JPH06237079A - Adhesive coated curcuit board and its manufacture - Google Patents
Adhesive coated curcuit board and its manufactureInfo
- Publication number
- JPH06237079A JPH06237079A JP5022400A JP2240093A JPH06237079A JP H06237079 A JPH06237079 A JP H06237079A JP 5022400 A JP5022400 A JP 5022400A JP 2240093 A JP2240093 A JP 2240093A JP H06237079 A JPH06237079 A JP H06237079A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- melt viscosity
- prepreg
- high melt
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、アディティブ法プリン
ト配線板に用いられる、接着剤被覆積層板積層板の製造
方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing an adhesive-coated laminated board laminated board used for an additive method printed wiring board.
【０００２】[0002]
【従来の技術】アディティブ法プリント配線板用積層板
の表面には、めっきによって金属を析出させて形成する
表面回路と積層板との密着性をよくするため、接着剤を
被覆している。2. Description of the Related Art The surface of a laminated board for an additive printed wiring board is coated with an adhesive in order to improve the adhesion between the surface circuit formed by depositing metal by plating and the laminated board.
【０００３】接着剤被覆積層板の製造方法の一つに、プ
リプレグと、接着剤フィルムとを重ねて、一体成形する
方法がある。この方法を転写法と称している。One of the methods for producing an adhesive-coated laminated plate is a method in which a prepreg and an adhesive film are laminated and integrally molded. This method is called a transfer method.
【０００４】接着剤フィルムは、ポリエチレンフィルム
のような離型用支持体上に接着剤を塗布し、加熱乾燥し
て得られる。The adhesive film can be obtained by coating the adhesive on a release support such as a polyethylene film and heating and drying.
【０００５】プリプレグは、熱硬化性樹脂（例えば、エ
ポキシ樹脂、フェノール樹脂、ポリイミド樹脂など）を
繊維基材（無機質基材又は有機質基材）に含浸乾燥して
得られる。The prepreg is obtained by impregnating and drying a fibrous base material (inorganic base material or organic base material) with a thermosetting resin (eg, epoxy resin, phenol resin, polyimide resin).
【０００６】[0006]
【発明が解決しようとする課題】この転写法の問題点
は、プリプレグと接着剤フィルムとを重ねて、加熱加圧
するときに、プリプレグの熱硬化性樹脂と接着剤フィル
ム上の接着剤とが相互に移行して混合し（以下マイグレ
ーションという）、その結果、接着剤膜厚が大きくばら
つくということである。The problem with this transfer method is that when the prepreg and the adhesive film are stacked and heated and pressed, the thermosetting resin of the prepreg and the adhesive on the adhesive film are It is meant that the adhesive film thickness largely varies as a result of shifting to and mixing (hereinafter referred to as migration).
【０００７】マイグレーションは、接着剤フィルムを製
造するときに、接着剤の硬化反応を進めて、溶融粘度を
高くすることにより対策できる。ところが、溶融粘度を
高くすると、表面回路と積層板との密着性（ひきはがし
強さによって表される）が大幅に低下する。これは、次
ぎの理由による。The migration can be prevented by promoting the curing reaction of the adhesive and increasing the melt viscosity when the adhesive film is manufactured. However, if the melt viscosity is increased, the adhesion between the surface circuit and the laminate (represented by the peel strength) is significantly reduced. This is for the following reason.
【０００８】アディティブ法でプリント配線板を製造す
る場合、接着剤の表面を粗化して、微少な凹凸を形成
し、アンカー効果によって接着力を高めている。ところ
が、この凹凸の形成し易さは、接着剤の硬化度合いによ
り大きく変化し、硬化反応を進めてしまうと粗化しずら
くなり、表面回路のひきはがし強さが低下し、接続信頼
性が損なわれる。以上の様に、転写法で接着剤層を形成
する場合には、成形時に発生するマイグレーションを抑
制し、かつ表面回路のひきはがし強さも維持することが
できなかった。When a printed wiring board is manufactured by the additive method, the surface of the adhesive is roughened to form minute unevenness, and the adhesive force is increased by the anchor effect. However, the ease with which these irregularities are formed greatly changes depending on the degree of curing of the adhesive, and as the curing reaction proceeds, it becomes difficult to roughen, the peeling strength of the surface circuit decreases, and the connection reliability deteriorates. Be done. As described above, when the adhesive layer is formed by the transfer method, it is not possible to suppress the migration that occurs during molding and maintain the peeling strength of the surface circuit.
【０００９】本発明は、このような問題点に鑑みてなさ
れたもので、成形時に発生するマイグレーションを抑制
し、かつ表面回路のひきはがし強さも維持することの可
能な接着剤被覆積層板及びその製造方法を提供するもの
である。The present invention has been made in view of the above problems, and it is possible to suppress the migration that occurs during molding and to maintain the peeling strength of the surface circuit, and an adhesive-coated laminate. A manufacturing method is provided.
【００１０】[0010]
【課題を解決するための手段】本発明は、積層板の表面
に、溶融粘度の高い接着剤を積層板側に、溶融粘度の低
い接着剤を表側にした複層の接着剤被覆を形成したこと
を特徴とする。本発明で、溶融粘度が高いとは、積層板
成形時に溶融したプリプレグの樹脂と接着剤とが混じり
あわない程度の溶融粘度をいう。According to the present invention, a multi-layered adhesive coating is formed on the surface of a laminated plate with an adhesive having a high melt viscosity on the laminated plate side and an adhesive having a low melt viscosity on the front side. It is characterized by In the present invention, the high melt viscosity means a melt viscosity such that the resin of the prepreg melted at the time of molding the laminate and the adhesive do not mix with each other.
【００１１】また、本発明の接着剤被覆積層板は、プリ
プレグを所定枚数重ね、その片側又は両側に、溶融粘度
の低い接着剤を離型用支持体面に、溶融粘度の高い接着
剤を表側にした複層接着剤フィルムを、溶融粘度の高い
接着剤とプリプレグとが接するように配し、全体を加熱
加圧することによって製造される。In the adhesive-coated laminate of the present invention, a predetermined number of prepregs are superposed, and an adhesive having a low melt viscosity is placed on one side or both sides of the release support and an adhesive having a high melt viscosity is placed on the front side. The multilayer adhesive film is placed so that the adhesive having a high melt viscosity and the prepreg are in contact with each other, and the whole is heated and pressed to produce the adhesive film.
【００１２】被覆用接着剤は、熱硬化性樹脂、ゴム成
分、充填剤及びめっき受容性物質を含む。そして、接着
剤の溶融粘度を異ならしめるには、反応性の異なる接着
剤を使用することによって達成される。勿論その他の方
法によってもよい。接着剤の反応性は、ゴム成分中の反
応基を有するゴムによって調整するとよい。溶融粘度の
差は、５００Ｐａ・ｓ以上あるのが好ましい。The coating adhesive contains a thermosetting resin, a rubber component, a filler and a plating receptive material. Then, the melt viscosity of the adhesive is made different by using the adhesive having different reactivity. Of course, other methods may be used. The reactivity of the adhesive may be adjusted by the rubber having a reactive group in the rubber component. The difference in melt viscosity is preferably 500 Pa · s or more.
【００１３】離型用支持体としては、金属はく、例え
ば、アルミニウムはく、銅はくなど、プラスチックフィ
ルム、例えば、ポリプロピレンフィルム、ポリエチレフ
ィルム、トリアセテートフィルム、ポリエステルフィル
ム、ふっ化ビニルフィルムなどが使用でき、離型処理し
て用いる。As the release support, a metal foil such as an aluminum foil or a copper foil is used, and a plastic film such as a polypropylene film, a polyethylene film, a triacetate film, a polyester film or a vinyl fluoride film is used. It can be used after being released.
【００１４】[0014]
【作用】接着剤の溶融粘度は、接着剤の硬化度の指標で
ある。溶融粘度が高い場合は、同じ接着剤であれば、硬
化反応が進んでいる。接着剤層を２層構造として、プリ
プレグ側に溶融粘度の高い接着剤層を設けることによ
り、成形時に発生するマイグレーションを抑制できる。The melt viscosity of the adhesive is an index of the degree of cure of the adhesive. When the melt viscosity is high, the curing reaction is proceeding with the same adhesive. When the adhesive layer has a two-layer structure and the adhesive layer having a high melt viscosity is provided on the prepreg side, migration that occurs during molding can be suppressed.
【００１５】また、最外層に溶融粘度の低い接着剤層を
設けることで、粗化工程での接着剤の溶解量を多くで
き、均一な微少な凹凸の形成が可能となる。このため、
表面回路との密着力が向上する。Further, by providing an adhesive layer having a low melt viscosity as the outermost layer, the amount of adhesive dissolved in the roughening step can be increased, and uniform fine irregularities can be formed. For this reason,
Adhesion with the surface circuit is improved.
【００１６】[0016]
接着剤Ａの調製 アクリロニトリルゴム（日本ゼオン株式会社 Ｎ−１０
３１）５０重量％、フェノール樹脂（日立化成工業株式
会社 Ｈ−２４００）２０重量％、エポキシ樹脂（油化
シェル株式会社 Ｅｐ−１００１）１０重量％、シリカ
微粉末（日本エアロジル株式会社 エアロジル）１５重
量％、ジメチルホルムアルデヒドにエポキシ樹脂を加え
さらに塩化パラジウムを混合して得られためっき受容性
物質（日立化成工業株式会社 ＰＥＣ−８）４重量％及
び２−エチル４−メチルイミダゾール１重量％よりなる
組成物を溶剤に溶解した。Preparation of Adhesive A Acrylonitrile rubber (Neon Japan N-10
31) 50% by weight, phenol resin (Hitachi Chemical Co., Ltd. H-2400) 20% by weight, epoxy resin (Yukaka Shell Co. Ep-1001) 10% by weight, silica fine powder (Japan Aerosil Co., Ltd. Aerosil) 15% by weight %, 4% by weight of a plating receptive substance (PEC-8, Hitachi Chemical Co., Ltd.) obtained by adding an epoxy resin to dimethylformaldehyde and further mixing palladium chloride, and 1% by weight of 2-ethyl 4-methylimidazole. The product was dissolved in the solvent.
【００１７】接着剤Ｂの調製 反応基含有アクリロニトリルゴム（日本ゼオン株式会社
ニポール１０７２）４０重量％、フェノール樹脂（日
立化成工業株式会社 Ｈ−２４００）２０重量％、エポ
キシ樹脂（油化シェル株式会社 Ｅｐ−１００１）２０
重量％、シリカ微粉末（日本エアロジル株式会社 エア
ロジル）１５重量％、ジメチルホルムアルデヒドにエポ
キシ樹脂を加えさらに塩化パラジウムを混合して得られ
ためっき受容性物質（日立化成工業株式会社 ＰＥＣ−
８）４重量％及び２−エチル４−メチルイミダゾール１
重量％よりなる組成物を溶剤に溶解した。Preparation of Adhesive B 40% by weight of reactive group-containing acrylonitrile rubber (Nihon Nippon Zeon Co., Ltd. Nipol 1072), 20% by weight of phenol resin (Hitachi Chemical Co., Ltd. H-2400), epoxy resin (Okaka Shell Co., Ltd. Ep -1001) 20
%, Silica fine powder (Japan Aerosil Co., Ltd. Aerosil) 15% by weight, plating acceptor obtained by adding epoxy resin to dimethylformaldehyde and further mixing with palladium chloride (Hitachi Chemical Co., Ltd. PEC-
8) 4% by weight and 2-ethyl 4-methylimidazole 1
A composition consisting of wt% was dissolved in a solvent.
【００１８】接着剤フィルムの調製 接着剤Ａを、離型処理したポリエチレンフィルムに塗布
し、１５０℃で５分間加熱して、厚さ１５μｍの接着剤
層Ａを形成した。Preparation of Adhesive Film Adhesive A was applied to a polyethylene film subjected to a mold release treatment and heated at 150 ° C. for 5 minutes to form an adhesive layer A having a thickness of 15 μm.
【００１９】次に、接着剤Ｂを、前記接着剤層Ａの上に
塗布し、１７０℃で５分間加熱して、厚さ１５μｍの接
着剤層Ｂを形成した。Next, the adhesive B was applied onto the adhesive layer A and heated at 170 ° C. for 5 minutes to form an adhesive layer B having a thickness of 15 μm.
【００２０】接着剤被覆積層板の調製 ガラスクロスにエポキシ樹脂を含浸、半硬化して得られ
たプリプレグを所定枚数重ね、前記の接着剤フィルムを
接着剤層面がプリプレグ面側になるように積載し、鏡板
で挟んで、１７０℃で７０分間、成形圧力４ＭＰａにて
成形し、接着剤被覆積層板を得た。Preparation of Adhesive-Coated Laminated Plate A predetermined number of prepregs obtained by impregnating glass cloth with epoxy resin and semi-curing are stacked, and the adhesive film is placed so that the adhesive layer side faces the prepreg side. Then, it was sandwiched between end plates and molded at 170 ° C. for 70 minutes at a molding pressure of 4 MPa to obtain an adhesive-coated laminated plate.
【００２１】無電解銅被覆積層板の調製 この接着剤被覆積層板を、クロム硫酸系粗化液に漬浸
し、表面を粗化し、無電解めっきによって、厚さ３０μ
ｍの銅を析出させた。Preparation of Electroless Copper-Coated Laminate Plate This adhesive-coated laminate plate is soaked in a chrome-sulfuric acid-based roughening solution to roughen the surface and electroless plating to a thickness of 30 μm.
m copper was deposited.
【００２２】比較例１ 接着剤フィルムの調製 接着剤Ａ（実施例と同じ）を、離型処理したポリエチレ
ンフィルムに塗布し、１７０℃で５分間加熱して、厚さ
３０μｍの接着剤層を形成した。Comparative Example 1 Preparation of Adhesive Film Adhesive A (same as in Example) was applied to a polyethylene film subjected to mold release treatment and heated at 170 ° C. for 5 minutes to form an adhesive layer having a thickness of 30 μm. did.
【００２３】以下実施例と同様にして、無電解銅被覆積
層板を調製した。In the same manner as in the following examples, electroless copper-clad laminates were prepared.
【００２４】比較例２ 接着剤フィルムの調製 接着剤Ｂ（実施例と同じ）を、離型処理したポリエチレ
ンフィルムに塗布し、１７０℃で５分間加熱して、厚さ
３０μｍの接着剤層を形成した。Comparative Example 2 Preparation of Adhesive Film Adhesive B (same as in Example) was applied to a release-treated polyethylene film and heated at 170 ° C. for 5 minutes to form an adhesive layer having a thickness of 30 μm. did.
【００２５】以下実施例と同様にして、無電解銅被覆積
層板を調製した。The electroless copper-clad laminate was prepared in the same manner as in the following examples.
【００２６】以上のようにして得られた無電解銅被覆積
層板について、接着剤層と積層板層との樹脂成分のマイ
グレーションの有無、接着剤層の厚さ及び無電解銅のひ
きはがし強さを調べた。マイグレーションの有無は、電
子顕微鏡観察で調べた。Regarding the electroless copper-coated laminate obtained as described above, the presence or absence of migration of resin components between the adhesive layer and the laminate layer, the thickness of the adhesive layer and the peeling strength of the electroless copper. I checked. The presence or absence of migration was examined by electron microscope observation.
【００２７】その結果を表１に示す。表の結果から、実
施例の無電解銅被覆積層板は、接着剤層と積層板層との
樹脂成分のマイグレーションが無く、接着剤層の厚さ及
び無電解銅のひきはがし強さもすぐれていることがわか
る。The results are shown in Table 1. From the results in the table, the electroless copper-coated laminate of the example has no migration of resin components between the adhesive layer and the laminate layer, and the thickness of the adhesive layer and the peeling strength of the electroless copper are also excellent. I understand.
【００２８】[0028]
【表１】 [Table 1]
【００２９】[0029]
【発明の効果】本発明の接着剤被覆積層板は、積層板の
表面に、溶融粘度の高い接着剤を積層板側に、溶融粘度
の低い接着剤を表側にした複層の接着剤被覆を形成した
ので、成形時にプリプレグの樹脂と接着剤の樹脂とのマ
イグレーションがなく、かつ粗化もしやすい接着剤被覆
とすることができる。EFFECTS OF THE INVENTION The adhesive-coated laminate of the present invention has a multilayer adhesive coating on the surface of the laminate, with the adhesive having high melt viscosity on the laminate side and the adhesive having low melt viscosity on the front side. Since it is formed, it is possible to obtain an adhesive coating in which the resin of the prepreg and the resin of the adhesive do not migrate at the time of molding and the roughening is easy.
【００３０】また、本発明の接着剤被覆積層板は、プリ
プレグを所定枚数重ね、その片側又は両側に、溶融粘度
の低い接着剤を離型用支持体面に、溶融粘度の高い接着
剤を表側にした複層接着剤フィルムを、溶融粘度の高い
接着剤とプリプレグとが接するように配し、全体を加熱
加圧することにより、従来と変わらず容易に製造でき
る。In the adhesive-coated laminate of the present invention, a predetermined number of prepregs are stacked, and one or both sides of the prepreg are coated with an adhesive having a low melt viscosity on the surface of the release support and an adhesive having a high melt viscosity on the front side. The multilayer adhesive film thus prepared is arranged so that the adhesive having a high melt viscosity and the prepreg are in contact with each other, and the whole is heated and pressed, so that it can be easily manufactured as in the conventional case.
【手続補正書】[Procedure amendment]
【提出日】平成５年４月２２日[Submission date] April 22, 1993
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００１[Correction target item name] 0001
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【０００１】[0001]
【産業上の利用分野】本発明は、アディティブ法プリン
ト配線板に用いられる、接着剤被覆積層板の製造方法に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing an adhesive-coated laminated board used for an additive printed wiring board.
【手続補正２】[Procedure Amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１６[Correction target item name] 0016
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００１６】[0016]
【実施例】 接着剤Ａの調製 アクリロニトリル−ブタジエンゴム（日本ゼオン株式会
社 Ｎ−１０３１）５０重量％、フェノール樹脂（日立
化成工業株式会社 Ｈ−２４００）２０重量％、エポキ
シ樹脂（油化シェル株式会社 Ｅｐ−１００１）１０重
量％、シリカ微粉末（日本エアロジル株式会社 エアロ
ジル）１５重量％、ジメチルホルムアルデヒドにエポキ
シ樹脂を加えさらに塩化パラジウムを混合して得られた
めっき受容性物質（日立化成工業株式会社 ＰＥＣ−
８）４重量％及び２−エチル−４−メチルイミダゾール
１重量％よりなる組成物を溶剤に溶解した。Examples Preparation of Adhesive A Acrylonitrile-butadiene rubber (Neon Zeon Corporation N-1031) 50% by weight, phenol resin (Hitachi Chemical Co., Ltd. H-2400) 20% by weight, epoxy resin (Yuka Shell Co., Ltd.) Ep-1001) 10% by weight, silica fine powder (Japan Aerosil Co., Ltd. Aerosil) 15% by weight, plating acceptor obtained by adding epoxy resin to dimethylformaldehyde and further mixing with palladium chloride (Hitachi Chemical Co., Ltd. PEC −
8) A composition consisting of 4% by weight and 1% by weight of 2-ethyl-4-methylimidazole was dissolved in a solvent.
【手続補正３】[Procedure 3]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１７[Correction target item name] 0017
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００１７】接着剤Ｂの調製 反応基含有アクリロニトリル−ブタジエンゴム（日本ゼ
オン株式会社 ニポール１０７２）４０重量％、フェノ
ール樹脂（日立化成工業株式会社 Ｈ−２４００）２０
重量％、エポキシ樹脂（油化シェル株式会社 Ｅｐ−１
００１）２０重量％、シリカ微粉末（日本エアロジル株
式会社 エアロジル）１５重量％、ジメチルホルムアル
デヒドにエポキシ樹脂を加えさらに塩化パラジウムを混
合して得られためっき受容性物質（日立化成工業株式会
社 ＰＥＣ−８）４重量％及び２−エチル４−メチルイ
ミダゾール１重量％よりなる組成物を溶剤に溶解した。Preparation of Adhesive B 40% by weight of reactive group-containing acrylonitrile-butadiene rubber (Nihon Zeon Co., Ltd. Nipol 1072), phenol resin (Hitachi Chemical Co., Ltd. H-2400) 20
% By weight, epoxy resin (Yukaka Shell Co., Ltd. Ep-1
001) 20% by weight, fine silica powder (Japan Aerosil Co., Ltd. Aerosil) 15% by weight, dimethylformaldehyde to which an epoxy resin was added and palladium chloride was further mixed (Hitachi Chemical Co., Ltd. PEC-8). ) 4% by weight and 2-ethyl 4-methylimidazole 1% by weight were dissolved in a solvent.
Claims (2)
を積層板側に、溶融粘度の低い接着剤を表側にした複層
の接着剤被覆を形成してなる接着剤被覆積層板。1. An adhesive-coated laminated sheet having a multilayered adhesive coating formed by forming an adhesive having a high melt viscosity on the laminated plate side and an adhesive having a low melt viscosity on the front side on the surface of the laminated plate.
は両側に、溶融粘度の低い接着剤を離型用支持体面に、
溶融粘度の高い接着剤を表側にした複層接着剤フィルム
を、溶融粘度の高い接着剤とプリプレグとが接するよう
に配し、全体を加熱加圧することを特徴とする接着剤被
覆積層板の製造方法。2. A predetermined number of prepregs are piled up, and an adhesive having a low melt viscosity is provided on one or both sides of the prepreg on the surface of a release support.
A multi-layer adhesive film having an adhesive having a high melt viscosity on the front side is arranged so that the adhesive having a high melt viscosity and the prepreg are in contact with each other, and the whole is heated and pressed to produce an adhesive-coated laminated sheet. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5022400A JPH06237079A (en) | 1993-02-10 | 1993-02-10 | Adhesive coated curcuit board and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5022400A JPH06237079A (en) | 1993-02-10 | 1993-02-10 | Adhesive coated curcuit board and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06237079A true JPH06237079A (en) | 1994-08-23 |
Family
ID=12081620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5022400A Pending JPH06237079A (en) | 1993-02-10 | 1993-02-10 | Adhesive coated curcuit board and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06237079A (en) |
-
1993
- 1993-02-10 JP JP5022400A patent/JPH06237079A/en active Pending
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