JPH06228514A - Conductive adhesive - Google Patents

Abstract

PURPOSE:To provide an adhesive having good electrical conductivity as well as sufficient bond strength. CONSTITUTION:The adhesive is formed by dispersing ceramic particles 12 in an epoxy resin adhesive 10.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive adhesive.

[0002]

2. Description of the Related Art For example, in a grinding wheel of a grinder, there is a grinding wheel in which a grinding wheel layer is bonded to an outer peripheral surface of a metal core with an adhesive.

When used in electrolytic discharge grinding such as a metal bond grinding wheel, the adhesive is used as shown in a magnified composition of FIG. 2 in order to secure conductivity between the core and the metal bond grinding wheel layer. An adhesive in which silver powder 11 is dispersed in the epoxy resin adhesive 10 is used.

[0004]

The original property of the epoxy resin adhesive is thermoplastic, but when it is used as an ordinary adhesive, an amino derivative (ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepenta) is used as a curing agent. Min.) Or polyamide to form a network structure to obtain an insoluble and infusible resin.

Silver powder 11 is added to the above epoxy resin adhesive 10.
In the case of an adhesive having dispersed therein, a film is generated on the surface of the silver powder 11 by the curing agent, and this film deteriorates the conductivity. Therefore, the amount of the curing agent added is reduced to suppress the formation of a film on the surface of the silver powder 11. As a result, the conductivity is secured, but the adhesive strength is reduced due to the decrease in the amount of the curing agent added. Further, silver powder is expensive, and there is a problem that the cost is high.

SUMMARY OF THE INVENTION An object of the present invention is to provide a conductive adhesive agent which has secured adhesive strength and conductivity in view of the above problems of the prior art.

[0007]

The gist of the present invention for achieving the above object is to add and disperse conductive ceramic particles to an epoxy resin adhesive.

[0008]

With the above structure, the conductive ceramic particles are not affected by the curing agent added to the epoxy resin adhesive, maintain good conductivity, and secure sufficient adhesive strength.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a microscopic enlarged view of a conductive adhesive according to the present invention. 10 is an epoxy resin adhesive and 12 is conductive ceramic particles added and dispersed in the epoxy resin adhesive 10. The particle size of the conductive ceramic particles 12 is preferably approximately the same as the thickness of the adhesive layer.

The addition ratio of the conductive ceramic particles 12 to the epoxy resin adhesive 10 is 20 to 4 by volume.
About 0% is desirable.

The conductive ceramic particles 12 added to the epoxy resin adhesive 10 are not affected by the curing agent added to the epoxy resin adhesive 10 and are conductive on the surface like silver powder. Does not generate a film that inhibits

Therefore, there is no need to limit the amount of the curing agent added to the epoxy resin adhesive 10, so that an adhesive having sufficient adhesive strength and good electrical conductivity can be obtained.

The above-mentioned conductive adhesive according to the present invention is effective for adhering metals that need to be energized, and can be used, for example, for adhering a metal core and a grindstone layer of a grinding wheel used for electrolytic discharge grinding.

As an example thereof, as shown in FIG. 3, the grindstone layer 3 is adhered to the outer peripheral surface of the metal core 2 of the grinding wheel 1 by the conductive adhesive 4 of the present invention. In this case, the grindstone layer 3
The composition is a vitrified bond grindstone composed of a glass-based binder, conductive ceramics, and abrasive grains.

The grindstone layer 3 made of such a vitrified bond grindstone is strongly bonded to the metal core 2 by the conductive adhesive 4 of the present invention, and the conductive ceramics 12 in the conductive adhesive 4 and the grindstone layer 3 are bonded. Conductivity between the metal core 2 and the grindstone layer 3 is secured by the conductive ceramics.

Further, the grindstone layer 3 made of the vitrified bond grindstone having the above composition has chip pockets, and has a lower grinding resistance than that of the metal bond grinding wheel, and is optimal for electrolytic discharge grinding.

[0017]

As described above, according to the present invention, since the conductive ceramic particles are added and dispersed in the epoxy resin adhesive, the amount of the curing agent added to the epoxy resin adhesive is limited. It is possible to provide a conductive adhesive that does not need to have sufficient adhesive strength and that retains good conductivity.

[Brief description of drawings]

FIG. 1 is a microscopic enlarged composition diagram of a conductive adhesive according to the present invention.

FIG. 2 is a microscopic enlarged composition diagram of a conventional conductive adhesive.

FIG. 3 is a sectional view of a grinding wheel using a conductive adhesive according to the present invention.

[Explanation of symbols]

 10 Epoxy Resin Adhesive 12 Conductive Ceramic Particles

Claims (1)

[Claims] 1. A conductive adhesive obtained by adding and dispersing conductive ceramic particles to an epoxy resin adhesive.