JPH06226760A - Mold device for casting coil - Google Patents

Mold device for casting coil

Info

Publication number
JPH06226760A
JPH06226760A JP5040588A JP4058893A JPH06226760A JP H06226760 A JPH06226760 A JP H06226760A JP 5040588 A JP5040588 A JP 5040588A JP 4058893 A JP4058893 A JP 4058893A JP H06226760 A JPH06226760 A JP H06226760A
Authority
JP
Japan
Prior art keywords
insulating spacer
mold
heat
support pin
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5040588A
Other languages
Japanese (ja)
Other versions
JP2822835B2 (en
Inventor
Toshiharu Ando
敏治 安東
Fumio Nogami
文夫 野上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP5040588A priority Critical patent/JP2822835B2/en
Publication of JPH06226760A publication Critical patent/JPH06226760A/en
Application granted granted Critical
Publication of JP2822835B2 publication Critical patent/JP2822835B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Insulating Of Coils (AREA)

Abstract

PURPOSE:To obtain an electrically excellent casting coil without generating a sink or release at the interface of an insulating spacer and a casting resin by eliminating the temp. difference with the periphery of an insulating spacer for providing a predetermined gap between a mold and a conductor. CONSTITUTION:A heat source 11 supplying heat to an insulating spacer 4 or a built-in insulating spacer support pin 6b is used to immediately supply heat from the point of time when the insulating spacer 4 is attached and a casting resin is injected while the temp. of the insulating spacer 4 and the peripheral temp. are held to the same temp. to be cured. After the completion of curing, an insulating spacer support pin 6b and a knock-out pin 6a are simultaneously raised to take out a product.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、注型樹脂内に導体を
埋め込むようにした注型コイルの製造用金型装置に関す
るものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold device for manufacturing a casting coil in which a conductor is embedded in a casting resin.

【0002】[0002]

【従来の技術】図3a,bは例えば特願平3−2163
33に示された従来の注型コイル用金型装置の絶縁スペ
ーサ配置状態を示す断面図であり、図において、1は導
体、2は成形部、3aは金型、3bは金型3aを通じて
全体へ熱供給するための熱板、4は金型3aと導体1と
の間に所定の間隙を設けるための絶縁スペーサ、5はブ
シュ、6は製品取り出し用のノックアウト装置で、ノッ
クウアウトピン6aとこれに対し相対的に上下方向に移
動可能となるようにその中心部に配置した絶縁スペーサ
支持ピンとからなる。7はブシュ5とノックアウトピン
6aとの嵌合部を真空にするための真空チャンバー、8
はOリングである。
2. Description of the Related Art FIGS. 3a and 3b show, for example, Japanese Patent Application No. Hei 3-2163.
FIG. 34 is a cross-sectional view showing an insulating spacer arrangement state of the conventional casting coil mold device shown in FIG. 33, in which 1 is a conductor, 2 is a molding part, 3 a is a mold, 3 b is a whole through the mold 3 a. Heat plate 4 for supplying heat to the insulating spacer 4 for providing a predetermined gap between the mold 3a and the conductor 1, 5 is a bush, 6 is a knockout device for taking out a product, and a knockout pin 6a And an insulating spacer support pin arranged at the center of the insulating spacer support pin so as to be movable in the vertical direction relative thereto. 7 is a vacuum chamber for evacuating the fitting portion between the bush 5 and the knockout pin 6a, 8
Is an O-ring.

【0003】次に動作について説明する。金型3aが熱
板3bより熱供給を受けて所定の温度に加熱され、この
金型3aからの熱伝導により、ブシュ5及びノックアウ
トピン6aが加熱され、さらにまた、成形部2がこれら
の輻射によって加熱されている。このような状況の下
で、先ずノックアウトピン6aを成形部2へ上昇させ
る。この時、絶縁スペーサ支持ピン6bは逆に絶縁スペ
ーサ4が転倒や脱落しない所定のレベルまで下降する。
絶縁スペーサ4を絶縁スペーサ支持ピン6bに取付けた
後、あらかじめ外部で所定の温度に予熱された導体1を
セットする(図3a)。しかる後、ノックアウトピン6
aを成形部2面と同一平面となるまで下降させ、このノ
ックアウトピン6aが下降した時点で、絶縁スペーサ支
持ピン6bを金型3a及びノックアウトピン6aと同一
平面となるまで上昇させる。導体1と金型3aとは絶縁
スペーサ4により所定の間隙を保持した状態となる(図
3b)。絶縁スペーサ4は、導体1及び絶縁スペーサ支
持ピン6bからの熱伝導、さらには輻射等によって加熱
される。一定の予熱時間が終了すると、成形部2及び真
空チャンバー7を同一真空に保持しつつ底部の注入口よ
り注型樹脂を充填する。成形部2内に充填を完了した
後、所定の硬化を行い、しかる後、ノックアウトピン6
a、絶縁スペーサ支持ピン6bを同時に上昇させ、成形
部2より注型コイルを取り出し、一連の動作を終える。
Next, the operation will be described. The mold 3a receives heat from the hot plate 3b and is heated to a predetermined temperature, the heat conduction from the mold 3a heats the bush 5 and the knockout pin 6a, and the molding unit 2 further radiates these. Is being heated by. Under such a condition, first, the knockout pin 6a is raised to the molding portion 2. At this time, the insulating spacer support pin 6b, on the contrary, descends to a predetermined level at which the insulating spacer 4 does not fall or fall.
After the insulating spacer 4 is attached to the insulating spacer support pin 6b, the conductor 1 which is preheated to a predetermined temperature outside in advance is set (FIG. 3a). After that, knockout pin 6
a is lowered until it is flush with the surface of the molding portion 2, and when this knockout pin 6a is lowered, the insulating spacer support pin 6b is raised until it is flush with the mold 3a and the knockout pin 6a. The conductor 1 and the mold 3a are kept in a predetermined gap by the insulating spacer 4 (FIG. 3b). The insulating spacer 4 is heated by heat conduction from the conductor 1 and the insulating spacer support pin 6b, and further by radiation. When the constant preheating time is completed, the molding unit 2 and the vacuum chamber 7 are kept at the same vacuum and the casting resin is filled from the injection port at the bottom. After the filling in the molding part 2 is completed, a predetermined curing is performed, and then the knockout pin 6
At the same time, the insulating spacer support pin 6b is lifted, the casting coil is taken out from the molding unit 2, and the series of operations is completed.

【0004】[0004]

【発明が解決しようとする課題】従来の注型コイルは上
記のようにして製造されていたが、外部で所定の温度に
予熱された導体が、型内へセットされるまでの移動中に
外気温で著しく冷却されたり、ブシュとノックアウトピ
ンの間には、Oリングが取付けられているため微少なギ
ャップが生じ、ノックアウトピン及び絶縁スペーサ支持
ピンと金型とが同一温度になり難い。さらにノックアウ
トピンは金型の系外にある駆動部までつながっているた
め放熱が大きく、結果として絶縁スペーサ支持ピンをさ
らに温度低下させることになる。また、絶縁スペーサ表
面は、通常注型樹脂との接着強度を向上させるべくブラ
スト処理等によって凹凸がつけられていることが多く、
絶縁スペーサ支持ピンヘッド面と絶縁スペーサとの接触
面積が著しく小さくなっている場合がある。このような
ことから、絶縁スペーサの温度を一定の予熱時間のもと
で常に安定した所定の温度まで上昇させることが困難で
あり、特に外部雰囲気温度によって大きく左右され、絶
縁スペーサの温度が周囲の温度に対し著しく低い状態が
生じ、注入された注型樹脂がゲル化する際に絶縁スペー
サと注型樹脂との界面にヒケや剥離が発生するという問
題があった。以上のようなことから、部分放電特性や耐
電圧特性に関して劣る現象が生じ、良品率が向上しなか
った。
The conventional casting coil has been manufactured as described above, but the conductor preheated to a predetermined temperature outside the coil does not come out during movement until it is set in the mold. It is significantly cooled by the air temperature, or a small gap is generated between the bush and the knockout pin because the O-ring is attached, and it is difficult for the knockout pin, the insulating spacer support pin and the mold to have the same temperature. Further, since the knockout pin is connected to the driving unit outside the mold system, heat is radiated greatly, and as a result, the temperature of the insulating spacer support pin is further lowered. Further, the surface of the insulating spacer is usually provided with unevenness by blast treatment or the like in order to improve the adhesive strength with the casting resin,
In some cases, the contact area between the insulating spacer support pin head surface and the insulating spacer is extremely small. For this reason, it is difficult to always raise the temperature of the insulating spacer to a stable predetermined temperature under a constant preheating time, and the temperature of the insulating spacer is greatly affected by the temperature of the external atmosphere. There is a problem that a state extremely low with respect to the temperature occurs, and when the injected casting resin gels, a sink mark or peeling occurs at the interface between the insulating spacer and the casting resin. As described above, the phenomenon of inferior partial discharge characteristics and withstand voltage characteristics occurred, and the yield rate was not improved.

【0005】この発明は上記のような問題点を解消する
ためになされたものであり、絶縁スペーサと周囲とに著
しい温度差を生じることなく電気的に優れた注型コイル
を得ることを目的とする。
The present invention has been made to solve the above problems, and an object thereof is to obtain an electrically excellent casting coil without causing a significant temperature difference between the insulating spacer and the surroundings. To do.

【0006】[0006]

【課題を解決するための手段】この発明に係る注型コイ
ル用金型装置は、絶縁スペーサ支持ピンに、加熱ヒータ
ーやマイクロ波を伝送するための導波管を内蔵すること
で、絶縁スペーサへ熱供給を行い、絶縁スペーサと周囲
とに温度差が生じないようにしたものである。
The casting coil mold apparatus according to the present invention is provided with a heating heater and a waveguide for transmitting microwaves in the insulating spacer support pin, so that the insulating spacer is supported by the insulating spacer support pin. Heat is supplied to prevent a temperature difference between the insulating spacer and the surroundings.

【0007】[0007]

【作用】この発明における注型コイル用金型装置は、絶
縁スペーサ支持ピンに内蔵した加熱源から絶縁スペーサ
へ熱供給を行い、一定の予熱時間内に絶縁スペーサが周
囲と同一の温度に上昇保持できるようにしたので、従来
のような絶縁スペーサと注型樹脂との界面にヒケや剥離
を発生することなく、部分放電特性や耐電圧特性に優れ
た注型コイルを製造できるものである。
The casting coil mold device according to the present invention supplies heat to the insulating spacer from a heating source built in the insulating spacer support pin, and the insulating spacer is kept at the same temperature as the surroundings within a certain preheating time. As a result, it is possible to manufacture a casting coil having excellent partial discharge characteristics and withstand voltage characteristics without causing sink marks or peeling at the interface between the insulating spacer and the casting resin as in the conventional case.

【0008】[0008]

【実施例】【Example】

実施例1.以下、この発明の一実施例を図について説明
する。図1において、上記従来技術と同一部分について
は同一符号により示すものとする。9は絶縁スペーサ支
持ピン6bの上部ヘッド部に断熱材10を介して装着さ
れた金属製の支持ピンヘッド、11と12はこの支持ピ
ンヘッド中に内蔵された加熱ヒーターと温度センサーで
ある。なおその他の構成は従来例と同様である。
Example 1. An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, the same parts as those in the above-mentioned conventional technology are designated by the same reference numerals. Reference numeral 9 is a metallic support pin head mounted on the upper head portion of the insulating spacer support pin 6b via a heat insulating material 10, and 11 and 12 are a heater and a temperature sensor built in the support pin head. The rest of the configuration is the same as the conventional example.

【0009】次に動作について説明する。先ず、金型3
aが熱板3bより熱供給され所定の温度に加熱され、こ
の熱伝導により、ブシュ5やノックアウトピン6a、絶
縁スペーサ支持ピン6b、支持ピンヘッド9等が加熱さ
れ、成形部2はこれらの輻射によって加熱されている。
この時、支持ピンヘッド9部は内蔵された温度センサー
12により常に温度検知がなされており、金型3aと同
一の温度となるよう加熱ヒーター11を動作させてい
る。次にノックアウトピン6aを成形部2へ上昇させる
が、この時、絶縁スペーサ支持ピン6b(支持ピンヘッ
ド9及び断熱材10も一体化したもの)は、逆に絶縁ス
ペーサ4が転倒や脱落しない所定のレベルまで下降す
る。この状態において、ノックアウトピン6a及び絶縁
スペーサ支持ピン6bは金型3aからの熱伝導による熱
供給はあるものの、放熱も著しくなってくるが、この際
支持ピンヘッド9が上記のごとく内蔵された加熱ヒータ
ー11によって常に熱供給がされている。従って、後に
絶縁スペーサ4が取付けられるが、この時の支持ピンヘ
ッド9部は上記加熱により常に金型3aと同一温度が保
持されており、絶縁スペーサ4への熱供給が直ちに開始
されることになる。しかる後、外部であらかじめ所定の
温度に予熱された導体1をセットし、ノックアウトピン
6aを成形部2面と同一平面となるまで下降させる。ノ
ックアウトピン6aが下降した時点で、絶縁スペーサ支
持ピン6bを金型3a及びノックアウトピン6aと同一
平面となるまで上昇させる。一定の予熱時間が終了した
後、成形部2及び真空チャンバー7を同一真空に保持し
つつ底部の注入口より注型樹脂を充填し、成形部2内に
充填を完了した後、所定の硬化を行う。これら一連の過
程において、絶縁スペーサ4には常に熱供給が行われ続
けている。硬化が終了した後、ノックアウトピン6a及
び絶縁スペーサ支持ピン6bを同時に上昇させ、成形部
2より注型コイルを取り出し、一連の動作を終える。
Next, the operation will be described. First, mold 3
a is supplied with heat from the hot plate 3b and heated to a predetermined temperature, and by this heat conduction, the bush 5, the knockout pin 6a, the insulating spacer support pin 6b, the support pin head 9 and the like are heated, and the molding portion 2 is radiated by these. It is heated.
At this time, the temperature of the supporting pin head 9 is always detected by the built-in temperature sensor 12, and the heater 11 is operated so that the temperature is the same as that of the mold 3a. Next, the knockout pin 6a is raised to the molding portion 2, but at this time, the insulating spacer support pin 6b (in which the support pin head 9 and the heat insulating material 10 are also integrated) does not cause the insulating spacer 4 to fall or drop. Descend to the level. In this state, the knockout pin 6a and the insulating spacer support pin 6b are supplied with heat by the heat conduction from the mold 3a, but the heat is also radiated significantly. Heat is constantly supplied by 11. Therefore, the insulating spacer 4 is attached later, but the supporting pin head 9 portion at this time is always kept at the same temperature as the mold 3a by the above heating, and the heat supply to the insulating spacer 4 is immediately started. . After that, the conductor 1 preheated to a predetermined temperature outside is set, and the knockout pin 6a is lowered until it becomes flush with the molding portion 2 surface. When the knockout pin 6a is lowered, the insulating spacer support pin 6b is raised until it is flush with the mold 3a and the knockout pin 6a. After a certain preheating time, while maintaining the molding unit 2 and the vacuum chamber 7 at the same vacuum, the casting resin is filled from the injection port at the bottom, and after the filling in the molding unit 2 is completed, a predetermined curing is performed. To do. In these series of processes, heat is constantly supplied to the insulating spacer 4. After the curing is completed, the knockout pin 6a and the insulating spacer support pin 6b are simultaneously raised, and the casting coil is taken out from the molding section 2 to complete a series of operations.

【0010】実施例2.次に、実施例2による注型コイ
ル用金型について図2に基づいて説明する。図2におい
て、13は石英ガラス製支持ピンヘッド、14はこの支
持ピンヘッド13と絶縁スペーサ6bに内蔵された、マ
イクロ波を伝送するための導波管である。なお図には示
していないが、導波管14の端部にはマイクロ波発振器
(マグネトロン)等の機器が付属されている。その他の
構成は実施例1と同様である。
Embodiment 2. Next, a casting coil mold according to the second embodiment will be described with reference to FIG. In FIG. 2, 13 is a support pin head made of quartz glass, and 14 is a waveguide for transmitting microwaves built in the support pin head 13 and the insulating spacer 6b. Although not shown in the drawing, a device such as a microwave oscillator (magnetron) is attached to the end of the waveguide 14. Other configurations are the same as those in the first embodiment.

【0011】次に動作について説明するが、一連の動作
は実施例1と殆んど同一である。絶縁スペーサ支持ピン
ヘッド13に絶縁スペーサ4を取付けた後、あらかじめ
調整された条件のもとで、絶縁スペーサ4へマイクロ波
を与えることで、スペーサ4は内部から加熱され所定の
温度まで上昇する。なお実施例1の場合、絶縁スペーサ
4への熱供給は外部から行われるが、この実施例のマイ
クロ波加熱の場合は、絶縁スペーサ4の内部から加熱さ
れるため、蓄熱(保温)効果が高い。尚、本実施例にお
いては、石英ガラス製支持ピンヘッドを使用したが、石
英ガラスの代わりに他のセラミックスを用いても同一の
効果がある。
Next, the operation will be described. A series of operations are almost the same as those in the first embodiment. After the insulating spacer 4 is attached to the insulating spacer support pin head 13, microwaves are applied to the insulating spacer 4 under previously adjusted conditions, so that the spacer 4 is heated from the inside and rises to a predetermined temperature. In the case of the first embodiment, heat is supplied to the insulating spacer 4 from the outside, but in the case of microwave heating of this embodiment, since the heating is performed from the inside of the insulating spacer 4, the heat storage (heat retention) effect is high. . Although the quartz glass support pin head is used in the present embodiment, the same effect can be obtained by using other ceramics instead of quartz glass.

【0012】実施例3.実施例1及び2では、支持ピン
6b上に直接絶縁スペーサ4を設置するようにしている
が、例えば図1に示されている支持ピンヘッド表面に熱
伝導性に優れかつ弾性に富んだ物質、例えば、金属粉末
やカーボン粉末を充填したゴム系高分子層を設けると、
絶縁スペーサ支持ピン表面と絶縁スペーサとの界面が極
めて緻密に接触し、絶縁スペーサへの熱供給が極めて効
率良く行われるものである。尚、支持ピンヘッド表面に
施す物質は、熱伝導性や弾性に富んだものであれば良
く、上記に限られたものではない。
Embodiment 3. In the first and second embodiments, the insulating spacers 4 are directly installed on the support pins 6b. However, for example, the surface of the support pin head shown in FIG. When a rubber-based polymer layer filled with metal powder or carbon powder is provided,
The interface between the surface of the insulating spacer support pin and the insulating spacer comes into very close contact, and heat is supplied to the insulating spacer very efficiently. The substance to be applied to the surface of the supporting pin head may be any substance that is rich in thermal conductivity and elasticity, and is not limited to the above.

【0013】[0013]

【発明の効果】以上のようにこの発明によれば、絶縁ス
ペーサへ連続的に熱供給ができるようにしたので、絶縁
スペーサと周囲とが常に同一温度で保たれることにな
り、絶縁スペーサと注型樹脂との界面に剥離やヒケを発
生することなく、電気的に優れた注型コイルが得られる
効果がある。
As described above, according to the present invention, the heat can be continuously supplied to the insulating spacers, so that the insulating spacers and the surroundings are always kept at the same temperature. There is an effect that an electrically excellent casting coil can be obtained without causing peeling or sink marks at the interface with the casting resin.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例1による注型コイル用金型装置
を示す断面図である。
FIG. 1 is a sectional view showing a mold device for a casting coil according to a first embodiment of the present invention.

【図2】本発明の実施例2による注型コイル用金型装置
を示す断面図である。
FIG. 2 is a sectional view showing a mold device for a casting coil according to a second embodiment of the present invention.

【図3】従来の注型コイル用金型を示し、aは成形部外
での絶縁スペーサ及び導体の設置状態を、bは成形部内
への絶縁スペーサ及び導体の設置加熱状態で示す断面図
である。
FIG. 3 is a cross-sectional view showing a conventional casting coil mold, in which a is the installation state of insulating spacers and conductors outside the molding portion, and b is the installation heating state of insulating spacers and conductors inside the molding portion. is there.

【符号の説明】[Explanation of symbols]

1 導体 2 成形部 3a 金型 4 絶縁スペーサ 6 ノックアウト装置 6a ノックアウトピン 6b 絶縁スペーサ支持ピン 9 金属製支持ピンヘッド 10 断熱材 11 加熱ヒーター 13 石英ガラス製支持ピンヘッド 14 導波管 DESCRIPTION OF SYMBOLS 1 conductor 2 molding part 3a mold 4 insulating spacer 6 knockout device 6a knockout pin 6b insulating spacer support pin 9 metal support pin head 10 heat insulating material 11 heating heater 13 quartz glass support pin head 14 waveguide

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 上部に脱気口を有し、底部の注入口より
樹脂が注入され、所定の形状に成形するための成形部
と、上下に移動して製品をノックアウトするノックアウ
ト装置を有する金型であって、この金型と導体との間に
所定の間隙を設けるための絶縁スペーサを配置するもの
において、上記ノックアウト装置の絶縁スペーサ支持部
に、上記絶縁スペーサを加熱するための熱供給手段を備
えたことを特徴とする注型コイル用金型装置。
1. A metal having a degassing port in the upper part, a molding part for injecting resin from a bottom injection port to mold it into a predetermined shape, and a knockout device for moving up and down to knock out a product. A mold, in which an insulating spacer for arranging a predetermined gap between the mold and the conductor is arranged, a heat supply means for heating the insulating spacer to the insulating spacer supporting portion of the knockout device. A mold device for a casting coil, comprising:
【請求項2】 絶縁スペーサへの熱供給手段として、絶
縁スペーサ支持ピン上部に断熱材を介して金属製支持ピ
ンヘッドを設けると共に、上記支持ピンヘッド内に加熱
ヒーターを備えたことを特徴とする請求項1記載の注型
コイル用金型装置。
2. A metal supporting pin head is provided above the insulating spacer supporting pin via a heat insulating material as a heat supplying means to the insulating spacer, and a heating heater is provided in the supporting pin head. 1. The mold device for casting coil according to 1.
【請求項3】 絶縁スペーサへの熱供給手段として、絶
縁スペーサ支持ピン上部に断熱材を介してセラミック製
支持ピンヘッドを設けると共に、上記支持ピンヘッド内
にマイクロ波伝送用導波管を備えたことを特徴とする請
求項1記載の注型コイル用金型装置。
3. As a means for supplying heat to the insulating spacer, a ceramic support pin head is provided above the insulating spacer support pin via a heat insulating material, and a microwave transmission waveguide is provided in the support pin head. The mold apparatus for a casting coil according to claim 1.
【請求項4】 絶縁スペーサ支持ピンヘッド表面に熱伝
導性に優れ、かつ弾性に富んだ物質を施したことを特徴
とする請求項1乃至3記載の注型コイル用金型装置。
4. The mold device for a casting coil according to claim 1, wherein the surface of the insulating spacer supporting pin head is provided with a material having excellent thermal conductivity and rich elasticity.
JP5040588A 1993-02-03 1993-02-03 Mold device for casting coil Expired - Fee Related JP2822835B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5040588A JP2822835B2 (en) 1993-02-03 1993-02-03 Mold device for casting coil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5040588A JP2822835B2 (en) 1993-02-03 1993-02-03 Mold device for casting coil

Publications (2)

Publication Number Publication Date
JPH06226760A true JPH06226760A (en) 1994-08-16
JP2822835B2 JP2822835B2 (en) 1998-11-11

Family

ID=12584663

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5040588A Expired - Fee Related JP2822835B2 (en) 1993-02-03 1993-02-03 Mold device for casting coil

Country Status (1)

Country Link
JP (1) JP2822835B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019202533A (en) * 2018-05-21 2019-11-28 マイクロ波化学株式会社 Molding apparatus, mold, and method for manufacturing molded product
JP2020192817A (en) * 2018-05-21 2020-12-03 マイクロ波化学株式会社 Molding apparatus, mold, and method for manufacturing molded product

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019202533A (en) * 2018-05-21 2019-11-28 マイクロ波化学株式会社 Molding apparatus, mold, and method for manufacturing molded product
JP2020192817A (en) * 2018-05-21 2020-12-03 マイクロ波化学株式会社 Molding apparatus, mold, and method for manufacturing molded product

Also Published As

Publication number Publication date
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