JPH0625006Y2 - 回路基板 - Google Patents
回路基板Info
- Publication number
- JPH0625006Y2 JPH0625006Y2 JP1988043011U JP4301188U JPH0625006Y2 JP H0625006 Y2 JPH0625006 Y2 JP H0625006Y2 JP 1988043011 U JP1988043011 U JP 1988043011U JP 4301188 U JP4301188 U JP 4301188U JP H0625006 Y2 JPH0625006 Y2 JP H0625006Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- chip
- bonding
- electronic component
- shaped electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988043011U JPH0625006Y2 (ja) | 1988-03-31 | 1988-03-31 | 回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988043011U JPH0625006Y2 (ja) | 1988-03-31 | 1988-03-31 | 回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01146529U JPH01146529U (US06168776-20010102-C00041.png) | 1989-10-09 |
| JPH0625006Y2 true JPH0625006Y2 (ja) | 1994-06-29 |
Family
ID=31269412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988043011U Expired - Lifetime JPH0625006Y2 (ja) | 1988-03-31 | 1988-03-31 | 回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0625006Y2 (US06168776-20010102-C00041.png) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5769766A (en) * | 1980-10-17 | 1982-04-28 | Matsushita Electric Ind Co Ltd | Ship carrier |
| JPS6042620B2 (ja) * | 1980-10-17 | 1985-09-24 | 松下電器産業株式会社 | 半導体装置の封止体 |
| JPS57201839U (US06168776-20010102-C00041.png) * | 1981-06-19 | 1982-12-22 |
-
1988
- 1988-03-31 JP JP1988043011U patent/JPH0625006Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01146529U (US06168776-20010102-C00041.png) | 1989-10-09 |
