JPH06236031A - Photosensitive resin composition and photosensitive element using the same - Google Patents

Abstract

PURPOSE:To provide a photosensitive resin compsn. developable with an aq. weak alkali soln. in a short time under high resolution and giving a photoset product excellent in adhesion and flexibility and having high resistance to alkali etching. CONSTITUTION:The objective photosensitive resin compsn. contains a vinyl copolymerized compd. having a specified glass transition temp. and a specified mol. wt., two kinds of ethylenically unsatd. compds. each having a specified structure, e.g., 2,2-bis[4-(methacryloxy-polyethoxy)phenyl]propane and beta'- acryloyloxyethyl-gamma-chloro-beta-hydroxy-propyl o-phthalate, and three kinds of photopolymn. initiators each having a specified structure, e.g. 1,7-bis(9-acridinyl) heptane, benzyl dimethyl ketal and a benzophenone deriv. The objective photosensitive element uses the photosensitive resin compsn.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a photosensitive resin composition and a photosensitive element using the same. More specifically, it can be developed with good resolution in a short time by a weak alkaline aqueous solution that does not use an organic solvent, and its photocured product is a photosensitive resin composition having excellent adhesion, flexibility, and excellent alkali etching resistance. The present invention relates to a photosensitive element using the same.

[0002]

2. Description of the Related Art Conventionally, a photosensitive resin composition and a photosensitive element obtained by using the same have been used as resist materials used for etching, plating, etc. in the fields of manufacturing printed wiring boards, precision processing of metals and the like. Widely used. This photosensitive element includes a solvent-developable photosensitive element that develops with a chlorine-based organic solvent and an alkaline-developable photosensitive element that develops with a weak alkaline aqueous solution. Therefore, alkali-developable photosensitive elements are often used.

However, this alkali-developable photosensitive element has a lower resistance to etching, particularly alkali etching, as compared with the conventional organic solvent-developable photosensitive element, so that there are many restrictions on the treatment, which often causes a problem in use. There are two types of etching liquids,
1) Acidic etching solution, for example cupric chloride, second chloride
Iron, 2) alkaline etching solutions such as ammonia-based alkaline etching solutions are often used. Conventional organic solvent-developable photosensitive elements show equivalent resistance to these two types of etching solutions, but alkali-developable photosensitive elements can be developed with a weak alkaline aqueous solution and their photo-cured products are strong alkaline solutions. Since it is peeled off with an aqueous solution, it is not sufficiently resistant to a relatively strong alkaline etching solution, which is an etching solution, and it is extremely sensitive to the pH, temperature, etching time, etc. of the alkaline etching solution, and the working conditions are extremely wide. The problem was that it was very narrow.

[0004]

DISCLOSURE OF THE INVENTION The present invention overcomes the above-mentioned problems of conventional alkali-developable photosensitive resin compositions and photosensitive elements using the same, and has strong resistance to alkali etching, Provided are a photosensitive resin composition which can be developed with high resolution in an alkaline aqueous solution in a short period of time with good resolution, and which has a good adhesiveness and flexibility, and a photosensitive element using the same.

[0005]

The present invention provides (A) a Tg of 50 to 120 ° C. obtained by copolymerizing (A) methacrylic acid, methyl methacrylate and ethyl acrylate,
A vinyl copolymer compound having a weight average molecular weight of 30,000 to 150,000, (B) an ethylenically unsaturated compound represented by the general formula (I),

[Chemical 6] (In the formula, R ₁ , R ₂ , R ₃ and R ₄ each independently represent H or CH ₃ , and n and m represent positive integers selected so that n + m = 8 to 12) (C ) An ethylenically unsaturated compound represented by the general formula (II),

[Chemical 7] (In the formula, Z is a cyclic dibasic acid residue, R ₅ is 1 to 1 carbon atoms.
3, an alkylene group, R ₆ represents a hydrogen atom or a methyl group, and R ₇ represents a hydrogen atom, a methyl group, an ethyl group or CH ₂ X.
(X represents a chlorine atom or a bromine atom) (D) A photoinitiator represented by the general formula (III),

[Chemical 8] (In the formula, R ₈ represents an alkylene group having 6 to 12 carbon atoms.) (E) A photoinitiator represented by the general formula (IV) and

[Chemical 9] (In the formula, Ar ₁ and Ar ₂ each independently represent an unsubstituted phenyl group or a phenyl group substituted with an alkyl group having 1 to 3 carbon atoms or an alkoxy group having 1 to 3 carbon atoms, R ₉ and Each R ₁₀ independently has 1 carbon atom
To 9 alkyl groups) (F) Photoinitiator represented by the general formula (V),

[Chemical 10] (Wherein R ₁₁ , R ₁₂ , R ₁₃ and R ₁₄ each independently represent a hydrogen atom or an alkyl group having 1 to 3 carbon atoms) and a photosensitive resin composition containing the same It relates to a photosensitive element.

The methacrylic acid in the vinyl copolymer compound (A) used in the present invention is a component that enables alkali development and imparts developability and releasability. Methyl methacrylate and ethyl acrylate are components for improving the flexibility of the photosensitive element, enhancing the adhesion with copper, and adjusting the Tg of the copolymer compound.

The proportion of the copolymerization material constituting the component (A) vinyl-based copolymerization compound is 10 to 25 methacrylic acid.
It is preferable that the total amount is 100 parts by weight, which is 30 parts by weight to 30 parts by weight of methyl methacrylate and 20 parts by weight to 40 parts by weight of ethyl acrylate. If the ratio is out of this range, the releasability and developability tend to deteriorate, and the adhesiveness, flexibility, and tolerance to alkali etching tend to decrease.

The vinyl-based copolymer compound (A) obtained by copolymerization of these copolymer materials has a Tg of 50 to 120.
℃ If Tg is less than 50 ° C, the elongation of the cured film of the adhesive resist to the substrate of the cured resist image will decrease, and if Tg is higher than 120 ° C, the elongation of the uncured resin will decrease, causing breakage during cutting. .

The weight average molecular weight of the vinyl copolymer compound (A) is 30,000 to 150,000, preferably 50,000 to 120,000. Outside of this range, the developability and peelability are poor.

Examples of the ethylenically unsaturated compound represented by formula (I) (B) in the present invention include 2,2bis (4-methacryloxypentaethoxyphenyl) propane and 2,2bis (4-acryloxypenta). Examples include ethoxyphenyl) propane and 2,2bis (4-methacryloxytetraethoxyphenyl) propane, and examples of commercially available products include BPE-500 (trade name, manufactured by Shin-Nakamura Chemical Co., Ltd.). The ethylenically unsaturated compound (B) may be used as a single compound, but may be used as a mixture of two or more compounds. n + m is selected so as to be in the range of 8 to 12, but when n + m is 7 or less, the compatibility with the linear copolymer containing a carboxyl group decreases, and it easily peels off when a photosensitive film is laminated on the substrate. . When n + m is 13 or more, the hydrophilicity of the system increases, the resist image is likely to peel off during development, and the alkali etching resistance also decreases.

The ethylenically unsaturated compound (C) represented by the general formula (II) in the present invention is easily produced, for example, from a cyclic dibasic acid anhydride by a reaction represented by the following formula (Z in the formula: , R ₅ , R ₆ and R ₇ are the same as defined in the general formula (II)).

[0012]

[Chemical 11]

Examples of cyclic dibasic acid anhydrides include succinic anhydride, phthalic anhydride, hexahydrophthalic anhydride,
Tetrahydrophthalic anhydride, Hymic anhydride (3,6-End methylene manufactured by Hitachi Chemical Co., Ltd. 1,2,3,6-Tetrahydrophthalic anhydride product name), Methyl hymic acid anhydride (3,6 End manufactured by Hitachi Chemical) Methylene 1,2,
The trade name of 3,6-tetrahydromethylphthalic anhydride) and the like can be mentioned. Among the compounds represented by (C), a particularly preferred compound is β-represented by the formula (IV).
Acryloyloxyethyl-γ-chloro-β-hydroxypropyl-o-phthalate may be mentioned.

[Chemical 12]

The total amount (B) + (C) of the ethylenically unsaturated compounds of the components (B) and (C) is (A) + (B) + (C)
It is preferably 20 to 60 parts by weight, and more preferably 30 to 50 parts by weight, based on 100 parts by weight of the total amount of the components. When the amount is less than 20 parts by weight, the photosensitive layer is poor in flexibility and easily peeled off from the substrate during lamination. Again 6
When the amount is more than 0 parts by weight, the photosensitive layer is softened and is likely to cause cold flow during winding and storage in a roll form.

When the amount of the ethylenically unsaturated compound (B) + (C) used is 20 to 60 parts by weight, the amount of the vinyl copolymer compound represented by (B) used is 15 to 35 parts by weight. It is preferably within the range. When it is in the range of 15 to 35 parts by weight, the alkali etchant resistance becomes sufficient, and the resolution and the adhesion of the resist image become high.

When the amount of the ethylenically unsaturated compound represented by (C) used is in the range of 5 to 15 parts by weight, the resolution, in particular, the adhesion of the resist image during and after development, photosensitivity, developability and durability. Alkali etchant property becomes high.

Examples of the component (D) in the present invention include 1,6-bis (9-acridinyl) hexane, 1,
7-bis (9-acridinyl) heptane, 1,8-bis (9-acridinyl) octane, 1,9-bis (9-acridinyl) nonane, 1,10-bis (9-acridinyl) decane, 1,11- Examples thereof include bis (9-acridinyl) undecane and 1,12-bis (9-acridinyl) dodecane. These can be used alone or in combination of two or more.

The photoinitiator (acridine compound) represented by the general formula (III), which is the component (D), is easily produced, for example, by reacting diphenylamine and a divalent carboxylic acid in the presence of a metal chloride. can do.

The component (D) is the component (A) + (B) +
0.05 to 1.0 per 100 parts by weight of the total amount of component (C)
It is preferably used in the range of parts by weight, and 0.1 to
More preferably, it is used in the range of 0.5 parts by weight.
If it is less than 0.05 part by weight, sufficient photosensitivity cannot be obtained and the resolution is lowered. Further, when it is used in an amount of more than 1.0 part by weight, further improvement in sensitivity cannot be expected and the ultraviolet transmittance of the photosensitive layer is lowered, so that a normal resist image cannot be obtained.

Examples of the photoinitiator represented by the general formula (IV) used as the component (E) of the present invention include 1- (4-methoxyphenyl) -2,2-dimethoxy-2-phenyl- 1-ethanone, 1- (4-methoxyphenyl) -2-methoxy-2-ethoxy-2-phenyl-1-ethanone, 1- (4-methoxyphenyl) -2
-Methoxy-2-propoxy-2-phenyl-1-ethanone, the formula

[Chemical 13] 2,2-dimethoxy-1,2-diphenyl-
1-ethanone (commonly called benzyl dimethyl ketal) and the like can be mentioned. These can be used alone or in combination of two or more. Of these, benzyl dimethyl ketal is preferable.

The component (E) is the above-mentioned (A) + (B) +.
1.0 to 10.0 based on 100 parts by weight of the total amount of the component (C)
It is preferably used in the range of parts by weight, and is 2.0 to
It is more preferably used in the range of 5.0 parts by weight.
If it is less than 1.0 part by weight, sufficient photosensitivity cannot be obtained and the resolution tends to be lowered, and if it is used in excess of 10.0 parts by weight, the storage stability of the photosensitive resin composition is lowered. Tend.

The general formula (V) of the component (F) in the present invention is
Examples of the photoinitiator represented by are p, p-dimethylaminobenzophenone, p, p-diethylaminobenzophenone, p, p-dipropylaminobenzophenone, and the like.

The component (F) is the above (A) + (B) + (C).
It is preferably used in the range of 0.01 to 3.0 parts by weight with respect to 100 parts by weight of the total amount of the components, and 0.03 to 1.
It is more preferably used in the range of 0 parts by weight. 0.
If it is less than 01 parts by weight, the resolution tends to decrease, and
When it is used in an amount of more than 0 parts by weight, the ultraviolet transmittance of the photosensitive layer is lowered, and a normal resist image tends not to be obtained.

The photosensitive resin composition of the present invention includes, for example,
A thermal polymerization inhibitor such as p-methoxyphenol, hydroquinone, pyrogallol, naphthylamine, phenothiazine and t-butylcatechol can be contained.

The photosensitive resin composition of the present invention may contain a colorant such as a dye or a pigment. As the colorant, for example, fuchsin, auramine base, crystal violet, Victoria pier blue, malachite green, methyl orange, acid violet RRH and the like are used.

Further, the photosensitive resin composition of the present invention comprises
Known additives such as a plasticizer, an adhesion promoter, and talc may be added, or a combination of a halogen compound such as carbon tetrabromide and a leuco dye may be added so that the exposed portion is discolored. .

The photosensitive resin composition of the present invention can be used as a laminate (photosensitive film) by coating it on a support and drying it. As the support, a polymer film, for example, a film made of polyethylene terephthalate, polypropylene, polyethylene or the like is used, and a polyethylene terephthalate film is preferable. Since these polymer films must be removable from the photosensitive layer later, they are materials that cannot be removed or have been subjected to a surface treatment that makes them impossible to remove. must not. The thickness of these polymer films is usually 5 to 100 μm, preferably 10 to 30 μm. One of these polymer films may be laminated on the screen of the photosensitive layer as a support film for the photosensitive layer and the other as a protective film for the photosensitive layer.

In producing the photosensitive element,
First, the photosensitive resin composition containing the components (A) to (F) is uniformly dissolved in a solvent. The solvent may be a solvent that dissolves the photosensitive resin composition, for example, acetone, methyl ethyl ketone, a ketone solvent such as methyl isobutyl ketone,
An ether solvent such as methyl cellosolve and ethyl cellosolve, a chlorinated hydrocarbon solvent such as dichloromethane and chloroform, and an alcohol solvent such as methyl alcohol and ethyl alcohol are used. These solvents may be used alone or in combination of two or more.

Next, the photosensitive resin composition in the form of a solution is uniformly applied on the polymer film as the supporting film layer, and then the solvent is removed by heating and / or blowing with hot air to obtain a dry film. The thickness of the dry film is not particularly limited and is usually 10 to 100 μm, preferably 20 to 6
It is set to 0 μm. The photosensitive element of the present invention comprising the two layers of the photosensitive layer and the polymer film thus obtained may be stored as it is or on the other surface of the photosensitive layer by further laminating a protective film and winding it into a roll. To be done.

In producing a photoresist image using the photosensitive element of the present invention, when the protective film is present, the protective film is removed and then the photosensitive layer is pressed against the substrate while heating. To stack. The surface to be laminated is usually a metal surface, but is not particularly limited. The heating and pressure bonding of the photosensitive layer are usually 90 to 130.
The temperature is 3 ° C and the pressure is 3 kgf / cm ² , but these conditions are not particularly limited.

When the photosensitive element of the present invention is used, it is not always necessary to preheat the substrate if the photosensitive layer is heated as described above. Needless to say, the substrate may be preheated to further improve the stackability.

The photosensitive layer thus laminated is
It is then imagewise exposed to actinic light using a negative or bodifilm. As the active light, light generated from a known active light source such as carbon arc, mercury vapor arc, xenon arc, or the like is used.

Then, after the exposure, the polymer film on the photosensitive layer is removed, and then the unexposed portion is removed using an alkaline aqueous solution by a known method such as spraying, rocking dipping, brushing, scraping and the like. develop. Examples of the base of the alkaline aqueous solution include alkali hydroxides of hydroxides such as lithium, sodium and potassium, alkali carbonates of carbonates or bicarbonates of lithium, sodium and potassium, alkali metals such as potassium phosphate and sodium phosphate. Phosphates, alkali metal pyrophosphates such as sodium pyrophosphate, potassium pyrophosphate and the like are used, and an aqueous solution of sodium carbonate is particularly preferable.

The pH of the alkaline aqueous solution used for development is preferably between 9 and 11, and the development temperature is adjusted according to the developability of the photosensitive layer. A surface active agent, a defoaming agent, and a small amount of an organic solvent for accelerating the development may be mixed in the alkaline aqueous solution.

Further, when manufacturing a printed wiring board, the exposed surface of the substrate is treated by a known method such as etching or plating using the developed photoresist image as a mask. Next, the photoresist image is usually stripped with a stronger alkaline aqueous solution than the alkaline aqueous solution used for development. As this strongly alkaline aqueous solution,
For example, a 1 to 5 wt% sodium hydroxide aqueous solution or the like is used.

[0036]

EXAMPLES The present invention will be described with reference to examples. Ia Synthesis Example of Vinyl Copolymer Compound 80 g of a mixture of methyl cellosolve / toluene in a weight ratio of 3/2 (hereinafter referred to as mixture A) was placed in a 500 ml flask and heated to 85 ° C. After keeping the temperature at 85 ° C. for 30 minutes, a solution prepared by mixing and dissolving 20 g of methacrylic acid, 50 g of methyl methacrylate, 30 g of acrylic acid and 0.5 g of azobisisobutyronitrile was dropped into the flask for 3 hours. Then, a liquid in which 20 g of the mixture A and 0.1 g of azobisisobutyronitrile were mixed and dissolved was added, and the mixture was kept at 85 ° C. for 5 hours. Then, the solution was cooled to obtain a solution of the vinyl copolymer compound (I). Weight average molecular weight 90,000, glass transition point 6
The non-volatile content was 5% by weight at 5 ° C.

In the description of the examples of the present invention, the vinyl-based copolymer compound uses a production method similar to that of the synthesis example of 1-a,
The proportion of the monomers in the vinyl-based copolymer compound is the blending weight%, and the weight average molecular weight is shown in terms of polystyrene by liquid chromatography. The glass transition point is Encyclopedia of Polymer Science and Technology: InterScience Publishers
The Division of John Wiley and Sons, Inc. (Encyclopedia of polyme
r Science and Technology: Interscience Publishers a
Division of John Wiley & Sons. Inc.) etc., and the compounding amount is shown as a solid content.

Examples 1 to 8 and Comparative Examples 1 to 9 Photosensitive resin compositions having the compositions shown in Table 1 and Table 2 described below were prepared and the photosensitive resin composition 4 was prepared using the apparatus shown in FIG.
Is evenly coated on a polyethylene terephthalate film 12 having a thickness of 20 μm as a support, dried for about 5 minutes in a hot air convection dryer 6 at 100 ° C. to remove the solvent, and the thickness of the photosensitive layer after drying. Was 50 μm. In FIG. 1, a polyethylene terephthalate film feeding roll, 2 and 3 are film feeding rolls, 5 is a coating thickness adjusting roll, 7 and 8 are polyethylene film laminating rolls, 9 is a polyethylene film feeding roll and 10 is a photosensitive film winding roll. Is.

The coating speed at this time was 1 m / min, and the hot air temperature was 9
It was set to 0 ° C. Then, a polyethylene film 11 having a thickness of 30 μm is laminated as a protective film on the photosensitive layer,
It was wound into a length of 125 m. While peeling off the protective film of the photosensitive element obtained by the above method, the photosensitive layer was used a Hitachi Chemical Co., Ltd. hot roll laminator (model HLM-1500), the copper surface was polished with a cleanser, washed with water and dried. Laminating temperature 1 on a printed wiring board substrate (MCL-E-61 manufactured by Hitachi Chemical Co., Ltd.)
Lamination was performed at 10 ° C. and a laminating pressure of 3.0 kgf / cm ² .

When the temperature of the printed wiring board substrate laminated with the photosensitive element reaches 23 ° C., a photo tool (21 of Stofer 21
Multi-step tablet and line / space = 30/30
~ 250/250 (resolution), line / space = 30
/ 400 to 250/400 (adhesiveness) phototool having a wiring pattern) is brought into close contact with an exposure machine manufactured by Oak Manufacturing Co., Ltd. (model HMW-201B, 3 kW ultra high pressure mercury lamp)
Was exposed with an energy amount such that the number of remaining step steps after development of the 21-step step tablet of the stouffer was 8.0.

After 15 minutes of exposure, the polyethylene terephthalate film was peeled off and developed by spraying a 1.0% by weight sodium carbonate aqueous solution at 30 ° C.
At this time, the development was performed by setting the speed so that the development was completed at a position of 2/3 from the entrance in the conveyor type developing tank. The exposure amount at which the number of remaining steps after development at this time is 8.0 and the resolution, adhesion, alkali etching property and cross-cut property at that time are shown in Table 1.

[0042]

[Table 1]

* 1 P _M- 01 (prototype manufactured by Hitachi Chemical Co., Ltd.), methacrylic acid / methyl methacrylate / ethyl acrylate = 20/50/30 (wt%) in methyl cellosolve / toluene solution (solid content) 50%), weight average molecular weight 90,000, glass transition point 65 ℃ * 2 P _M -02 (Hitachi Chemical Co., prototype), methacrylic acid / methyl methacrylate / butyl acrylate = 2
0/70/10 (wt%) methyl cellosolve / toluene solution (solid content 50%), weight average molecular weight = 90,00
0, glass transition point 65 ° C. * 3 BPE-500: 2,2-bis [4- (methacryloxypolyethoxy) phenyl] propane (manufactured by Shin-Nakamura Chemical Co., Ltd.) * 4 MECHPP = β′-acryloyloxyethyl- γ-Chlor-β-hydroxypropyl-o-phthalate (manufactured by Osaka Organic Chemical Industry Co., Ltd.) * 5 14G: polyethylene glycol # 600 dimethacrylate (manufactured by Shin Nakamura Chemical Industry Co., Ltd.)

* 6 APG-200: tripropylene glycol diacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd.) * 7 1,7-bis (9-acridinyl) heptane (prototype manufactured by Asahi Denka Co., Ltd.) * 8 benzyl Dimethyl ketal (manufactured by Japan Ciba-Geigy Co., Ltd.) * 9 Time required for the unexposed photosensitive film to be completely dissolved and removed by the developing solution * 10 The number of remaining steps after development is 8.0 (21 steps for Stofer) Exposure energy required to become a step tablet)

* 11 The number of remaining steps after development is 8.
Adhesion when 0 (line / space = n / 400 μm) * 12 Resolution when residual step number after development is 8.0 (line / space = n / n μm) * 13 Step number after development is 8. Adhesion line when 0 (line / space = 30/400 to 200/40
0 μm) is a residual line when the A-process manufactured by Meltex is used as an alkaline etching solution at 50 ° C. for 125 seconds. * 14 A cured film having a step number after development of 8.0 is JI.
A cross cut test was performed by the method of S-K5400.

[0046]

Industrial Applicability The photosensitive resin composition of the present invention and the photosensitive element using the same can be developed with a weak alkaline aqueous solution in a short time with good resolution, and the photocured product has excellent adhesion and flexibility, and It has excellent resistance to alkali etching.

[Brief description of drawings]

FIG. 1 is a systematic diagram of a manufacturing device diagram of a photosensitive element used in Examples.

[Explanation of symbols]

1 Polyethylene terephthalate film feeding roll 2, 3 Film feeding roll 4 Photosensitive resin composition 5 Coating thickness adjusting roll 6 Dryer 7, 8 Polyethylene film laminating roll 9 Polyethylene film feeding roll 10 Photosensitive element winding roll 11 Polyethylene film 12 Polyethylene Terephthalate film

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification number Internal reference number FI Technical indication location G03F 7/033 H01L 21/027 H05K 3/00 F 6921-4E (72) Inventor Kiyohito Tanno Ibaraki Prefecture Hitachi City Higashimachi 4-chome 13-1 Hitachi Chemical Co., Ltd. Yamazaki Plant (72) Inventor Hajime Kakumaru Hitachi City Ibaraki Prefecture Higashimachi 4-chome 13-1 Hitachi Chemical Co., Ltd. Yamazaki Plant (72) Invention Naohiro Kubota 7-35 Higashiokyu, Arakawa-ku, Tokyo, Asahi Denka Kogyo Co., Ltd. (72) Inventor Nobuhide Tominaga 7-35, Higashiokyu, Arakawa-ku, Tokyo Asahi Denka Co., Ltd. (72) Invention Koji Ishizaki 7-35 Higashiohisa, Arakawa-ku, Tokyo Inside Asahi Denka Kogyo Co., Ltd.

Claims (5)

[Claims] 1. Tg5 obtained by copolymerizing (A) methacrylic acid, methyl methacrylate and ethyl acrylate.
0 to 120 ° C., weight average molecular weight 30,000 to 150,
000 vinyl copolymer compounds, (B) an ethylenically unsaturated compound represented by the general formula (I), (In the formula, R ₁ , R ₂ , R ₃ and R ₄ each independently represent H or CH ₃ , and n and m represent positive integers selected so that n + m = 8 to 12) (C ) An ethylenically unsaturated compound represented by the general formula (II): (In the formula, Z is a cyclic dibasic acid residue, R ₅ is 1 to 1 carbon atoms.
3, an alkylene group, R ₆ represents a hydrogen atom or a methyl group, and R ₇ represents a hydrogen atom, a methyl group, an ethyl group or CH ₂ X.
(X represents a chlorine atom or a bromine atom) (D) A photoinitiator represented by the general formula (III), (In the formula, R ₈ represents an alkylene group having 6 to 12 carbon atoms.) (E) A photoinitiator represented by the general formula (IV) and (In the formula, Ar ₁ and Ar ₂ each independently represent an unsubstituted phenyl group or a phenyl group substituted with an alkyl group having 1 to 3 carbon atoms or an alkoxy group having 1 to 3 carbon atoms, R ₉ and R ₁₀ independently has 1 carbon atom
To an alkyl group of 9) (F) Photoinitiator represented by the general formula (V) (In the formula, R ₁₁ , R ₁₂ , R ₁₃ and R ₁₄ each independently represent a hydrogen atom or an alkyl group having 1 to 3 carbon atoms). 2. The use ratio of the copolymerization material constituting the vinyl-based copolymerization compound as the component (A) is 10 to 10% by weight of methacrylic acid.
25 parts by weight, 30 to 70 parts by weight of methyl methacrylate and 20 to 40 parts by weight of ethyl acrylate for a total amount of 100.
The photosensitive resin composition according to claim 1, which is a ratio of parts by weight. 3. The ethylenically unsaturated compound represented by the general formula (I) and the ethylenically unsaturated compound represented by the general formula (II) are used in such a ratio that the ethylenically unsaturated compound represented by the general formula (I) is used. 60 to 90 parts by weight and the general formula (I
The photosensitive resin composition according to claim 1 or 2, wherein the proportion is 10 to 40 parts by weight of the ethylenically unsaturated compound represented by I) and the total amount is 100 parts by weight. 4. (A), (B), (C), (D),
The proportion of the components (E) and (F) used is (A) 40 to 80 parts by weight (B) + (C) 60 to 20 parts by weight (however, (A) + (B) + (C) = 100 parts by weight). (D) (A) + (B) + (C) 100 parts by weight,
0.05 to 1.0 parts by weight (E) (A) + (B) + (C) 100 parts by weight,
1.0 to 10 parts by weight (F) (A) + (B) + (C) 100 parts by weight,
The photosensitive resin composition according to claim 1, 2 or 3, which is 0.01 to 3.0 parts by weight. 5. A photosensitive element obtained by applying the photosensitive resin composition according to claim 1, 2, 3 or 4 onto a support and drying the support.