JPH06226636A - Vitrified bond grinding wheel - Google Patents

Abstract

PURPOSE:To provide a vitrified bond grinding wheel small in grinding resistance and optimum as an electrochemical discharge grinding wheel by dispersing conductive ceramics grain in glass group bonding material, adding abrasive grain thereto, and press-baking it. CONSTITUTION:This vitrified bond grinding wheel conductive and enabling electrochemical discharge grinding is manufactured by dispersing conductive ceramics grain 2 in glass group bonding material 3, adding abrasive grain 1 thereto, and press-baking it. In this grinding wheel, the abrasive grain 1 and the conductive ceramics grain 2 are included in the glass group bonding material 3 and cross-linked by the glass group bonding material 3, and chip pockets 4 are formed. The conductive ceramics grain aggregate may be substituted by metal coat carbon grain. The grinding resistance of the grinding wheel can be reduced because of having the chip pockets 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive vitrified bond grindstone used for a grinding machine.

[0002]

2. Description of the Related Art There is a grindstone used for electrolytic discharge grinding in which a metal bond grindstone layer is adhered to the outer peripheral surface of a metal core with an adhesive or brazing.

[0003]

Since the metal bond grindstone does not have a chip pocket like the vitrified bond grindstone, there is a problem that the grinding resistance is high.

SUMMARY OF THE INVENTION An object of the present invention is to provide a vitrified bond grindstone in which conductivity is secured in view of the above conventional problems.

[0005]

The gist of the present invention for achieving the above object is to disperse conductive ceramic particles in a glass-based binder, add abrasive grains thereto, and press-fire.

[0006]

With the above structure, the electroconductive ceramic particles ensure the electroconductivity, and the electrolytic discharge grinding with a low grinding resistance, which is an advantage of the vitrified bond grindstone, is enabled.

[0007]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a microscopic enlarged view of a vitrified bond grindstone in which conductive ceramic particles 2 are dispersed in a glass-based binder 3, abrasive grains 1 are added to the glass binder 3, and press-fired. The abrasive grains 1 and the conductive ceramic particles 2 are The abrasive grains 1 and the conductive ceramic particles 2 are mixed in the glass-based binder 3 and are cross-linked by the glass-based binder 3 and the chip pocket 4 is formed.

FIG. 2 is an enlarged view of a microscope of a vitrified bond grindstone obtained by adding metal-coated carbon particles 5 and abrasive grains 1 to a glass-based binder 3 and press-baking. The abrasive grains 1 and the metal-coated carbon particles 5 are glass-based. The abrasive grains 1 and the metal-coated carbon particles 5 are mixed in the binder 3, crosslinked with the glass-based binder 3, and the chip pockets 4 are formed. As compared with FIG. 1, a part of the abrasive grains 1 is replaced with the metal-coated carbon particles 5.

As still another modification, the metal-coated carbon particles 5 shown in FIG. 2 may be replaced with conductive ceramic aggregate. In this case, the abrasive grains and the conductive ceramic aggregate are mixed in the glass-based binder containing the conductive ceramic particles, and the abrasive grains and the conductive ceramic aggregate are crosslinked.

FIG. 3 shows a grindstone in which a grindstone layer 7 is bonded to an outer peripheral surface of a metal core 6 with a conductive adhesive 8. The grindstone layer 7 has the glass-based binder 3 of FIG.
And a vitrified bond grindstone in which abrasive grains 1 are added and fired by pressing, or a vitrified bond grindstone in which metal-coated carbon particles 5 and abrasive grains 1 are added to the glass-based binder 3 of FIG. 2 and press fired. .

The conductive adhesive 8 may be, for example, an epoxy resin adhesive in which conductive ceramic particles are added and dispersed, without limiting the addition amount of the curing agent.
Adhesive strength is sufficiently secured and good conductivity is obtained.

FIG. 4 shows that the entire grindstone has the conductive ceramic particles 2 dispersed in the glass binder 3 shown in FIG.
The vitrified bond grindstone or the glass-based binder 3 shown in FIG.
It is a case where it is constituted by a vitrified bond grindstone which is obtained by adding and polishing grains 1 and press firing.

FIG. 5 shows a vitrified bond grindstone obtained by dispersing conductive ceramic particles 2 in the glass-based binder 3 of FIG. 1 and adding abrasive grains 1 to the glass-based binder 3 or press-baked metal or the glass-based binder 3 of FIG. Coated carbon particles 5 and abrasive grains 1
A grindstone layer 7 made of a vitrified bond grindstone that has been pressed and fired is bonded to the outer peripheral surface of the metal core 6 with an adhesive 8a, and a conductive adhesive 9 is applied to the side surface of the grindstone layer 7 and the side surface of the metal core 6. It was done.

In this case, the conductive adhesive 9 is the above epoxy resin adhesive with conductive ceramic particles added and dispersed therein, or the epoxy resin adhesive with silver powder dispersed therein. The adhesive 8a used for bonding to the outer peripheral surface of the core 6 may be an ordinary metal adhesive or a conductive adhesive obtained by adding and dispersing conductive ceramic particles to the epoxy resin adhesive.

The vitrified bond grindstone is
Although not shown, the conductive ceramic particles 2 and the metal-coated carbon particles 5 may be dispersed in the glass-based binder 3, and the abrasive grains 1 may be added thereto and press-fired.

Since the present invention is configured as described above, in the case of FIG. 4, the entire grindstone is made of conductive ceramic particles 2 or conductive ceramic particles 2 and conductive ceramic aggregate or conductive ceramic particles 2 and metal-coated carbon. The particles 5 maintain the conductivity and have the chip pocket 4 which is a characteristic of the vitrified bond grindstone.

Further, in the case where the grindstone layer 7 is joined to the outer peripheral surface of the metal core 6 in FIG. 3, the conductive ceramic particles 2 or the conductive ceramic particles 2 and the conductive ceramic aggregate or the conductivity in the grindstone layer 7 are used. The ceramic particles 2 and the metal-coated carbon particles 5 and the conductive adhesive 8 maintain the conductivity between the grindstone layer 7 and the metal core 6 and have the chip pocket 4 which is the characteristic of the vitrified bond grindstone. There is.

In the case of FIG. 5, the conductive ceramic particles 2 or the conductive ceramic particles 2 and the conductive ceramic aggregates or the conductive ceramic particles 2 and the metal coated carbon particles 5 in the grindstone layer 7 and the side surface of the grindstone layer 7 are used. And the conductive adhesive 9 applied to the side surface of the metal core 6
Has the chip pocket 4 which maintains the conductivity between the grindstone layer 7 and the metal core 6 and which is a characteristic of the vitrified bond grindstone. Therefore, the adhesive 8a used for joining the grindstone layer 7 and the outer peripheral surface of the metal core 6 retains conductivity even with an ordinary metal adhesive. Both with Agent 9
Further, the conductivity between the grindstone layer 7 and the metal core 6 is improved, and it is suitable for use at a high peripheral speed.

[0019]

As described above, according to the present invention, the conductive ceramic particles are dispersed in the glass-based binder, and the vitrified bond grindstone is obtained by adding abrasive grains to the particles and press-baking them. Moreover, the grinding resistance is low due to the chip pocket which is a characteristic of the vitrified bond grindstone, and it is most suitable as a grindstone for electrolytic discharge grinding.

[Brief description of drawings]

FIG. 1 is a microscopic enlarged composition view of a vitrified bond grindstone according to the present invention.

FIG. 2 is a microscopic enlarged composition diagram of a vitrified bond grindstone according to the present invention.

FIG. 3 is a sectional view of a grinding wheel using a vitrified bond grinding wheel according to the present invention.

FIG. 4 is a sectional view of a grinding wheel using a vitrified bond grinding wheel according to the present invention.

FIG. 5 is a sectional view of a grinding wheel using a vitrified bond grinding wheel according to the present invention.

[Explanation of symbols]

 1 Abrasive grains 2 Conductive ceramic particles 3 Glass binder 4 Chip pockets 5 Metal coated carbon particles

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Akimitsu Kamiya 1-1 Asahi-cho, Kariya city, Aichi Toyota Koki Co., Ltd. (72) Shinji Soma 1-1-1 Asahi-cho, Kariya city, Aichi Toyota Koki Within the corporation

Claims (1)

[Claims] 1. A vitrified bond grindstone characterized in that conductive ceramic particles are dispersed in a glass-based binder, abrasive grains are added to the dispersion, and the mixture is press-fired.