JPH06239381A - Holder for electronic part with many leads - Google Patents

Abstract

PURPOSE:To prevent trouble, where an electronic part with many leads projecting laterally from the sides of the package is, for example, conveyed by means of a holder, relating to bending and deformation of the leads by vibration or the like. CONSTITUTION:A plurality of projections 3 extending along the sides of an electronic part A are formed on a base 2. The projections 3 support the leads C of the electronic part A at the bases C1 in such a manner as to hold the electronic part A securely against slippage.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION In the present invention, as shown in FIG. 14, for example, a large number of lead wires C are formed from the outer peripheral surface of a package portion B.
Or a flat package type electronic component A in which each of the lead wires C is bent downward in the vicinity of the root of the lead wire C and the tip of the lead wire C is soldered to a printed circuit board or the like. The present invention relates to a holder used when performing a thermal shock test on the electronic component A.

[0002]

2. Description of the Related Art A quad-type flat formed by projecting a large number of lead wires C from four side surfaces of a package portion B, bending each lead wire C downward, and further bending the tip of each lead wire C horizontally. Conventionally, when carrying an electronic component A such as a packaged IC, a synthetic resin holder (carrier) 20 having a configuration as shown in FIG. 14 has been used.

That is, the holder 20 is formed by vertically and horizontally arranging a space 22 having a rectangular shape in a plan view into which a electronic component A is fitted on a plate-shaped base body 21, and the electronic component A is placed in each recess 22. It was fitted and placed, and a plate-shaped or mesh-shaped cover body 23 was stretched on the upper surface of the base body 20.

[0004]

However, in the conventional holder 20, the tips of the lead wires C in the electronic component A are directly in contact with the bottom surface of the recess 22, that is, in other words,
Since the weight of the electronic component A is supported by the tip of the lead wire C, the weight of the electronic component A acts as a moment on the lead wire C, while each lead wire C is very thin. When the electronic component A bounces or is displaced in the recess 22 due to vibration during transportation, a large impact is applied to the lead wire C, and the lead wire C is bent and deformed, which can be mounted on a printed circuit board or the like. There was a problem that many accidents disappeared.

The holder 20 is also used in the thermal shock test of the electronic component A. The electronic component A is fitted into each recess 22 of the holder 20, and the surface of the holder 20 is mesh-shaped. After the cover body 23 is stretched, the holder 2
By alternately immersing 0 in a cold and hot liquid bath of about -50 ° C and a hot liquid bath of about + 150 ° C multiple times, the electronic component A
After thermal shock is applied to the electronic component A, the electronic component A is taken out and the performance is inspected.

In this case, after the holder 20 is pulled up from the cold / hot liquid tank and the hot liquid tank, the holder 20 is rocked up and down to shake off the liquid from the holder 20, so that the electronic component A is recessed. There is a problem that the lead wire C is vibrated violently in 22 and a large impact force is applied to the lead wire C. Therefore, in the thermal shock test, the adverse effect of the bending deformation of the lead wire C appears remarkably.

An object of the present invention is to provide a holder which prevents the lead wire from bending and deforming.

[0008]

In order to achieve this object, the present invention is a holder for an electronic component, which is formed by projecting a large number of lead wires from at least two opposite side surfaces of a package portion. Then, the plate-shaped base body is provided with the projections that support the roots of the lead wires of the electronic component so as to extend along the side surfaces of the package portion.

[0009]

As described above, with the structure in which the root of the lead wire is supported, the weight of the electronic component hardly acts as a moment on the lead wire. Does not bend and deform even if the wire tends to bounce in its thickness direction.

Further, since the projections are close to the side surfaces of the package portion of the electronic component, the projections serve as stoppers against the displacement movement of the package portion of the electronic component, so that the displacement movement of the electronic component causes a large amount to the lead wire. No impact force is applied. Therefore, according to the present invention, when an electronic component having a large number of lead wires is carried by a holder, an accident in which the lead wires are bent and deformed due to vibration during carrying is prevented or significantly reduced. Has the effect that can.

[0011]

Embodiments of the present invention will now be described with reference to the drawings (FIGS. 1 to 1).
A description will be given based on 3). 1 and 2 show a first embodiment when applied to a holder for transporting an electronic component A, and the holder is indicated by reference numeral 1. The holder 1 is made of a conductive synthetic resin that is capable of holding a ground function, and has four protrusions extending along a side surface of the package portion B of the electronic component A on the plate-shaped base body 2. A large number of frame bodies 4 made of strips 2 are formed in a state of being aligned vertically and horizontally, and the projections 3 of each frame body 4 support the root C1 of the lead wire C in the electronic component A.

At this time, in the state where the electronic component A is supported by the frame body 4, the respective protrusions 3 come into close contact with the outer surface of the package portion B of the electronic component A, and the outer surface of the protrusion 3 and the vertical portion C2 of the lead wire C. It is set so that there is a slight gap between. In this way, when the root C1 of the lead wire C of the electronic component A is supported by the protrusion 3, even if the electronic component A bounces in its thickness direction, the weight of the electronic component A becomes a large momentum with respect to the lead wire C. The projection 3 serves as a stopper against the lateral displacement of the package part B in the electronic component A, and the lateral displacement of the electronic component A can be almost eliminated. Accidents in which C is bent and deformed can be prevented or significantly reduced.

By the way, the reason why the holder A is made of a conductive synthetic resin is that when the person or object touches the lead wire C of the electronic component A while the electronic component A is held, the person or object is charged. This is to prevent the generated static electricity from being released and damaging the semiconductor chip or the circuit of the electronic component A. In this case, the lead wire C of the electronic component A, as in the conventional example shown in FIG.
When contacting the bottom of the recess 22 with static electricity, static electricity can be released, but bending and deformation of the lead wire C cannot be prevented. On the other hand, as shown in FIG.
When only the package portion B of the electronic component A is supported by the frame portion 24, the bending deformation of the lead wire C can be prevented, but the semiconductor chip and the circuit due to static electricity cannot be prevented. Since the engagement depth of the package part B with respect to the frame part 24 is shallow, the electronic part A
There is a problem that it is easy to drop.

On the other hand, according to the structure of the present invention, since the lead wire C and the holder 1 are electrically conducted, the function of releasing static electricity is not impaired, and therefore static electricity causes a semiconductor chip. It is possible to prevent both the damage to the lead wire and the bending deformation of the lead wire C. Further, since the electronic component A is deeply fitted into the frame body 4,
It is possible to prevent the electronic component A from falling off.

FIG. 4 shows a second embodiment which is a modification of the first embodiment. In the second embodiment, the portion of the base body 2 surrounded by the frame 4 is hollowed out. Is. When the electronic component A is carried by the holders 1 of the first and second embodiments described above, a large number of holders 1 can be loaded in a front opening box type magazine in a multi-tiered manner, as shown in FIG. As shown by the alternate long and short dash line, the holder 1 may be equipped with a cover body 5 for preventing the electronic component A from falling off.

5 to 6 show the first and second parts.
It is a third embodiment which is a modification of the embodiment, and in this embodiment, a partition wall 6 for attaching the cover body 5 to the base body 2 is formed in a grid pattern, and the vertical and horizontal partition walls 6 are used. A frame 4 composed of four protrusions 3 is formed in each of the enclosed portions. Each partition wall 6 has a recess 6a into which a finger fits, for convenience when the electronic component A is picked up with a finger and loaded into the frame body 4.
Is formed.

FIGS. 7 to 10 show a fourth embodiment applied to a holder used for a thermal shock test of an electronic component A. In this embodiment, the holder 1 is a cover made of a metal plate. It has a body 5. In the fourth embodiment, four protrusions 3a corresponding to the lead wires C on each side surface of the package portion B of the electronic component A are formed on the upper surface of the base body 2 formed of a conductive synthetic resin in a rectangular shape in plan view. In a case where a large number of sets of 3b are arranged vertically and horizontally, the first protrusions 3a extending in the lateral direction (lateral direction) of the base body 2 have a length as long as the width of the package portion B in the electronic component A. The length of the second protrusion 3b extending in the longitudinal direction (longitudinal direction) of the base body 2 is set to a very short length.

The lengths of the vertical and horizontal projections 3a and 3b are changed in this manner, as shown in FIG. 7, in the thermal shock test of the electronic component A, the low temperature liquid tank 7 is held in a posture in which the holder 1 is horizontally long.
In consideration of alternately immersing in the high temperature liquid tank 8 and the high temperature liquid tank 8, by shortening the length of the second protrusion 3b extending in the direction orthogonal to the inserting / removing direction of the holder 1 to / from both liquid tanks 7 and 8, The amount of liquid adhered when the holder 1 is pulled up from both the liquid tanks 7 and 8 is kept to a minimum (when a large amount of liquid adheres to the holder 1, not only is the expensive liquid consumed significantly, The temperature inside both liquid tanks 7 and 8 changes, and the reliability of the test decreases.

At the corners of the cover body 5, the base body 2
Supporting piece 5a which is arranged to overlap the end side surface of the short side in
Are projected downward and penetrate the support piece 5a and screw a screw 9 into the base body 2 to cover the cover body 5
Is configured to be rotatable around the axis of the screw 9. Further, a plurality of holes 10 are formed in the side edge of the cover body 5 opposite to the center of rotation thereof.

On the other hand, a column 11 having a small diameter portion 11a which fits into the hole 10 of the cover body 5 is provided at a portion of the base body 2 on the side opposite to the rotation axis of the cover body 5. 1
A hairpin-shaped stop pin 13 is inserted into and locked in a pin hole 12 formed in the small-diameter portion 11a of No. 1 and the cover body 5 is pressed and fixed by this stop pin 13. The cover body 5
Is set so as to have a certain gap between the upper surface of the electronic component A and the upper surface of the electronic component A when fixed to the column 11.
A fixing piece 13 having a protrusion 13a that partially abuts the upper surface of the package part B of the electronic component A is cut and formed at each portion of the cover body 5 corresponding to the row of each electronic component A. The fixing piece 13 is set so as to extend along the lateral direction of the base body 2.

As described above, a gap is provided between the cover body 5 and the electronic component A, the protrusion 13a is formed on the fixing piece 13, or the fixing piece 13 is formed so as to extend in the short side direction of the base body 2. The reason for this is that when the holder 1 is pulled up from both the liquid tanks 7 and 8, the adhesion of the liquid is minimized. 11 to 13 show a fifth embodiment applied to a holder for a thermal shock test of an electronic component A as in the fourth embodiment.

In the holder 1 in the fifth embodiment, the base body 2 is formed of a metal plate such as an aluminum plate, and the upper surface thereof is
Block plates 14 made of a conductive synthetic resin are aligned vertically and horizontally, and each block plate 14 is detachably fixed to the base body 2 with a screw 15. The lead wire C of the electronic component A is attached to each block plate 14. The first and second protrusions 3a and 3b for supporting are provided.

In this case, the upper surface of the base 2 and the block plate 1
4 by inserting a thin silicon film 15 between the lower surface and the side surfaces of the adjacent block plates 14 so that the base body 2 and the block plate 14 and the side surfaces of the adjacent block plates 14 are adjacent to each other. The gap is prevented from occurring, so that the liquid is prevented from adhering to the minimum when the liquid is pulled up from both the liquid tanks 7 and 8.

In addition, the block plate 14 has a foot portion 14a which penetrates the silicon film 15 and contacts the upper surface of the base body 2.
Are provided in an appropriate number so that the block plate 14 and the base body 2 are also electrically connected to each other at the position of the foot portion 14a (the block plate 14 and the base body 2 are also electrically connected by the screw 15). Is conducted to). The cover body 5 is formed in the same manner as in the fourth embodiment.

When the block plate 14 is detachably fixed to the upper surface of the base body 2 as in the fifth embodiment, the block plate 14 can be replaced to accommodate various electronic parts A having different standards. There are advantages. In this case, the interval L between the protrusions 13a of the fixing piece 13 of the cover body 5 is set to an interval such that the electronic component A having the smallest size can be pressed, or the intervals L are set to be unequal. The cover body 5 can press and fix each electronic component A having a different standard.

Although each of the above-described embodiments was used for holding a quad type flat package type electronic component, in the present invention, the lead wire is projected from the two side surfaces or the three side surfaces facing each other in the package portion. It goes without saying that the invention can also be applied to a holder for an electronic component having the above-mentioned form.

[Brief description of drawings]

FIG. 1 is a perspective view of a main part of a first embodiment.

FIG. 2 is a plan view of the first embodiment.

FIG. 3 III-III of FIG. 2 with an electronic component held
FIG.

FIG. 4 is a cross-sectional view of essential parts of a second embodiment.

FIG. 5 is a partial perspective view of a third embodiment.

6 is a sectional view taken along line VI-VI of FIG. 5 in a state where an electronic component is held.

FIG. 7 is a diagram showing a procedure of a thermal shock test of an electronic component.

FIG. 8 is a partial perspective view of a fifth embodiment.

FIG. 9 is an exploded perspective view of a fifth embodiment.

FIG. 10 is a cross-sectional view taken along line XX of FIG. 9 in a state of holding an electronic component.

FIG. 11 is an exploded perspective view of the fifth embodiment.

FIG. 12: XII- of FIG. 11 with electronic parts held
It is a XII sectional view.

FIG. 13 is a perspective view showing a state in which a block plate according to a fifth embodiment is turned over.

FIG. 14 is a partial perspective view showing a conventional example.

FIG. 15 is a cross-sectional view of essential parts showing a comparative example with the present invention.

[Explanation of symbols]

 A electronic component B package part C lead wire C1 root of lead wire 1 holder 2 base body 3, 3a, 3b protrusion 14 block plate 5 cover body

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[Procedure amendment]

[Submission date] February 18, 1993

[Procedure Amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0018

[Correction method] Change

[Correction content]

The lengths of the vertical and horizontal projections 3a and 3b are changed in this manner, as shown in FIG. 7, in the thermal shock test of the electronic component A, the low temperature liquid tank 7 is held in a posture in which the holder 1 is horizontally long.
In consideration of alternately immersing in the high temperature liquid tank 8 and the high temperature liquid tank 8, by shortening the length of the second protrusion 3b extending in the direction orthogonal to the inserting / removing direction of the holder 1 to / from both liquid tanks 7 and 8, The amount of liquid adhered when the holder 1 is pulled up from both the liquid tanks 7 and 8 is kept to a minimum (when a large amount of liquid adheres to the holder 1, not only is the expensive liquid consumed significantly, Both
By mixing the liquids in the liquid tanks 7 and 8 with each other, both liquid tanks 7,
The temperature inside 8 may change or the characteristics of the liquid may deteriorate.
As a result, the reliability of the test will decrease).

Claims (1)

[Claims] 1. A holder for an electronic component, comprising a plurality of lead wires projecting from at least two opposite side faces of a package portion, wherein a lead of the electronic component is attached to a plate-shaped base body. A holder for a multi-lead electronic component, characterized in that a protrusion for supporting a root of the wire is provided so as to extend along a side surface of the package portion.