JPH06241634A - Evaporation cooling device - Google Patents

Abstract

PURPOSE:To obtain an evaporation type cooling device, capable of changing quickly without delay when the cooling degree of the device is to be changed. CONSTITUTION:A passage 2, through which material to be cooled is passed, is formed in a flat plate type heat exchanger 1. A plurality of cooling liquid supplying ports 3, 4, 5, 6, 7, 8, 9, 10 are provided around the outer periphery of the heat exchanger l. Respective cooling liquid supplying ports 3, 4, 5, 6, 7, 8, 9, 10 are connected to a cooling liquid pipe through valves 11, 12, 13, 14, 15, 16, 17, 18. The amount, pressure and direction of cooling liquid for the heat exchanger 1 is controlled to regulate the thickness of cooling liquid film, formed on the outer surface of the heat exchanger 1, and control the cooling degree of the cooling liquid.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an object for evaporative cooling of an object to be cooled by evaporating cooling water supplied into a cooling chamber. Specifically, the present invention relates to a cooling device for a reaction kettle that performs various reactions, and a vaporization cooling device for foods, pharmaceuticals, paper / pulp, fibers and the like.

[0002]

2. Description of the Related Art As a conventional reactor cooling device, for example, there is one disclosed in Japanese Patent Laid-Open No. 4-180829.
This forms a cooling fluid chamber in contact with the cooling container, connects a cooling water supply pipe for supplying cooling water to the fluid chamber, connects the fluid chamber to a vacuum pump, and forms a gap on the outer wall of the cooling container. By providing a gas-liquid separation functional polymer membrane through the cooling liquid, by supplying the cooling liquid between the outer wall of the cooling container and the gas-liquid separation functional polymer film, a uniform water film around the entire circumference of the cooling container. By forming and evaporative cooling, prevent uneven cooling,
The quality of the product can be kept constant.

[0003]

The above-mentioned conventional device has a problem that a time delay occurs when the degree of evaporative cooling, that is, the amount of transferred heat is changed. This is because the transferred heat amount is changed by operating the vacuum pump to change the degree of vacuum of the fluid chamber or changing the liquid temperature of the cooling liquid to be supplied. It takes a certain amount of time from the operation of the vacuum pump to the actual change in the degree of vacuum in the fluid chamber, and there is a delay from the adjustment of the cooling liquid temperature to the actual change in the fluid chamber temperature. Of.

For example, in a reaction vessel, it is necessary to accurately adjust the temperature in the course of the reaction, and if a time delay occurs, the reaction product may be deteriorated or damaged.

Therefore, a technical object of the present invention is to obtain an evaporative cooling device capable of controlling the cooling temperature with high accuracy by making it possible to control the degree of evaporative cooling, that is, the amount of heat transferred, without causing a time delay. That is.

[0006]

The structure of the evaporative cooling apparatus of the present invention is as follows. In a system for supplying a cooling liquid to an object to be cooled and cooling the object to be cooled by the heat of vaporization of the cooling liquid, a cooling liquid supply port for supplying the cooling liquid is formed, and the cooling liquid supplied from the cooling liquid supply port is The amount of cooling heat from the object to be cooled is controlled by controlling the pressure, the flow rate, the direction, etc. to adjust the film thickness of the cooling liquid film formed on the surface of the object to be cooled.

[0007]

The cooling liquid is supplied from the cooling liquid supply port to the surface of the object to be cooled, and the cooling liquid removes heat from the object to be cooled and evaporates and vaporizes, whereby the object to be cooled is cooled. The amount of heat transferred from the object to be cooled to the cooling liquid changes depending on the thickness of the cooling liquid film formed on the surface of the object to be cooled. That is, when the cooling liquid film is relatively thin, the amount of vaporization of the cooling liquid is large and the amount of transferred heat is also large, so that the object to be cooled is further cooled. When the cooling liquid film becomes thick, the amount of vaporization of the cooling liquid becomes small and the amount of transferred heat becomes small, so that the cooling degree of the object to be cooled decreases. Therefore, by controlling the pressure, flow rate, direction, etc. of the cooling liquid supplied from the cooling liquid supply port, the amount of heat transferred can be controlled by changing the thickness of the cooling liquid film formed on the surface of the object to be cooled. You can Since the thickness of the cooling liquid film changes immediately when the pressure, flow rate, direction, etc. of the cooling liquid are changed, the cooling degree can be changed without causing a time delay.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The illustrated embodiment will be described in detail. In this embodiment, a flat plate heat exchanger is used as the evaporative cooling device. A passage 2 for an object to be cooled is formed inside a flat plate heat exchanger 1. The object to be cooled can pass through the passage 2 from the lower side to the upper side. A plurality of cooling liquid supply ports 3, 4, 5, 6, for supplying the cooling liquid to both outer surfaces of the heat exchanger 1.
7, 8, 9, 10 are arranged. Although not shown, each supply port is preferably formed in a nozzle shape. The respective supply ports 3, 4, 5, 6, 7, 8, 9, 10 are valves 11, 12, 13, 14, 15, 16, 17, 18, respectively.
To the cooling liquid pipe. The cooling liquid supply ports 3 and 4 supply the cooling liquid to the heat exchanger 1 from vertically above to below. The supply ports 5 and 6 supply the cooling liquid to the heat exchanger 1 obliquely from above. Similarly, the supply ports 7 and 8 supply from the horizontal direction, and the supply ports 9 and 10 supply from diagonally below. Each valve 11, 12, 13, 14, 15, 16, 1
It is desirable that the valves 7 and 18 can be fully opened and closed and the valve opening can be adjusted in order to control the pressure, flow rate, direction, etc. of the cooling liquid.

In order to evaporatively cool the heat exchanger 1 to cool the object to be cooled in the passage 2, the respective cooling liquid supply ports 3, 4,
Coolant is supplied to the heat exchanger 1 from 5, 6, 7, 8, 9, and 10. The cooling liquid located on the heat exchanger 1 absorbs heat of the object to be cooled in the passage 2 and vaporizes to cool the object to be cooled. The vaporized vapor diffuses into the atmosphere. The amount of heat transferred to the heat exchanger 1 can be changed without changing the thickness of the cooling liquid film formed on the heat exchanger 1 without causing a time delay. The thickness of the cooling liquid film can be changed by changing the respective valves 11, 12, 13, 14, 15, 16, 1.
This can be done by changing the pressure, flow rate, direction, etc. of the cooling liquid by opening / closing 7, 18 or adjusting the valve opening.

In this embodiment, the flat heat exchanger 1 is used as the evaporative cooling device. However, the heat exchanger is not limited to the flat heat exchanger, and may be, for example, a cylinder or a roll. Alternatively, a conventionally known heat exchanger such as a conical shape or a rectangular shape can be used. Further, it is also possible to use a heat exchanger that accommodates a predetermined amount of the object to be cooled and cools it intermittently, instead of the object to be cooled flowing down.

In this embodiment, the vaporized vapor of the cooling liquid is diffused into the atmosphere, but the outer periphery of the heat exchanger is divided into chambers and the cooling liquid is supplied into the chamber and vaporized. It is also possible to suck the vapor into a predetermined place by sucking it with a suction pump that communicates with the chamber.

[0012]

The present invention has the following effects. By changing the pressure, flow rate, direction, etc. of the cooling liquid supplied from the cooling liquid supply port, it is possible to adjust the thickness of the cooling liquid film and change the amount of heat transferred without causing a time delay. It is possible to prevent deterioration and damage of the object and to cool it with high accuracy.

[Brief description of drawings]

FIG. 1 is a configuration diagram of an embodiment of an evaporative cooling device of the present invention.

[Explanation of symbols]

 1 heat exchanger 2 passages 3, 4, 5, 6, 7, 8, 9, 10 cooling liquid supply port

Claims (1)

[Claims] 1. A cooling liquid supply port for supplying a cooling liquid, wherein the cooling liquid is supplied to a cooling target to cool the cooling target by heat of vaporization of the cooling liquid. Controlling the amount of cooling heat from the object to be cooled by controlling the pressure, flow rate, direction, etc. of the supplied cooling liquid to adjust the film thickness of the cooling liquid film formed on the surface of the object to be cooled. Evaporative cooling device.