JPH06220555A - Sliding contact material and its production - Google Patents
Sliding contact material and its productionInfo
- Publication number
- JPH06220555A JPH06220555A JP5089128A JP8912893A JPH06220555A JP H06220555 A JPH06220555 A JP H06220555A JP 5089128 A JP5089128 A JP 5089128A JP 8912893 A JP8912893 A JP 8912893A JP H06220555 A JPH06220555 A JP H06220555A
- Authority
- JP
- Japan
- Prior art keywords
- sliding contact
- contact material
- weight
- phase
- temp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、摺動接点材料及びその
加工方法に係り、特にマイクロモータに好適なコミテー
タ材料及び加工方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sliding contact material and a processing method thereof, and more particularly to a commutator material and a processing method suitable for a micromotor.
【0002】[0002]
【従来の技術】従来より摺動接点材料の1つとしてAg
Cu合金が用いられてきたが、AgCu合金はその金属
組織が十分にコントロールされておらず、特にCu原子
がAgα相中に完全に固溶しておらず、固溶体硬化が十
分に発揮されていなかった。その為製造時の金属組織の
ばらつきによって摺動時に軟化し、早く摩耗し、耐摩耗
性が不十分であった。またこの材料でコミテータを製作
したマイクロモータの場合には、刷子接点との摺動によ
り摩耗が生じ、摩耗粉がノイズの原因となっていた。2. Description of the Related Art Ag has been conventionally used as one of sliding contact materials.
A Cu alloy has been used, but the metal structure of the AgCu alloy is not sufficiently controlled, and in particular, the Cu atom is not completely solid-solved in the Agα phase, and solid solution hardening is not sufficiently exerted. It was Therefore, it was softened at the time of sliding due to the variation of the metal structure at the time of manufacturing, was worn quickly, and had insufficient wear resistance. Further, in the case of a micromotor in which a commutator is made of this material, abrasion occurs due to sliding with the brush contact, and abrasion powder causes noise.
【0003】[0003]
【発明が解決しようとする課題】そこで本発明は、耐摩
耗性を向上させ、摩耗粉の発生を軽減しノイズの発生を
抑えるようにした摺動接点材料及びその加工方法を提供
しようとするものである。SUMMARY OF THE INVENTION Therefore, the present invention is intended to provide a sliding contact material having improved wear resistance, reduced generation of abrasion powder and suppressed generation of noise, and a method of processing the same. Is.
【0004】[0004]
【課題を解決するための手段】上記課題を解決するため
の本発明の摺動接点材料の1つは、Cuを0.1 〜8重量
%含有するAgCu合金において、含有する全Cu量の
70重量%以上がAgα相中に固溶していることを特徴と
するものである。One of the sliding contact materials of the present invention for solving the above-mentioned problems is an AgCu alloy containing 0.1 to 8% by weight of Cu.
It is characterized in that 70% by weight or more is solid-dissolved in the Agα phase.
【0005 】本発明の摺動接点材料の他の1 つは、前記
摺動接点材料において、さらにCd、Pb、Ge、I
n、Sn、Sb及びZnより選択される少なくとも1種
を0.1〜2重量%含有していることを特徴とするもので
ある。Another one of the sliding contact materials of the present invention is the above sliding contact material, further comprising Cd, Pb, Ge and I.
It is characterized by containing 0.1 to 2% by weight of at least one kind selected from n, Sn, Sb and Zn.
【0006】本発明の摺動接点材料の製造方法は、前記
2つの摺動接点材料のいずれかを、その組成におけるA
gCu二元系状態図での固相線温度以下および溶解度曲
線温度以上の温度に保持した後急冷し、その後少なくと
も30%以上の加工率で冷間加工を行なうことを特徴とす
るものである。In the method for producing a sliding contact material of the present invention, one of the above two sliding contact materials is used in the composition A
It is characterized in that the temperature is kept below the solidus temperature and above the solubility curve temperature in the gCu binary system phase diagram, followed by rapid cooling and then cold working at a working rate of at least 30% or more.
【0007】[0007]
【作用】上記のように本発明の摺動接点材料は、Agα
相中に全Cu量の70重量%以上が固溶しているため、A
gα相への固溶体硬化を十分に発揮させることができ、
摺動時に起こる軟化に伴う摩耗を軽減でき、耐摩耗性を
向上することができる。ここでAgα相中に固溶するC
uの量を70重量%以上としたのは、これより少ないと固
溶体硬化が十分に発揮されないためである。As described above, the sliding contact material of the present invention is Agα
Since 70% by weight or more of the total amount of Cu is dissolved in the phase,
It is possible to sufficiently exert solid solution hardening to the gα phase,
It is possible to reduce wear caused by softening that occurs during sliding and improve wear resistance. Here, C which forms a solid solution in the Agα phase
The reason why the amount of u is 70% by weight or more is that if it is less than this, the solid solution curing cannot be sufficiently exhibited.
【0008】さらに上記摺動接点材料は、Ge、Ni、
Sn、In、Zn、Mg、Mn、Sb、PbおよびBi
より選択される少なくとも1種を0.1 〜2重量%の範囲
で含有させることにより、摩耗を軽減させる効果がさら
に向上する。ここで含有させる範囲を0.1 〜2重量%と
したのは、0.1 重量%未満では添加による摩耗軽減効果
が発揮できず、2 重量%を起えると接触抵抗が高くなり
すぎるという問題が生じてしまうためである。Further, the above sliding contact materials are Ge, Ni,
Sn, In, Zn, Mg, Mn, Sb, Pb and Bi
By containing at least one selected from the range of 0.1 to 2% by weight, the effect of reducing wear is further improved. The content range is 0.1 to 2% by weight. If the content is less than 0.1% by weight, the effect of reducing wear cannot be exhibited, and if it exceeds 2% by weight, the contact resistance becomes too high. This is because.
【0009】本発明の摺動接点材料の製造方法で加熱に
よる溶体化処理を行なった後冷間加工を行なうのは、溶
体化処理を行なったままではAgα相は再結晶して軟化
してしまい、このままプレス加工すると表面に凹凸が発
生するという問題が発生するためである。本発明の摺動
接点材料の製造方法のように、溶体化処理後、少なくと
も30%以上の加工率で冷間加工を行なうことにより、加
工硬化させプレス加工で発生する表面の凹凸を抑制し、
さらに耐摩耗性を向上させることができる。このように
して製造された本発明の摺動接点材料は耐摩耗性が大変
改善され、例えばこの材料でコミテータを製作したマイ
クロモータの場合、刷子接点との摺動時の摩耗が軽減さ
れ、摩耗粉により起こるノイズを軽減することができる
ものである。In the method for producing a sliding contact material according to the present invention, the solution treatment by heating is performed and then the cold working is performed. If the solution treatment is still performed, the Agα phase is recrystallized and softened. This is because, if the press working is performed as it is, a problem that unevenness occurs on the surface occurs. As in the method for producing a sliding contact material of the present invention, after the solution treatment, by performing cold working at a working rate of at least 30% or more, to suppress surface irregularities generated by work hardening and press working,
Further, the wear resistance can be improved. The sliding contact material of the present invention produced in this way has a significantly improved wear resistance. The noise caused by the powder can be reduced.
【0010】[0010]
【実施例】本発明の摺動接点材料及びその製造方法の実
施例を比較例、従来例と共に説明する。下記の表1の成
分組成の実施例1の材料は、 750℃で1時間保持した
後、水冷し、その後、49%の加工率で伸線加工を行っ
た。実施例2〜12および比較例1〜2の材料は、 700℃
にて30分間保持した後、水冷し、その後75%の加工率で
伸線加工を行なった。また従来例の材料は 550℃にて1
時間保持した後、空冷し、その後49%の加工率で伸線加
工を行なった。EXAMPLES Examples of the sliding contact material of the present invention and a method for producing the same will be described together with comparative examples and conventional examples. The material of Example 1 having the component composition shown in Table 1 below was held at 750 ° C. for 1 hour, cooled with water, and then wire-drawn at a working rate of 49%. The materials of Examples 2-12 and Comparative Examples 1-2 were 700 ° C.
After being held for 30 minutes at 80 ° C., it was cooled with water and then drawn at a working rate of 75%. The material of the conventional example is 1 at 550 ° C.
After holding for a time, it was air-cooled, and then wire drawing was performed at a working rate of 49%.
【0011】[0011]
【表1】 [Table 1]
【0012】このようにして製作した材料のAgα相の
格子定数は実施例1で 4.037Å、実施例2で 4.050Å、
従来例で 4.063Åであった。Vegard則により実施
例1、実施例2及び従来例におけるCuの固溶量はそれ
ぞれ 6.6重量%、 4.8重量%及び3重量%であり、摺動
接点材料に含まれる全Cu量のそれぞれ88重量%、80重
量%及び40重量%がAgα相中に固溶しているものであ
った。The Agα phase lattice constant of the material thus manufactured was 4.037Å in Example 1, 4.050Å in Example 2,
It was 4.063Å in the conventional example. According to Vegard's law, the solid solution amounts of Cu in Examples 1, 2 and the conventional example are 6.6% by weight, 4.8% by weight and 3% by weight, respectively, and 88% by weight of the total amount of Cu contained in the sliding contact material, respectively. , 80 wt% and 40 wt% were in solid solution in the Agα phase.
【0013】然して上記成分組成の実施例1〜12、比較
例1〜2及び従来例の試験材料として直径2mmの丸棒を
用い、同径のAg−Pd50%の丸棒と十字交差させて、
下記の試験条件にて摺動試験を行ない、摩耗量と接触抵
抗を求めた処、下記の表2に示すような結果を得た。As a test material for Examples 1 to 12, Comparative Examples 1 and 2 and the conventional example having the above-mentioned composition, a round bar having a diameter of 2 mm was used and crossed with a round bar having the same diameter of 50% Ag-Pd.
A sliding test was conducted under the following test conditions to determine the amount of wear and the contact resistance, and the results shown in Table 2 below were obtained.
【0014】試験条件 電流 DC 170mA 摺動速度 20mm/sec 荷重 25g テスト時間 333分 温度 25℃ 湿度 50%RHTest conditions Current DC 170mA Sliding speed 20mm / sec Load 25g Test time 333 minutes Temperature 25 ° C Humidity 50% RH
【0015】[0015]
【表2】 [Table 2]
【0016】上記の表2で明らかなように実施例1〜12
の摺動接点材料は従来例の摺動接点材料に比べ摩耗量が
著しく少なく、接触抵抗が著しく低いことが判る。また
比較例1の摺動接点材料は接触抵抗が低いかわりに摩耗
量が多く比較例2では、摩耗量が少ないかわりに接触抵
抗が高いという問題点があり、実施例1〜12の摺動接点
材料に比べて劣るものである。As can be seen in Table 2 above, Examples 1-12
It can be seen that the sliding contact material of (1) has a significantly smaller amount of wear than the sliding contact material of the conventional example, and the contact resistance is significantly low. Further, the sliding contact material of Comparative Example 1 has a large amount of wear in spite of low contact resistance, and Comparative Example 2 has a problem of high contact resistance in spite of a small amount of wear. It is inferior to the material.
【0017】[0017]
【発明の効果】以上の通り本発明の摺動接点材料はAg
α相中に含有するCu原子の70%以上が固溶されたり、
さらにGe、Ni、Sn、In、Zn、Mg、Mn、S
b、Pb及びBiの内少なくとも1種を含有するもの
で、Agα相への固溶体硬化を十分に発揮させることが
できる。従って摺動時に起こる軟化に伴う摩耗を軽減で
き、耐摩耗性を向上できる。また溶体化処理を行なった
ままでは、Agα相は再結晶して軟化しているが、本発
明の摺動接点材料の加工方法のように少なくとも30%以
上の加工率で冷間加工を行なうことにより加工硬化す
る。従って、この材料で製作した摺動接点は刷子接点と
の摺動時摩耗が軽減され、摩耗からくるノイズを軽減で
きる。As described above, the sliding contact material of the present invention is Ag
70% or more of the Cu atoms contained in the α phase are dissolved,
Furthermore, Ge, Ni, Sn, In, Zn, Mg, Mn, S
It contains at least one of b, Pb and Bi, and can sufficiently exhibit solid solution hardening to the Agα phase. Therefore, it is possible to reduce wear caused by softening that occurs during sliding and improve wear resistance. Further, the Agα phase is recrystallized and softened when the solution treatment is performed, but cold working should be performed at a working rate of at least 30% or more as in the working method of the sliding contact material of the present invention. Work hardens by. Therefore, the sliding contact made of this material is reduced in abrasion when sliding on the brush contact, and noise caused by abrasion can be reduced.
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成5年6月7日[Submission date] June 7, 1993
【手続補正1】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】0005[Name of item to be corrected] 0005
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【0005】本発明の摺動接点材料の他の1つは、前記
摺動接点材料において、さらにGe、Ni、Sn、I
n、Zn、Mg、Mn、Sb、Pb及びBiより選択さ
れる少なくとも1種を0.1〜2重量%含有しているこ
とを特徴とするものである。Another one of the sliding contact materials of the present invention is the above sliding contact material, further comprising Ge, Ni, Sn and I.
It is characterized by containing 0.1 to 2% by weight of at least one selected from n, Zn, Mg, Mn, Sb, Pb and Bi .
Claims (4)
u合金において、含有する、全Cu量の70重量%以上が
Agα相中に固溶していることを特徴とする摺動接点材
料。1. AgC containing 0.1 to 8% by weight of Cu
In the u alloy, a sliding contact material comprising 70% by weight or more of the total amount of Cu contained in the Agα phase as a solid solution.
e、Ni、Sn、In、Zn、Mg、Mn、Sb、Pb
及びBiより選択される少なくとも1種を0.1 〜2重量
%含有していることを特徴とする請求項1に記載の摺動
接点材料。2. The sliding contact material further comprising G
e, Ni, Sn, In, Zn, Mg, Mn, Sb, Pb
2. The sliding contact material according to claim 1, containing 0.1 to 2% by weight of at least one selected from Bi and Bi.
u合金を、その組成におけるAgCu二元系状態図での
固相線温度以下および溶解度曲線温度以上の温度に保持
した後急冷し、その後少なくとも30%以上の加工率で冷
間加工を行なうことを特徴とする摺動接点材料の製造方
法。3. AgC containing 0.1 to 8% by weight of Cu
The u alloy should be cooled at a temperature below the solidus temperature and above the solubility curve temperature in the AgCu binary phase diagram for that composition, followed by quenching and then cold working at a working rate of at least 30% or more. A method for producing a sliding contact material characterized.
i、Sn、In、Zn、Mg、Mn、Sb、Pb及びB
iより選択される少なくとも1種を0.1 〜2重量%含有
することを特徴とする、請求項3に記載の摺動接点材料
の製造方法。4. The AgCu alloy further comprises Ge, N
i, Sn, In, Zn, Mg, Mn, Sb, Pb and B
The method for producing a sliding contact material according to claim 3, wherein the content of at least one selected from i is 0.1 to 2% by weight.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP08912893A JP3355380B2 (en) | 1992-03-25 | 1993-03-24 | Method of manufacturing commutator material for small DC motor |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4-98692 | 1992-03-25 | ||
JP9869292 | 1992-03-25 | ||
JP08912893A JP3355380B2 (en) | 1992-03-25 | 1993-03-24 | Method of manufacturing commutator material for small DC motor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH06220555A true JPH06220555A (en) | 1994-08-09 |
JP3355380B2 JP3355380B2 (en) | 2002-12-09 |
Family
ID=26430560
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP08912893A Expired - Lifetime JP3355380B2 (en) | 1992-03-25 | 1993-03-24 | Method of manufacturing commutator material for small DC motor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3355380B2 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5558833A (en) * | 1995-06-09 | 1996-09-24 | Zamojski; Marek R. | Silver alloy |
US7160632B2 (en) | 2003-11-26 | 2007-01-09 | Mabuchi Motor Co., Ltd. | Material for sliding contacts, clad composite material and small-sized DC motor using the same |
CN100439529C (en) * | 2007-01-19 | 2008-12-03 | 昆明贵金属研究所 | Silver-copper rare earth alloy material |
CN102134666A (en) * | 2011-02-09 | 2011-07-27 | 贵研铂业股份有限公司 | Novel silver-based electric contact elastic material and application thereof |
CN102321825A (en) * | 2011-10-13 | 2012-01-18 | 西北工业大学 | Silver-copper nano alloy and electrosynthesis method thereof |
US8330320B2 (en) | 2009-06-05 | 2012-12-11 | Mabuchi Motor Co., Ltd. | Sliding contact material, clad composite material, and motor |
CN103334023A (en) * | 2013-06-20 | 2013-10-02 | 昆明贵金属研究所 | Silver copper zinc nickel sliding electric contact material containing rare earth ferrosilicomagnesium alloy |
JP2016065308A (en) * | 2014-09-18 | 2016-04-28 | 三菱マテリアル株式会社 | Ag ALLOY SPUTTERING TARGET, PRODUCTION METHOD OF Ag ALLOY SPUTTERING TARGET, Ag ALLOY FILM AND PRODUCTION METHOD OF Ag ALLOY FILM |
-
1993
- 1993-03-24 JP JP08912893A patent/JP3355380B2/en not_active Expired - Lifetime
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5558833A (en) * | 1995-06-09 | 1996-09-24 | Zamojski; Marek R. | Silver alloy |
US7160632B2 (en) | 2003-11-26 | 2007-01-09 | Mabuchi Motor Co., Ltd. | Material for sliding contacts, clad composite material and small-sized DC motor using the same |
CN100439529C (en) * | 2007-01-19 | 2008-12-03 | 昆明贵金属研究所 | Silver-copper rare earth alloy material |
US8330320B2 (en) | 2009-06-05 | 2012-12-11 | Mabuchi Motor Co., Ltd. | Sliding contact material, clad composite material, and motor |
CN102134666A (en) * | 2011-02-09 | 2011-07-27 | 贵研铂业股份有限公司 | Novel silver-based electric contact elastic material and application thereof |
CN102321825A (en) * | 2011-10-13 | 2012-01-18 | 西北工业大学 | Silver-copper nano alloy and electrosynthesis method thereof |
CN103334023A (en) * | 2013-06-20 | 2013-10-02 | 昆明贵金属研究所 | Silver copper zinc nickel sliding electric contact material containing rare earth ferrosilicomagnesium alloy |
JP2016065308A (en) * | 2014-09-18 | 2016-04-28 | 三菱マテリアル株式会社 | Ag ALLOY SPUTTERING TARGET, PRODUCTION METHOD OF Ag ALLOY SPUTTERING TARGET, Ag ALLOY FILM AND PRODUCTION METHOD OF Ag ALLOY FILM |
JP2017128812A (en) * | 2014-09-18 | 2017-07-27 | 三菱マテリアル株式会社 | Ag ALLOY SPUTTERING TARGET, METHOD FOR PRODUCING Ag ALLOY SPUTTERING TARGET AND METHOD FOR PRODUCING Ag ALLOY FILM |
US10060025B2 (en) | 2014-09-18 | 2018-08-28 | Mitsubishi Materials Corporation | Ag alloy sputtering target, method of manufacturing Ag alloy sputtering target, Ag alloy film, and method of forming Ag alloy film |
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---|---|
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