付プリント基板側コネクタ６及びマザーボード側コネ
クタ１０の破損を防止することができる。Therefore, a reliable pressing contact force between the upper portion 12 of the heat sink and the guide 4 can be obtained, and damage to the printed circuit board side connector 6 with a heat sink and the motherboard side connector 10 can be prevented.
【００１４】[0014]
【発明の効果】以上説明したように本発明は、ヒートシ
ンク付プリント基板側コネクタに可動性をもたせたこと
により、コネクタかん合位置に対応するヒートシンクと
ガイド間の接触位置の誤差が吸収出来るため、クサビ構
造による押圧接触力は確実となり、又コネクタの破損も
防止出来る効果を奏する。As described above, according to the present invention, since the connector on the printed circuit board side with the heat sink is made movable, the error in the contact position between the heat sink and the guide corresponding to the connector mating position can be absorbed. The wedge contact structure ensures a reliable pressing contact force, and also has an effect of preventing damage to the connector.
【図１】本発明の一実施例であり、（Ａ）は正面図、
（Ｂ）は上面図、（Ｃ）は断面図、（Ｄ）はヒートシン
ク付プリント基板側コネクタの取付部の拡大図を、それ
ぞれ示す。1 is an embodiment of the present invention, (A) is a front view,
(B) is a top view, (C) is a cross-sectional view, and (D) is an enlarged view of a mounting portion of a printed circuit board-side connector with a heat sink.
【図２】本発明の一実施例におけるヒートシンク上部、
ヒートシンク下部及びフレキシブル基板の構造であり、
（Ａ）は正面図、（Ｂ）は断面図を、それぞれ示す。FIG. 2 is a top view of a heat sink according to an embodiment of the present invention,
The structure of the lower part of the heat sink and the flexible board,
(A) is a front view and (B) is a sectional view.
【図３】従来の技術であり、（Ａ）は正面図、（Ｂ）は
上面図、（Ｃ）は断面図を、それぞれ示す。FIG. 3 shows a conventional technique, (A) is a front view, (B) is a top view, and (C) is a sectional view.
１ ヒートシンク付プリント基板 ２ 発熱部品 ３ クサビ型クランプ ４ ガイド ５ シャーシ ６ ヒートシンク付プリント基板側コネクタ ７ フレキシブル基板 ８ ブロック ９ 特殊ネジ １０ マザーボード側コネクタ １１ ヒートシンク １２ ヒートシンク上部 １３ ヒートシンク下部 １４ マーザーボード 1 Printed Circuit Board with Heat Sink 2 Heat-generating Components 3 Wedge Type Clamp 4 Guide 5 Chassis 6 Connector for Printed Circuit Board with Heat Sink 7 Flexible Board 8 Block 9 Special Screw 10 Motherboard Side Connector 11 Heat Sink 12 Heat Sink Upper 13 Heat Sink Lower 14 Mother Board
Claims (2)
品の熱をヒートシンクとガイド間をクサビ構造により押
圧接触させてシャーシに伝導させる放熱構造において、
ヒートシンク付プリント基板側コネクタに可動性をもた
せ、ヒートシンクとガイド間のクサビ構造による押圧接
触を容易にさせたことを特徴とするヒートシンク付プリ
ント基板の放熱構造。1. A heat dissipation structure in which heat of a heat-generating component on a printed circuit board with a heat sink is pressed into contact between a heat sink and a guide by a wedge structure to conduct to a chassis,
A heat dissipation structure for a printed circuit board with a heat sink, characterized in that the connector on the printed circuit board side with a heat sink is made to be movable to facilitate pressure contact between the heat sink and the guide by a wedge structure.
を積層し、ヒートシンク付プリント基板側コネクタを設
けられたヒートシンクの一部が、ガイドに押圧接触する
ヒートシンクの他部に対して可動性をもつことを特徴と
する請求項１記載のヒートシンク付プリント基板の放熱
構造。2. A flexible substrate is laminated inside a heat sink, and a part of the heat sink provided with a printed circuit board-side connector with a heat sink is movable with respect to the other part of the heat sink that comes into pressure contact with the guide. The heat dissipation structure for a printed circuit board with a heat sink according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3797793A JPH06252574A (en) | 1993-02-26 | 1993-02-26 | Heat dissipating structure of printed board having heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3797793A JPH06252574A (en) | 1993-02-26 | 1993-02-26 | Heat dissipating structure of printed board having heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06252574A true JPH06252574A (en) | 1994-09-09 |
Family
ID=12512633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3797793A Withdrawn JPH06252574A (en) | 1993-02-26 | 1993-02-26 | Heat dissipating structure of printed board having heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06252574A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4213236A1 (en) * | 1991-04-22 | 1992-11-05 | Hitachi Ltd | Electrostatic photocopier with endless band image transfer mechanism - has image forming developing transfer and fixing units built as combined space-saving assembly |
| JP2010225874A (en) * | 2009-03-24 | 2010-10-07 | Toppan Printing Co Ltd | Substrate with heat sink, and housing |
| US8040688B2 (en) | 2008-06-10 | 2011-10-18 | Fujitsu Limited | Circuit board unit and electronic device |
| US8967903B1 (en) | 2012-06-20 | 2015-03-03 | General Micro Systems, Inc. | Locking displaceable frame |
| KR20200116939A (en) * | 2018-02-13 | 2020-10-13 | 후라마통 | Sub-rack assembly, rack including the same, and assembly method thereof |
-
1993
- 1993-02-26 JP JP3797793A patent/JPH06252574A/en not_active Withdrawn
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4213236A1 (en) * | 1991-04-22 | 1992-11-05 | Hitachi Ltd | Electrostatic photocopier with endless band image transfer mechanism - has image forming developing transfer and fixing units built as combined space-saving assembly |
| DE4213236C2 (en) * | 1991-04-22 | 1997-08-28 | Hitachi Ltd | Copier |
| US8040688B2 (en) | 2008-06-10 | 2011-10-18 | Fujitsu Limited | Circuit board unit and electronic device |
| JP2010225874A (en) * | 2009-03-24 | 2010-10-07 | Toppan Printing Co Ltd | Substrate with heat sink, and housing |
| US8967903B1 (en) | 2012-06-20 | 2015-03-03 | General Micro Systems, Inc. | Locking displaceable frame |
| KR20200116939A (en) * | 2018-02-13 | 2020-10-13 | 후라마통 | Sub-rack assembly, rack including the same, and assembly method thereof |
| US11792951B2 (en) | 2018-02-13 | 2023-10-17 | Framatome | Subrack assembly, associated rack and assembly method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20000509 |