JPH062388B2 - Manufacturing equipment for resin sandwich type metal plate containing conductive filler - Google Patents

Manufacturing equipment for resin sandwich type metal plate containing conductive filler

Info

Publication number
JPH062388B2
JPH062388B2 JP1297642A JP29764289A JPH062388B2 JP H062388 B2 JPH062388 B2 JP H062388B2 JP 1297642 A JP1297642 A JP 1297642A JP 29764289 A JP29764289 A JP 29764289A JP H062388 B2 JPH062388 B2 JP H062388B2
Authority
JP
Japan
Prior art keywords
resin
conductive filler
metal plate
sandwich type
type metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1297642A
Other languages
Japanese (ja)
Other versions
JPH03159734A (en
Inventor
保弘 大村
良一 松田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Priority to JP1297642A priority Critical patent/JPH062388B2/en
Priority to CA002007585A priority patent/CA2007585C/en
Priority to EP90100523A priority patent/EP0379899B1/en
Priority to KR1019900000295A priority patent/KR920007038B1/en
Priority to DE69032213T priority patent/DE69032213T2/en
Publication of JPH03159734A publication Critical patent/JPH03159734A/en
Priority to US07/777,722 priority patent/US5236533A/en
Priority to US07/859,096 priority patent/US5188698A/en
Publication of JPH062388B2 publication Critical patent/JPH062388B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は導電性フィラー含有樹脂サンドイッチ型金属板
の製造装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for producing a resin sandwich type metal plate containing a conductive filler.

[従来技術とその課題] 樹脂サンドイッチ型金属板の樹脂内へ導電性フィラーと
して鉄粉、ニッケル粉、ステンレス粉等を添加して導電
性を付与し、溶接性を確保することが知られている(特
開昭59-145142号等)。このような導電性フィラーは全
面に配置されており、どの範囲(位置)でも溶接性は良
好である。
[Prior Art and Its Problems] It is known that iron powder, nickel powder, stainless powder, etc. are added as a conductive filler into the resin of a resin sandwich type metal plate to impart conductivity and ensure weldability. (JP-A-59-145142, etc.). Such a conductive filler is arranged on the entire surface, and the weldability is good in any range (position).

しかしながら例えば、容器状の部品等を製造する場合
は、胴部を形成し、その上下にフランジを構成し、該フ
ランジと別の部材を溶接することが行なわれている。こ
のような場合には、鋼板圧延方向両端部に導電性フラー
添加樹脂が配置され、中央部にはフィラー無添加樹脂が
配置されていればよい。即ち、溶接しない部位にフィラ
ー添加樹脂が配置されていると、金属板と樹脂の密着
性、制振性がフィラー無添加樹脂の配置部位に比べ若干
劣るため不利であると共に、又フィラーを無駄に使用し
ていることになり、特にニッケル粉等高価なものである
と、コストが著しく上昇する等の欠点をともなうもので
ある。
However, for example, in the case of manufacturing a container-shaped part or the like, a body is formed, flanges are formed above and below the body, and the flange and another member are welded. In such a case, the conductive fuller-added resin may be arranged at both ends in the steel sheet rolling direction, and the filler-free resin may be arranged in the central part. That is, if the filler-added resin is placed in the non-welded area, the adhesiveness between the metal plate and the resin, and the damping property are a little inferior to the placement area of the filler-free resin, which is disadvantageous and the filler is wasted. Since it is used, especially if it is expensive such as nickel powder, there is a drawback that the cost is significantly increased.

[課題を解決するための手段] 本発明の要旨とするところは、樹脂テーブル幅方向に中
央部と両端部に樹脂供給路を区分し、これらの供給路に
対し、導電性フィラー添加樹脂回路と導電性フィラー無
添加樹脂回路を樹脂タンク間に構成し、樹脂コーターロ
ールとピックアップロール間の導電性フィラー添加樹脂
と導電性フィラー無添加樹脂付着境界位置にセパレータ
ーを配置した導電性フィラー含有樹脂サンドイッチ型金
属板の製造装置にある。
[Means for Solving the Problems] The gist of the present invention is that a resin supply path is divided into a central portion and both end portions in the resin table width direction, and a conductive filler-added resin circuit is provided for these supply paths. A conductive filler-containing resin sandwich type in which a conductive filler-free resin circuit is configured between resin tanks, and a separator is placed at the boundary position between the resin coater roll and the pick-up roll It is in a metal plate manufacturing device.

[作用] しかして例えば、容器状の部品で上下部のみ溶接性を付
与する場合は、樹脂テーブルの両端部に導電性フィラー
添加樹脂を樹脂タンクから供給し、中央部へはフィラー
無添加樹脂を別の樹脂タンクから供給し、ピックアップ
ロール及びコーターロールを介して一方の金属板表面へ
塗布し、余剰のそれぞれの樹脂は、上記ピックアップロ
ールとコーターロール間に配置したセパレーターにより
互いに混入させることなく、樹脂タンクへ戻す。又部品
と部品を接続する等金属幅方向中央部に溶接性を付与す
る場合は、中央部へ導電性フィラー添加樹脂を供給し、
両端部へフィラー無添加樹脂を供給する。
[Operation] Thus, for example, in the case of imparting weldability only to the upper and lower parts of a container-shaped part, the resin with additive of conductive filler is supplied to both ends of the resin table from the resin tank, and the resin with no filler is added to the center. Supply from another resin tank, applied to one metal plate surface through the pickup roll and coater roll, each surplus resin, without mixing with each other by the separator placed between the pickup roll and coater roll, Return to resin tank. In addition, when imparting weldability to the central portion in the metal width direction such as connecting parts to each other, supplying conductive filler added resin to the central part,
Supply resin without filler to both ends.

更には、両端部と中央部に導電性フィラー添加樹脂を供
給し、両端部と中央部間にフィラー無添加樹脂を供給す
る等、種々の形態をとり得るものである。
Further, various forms can be adopted, such as supplying the conductive filler-added resin to both ends and the central part and supplying the filler-free resin between the both ends and the central part.

[実施例] 次に、本発明の実施例を上げる。[Examples] Next, examples of the present invention will be described.

第1図及び第2図において、樹脂タンク1に導電性フィ
ラー添加樹脂2を充填し、ポンプ3を介して供給回路4
から樹脂テーブル5幅方向両端部に配設した枡6,6a
に分岐供給路7を介して樹脂2を供給し、該枡6,6a
からピックアップロール8へピックアップし、コーター
ロール9を介して金属板(帯)10の両端部へ塗布する。
余剰の樹脂2は、枡6から樋11,11aを介して、回路4a
から樹脂タンク1へ戻す。
In FIGS. 1 and 2, a resin tank 1 is filled with a conductive filler-added resin 2, and a supply circuit 4 is provided via a pump 3.
To the resin table 5 Masu 6,6a arranged at both ends in the width direction
Resin 2 through a branch supply path 7 to the cells 6, 6a
It is picked up from the pick-up roll 8 and applied to both ends of the metal plate (band) 10 through the coater roll 9.
Excess resin 2 is passed from the measure 6 through the gutters 11 and 11a to the circuit 4a.
Return to resin tank 1.

一方、別の樹脂タンク1aに導電性フィラー無添加樹脂
2aを充填し、ポンプ3aを介して供給回路12から樹脂
テーブル5幅方向中央部のテーブル5へ供給路7aから
樹脂2aを供給し、ピックアップロール8へピックアッ
プし、コーターロール9を介して金属板(帯)10の中央
部に塗布し、次いで塗布した樹脂2,2aを乾燥して別
の金属板(帯)(図示せず)を樹脂面へ配置し、圧着し
て樹脂サンドイッチ型金属板とするものである。
On the other hand, another resin tank 1a is filled with conductive filler-free resin 2a, and the resin 2a is supplied from the supply circuit 7 to the table 5 at the widthwise central portion of the resin table 5 via the pump 3a from the supply path 7a to pick up. The roll 8 is picked up and applied to the central portion of the metal plate (band) 10 via the coater roll 9, and then the applied resins 2 and 2a are dried to apply another metal plate (band) (not shown) to the resin. The resin sandwich type metal plate is arranged on the surface and pressure-bonded.

しかして、テーブル5中央部へ供給した余剰の樹脂2a
は、容器13へ落下し、容器13から回路12aを介して樹脂
タンク1aへ戻す。
Then, the surplus resin 2a supplied to the central portion of the table 5
Drops into the container 13 and returns from the container 13 to the resin tank 1a via the circuit 12a.

ピックアップロール8及びコーターロール9から幅方向
両端部の導線性フィラー添加樹脂2と、中央部の導線性
フィラー無添加樹脂2aが落下するとき等で互いに混入
しないように、図示のごとくセパレーター14をフィラー
無添加樹脂2aとフィラー添加樹脂2の境界位置に配置
する、即ち第3図のごとく樋11,11aの幅方向両端に配置
する。
In order to prevent the conductive filler-added resin 2 at both ends in the width direction from the pick-up roll 8 and the coater roll 9 and the conductive filler-free resin 2a in the central part from falling into each other, the separator 14 is filled with a filler as shown in the figure. It is arranged at the boundary position between the unadded resin 2a and the filler-added resin 2, that is, it is arranged at both ends in the width direction of the gutters 11 and 11a as shown in FIG.

上記のごとくテーブル5の幅方向に中央部と両端部に樹
脂供給路7,7aを区分し、これらの供給路7,7aに
対して、樹脂2,2a回路4,4a12,12aを樹脂タンク
1,1a間に構成し、ピックアップロール8とコーター
ロール9間の樹脂境界位置にセパレーター14を配置する
ものである。
As described above, the resin supply passages 7 and 7a are divided into the central portion and both end portions in the width direction of the table 5, and the resin 2, 2a circuits 4, 4a 12 and 12a are connected to the supply passages 7 and 7a. , 1a, and the separator 14 is disposed at the resin boundary position between the pickup roll 8 and the coater roll 9.

[発明の効果] かくすることにより導電性フィラー添加樹脂と無添加樹
脂の塗布位置を金属板幅方向で任意に変更でき、製造部
材に応じた溶接可能部位を具備する樹脂サンドイッチ型
金属板とすることができ、金属板と樹脂との密着性が向
上し、加工性が向上する。
[Advantages of the Invention] By doing so, the application position of the conductive filler-added resin and the additive-free resin can be arbitrarily changed in the width direction of the metal plate, and the resin sandwich type metal plate is provided with the weldable portion according to the manufacturing member. Therefore, the adhesion between the metal plate and the resin is improved, and the workability is improved.

又、制振性樹脂を用いる場合は、制振性をも向上させる
ことができ、フィラーの使用量も減少しコストを低下さ
せることができる。更に塗布に際し、余剰樹脂を互いに
混入することなく再使用できる等の優れた効果をもたら
すことができる。
Further, when the vibration damping resin is used, the vibration damping property can be improved, the amount of the filler used can be reduced, and the cost can be reduced. Further, upon application, it is possible to bring about an excellent effect such that the excess resins can be reused without being mixed with each other.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明の実施例を示す正面による説明図、第2
図は側面による説明図、第3図はセパレーターの設置例
を示す説明図である。 1,1a…樹脂タンク、2…フィラー添加樹脂、2a…
フィラー無添加樹脂、3,3a…ポンプ、4,4a…樹
脂回路、5…樹脂テーブル、6,6a…枡、7,7a…
供給路、8…ピックアップロール、9…コーターロー
ル、10…金属板(帯)、11,11a…樋、12,12a…樹脂回
路、13…容器(パン)、14…セパレーター。
FIG. 1 is a front explanatory view showing an embodiment of the present invention, and FIG.
The figure is an explanatory view by a side surface, and FIG. 3 is an explanatory view showing an example of installation of a separator. 1, 1a ... Resin tank, 2 ... Filler-added resin, 2a ...
Filler-free resin, 3, 3a ... Pump, 4, 4a ... Resin circuit, 5 ... Resin table, 6, 6a ... Masu, 7, 7a ...
Supply path, 8 ... Pickup roll, 9 ... Coater roll, 10 ... Metal plate (band), 11, 11a ... Gutter, 12, 12a ... Resin circuit, 13 ... Container (pan), 14 ... Separator.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】樹脂テーブル幅方向に中央部と両端部に樹
脂供給路を区分し、これらの供給路に対し、導電性フィ
ラー添加樹脂回路と導電性フィラー無添加樹脂回路を樹
脂タンク間に構成し、樹脂コーターロールとピックアッ
プロール間の導電性フィラー添加樹脂と導電性フィラー
無添加樹脂付着境界位置にセパレーターを配置した導電
性フィラー含有樹脂サンドイッチ型金属板の製造装置。
1. A resin supply passage is divided into a central portion and both end portions in the width direction of the resin table, and a conductive filler-added resin circuit and a conductive filler-free resin circuit are formed between the resin tanks for these supply passages. Then, a conductive filler-containing resin sandwich type metal plate manufacturing apparatus in which a separator is disposed at a boundary position between the resin coater roll and the pick-up roll where the conductive filler-added resin and the conductive filler-free resin are attached.
JP1297642A 1989-01-23 1989-11-17 Manufacturing equipment for resin sandwich type metal plate containing conductive filler Expired - Fee Related JPH062388B2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP1297642A JPH062388B2 (en) 1989-11-17 1989-11-17 Manufacturing equipment for resin sandwich type metal plate containing conductive filler
CA002007585A CA2007585C (en) 1989-01-23 1990-01-11 Resin-sandwiched metal laminate, process and apparatus for producing the same and process for producing resin film for the resin-sandwiched metal laminate
EP90100523A EP0379899B1 (en) 1989-01-23 1990-01-11 Resin-sandwiched laminate, process and apparatus for producing the same and process for producing resin film for the resin-sandwiched laminate
KR1019900000295A KR920007038B1 (en) 1989-01-23 1990-01-11 Resin-sandwiched metal laminated process and apparatus for producing the same and process for producing resin film for the resin-sandwiched metal laminate
DE69032213T DE69032213T2 (en) 1989-01-23 1990-01-11 Resin laminate, method and apparatus for producing the same, and method for producing a resin layer for the resin laminate.
US07/777,722 US5236533A (en) 1989-01-23 1991-10-16 Resin-sandwiched metal laminate, process and apparatus for producing the same and process for producing resin film for the resin-sandwiched metal laminate
US07/859,096 US5188698A (en) 1989-01-23 1992-03-27 Resin-sandwiched metal laminate, process and apparatus for producing the same and process for the producing resin film for the resin-sandwiched metal laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1297642A JPH062388B2 (en) 1989-11-17 1989-11-17 Manufacturing equipment for resin sandwich type metal plate containing conductive filler

Publications (2)

Publication Number Publication Date
JPH03159734A JPH03159734A (en) 1991-07-09
JPH062388B2 true JPH062388B2 (en) 1994-01-12

Family

ID=17849225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1297642A Expired - Fee Related JPH062388B2 (en) 1989-01-23 1989-11-17 Manufacturing equipment for resin sandwich type metal plate containing conductive filler

Country Status (1)

Country Link
JP (1) JPH062388B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1226933A4 (en) * 1999-08-31 2003-01-29 Mitsubishi Plastics Inc Releasing laminated film

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63134235A (en) * 1986-11-26 1988-06-06 住友金属工業株式会社 Manufacture of spot-weldable laminated steel plate

Also Published As

Publication number Publication date
JPH03159734A (en) 1991-07-09

Similar Documents

Publication Publication Date Title
US5964395A (en) Predeposited transient phase electronic interconnect media
EP0083680B1 (en) Wavesoldering of chips
CN100595898C (en) Component mounting apparatus and component mounting method
US5996222A (en) Soldering process with minimal thermal impact on substrate
US20040134684A1 (en) Laminate comprised of flat conductor elements
US4361862A (en) Assemblies of electrical components with printed circuit boards, and printed circuit board structures therefor
JPH062388B2 (en) Manufacturing equipment for resin sandwich type metal plate containing conductive filler
CN206422049U (en) Reflux
DE69834774D1 (en) Printed circuit board with connection points for connection with bumps by ultrasonic welding
CN209462744U (en) The mounting structure of multilager base plate and multilager base plate to circuit substrate
EP0739579B1 (en) A circuit board with specifically designed connection terminals
CN205828430U (en) A kind of miniature LED and electronic device
JP2504510B2 (en) Electronic parts
CN1209942A (en) Process for reflow soldering of printed circuit board fitted with SMD-components
CN113709966B (en) Printed circuit board assembly and electronic equipment
US6246106B1 (en) Lead frame
JPH03266459A (en) Lead frame
JPH0728939Y2 (en) Resin sandwich type metal plate resin coating device
JP2572116B2 (en) Method for producing resin film of resin sandwich type metal plate
JPS6342416B2 (en)
JPS58143865A (en) Coater
CN105163482B (en) A kind of printed circuit board (PCB)
DE19649116A1 (en) Housing or circuit board with conductive structure e.g. for computer housing
CN210156586U (en) Electrical component and printed circuit board
JPH04237574A (en) Spot welding method for galvanized steel sheet

Legal Events

Date Code Title Description
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090112

Year of fee payment: 15

LAPS Cancellation because of no payment of annual fees