JPH06230561A - Production of pellicle for lithography - Google Patents

Abstract

PURPOSE:To provide a production method of a pellicle film for lithography by using such a production device for pellicle that the substrate is not damaged when unnecessary pellicle film in the outside of a pellicle frame is to be removed. CONSTITUTION:In the method of producing a pellicle film for lithography, the production device of pellicle is equipped with a first frame 1 on which a pellicle film is stretched, and a second frame 2. The second frame 2 is larger than the frame 1 and connected to the first frame 1 with connecting pins 3.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a method for producing a pellicle film for lithography, and more particularly to a semiconductor device such as an LSI or VLSI, or a dust shield for producing a liquid crystal display plate, which is substantially 500 nm or less. The present invention relates to a method of manufacturing a pellicle film for lithography in an exposure method using the above light.

[0002]

2. Description of the Related Art In the manufacture of semiconductor devices such as LSI and VLSI, or liquid crystal display plates, etc., a semiconductor wafer or an original plate for liquid crystal is irradiated with light to form a pattern. If dust is attached, it absorbs light or bends the light, so the transferred pattern is deformed,
In addition to the sharp edges, the dimensions, quality, and appearance were impaired. For this reason, these operations are usually performed in a clean room, but it is difficult to always keep the exposure master clean in this clean room. A method of sticking a pellicle that passes through well is adopted.

Since this pellicle is used as a dust repellent in the semiconductor lithography process, foreign matter must not adhere to itself before use.
It is difficult to completely prevent foreign matter from adhering to the pellicle film in the manufacturing process. There are various causes for the generation source and adhesion of the foreign matter, and examples thereof include particles in the clean room from the manufacturing environment, particles in pure water, pellicle film raw materials from the material, and particles in the adhesive. . The generation of foreign matter in this pellicle often occurs especially in the mechanical processing step of the pellicle film.For example, after attaching the frame to the pellicle film formed by spin coating or casting, the extra film protruding from the frame is cut by a cutter. If the pellicle film itself has debris that occurs when it is cut and the foreign matter that is generated by scratching the substrate adheres to the pellicle film, it is almost impossible to remove it in the subsequent steps, This also has a problem that the film-forming substrate is damaged by this mechanical processing.

[0004]

Therefore, as a method of processing the pellicle film, laser light is also used. With the laser light processing method, the substance to be cut is melted at the cutting portion. Since it can be cut, there is no generation of cutting fragments, and generation of particles and adhesion to the pellicle film can be prevented. However, the pellicle membrane is i
Line-to-excimer laser lithography is required to have a characteristic that can be applied to light in the visible to vacuum ultraviolet range (248 nm for KrF excimer laser, 193 nm for ArF excimer laser). Since it has a high transmittance with respect to, it hardly absorbs laser light, and it is practically difficult to cut it even when using a YAG laser used for material processing or the excimer laser as described above, and it could be cut. In order to damage the quartz and silicon used as the substrate for forming the pellicle film,
Conventionally, the only method of cutting and processing the pellicle film is mechanical processing, which causes the quality of the pellicle film to deteriorate and the yield to decrease.

As a method for preventing the generation of foreign matter in the pellicle film, the film protruding from the frame is cut by mechanical means, and the cut portion is dipped in a solvent that dissolves the pellicle film. Has been proposed (see Japanese Patent Laid-Open No. 4-77739), however, even with this method, mechanical means are used at the time of cutting, and it is unavoidable that the substrate is scratched, and therefore reuse of the substrate is unavoidable. Yields are reduced due to particles generated by scratches on the substrate.

[0006]

SUMMARY OF THE INVENTION The present invention relates to a method for manufacturing a pellicle film for lithography which solves the above disadvantages and drawbacks, and it is larger than this frame on the outside of the frame on which the pellicle film is stretched, and The pellicle film is manufactured using an apparatus provided with a second frame connected to this frame.

That is, the inventors of the present invention have conducted various studies to develop a method for producing a pellicle film that does not damage the substrate for film formation during the production of the pellicle film, and as a result, have found that the pellicle film is provided on the outside of the frame. When the pellicle film is manufactured by providing the second frame which is larger than this frame and is connected to this frame, the substrate may be damaged when the unnecessary pellicle film on the outer part of the pellicle frame is removed. The present invention has been completed by discovering that the foreign matter generated from scratches on the substrate will not adhere to the pellicle film at all, and the quality of the pellicle film will be improved and the yield will be greatly improved. .

[0008]

The present invention relates to a method of manufacturing a pellicle film for lithography, which comprises a pellicle film manufacturing apparatus connected to the outside of a frame on which the pellicle film is stretched, which is larger than the frame and is connected to the frame. A frame is provided. This second frame needs to be larger than a known pellicle frame, but this is limited in size and shape as long as it is connected to the pellicle frame from the process of forming the pellicle film to the peeling process. There is no.

The second frame is not limited to a single frame connected to a known pellicle frame, and it may be a double or triplex multiplex frame on the outside of the known frame. May have a function of dividing or transforming itself. However, this material may be disconnected from the pellicle frame when the shape of the second frame is significantly deformed in the steps from the formation of the pellicle film to the peeling from the substrate, which may cause a trouble. Must have equivalent strength,
Therefore, this is an aluminum alloy such as duralumin that does not generate rust or foreign substances, or a metal such as stainless steel or iron, a resin such as acrylic resin, polycarbonate resin, Teflon resin, or ceramics such as silicon nitride or silicon carbide. It should be made of

The pellicle film forming apparatus used in the present invention is, for example, the one shown in FIG. FIG. 1 shows a plan view of a pellicle film forming apparatus used in the present invention. This is on the outside of a known pellicle frame 1 and is larger than the frame 1 and has a frame 1 and a connecting pin 3. Although the second frame 2 connected is provided, the connection pin 3 is provided with the frame 1 and the second frame 2.
As shown in the figure, it may be a pin-shaped member or a plate-shaped member as long as it is connected to. Although not shown, the second frame 2 may be provided with a handle (grasping tool), which makes it easier to handle and convey, and prevents foreign matter from entering the pellicle film or the frame. Is provided.

In the production of the pellicle film by the pellicle film production, the pellicle frame 1 is pressure-bonded to the pellicle film on the substrate on which the pellicle film is formed by using an adhesive, and then the second frame 2 is adhered to the same. Crimping with an agent, connect the frame 1 and the second frame 2 with the connection pin 3,
Then, the frame 1 and the second frame 2 are lifted up, and the target pellicle film 4 and the unnecessary pellicle film 5 protruding from this and the frame 1 and the second frame 2 are provided.
And the pellicle film 5 is peeled off from the substrate and the unnecessary pellicle film 5 is cut by a cutter, and then the target pellicle film is peeled off from the frame 1. This prevents the substrate from being scratched when the cutter is cut. There is an advantage that foreign matter is not mixed into the pellicle film due to scratches on the substrate, and the substrate can be used repeatedly.

[0012]

EXAMPLES Next, examples and comparative examples of the present invention will be described. Example A fluororesin / Teflon AF was applied to a 150 mm × 150 mm × 2.3 mm thick mirror-polished quartz substrate using a spin coater.
Dissolve 1,600 [trade name of DuPont in the US] in a fluorine-based solvent, Fluorinert FC-75 [trade name of 3M in the US] to make a 5% solution, and apply it at a rotation speed of 1,000 rpm for 30 seconds to obtain 150 ° C. Heat for 10 minutes to evaporate the solvent to a thickness of 0.85
A μm Teflon AF film was formed.

Then, an outer diameter of 100 mm square and a width of 2 are formed on the thin film.
mm, height 5 mm, made of aluminum alloy pellicle frame with epoxy adhesive, Araldai Trapit [Showa High Polymer Co., Ltd. product name], and bonded, then 130 mm inside diameter, 5 mm width, height A second frame made of the same aluminum alloy of 5 mm was pressure-bonded to the outside of the pellicle frame using the same adhesive, and the second frame was connected and fixed to the frame with four pins.

Then, the pellicle frame and the second frame are lifted to separate the pellicle film, the pellicle frame and the second frame from the substrate, and the pellicle film outside the pellicle frame is cut with a cutter, and then the second Was removed from the pellicle frame, the pellicle film was peeled from the pellicle frame, and the number of foreign matters on the surface of the pellicle film was counted using a condenser lamp.
The presence of particles of m or larger was not recognized.

Comparative Example A pellicle frame was adhered to a quartz substrate on which a pellicle film was formed by the same method as in the example, but the second frame was not used in this case, and the pellicle frame was adhered to this frame. When the pellicle film on the outside of the frame was cut along with the cutter and the frame was peeled from the substrate, traces of the cutter were found on the surface of the quartz substrate. It was confirmed by counting that there were 350 particles of 1 μm or larger.

[0016]

As described above, the present invention relates to a method for manufacturing a pellicle film for lithography, which is outside the frame on which the pellicle film is stretched, is larger than this frame, and is connected to this frame. The pellicle film is manufactured by using the apparatus provided with the frame, according to which the pellicle film formed on the frame can be separated from the substrate together with the second frame. , The cutting of the pellicle film formed on the outside of this frame by the carter is performed after peeling from the substrate, so the substrate is not scratched by the cutter, and therefore foreign matter due to the scratch of the substrate does not adhere to the pellicle film. The advantage is given that the substrate can also be used repeatedly.

[Brief description of drawings]

FIG. 1 is a plan view of a pellicle film manufacturing apparatus used in the present invention.

[Explanation of symbols]

1 ... Pellicle frame, 2 ... 2nd frame, 3 ... Connection pin, 4 ... Pellicle film, 5 ... Unnecessary pellicle film.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shu Kashida 2-13-1, Isobe, Annaka-shi, Gunma Prefectural Institute for Precision Materials, Shin-Etsu Chemical Co., Ltd. (72) Yoshihiro Kubota Annaka, Gunma Prefecture 2-13-1 Isobe Shin-Etsu Chemical Co., Ltd. Precision Materials Research Laboratory

Claims (1)

[Claims] 1. A pellicle film is manufactured using a device provided with a second frame, which is larger than the frame 1 and is connected to the frame 1, outside the frame 1 on which the pellicle film is stretched. Manufacturing method of pellicle film for lithography.