JPH06242145A - Probe pin and its forming method - Google Patents

Abstract

PURPOSE:To prevent adjacent extremely thin wires from mutual contact so as to examine more detailed part by projecting each end parts of plural metal extremely thin wires from a resin base plate toward the outside by the fixed length and supporting all the projecting part in a straddle mounting condition. CONSTITUTION:In a probe pin 8, mutual contact between adjacent extremely thin wires 3 can be prevented, because the extremely thin wires 3 in a projecting part, which projects from a resin base plate 1a and a holding base 1b, can maintain a pitch precision as it is when a wiring arrangement is finished by a base plate 1b, in which a wiring arrangement has already finished. On the other hand, stiffness of the pin 8 is improved as the extremely thin wires 3 are supported by straddle mounting, so that a projecting part L can be set largely in the pin 8. Therefore, examination over more detailed part is made possible.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a liquid crystal display (L
The present invention relates to a probe unit used when inspecting electrical conductivity of a CD, a semiconductor integrated circuit (IC), and the like, and particularly to a probe pin having excellent rigidity and a stable shape, and a method for forming the probe pin.

[0002]

2. Description of the Related Art For probe pins in this type of probe unit, the probe pin pitch is narrowed (for example, a fine pitch of 300 μm or less) in response to a demand for an increase in the number of pixels due to the recent improvement in image quality. The present inventors have been required to apply for a patent first (October 2, 1992).
(Submitted on date 0), this requirement proposed a "probe unit manufacturing method" that can be satisfied.

To explain the main points, first, a metal ultrafine wire (hereinafter referred to as "extrafine wire"), which is a conductor wire, is manually applied onto a rectangular mother board made of resin having a rectangular opening window in the center. At this time, a concave groove having a shape for holding the lower portion of the ultrafine wire is formed in advance on the surface of the mother substrate corresponding to the contact portion, and the ultrafine wire is mounted and positioned in this concave groove. After this, the resin substrate on which the wiring has been completed, which is energized and heated to the ultrafine wire and fusion-fixed (hereinafter referred to as "wiring") to the surface of the ultrafine wire, is in the state shown in FIG.

After that, a constant outward tension is applied to both the resin substrate 1a and the holding substrate 1b (see FIG. 2) left after cutting off both edges 1c and 1d of the opening window 2. In this state, as shown in FIG. 3, the dies 4a, 4b, 4c are sequentially actuated to bend the ultrafine wire 3, and finally, the holding substrate 1b.
By cutting the ultrafine wire 3 at a position C close to, the probe unit 5 having the probe pin shape shown in FIG. 4 is obtained. The tip portion 6a (corresponding to a contact) of the probe pin 6 is bent so as to have a roundness, and the slight variation in the wiring pitch of the ultrafine wire 3 causes the probe pin tip portion 6a to be on the surface to be inspected. It can be absorbed by sliding.

[0005]

By the way, in the above manufacturing process, since positioning is performed by hand when wiring the mother board, the extra fine wire is apt to be twisted, and after the wiring shown in FIG. 1 is completed. The extra-fine wire 3 on the mother substrate 1 is in a state in which the internal stress due to the twist is contained. Therefore, when the cantilevered probe pins shown in FIG. 4 are finally formed by removing the portions 1b, 1c, 1d of the mother substrate that are unnecessary for forming the probe pins, the portions L protruding from the resin substrate 1a,
That is, it has become clear that if the total length of the probe pin 6 is made longer, there arises a disadvantage that the adjacent ultrafine wires 3 come into contact with each other due to the appearance of twist due to the release of the regulation of the internal stress. Therefore, at present, in order to avoid such inconvenience, the probe pins 6 are relatively short in length for the inspection, but it is not always possible to completely avoid the occurrence of defective products, and more detailed inspection is not possible. There is a situation in which the probe pin is not an effective probe pin for the object to be inspected.

The present invention has been made under such circumstances, and its purpose is to eliminate the influence of twisting while acting on the ultrafine wires to avoid contact between the adjacent ultrafine wires, and to remove them from the resin substrate. It is an object of the present invention to provide a probe pin that has a protruding portion larger than that of a conventional one, and that enables more detailed inspection, and a method for forming the same.

In the probe pin according to the present invention (the invention of claim 1) which can achieve the above object, each end portion of a plurality of metal ultrafine wires arranged and arranged at a predetermined pitch on a resin substrate is provided. The gist of the present invention is to provide a probe pin protruding outward from the resin substrate by a certain length, in which all the metal fine wires in the protruding portion are supported in a double-supported state. Further, in the method of forming a probe pin according to the present invention (the invention of claim 2), a plurality of metal ultrafine wires are predetermined on a mother board in which a rectangular opening window is formed in the central portion of the mother board. After arranging and arranging for each pitch and cutting off the portions of the mother substrate corresponding to both edges of the opening window, one of the remaining mother substrates is used as a holding substrate and the other is used as a resin substrate, and then the resin A method for forming a metal ultrafine wire between a substrate and the holding substrate on a probe pin, wherein the holding is performed such that the lowermost end of the formed metal ultrafine wire is located below the horizontally arranged resin substrate. Bend the substrate in the direction of the resin substrate,
The gist of the present invention is to fix the holding substrate to the resin substrate or the probe unit holding member.

[0008]

The present invention forms a probe pin by using a holding substrate 1b that has been completed wiring, which has been unnecessary in the past (see FIGS. 1 to 3), and holds all ultrafine wires in a double-supported manner. Therefore, the internal stress due to the twist acting on the ultrafine wire is not released, and the pitch accuracy at the completion of the wiring can be maintained as it is. Also, since the ultrafine wire is supported by both ends, the rigidity of the probe pin is improved, and it becomes possible to form a probe pin with a large protruding portion from the resin substrate, which was impossible in the past, and more detailed inspection is possible. .

Further, the shape of the probe pin can be formed into a loop shape which could not be formed in the related art in relation to the pitch accuracy, and the rigidity of the probe pin can be easily increased only by changing the loop shape. Since it can be adjusted, it can be easily applied to various inspection objects.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 5 is a process drawing for explaining the method of forming the probe pin according to the present invention. As shown in FIG. 5A, the resin substrate 1a is gripped and fixed, and a predetermined tension is applied to the holding substrate 1b to bring the ultrafine wire 3 between the substrates 1a and 1b into a tensioned state.

In this state, as shown in FIG. 5 (b), the first mold 7a of the mold device 7 is brought into contact with the fine wire 3 and the fine wire 3 is tilted downward along the mold 7a. The second mold 7b is pressed against the mold 7a, and the ultrafine wire 3 is inclined forward when viewed from the resin substrate 1a (downward in the drawing). Then, as shown in FIG.
Is pushed upwards in the drawing along the second mold 7b,
The third die 7c is pressed against the die 7b to form a bent portion corresponding to the lower end portion which is a so-called contactor.

Next, as shown in FIG. 5D, the second die 7
Although the fourth mold 7d is brought into contact with the ultrafine wire 3 instead of b, the uppermost surface of the fourth mold 7d in the contact state is the resin substrate 1
A mold is used that substantially coincides with the top line of the ultrafine wire 3 laid on a. Next, as shown in FIG. 5 (e), the ultrafine wire 3 is tilted to the left in the drawing along the fourth die 7d, and the fifth die 7e is pressed against the fourth die 7d. 5 along the fourth mold 7d to the left in the drawing,
As shown in (f), the sixth die 7f is pressed against the fourth die 7d.

Finally, as shown in the figure, the holding substrate 1b
Is pressed so that the fine wire 3 on the holding substrate 1b and the fine wire 3 on the resin substrate 1a overlap each other, and then the molds 7a, 7
When c, 7e, 7f and 7d are released, the probe pin 8 according to the present invention as shown in FIG. 6 is obtained.

In such a probe pin 8, since the fine wire 3 in the portion projecting from the resin substrate 1a and the holding substrate 1b can maintain the pitch accuracy as it is when the wiring is completed, the contact between the adjacent fine wires is prevented. It can be avoided.
Further, since the ultrafine wire 3 is supported by both ends, the rigidity of the probe pin 8 is improved, and as a result, the protruding portion L can be set large for the probe pin, so that more detailed inspection is possible. Becomes

In the above embodiment, the holding substrate 1b is superposed on and fixed to the resin substrate 1a.
Although it is formed in a double-supported state, it is not necessarily limited to the fixing to the resin substrate 1a, and as long as the ultrafine wire 3 can be supported in the double-supported state by being fixed to a probe unit holding member or the like, The effect is obtained.

Further, in the above embodiment, since the formation of the probe pin having a relatively high rigidity was taken into consideration, strong bending was performed using the first to sixth molds as shown in FIG.
Depending on the characteristics of the object to be inspected, it is possible to prevent damage to the object to be inspected by forming the probe pin in a loop shape with a small number of molds and weakening the contact force of the probe pin to the object to be inspected. .

[0017]

The present invention is configured as described above, but the point is to use a probe pin in which all ultrafine wires are supported by both ends by using a holding substrate that has been completed wiring, which has been conventionally unnecessary. Therefore, the internal stress due to the twist acting on the ultrafine wire is not released, and the pitch accuracy at the time of completing the wiring can be maintained as it is. Further, since the ultrafine wire is supported by both ends, the rigidity of the probe pin is improved, and it is possible to perform more detailed inspection so that a probe pin with a large protruding portion from the resin substrate, which was impossible in the past, can be formed. . Furthermore, the probe pin shape can be formed into a loop shape that could not be formed in the past in relation to the pitch accuracy, and the rigidity of the probe pin can be easily adjusted by simply changing the loop shape. Therefore, it can be easily applied to various inspection objects.

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing a resin substrate on which wiring is completed.

FIG. 2 is a schematic perspective view showing a resin substrate immediately before starting a probe pin forming step.

FIG. 3 is a schematic explanatory diagram showing a conventional probe pin forming method.

FIG. 4 is a schematic perspective view showing a shape of a probe pin obtained by a conventional forming method.

FIG. 5 is a process explanatory view showing a method for forming a probe pin according to the present invention.

FIG. 6 is a schematic perspective view showing the shape of a probe pin of the present invention obtained by the molding method of the present invention.

[Explanation of symbols]

 1 Mother Substrate 1a Resin Substrate 1b Holding Substrate 2 Opening Window 3 Ultra Fine Wire 4 Mold Device 6,8 Probe Pin 7a, 7b, 7c, 7d, 7e, 7f Mold

Claims (2)

[Claims] 1. A probe pin in which each end portion of a plurality of metal ultrafine wires, which are arranged and fused and fixed at a predetermined pitch on a resin substrate, protrudes outward from the resin substrate by a predetermined length, A probe pin, wherein all of the metal ultrafine wires in the protruding portion are supported in a double-supported state. 2. A plurality of metal ultrafine wires are arranged at a predetermined pitch on the mother substrate in which a rectangular opening window portion is formed in the central portion of the rectangular plate-shaped mother substrate and are fused and fixed, After the portions of the mother substrate corresponding to both edges of the opening window are cut off to leave one of the mother substrates as a holding substrate and the other as a resin substrate, a metal microfiber between the resin substrate and the holding substrate is used. A method of forming a wire on a probe pin, wherein the holding substrate is bent in the direction of the resin substrate so that the lowermost end of the formed metal ultrafine wire is located below the horizontally arranged resin substrate. ,
A method for forming a probe pin, comprising fixing the holding substrate to the resin substrate or a probe unit holding member.