JPH05243295A - Manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To enable resin tablet to be manufactured even if heated at high temperature by heating the resin tablet in the condition that it is in a resin mold, after putting the resin tablet in the resin mold. CONSTITUTION:A plunger 3 is lowered and brought close to a resin tablet 1 after putting the resin tablet 1 into the pocket 2 inside a resin mold. In this condition, the resin tablet 1 is heated by electromagnetic waves, with the plunger 3 and a mold 4 under the pot as electrodes. Next, the plunger 3 is lowered further, and resin is injected into inside 7 of a mold consisting of an upper mold 5 and a lower mold 6. And, resin molding is performed by letting a specified time pass. Hereby, the resin tablet 1 can be manufactured easily even if heated at high temperature.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a semiconductor device, and more particularly to a resin molding method using a transfer molding method. Hereinafter, unless otherwise specified, the resin molding method is a resin sealing method by a transfer molding method.

[0002]

2. Description of the Related Art In the conventional resin sealing method, a resin tablet preheater of a type that heats a resin tablet by electromagnetic waves is preheated to about several tens of degrees Celsius and then placed in a pot portion in a resin molding die. After that, the resin tablet is injected and injected by the plunger of the resin sealing device, and the resin is molded by allowing an arbitrary pressurization time to elapse.

[0003]

According to the conventional method,
When the resin tablet is preheated by the resin tablet preheater before being put into the pot part in the resin molding die, if it is heated to about 100 ° C. or higher, the resin tablet starts to melt, so that the tablet shape cannot be maintained. Therefore, depending on the handling of the resin tablet, the resin tablet is easily deformed, which causes a problem such that the resin tablet cannot be put into the pot portion in the resin molding die. In the optimization of various conditions for resin molding, although the resin tablet preheating temperature is preferably set high, there is a limit to the temperature that can be raised because of the above-mentioned problem.

The object of the present invention is to solve the above problems,
It is an object of the present invention to provide a method for manufacturing a semiconductor device, which can be easily manufactured even when a resin tablet is heated at a high temperature.

[0005]

Means for Solving the Problems The constitution of the resin sealing method of the present invention is such that after a resin tablet is put in a pot portion in a resin molding die, the tablet is placed in the resin molding die, and an electromagnetic wave is generated. It is characterized in that it is preheated by, and then injection molded.

[0006]

FIG. 1 is a sectional view showing the structure of a resin sealing device including a resin tablet in the resin sealing method of the first embodiment of the present invention.

In FIG. 1, in this embodiment, first, the resin tablet 1 is put into the pot portion 2 in the resin molding die. Next, the plunger 3 is moved down to approach the resin tablet 1. In this state, the resin tablet 1 is heated by electromagnetic waves using the planjo 3 and the pot lower mold 4 as electrodes.

After that, the plunger 3 is further lowered to enter the mold interior 7 formed by the upper mold 5 and the lower mold 6,
Injection injection of resin. Resin molding is performed after a predetermined pressurizing time has elapsed.

The plunger 3 and the pot lower mold 4 are
Since it is necessary to function as an electrode, the insulator 8
The upper die 5 and the lower die 6 are respectively insulated from the portions other than the pot portion. As the insulator 8, heat resistant plastic or the like is suitable. An electromagnetic wave generation and control function unit 9 is connected to the plunger 3 and the lower mold 4.

FIG. 2 is a sectional view showing the structure of a resin sealing device including a resin tablet in the second embodiment of the present invention. In this embodiment, FIG. 2 shows the case where the lower die 6 as a whole is used as an electrode for heating the resin tablet 1 by electromagnetic waves, and the lower die 6 is used as an electrode. Other parts are the same as in FIG.

[0011]

As described above, the present invention is a method of heating a resin tablet in the resin molding die after the resin tablet is put into the resin molding die, and therefore, the resin molding is particularly preferable. Under the conditions described above, when a high temperature is suitable as the resin tablet preheating temperature, there is an effect that it is possible to heat the resin tablet to a high temperature at which it melts and deforms.

[Brief description of drawings]

FIG. 1 is a sectional view showing a structure of a resin sealing device including a resin tablet used in a method for manufacturing a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a sectional view showing a resin sealing method according to a second embodiment of the present invention.

[Explanation of symbols]

 1 resin tablet 2 pot part in resin molding die 3 plunger 4 pot part lower die 5 upper die 6 lower die 7 inside die 8 insulating material such as heat resistant plastic 9 electromagnetic wave generation and control function part

Claims (1)

[Claims] 1. A method of resin sealing a semiconductor device by a transfer molding method, wherein after a resin tablet is placed in a pot portion in a resin molding die, preheating with electromagnetic waves is performed with the tablet in the resin molding die. And then injection-molding the semiconductor device.