JPH06249770A - Hot-water extraction jig for wafer - Google Patents

Abstract

PURPOSE:To reduce the required amount of an extraction liquid to a minimum by a method wherein the title jig is constituted of a back-type container for a semiconductor wafer, of a first ring and a second ring which are opened partly and of a third ring which is not provided with an opening and the interleaving amount of the container is adjusted by the first and second rings. CONSTITUTION:A back-type container 2 is put on a first ring 3, and an opening part in the container 2 is set to the same direction as an opening part 4 in the ring 3. Then, a wafer 1 for analysis is put into the container 2 in such a way that it is situated in the center of the ring 3. Then, an opening part 6 in a second ring 5 is made to coincide with the opening part 4 on the container 2, the ring 3 is overlapped with the ring 5 so as to be fitted to the inside, the ring is pressurized from the upper part, and the rings 3, 5 are fitted. When an amount by which the container 2 is interleaved with the rings 3, 5 is adjusted, the amount of an extraction liquid 8 inside the container 2 can be adjusted. Then, the extraction liquid 8 is injected into the container 2, a third ring 7 is fitted to the ring 5, and hot water is extracted. By this method, a liquid amount by which the wafer 1 comes into perfect contact with the extraction liquid 8 can be reduced to a minimum.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig used for hot water extraction, which is one of the pretreatments for impurity analysis of semiconductor wafers.

[0002]

2. Description of the Related Art When analyzing the amount of impurities on the surface of a semiconductor wafer, there is a hot water extraction method as one of the pretreatment methods. This hot water extraction method is one of the analytical sample preparation methods that are widely used in inductively coupled plasma optical emission spectrometers, inductively coupled plasma mass spectrometers, atomic absorption spectrometers, ion chromatographic analyzers, etc. When extracting potential contaminant impurities such as the surface, soak in pure water, heat is applied to dissolve the impurities of the sample in the pure water, and the solution prepared as described above is used as the analytical sample pretreatment method. Is.

Table 1 shows the data obtained by rinsing the wafer after the boiled phosphate treatment using the above hot water extraction method. In Table 1, samples A to C are SiO ₂ wafers, and sample D is a Si wafer. An ion chromatographic analyzer is used as the analyzer.

[0004]

[Table 1]

As can be seen from the analysis results in Table 1, the analysis by this hot water extraction method revealed the relationship between the washing time and the residual concentration of PO ₄ ^3- , and also revealed the difference between Si and SiO _2. became. Thus, the hot water extraction method is a very effective pretreatment method.

The hot water extraction method using a conventional jig will be described below. FIG. 6 shows an external view of a jig used in a conventional hot water extraction method.

First, the analysis wafer 1 is put in a pack type container 2 formed by forming a soft resin sheet most suitable for the size of the analysis wafer 1 into a bag shape, and the pack type container 2 is made of a thin metal mesh. Square tubular cage holder 1
Put in 0.

Next, the extraction liquid is put into the pack type container 2 so that the analysis wafer 1 is completely immersed. For example, it takes about 20 for a 6 inch wafer to be completely immersed in the extract.
About 0 ml of extract is required.

Next, after the pack type container 2 is hermetically closed using the mouthpiece 11, it is immersed in a hot water bath for hot water extraction. At this time, during extraction, the pack type container 2 may float from the holder 10 in some cases, and the extraction efficiency may change.

After the extraction, the holder 10 is taken out of the hot water bath, the pack type container 2 therein is taken out, and the base 1
1 is removed, the analysis wafer 1 is taken out, and hot water extraction is completed.

[0011]

As described above, the conventional hot water extraction method using a jig is a very effective pretreatment method, but even if the holder 10 is used, the holder 10 can be used. Since the thickness and shape of itself is not suitable for the wafer shape, a large amount of extraction liquid is required, and it takes time and effort to select and arrange the pack type container 2 suitable for the wafer size for extraction.

Further, it is necessary to completely soak in a hot water bath during extraction, and when a plurality of extractions are performed at the same time, the holder 10 is considerably larger than the analysis wafer 1, so that a plurality of extractions can be performed efficiently at the same time. It cannot be extracted.

Further, the work of sealing with the mouthpiece 11 is required, work efficiency is poor, and the degree of tightness with the mouthpiece 11 is a concern when extracting using an oven instead of extracting in a hot water bath. Therefore, sealing by thermocompression bonding is required, and a jig for the thermocompression bonding is required, which requires time and effort for the crimping work.

An object of the present invention is to provide a wafer hot water extraction jig whose detection sensitivity can be improved more easily than ever before.

[0015]

According to a first aspect of the present invention, there is provided a wafer hot water extraction jig according to a first aspect of the present invention, which has a pack type container for accommodating a semiconductor wafer and a predetermined inner diameter which is partially opened. It is characterized by comprising a ring and a second ring, and a third ring having a predetermined inner diameter with no opening.

According to a second aspect of the present invention, there is provided a wafer hot water extraction jig which comprises the first ring, the second ring and the third ring.
The wafer hot water extraction jig according to claim 1, wherein the width of the ring is gradually reduced.

Further, the wafer hot water extraction jig of the present invention according to claim 3 is the first ring, the second ring and the third ring.
The wafer hot water extraction jig according to claim 1 or 2, wherein the ring is made of metal.

[0018]

By using the wafer hot water extraction jig of the present invention as set forth in claim 1, the first ring and the second ring having openings are slightly expanded when heated by hot water extraction. , The degree of sealing increases.

Further, by adjusting the amount of the pack type container sandwiched between the first ring and the second ring, the required amount of the extraction liquid can be minimized.

Further, the size of the wafer hot water extraction jig immersed in the hot water bath becomes smaller and thinner than the conventional jig. Further, by using the wafer hot water extraction jig according to the second aspect, workability at the time of assembling and disassembling the wafer hot water extraction jig is improved.

Furthermore, by using the wafer hot water extraction jig according to the third aspect, the jig is not lifted from the hot water bath during hot water extraction using the hot water bath.

[0022]

The present invention will be described in detail below based on an example.

FIG. 1 is a sectional view of a hot water extraction jig according to an embodiment of the present invention before assembly, FIG. 2 (a) is a plan view of the hot water extraction jig after assembly, and FIG. FIG. 3A to FIG. 3C are cross-sectional views taken along the line AA ′ in FIG. 2A after assembly of the hot water extraction jig, and FIGS. 3, 5 and 7 are plan views, FIG. 4 is an extraction process diagram using the hot water extraction jig, and FIG. 5 is a sectional view of the hot water extraction jig when disassembled. 1 to 5, 1 is an analysis wafer, 2 is a pack type container, 3 is a first ring, 4 is an opening of a first ring, 5 is a second ring, 6 is an opening of a second ring, 7 Indicates a third ring, 8 indicates an extract, and 9 indicates a pipette.

As shown in FIGS. 1 to 5, the wafer hot water extraction jig of the present invention comprises a first ring 3 having openings 4 and 6.
And a second ring 5, a third ring 7 having no opening, and a pack type container 2 in which a soft resin sheet is formed into a bag shape. The inner diameter of the first ring 3 is, for example, 6 for the analytical wafer 1 to be extracted. In the case of the inch size, it is formed to have a size suitable for the wafer size to be extracted, such as 16 cm, the inner diameter of the second ring 5 is set to be substantially the same as the outer diameter of the first ring 3, and the third ring 7 is The inner diameter is formed to be substantially the same as the outer diameter of the second ring 5.

The first ring 3, the second ring 5 and the third ring
Although each of the rings 7 is made of stainless steel, if the ring 7 is made of metal, the wafer hot water extraction jig can be used without being lifted from the hot water bath during extraction.

The opening 4 provided in the first ring 3
The opening 6 provided in the second ring 5 is used when the extract liquid 8 is injected around the analysis wafer 1 with the pack type container 2 sandwiched by the first ring 3 and the second ring 5. It is also used as play during assembly and disassembly of the wafer hot water extraction jig of the present invention.

Further, the widths of the first ring 3, the second ring 5 and the third ring 7 are formed so as to become shorter in order to improve workability when assembling and disassembling the jig.

Next, a hot water extraction process using the wafer hot water extraction jig of one embodiment of the present invention will be described with reference to FIGS. 4 and 5. First, the pack type container 2 is placed on the first ring 3.
Put. At this time, the opening of the pack type container 2 and the first
The ring 4 has the same direction as the opening 4 serving as the extract injection port. After that, the first ring 3 is placed in the pack type container 2.
The analysis wafer 1 is placed so as to be located at the center of the (FIGS. 4A and 4B).

Next, the position of the opening 6 of the second ring 5 and the position of the opening 4 of the first ring are aligned on the pack type container 2, and the first ring 3 is positioned inside the second ring 5. The first ring 3 and the second ring 5 are fitted to each other by superposing them so as to be fitted and applying a force from above (FIG. 4 (c)). At this time, since the first ring 3 and the second ring 5 are in a fitted state, the inside of the pack type container 2 is kept in the shape of an analysis wafer. Further, by adjusting the amount of the pack type container 2 sandwiched by the first ring 3 and the second ring 5, the amount of the extraction liquid 8 in the pack type container 2 can be freely changed.

Next, the extraction liquid 8 is put into the pack type container 2 using the pipette 9 through the opening 4 of the first ring 3 and the opening 6 of the second ring 5 (FIG. 4 (d)). . For example, when the analysis wafer 1 is a 6 inch wafer, when about 40 ml of the extraction liquid 8 is injected, the analysis wafer 1 is completely in contact with the extraction liquid 8, and about 200 ml is required for the conventional jig. Compared with what was there, the amount of extract required is 1/5, and the detection sensitivity is improved by 5 times.

Next, the second ring 5 and the third ring 7 are fitted in the same manner as described above (FIG. 4 (e)). by this,
The opening 4 of the first ring 3 and the opening 6 of the second ring 5 are closed, but the second ring 5 is rotated about 90 ° to the right or the left, and the opening 4 of the first ring 3 and the second ring 5 are rotated. It is possible to further increase the degree of sealing by shifting the position of the ring 5 with respect to the opening 6.

Next, after performing hot water extraction by the conventional method,
As shown in FIG. 5, the outer diameter of the first ring 3 is reduced by applying a force to the first ring 3 (in the direction of the arrow in FIG. 5) to reduce the opening 4. Then, the first ring 3 is lifted upward (in the direction of the arrow in FIG. 5) to remove the first ring 3 from the inside of the second ring 5. Similarly, the second ring 5 is removed from the third ring 7, the analysis wafer 1 is taken out from the pack type container 2, and the extraction is completed.

When a hot water bath is used in the above hot water extraction, the first ring 3, the second ring 5 and the third ring 7 are used.
Due to its weight, the pack type capacity is completely immersed in the hot water bath, so there is no worry of rising up on the way. Further, even when an oven is used, the first ring 3, the second ring 5 and the third ring 7 are slightly expanded by heating, so that the degree of adhesion is increased and hot water extraction is performed without the need for thermocompression bonding. be able to.

[0034]

As described above in detail, the following effects can be obtained by using the present invention described in claim 1.

First, by adjusting the amount of the pack type container sandwiched by the first ring and the second ring, it is possible to freely adjust the amount of the extraction liquid, and the analysis wafer comes into complete contact with the extraction liquid. The extract volume can be minimized.

Secondly, the wafer hot water extraction jig of the present invention has a ring shape, can be made compact and thin, and can extract a plurality of wafers at the same time.

Thirdly, it can be easily sealed without requiring a special jig and work, and extraction can be performed in either a hot water bath or an oven.

Fourth, it is not necessary to spend time in selecting and arranging the pack type container.

Further, by using the present invention described in claim 2, the work efficiency at the time of assembling and disassembling the wafer hot water extraction jig is improved.

Further, by using the present invention according to claim 3, the pack type container is a hot water bath when hot water extraction is performed using the hot water bath due to the weight of the first ring, the second ring and the third ring. It is possible to maintain a constant extraction efficiency without floating from above, without causing a change in heat conduction,
Work can be done quickly, easily and accurately.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a hot water extraction jig of one embodiment of the present invention before assembly.

FIG. 2A is a plan view of the hot water extraction jig after assembly, and FIG. 2B is a sectional view of the hot water extraction jig after assembly.

3A is a plan view of a first ring, FIG. 3B is a front view of a second ring, and FIG. 3C is a plan view of a third ring.

FIG. 4 is an extraction process diagram using the hot water extraction jig.

FIG. 5 is a sectional view of the hot water extraction jig when disassembled.

FIG. 6 is an external view of a conventional wafer hot water extraction jig.

[Explanation of symbols]

 1 wafer for analysis 2 pack type container 3 first ring 4 opening of first ring 5 second ring 6 opening of second ring 7 third ring 8 extract 9 pipette

Claims (3)

[Claims] 1. A pack type container for storing a semiconductor wafer, a first ring and a second ring which are partially opened and have a predetermined inner diameter, and a third ring which has no opening and has a predetermined inner diameter. A hot water extraction jig for wafers, which comprises a ring. 2. The wafer hot water extraction jig according to claim 1, wherein the widths of the first ring, the second ring and the third ring are sequentially reduced. 3. The wafer hot water extraction jig according to claim 1, wherein the first ring, the second ring and the third ring are made of metal.