JPH06237095A - Holding carrying method of printed board and its device - Google Patents

Holding carrying method of printed board and its device

Info

Publication number
JPH06237095A
JPH06237095A JP4588893A JP4588893A JPH06237095A JP H06237095 A JPH06237095 A JP H06237095A JP 4588893 A JP4588893 A JP 4588893A JP 4588893 A JP4588893 A JP 4588893A JP H06237095 A JPH06237095 A JP H06237095A
Authority
JP
Japan
Prior art keywords
holding
printed circuit
circuit board
opening
printed board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4588893A
Other languages
Japanese (ja)
Inventor
Takeshi Ishiyama
武士 石山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP4588893A priority Critical patent/JPH06237095A/en
Publication of JPH06237095A publication Critical patent/JPH06237095A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To prevent troubles from arising during automatic transfer of a printed board and to correspond to change of a board thickness. CONSTITUTION:When a printed board 10 is carried and transferred from a carrierless belt conveyor in a preceding process to a carrierless automatic soldering device, an upper holding click 5 is opened following an opening/closing guide bar 8 for preparing to receive the printed board 10 while a holding basic click 4 of the carrierless automatic soldering device moves in a circle arc. Then, after it is received, the opening/closing guide bar 8 is removed from the upper holding click 5 and the upper holding click 5 presses and fixes an upper surface of the printed board 10. The holding basic click 4 holds an lower surface of the printed board 10 and guides it transversely at the same time while moving.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、プリント基板の保持搬
送方法及びその装置に関し、より詳細には、プリント基
板に電子部品を挿入/装着後の自動半田付装置におい
て、プリント基板を自動搬送するようにしたプリント基
板の保持搬送方法及びその装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for holding and carrying a printed circuit board, and more particularly to a method for automatically carrying a printed circuit board in an automatic soldering device after inserting / mounting electronic components on the printed circuit board. The present invention relates to a method and apparatus for holding and carrying a printed circuit board.

【0002】[0002]

【従来の技術】図4及び図5(a),(b)は、従来の
プリント基板の保持搬送装置の構成図で、図4は保持搬
送装置、図5(a),(b)は図4のA部拡大図である。
図中、21は保持爪、22はモータ、23は歯車、24
はチェーン、25は電子部品、26はプリント基板であ
る。成型加工品、あるいはプリント基板26の上面及び
下面を保持爪21の端部で一体化保持し、モータ22を
用い、歯車23及びチェーン24を介して前記保持爪を
移動させる。図5(a)において、プリント基板26の
実線部は板厚が0.3cmのもの、点線部が板厚1cm
のものを各々示す。保持爪21の端部の形状は、3mm
まで垂直面になっており、その上方は斜面になってい
る。図(b)は図(a)の部分拡大図で板厚3cmのも
のまで傾斜部で保持できるようになっている。
2. Description of the Related Art FIGS. 4 and 5 (a) and 5 (b) are block diagrams of a conventional printed circuit board holding / conveying device, FIG. 4 is a holding / conveying device, and FIGS. 5 (a) and 5 (b) are drawings. 4 is an enlarged view of part A of FIG.
In the figure, 21 is a holding claw, 22 is a motor, 23 is a gear, 24
Is a chain, 25 is an electronic component, and 26 is a printed circuit board. The molded product, or the upper and lower surfaces of the printed circuit board 26 are integrally held by the ends of the holding claws 21, and the holding claws are moved using the motor 22 via the gear 23 and the chain 24. In FIG. 5A, the solid line portion of the printed circuit board 26 has a plate thickness of 0.3 cm, and the dotted line portion has a plate thickness of 1 cm.
Are shown respectively. The shape of the end of the holding claw 21 is 3 mm
It is a vertical plane up to and a slope is above it. Figure (b) is a partially enlarged view of Figure (a), and it is possible to hold up to a plate thickness of 3 cm by the inclined portion.

【0003】[0003]

【発明が解決しようとする課題】前述のように、従来の
プリント基板の保持搬送装置において、前工程のキャリ
アレスベルトコンベアからキャリアレス自動半田付装置
に基板を搬送する時、プリント基板の上ゾリ3mmまで
は角度が付いているため、受け渡しが可能であるが、そ
れ以上の上ゾリがあるものは基板を割ったり、その他の
乗り移りミスにつながる。また、プリント基板のサイズ
が同一で基板の厚みが変わった場合、その都度キャリア
レス自動半田付装置のプリント基板の搬送幅の調整を行
わなければならないという問題点があった。
As described above, in the conventional printed circuit board holding / conveying apparatus, when the board is conveyed from the carrierless belt conveyor in the previous step to the carrierless automatic soldering apparatus, the warp on the printed circuit board is prevented. It can be delivered because it is angled up to 3 mm, but if it has more overhang, it will break the substrate or cause other transfer errors. Further, when the size of the printed circuit board is the same and the thickness of the printed circuit board is changed, the carrying width of the printed circuit board of the carrierless automatic soldering device must be adjusted each time.

【0004】本発明は、このような実情に鑑みてなされ
たもので、プリント基板の自動受け渡しの時に発生する
該プリント基板の上ゾリによる各種のトラブルを防止
し、同一サイズプリント基板の場合に該プリント基板の
板厚が変わっても搬送幅を変更させずに保持及び搬送を
可能にしたプリント基板の保持搬送方法及びその装置を
提供することを目的としている。
The present invention has been made in view of the above circumstances, and prevents various troubles due to the overhang of the printed circuit board when the printed circuit board is automatically delivered, and in the case of the same size printed circuit board, It is an object of the present invention to provide a printed circuit board holding and carrying method and apparatus capable of holding and carrying the printed board without changing the carrying width even if the board thickness changes.

【0005】[0005]

【課題を解決するための手段】本発明は、上記目的を達
成するために、(1)キャリアレス自動半田付装置にお
けるプリント基板の保持搬送方法において、該プリント
基板の下面を保持し、横方向のガイドを行う第1の保持
手段と、該第1の保持手段とは別体で、開閉動作によっ
て前記プリント基板の上面保持する第2の保持手段とを
有し、前記プリント基板の装着時に、前記第2の保持手
段の開動作により前記第1の保持手段と離れ、前記プリ
ント基板の装着後に、前記第2の保持手段の閉動作によ
り前記プリント基板が保持されて搬送されること、或い
は、(2)キャリアレス自動半田付装置におけるプリン
ト基板の保持搬送装置において、前記プリント基板の下
面を保持し、横方向をガイドする基本保持部材と、該基
本保持部材と別体に設けられ、開閉手段を有して前記プ
リント基板の上面を保持する開閉式保持部材と、該開閉
式保持部材の開閉動作を行う開閉用部材とから成ること
を特徴としたものである。
In order to achieve the above object, the present invention provides (1) a method of holding and carrying a printed circuit board in a carrierless automatic soldering device, wherein the lower surface of the printed circuit board is held and the lateral direction And a second holding means for holding the upper surface of the printed circuit board by an opening / closing operation, which is a separate body from the first holding means. The second holding means separates from the first holding means by the opening operation, and after the printed board is mounted, the printed board is held and conveyed by the closing operation of the second holding means, or (2) In a carrier for holding and carrying a printed circuit board in a carrierless automatic soldering device, a basic holding member that holds the lower surface of the printed circuit board and guides in the lateral direction, and a separate body from the basic holding member. Provided, is obtained by a retractable holding member for holding the upper surface of the printed circuit board has a closing means, characterized in that it consists of an opening and closing member for opening and closing operation of the open-closing holding member.

【0006】[0006]

【作用】プリント基板の保持搬送方法として、基本保持
部材と開閉式保持部材とを別体に設け、該開閉式保持部
材は開閉動作によりプリント基板の乗り移り時に開き、
プリント基板の上ゾリによる各種のトラブル(基板割
れ、基板膜薄、電子部品破損)を防止し、また、プリン
ト基板サイズが同一で該プリント基板の板厚が変わる場
合に対しても保持及び搬送が可能である。
As a method of holding and transporting a printed circuit board, a basic holding member and an opening / closing type holding member are provided separately, and the opening / closing type holding member opens when the printed circuit board is transferred by the opening / closing operation.
Prevents various troubles (board cracking, board thin film, electronic component damage) due to the warp on the printed circuit board, and holds and conveys even when the printed board size is the same and the board thickness changes. It is possible.

【0007】[0007]

【実施例】実施例について、図面を参照して以下に説明
する。図1は、本発明によるプリント基板の保持搬送装
置の一実施例を説明するための構成図で、図中、1はモ
ータ、2は歯車、3はチェーン、4は下面保持用基本爪
(基本保持部材)、5は上面保持爪(開閉式保持部
材)、6は支点軸、7はスプリング、8は開閉用ガイド
バー、9a〜9cは電子部品、10はプリント基板であ
る。
Embodiments will be described below with reference to the drawings. FIG. 1 is a configuration diagram for explaining an embodiment of a printed circuit board holding and conveying apparatus according to the present invention. In the figure, 1 is a motor, 2 is a gear, 3 is a chain, and 4 is a lower surface holding basic claw (basic). (Holding member), 5 is an upper surface holding claw (opening / closing type holding member), 6 is a fulcrum shaft, 7 is a spring, 8 is an opening / closing guide bar, 9a to 9c are electronic components, and 10 is a printed circuit board.

【0008】プリント基板10は、該プリント基板10
の下面保持用基本爪4上に載せられて保持され、該プリ
ント基板10の上面は、上面保持爪5の支点軸6及び該
支点軸に巻き付けられて該上面保持爪5に作用するスプ
リング7を介して開閉動作により押えられる。前記下面
保持用基本爪4はチェーン3に固定されており、プリン
ト基板10はモータ1を用い、歯車2及びチェーン3を
介して搬送される。すなわち、前工程のキャリアレスベ
ルトコンベアからキャリアレス自動半田付装置にプリン
ト基板10を搬送受け渡しする時に、キャリアレス自動
半田付装置の保持用基板爪4は円孤状に移動しながら、
開閉用ガイドバー8にて倣って上面保持爪5が開き、プ
リント基板10の受け入れ準備をする。次に、受け入が
完了すると開閉用ガイドバー8が上面保持爪5から外
れ、該上面保持爪5がプリント基板10の上面を押えて
固定する。下面保持用基板爪4は、移動しながらプリン
ト基板10の下面の保持と横方向のガイドを同時に行
う。
The printed circuit board 10 is
Is held and held on the lower surface holding basic claw 4, and the upper surface of the printed circuit board 10 has a fulcrum shaft 6 of the upper surface holding claw 5 and a spring 7 that is wound around the fulcrum shaft and acts on the upper surface holding claw 5. It is pressed by the opening and closing action. The lower surface holding basic claw 4 is fixed to the chain 3, and the printed circuit board 10 is conveyed via the gear 2 and the chain 3 using the motor 1. That is, when the printed circuit board 10 is transferred from the carrierless belt conveyor in the previous step to the carrierless automatic soldering device, the holding substrate claws 4 of the carrierless automatic soldering device move in an arc shape,
The upper surface holding claw 5 opens following the open / close guide bar 8 to prepare for receiving the printed circuit board 10. Next, when the receiving is completed, the opening / closing guide bar 8 is disengaged from the upper surface holding claw 5, and the upper surface holding claw 5 presses and fixes the upper surface of the printed circuit board 10. While moving, the lower surface holding substrate claw 4 simultaneously holds the lower surface of the printed circuit board 10 and laterally guides it.

【0009】図2(a)〜(d)は、本発明によるプリ
ント基板の保持搬送装置の保持機構を示す図で、図
(a)は通常状態、図(b)は上面保持爪の開状態、図
(c)はプリント基板のセット状態、図(d)はプリン
ト基板の保持状態を各々示している。図(a)におい
て、プリント基板の下面保持用基本爪4の先端部4aに
は溝切部が設けられており、プリント基板の上面保持爪
5の先端部5aを受け入れるようになっている。前記下
面保持用基本爪4上には支点軸6及び該支点軸6に巻き
付けられ、上面保持爪5に作用するスプリング7を介し
て前記上面保持爪5が固定されている。上面保持爪5の
支点軸6を回転中心として、上面保持爪5はスプリング
のバネ圧により閉動作を行い、該上面保持爪5の先端部
5aと前記下面保持用基本爪4の先端部4aとが挟み合
って閉じている。
FIGS. 2A to 2D are views showing a holding mechanism of a printed circuit board holding and conveying apparatus according to the present invention. FIG. 2A is a normal state, and FIG. , (C) shows the set state of the printed circuit board, and (d) shows the held state of the printed circuit board. In FIG. 3A, a groove portion is provided in the tip portion 4a of the lower surface holding basic claw 4 of the printed circuit board so that the tip portion 5a of the upper surface holding claw 5 of the printed circuit board is received. The upper surface holding claw 5 is fixed on the lower surface holding basic claw 4 via a fulcrum shaft 6 and a spring 7 that is wound around the fulcrum shaft 6 and acts on the upper surface holding claw 5. With the fulcrum shaft 6 of the upper surface holding claw 5 as the center of rotation, the upper surface holding claw 5 is closed by the spring pressure of the spring, and the tip portion 5a of the upper surface holding claw 5 and the tip portion 4a of the lower surface holding basic claw 4 are Are sandwiched and closed.

【0010】図(b)において、上面保持爪5の開閉用
ガイドバー8を押し下げて、該上面保持爪5aの先端部
5aと反対側の端部を押すことにより、上面保持爪5は
支点軸6を回転中心として回動して開動作を行い、上面
保持爪5の先端部5aと下面保持用基板爪4の先端部4
aとは離れて開くことになる。図(c)において、前記
先端部5a,4aの開かれた空間部で、下面保持用基本
爪4の先端部4a上にプリント基板10の端部を載せて
セットする。図(d)において、上面保持爪5の開閉用
ガイドバー8を押し上げると、該上面保持爪5は、支点
軸6を回転中心として回動し、該上面保持爪5の先端部
5aが、下面保持用基本爪4の先端部4a上に載せられ
たプリント基板10の端部を押さえ、保持されることに
なる。
In FIG. 1B, by pushing down the opening / closing guide bar 8 of the upper surface holding claw 5 and pushing the end of the upper surface holding claw 5a opposite to the tip 5a, the upper surface holding claw 5 becomes a fulcrum shaft. 6 is rotated about 6 as a center of rotation to perform the opening operation, and the tip portion 5a of the upper surface holding claw 5 and the tip portion 4 of the lower surface holding substrate claw 4
It will open apart from a. In FIG. 3C, the end portion of the printed circuit board 10 is set on the tip portion 4a of the lower surface holding basic claw 4 in the open space of the tip portions 5a and 4a. In FIG. 3D, when the opening / closing guide bar 8 of the upper surface holding claw 5 is pushed up, the upper surface holding claw 5 rotates about the fulcrum shaft 6 as a center of rotation, and the tip portion 5a of the upper surface holding claw 5 moves to the lower surface. The end portion of the printed circuit board 10 placed on the tip portion 4a of the holding basic claw 4 is pressed and held.

【0011】このように、プリント基板10の上面保持
爪5と、下面保持用基本爪4とを専用化、別体化して固
定し、前記上面保持爪5を開閉式とすることにより、い
かなる板厚のプリント基板に対しても対応することがわ
かる。なお、図3は、本発明によるプリント基板の保持
搬送装置の上面図で、プリント基板の搬送の様子を示し
ている。
As described above, the upper surface holding claws 5 of the printed circuit board 10 and the lower surface holding basic claws 4 are dedicated and separated and fixed, and the upper surface holding claws 5 are opened and closed to make any plate. It can be seen that this is applicable to thick printed circuit boards. FIG. 3 is a top view of the printed circuit board holding / conveying device according to the present invention, showing a state of carrying the printed circuit board.

【0012】[0012]

【発明の効果】以上の説明から明らかなように、本発明
によると、以下のような効果がある。すなわち、前工程
キャリアレスコンベアからキャリアレス自動半田付装置
へのプリント基板自動受け渡し時に発生する基板の上ゾ
リによる各種トラブルの防止(基板割れ/基板脱落/部
品破損/他)、及び上面保持爪を開閉式の爪にしたこと
で同一サイズの基板であればプリント基板の板厚が変わ
っても自動半田付装置のプリント基板の搬送幅を変更せ
ずに生産が可能となる。
As is apparent from the above description, the present invention has the following effects. In other words, prevent various troubles (board crack / board drop / part damage / others) due to the warp on the board that occurs when the printed board is automatically transferred from the previous carrierless conveyor to the carrierless automatic soldering device, By using openable claws, if the boards of the same size are used, the production can be performed without changing the conveyance width of the printed boards of the automatic soldering device even if the thickness of the printed boards changes.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明によるプリント基板の保持搬送装置の一
実施例を説明するための構成図である。
FIG. 1 is a configuration diagram for explaining an embodiment of a printed circuit board holding and conveying apparatus according to the present invention.

【図2】図1におけるプリント基板の保持機構を示す図
である。
2 is a view showing a holding mechanism of the printed circuit board in FIG.

【図3】本発明によるプリント基板の保持搬送装置の搬
送の様子を示す図である。
FIG. 3 is a diagram showing how the printed circuit board holding and conveying device according to the present invention conveys.

【図4】従来のプリント基板の保持搬送装置の構成図で
ある。
FIG. 4 is a configuration diagram of a conventional printed circuit board holding and conveying device.

【図5】図4におけるプリント基板の保持機構の拡大図
である。
5 is an enlarged view of a printed board holding mechanism in FIG. 4. FIG.

【符号の説明】[Explanation of symbols]

1…モータ、2…歯車、3…チェーン、4…下面保持用
基本爪(基本保持部材)、5…上面保持爪(開閉式保持
部材)、6…支点軸、7…スプリング、8…開閉用ガイ
ドバー、9a〜9c…電子部品、10…プリント基板。
DESCRIPTION OF SYMBOLS 1 ... Motor, 2 ... Gear, 3 ... Chain, 4 ... Lower surface holding basic claw (basic holding member), 5 ... Upper surface holding claw (opening / closing type holding member), 6 ... Support shaft, 7 ... Spring, 8 ... Opening / closing Guide bars, 9a to 9c ... Electronic components, 10 ... Printed circuit boards.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 キャリアレス自動半田付装置におけるプ
リント基板の保持搬送方法において、該プリント基板の
下面を保持し、横方向のガイドを行う第1の保持手段
と、該第1の保持手段とは別体で、開閉動作によって前
記プリント基板の上面を保持する第2の保持手段とを有
し、前記プリント基板の装着時に、前記第2の保持手段
の開動作により前記第1の保持手段と離れ、前記プリン
ト基板の装着後に、前記第2の保持手段の閉動作により
前記プリント基板が保持されて搬送されることを特徴と
するプリント基板の保持搬送方法。
1. A method for holding and carrying a printed circuit board in a carrierless automatic soldering device, wherein: a first holding means for holding a lower surface of the printed circuit board and laterally guiding the printed circuit board; and the first holding means. A separate holding means for holding the upper surface of the printed circuit board by an opening / closing operation, and when mounting the printed circuit board, the second holding means separates from the first holding means by the opening operation of the second holding means. A method for holding and carrying the printed circuit board, wherein the printed circuit board is held and carried by the closing operation of the second holding means after the printed circuit board is mounted.
【請求項2】 キャリアレス自動半田付装置におけるプ
リント基板の保持搬送装置において、前記プリント基板
の下面を保持し、横方向をガイドする基本保持部材と、
該基本保持部材と別体に設けられ、開閉手段を有して前
記プリント基板の上面を保持する開閉式保持部材と、該
開閉式保持部材の開閉動作を行う開閉用部材とから成る
ことを特徴とするプリント基板の保持搬送装置。
2. A printed circuit board holding and conveying device in a carrierless automatic soldering device, and a basic holding member which holds a lower surface of the printed circuit board and guides in a lateral direction,
An opening / closing type holding member which is provided separately from the basic holding member and has an opening / closing means for holding the upper surface of the printed circuit board, and an opening / closing member for performing an opening / closing operation of the opening / closing type holding member. A printed circuit board holding and transporting device.
JP4588893A 1993-02-09 1993-02-09 Holding carrying method of printed board and its device Pending JPH06237095A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4588893A JPH06237095A (en) 1993-02-09 1993-02-09 Holding carrying method of printed board and its device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4588893A JPH06237095A (en) 1993-02-09 1993-02-09 Holding carrying method of printed board and its device

Publications (1)

Publication Number Publication Date
JPH06237095A true JPH06237095A (en) 1994-08-23

Family

ID=12731787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4588893A Pending JPH06237095A (en) 1993-02-09 1993-02-09 Holding carrying method of printed board and its device

Country Status (1)

Country Link
JP (1) JPH06237095A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102938972A (en) * 2012-11-23 2013-02-20 大连运明自动化技术有限公司 Good product automatic presser module of fully-automatic flexible detection production line for PCBs (Printed Circuit Boards)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102938972A (en) * 2012-11-23 2013-02-20 大连运明自动化技术有限公司 Good product automatic presser module of fully-automatic flexible detection production line for PCBs (Printed Circuit Boards)

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