JPH0621246A - Method and apparatus of marking semiconductor device - Google Patents

Abstract

PURPOSE:To make it possible to complete a marking process which has been conventionally performed every upper and lower surface by one process similar to the case of the upper surface. CONSTITUTION:A transfer plate A11 and a transfer B12 formed on both upper and lower surfaces are installed to each upper and lower surface of a semiconductor device 1, and a source of UV light is installed above and below the semiconductor device 1 adjoining to the transfer plates, and a marking pattern is simultaneously transferred on both upper and lower surfaces of the semiconductor device 1 by the transfer plate A and the transfer plate B. Then, by applying UV light 17 from the upper and lower surfaces of the semiconductor device 1, UV inks of the upper and lower surfaces are cured and thereby marking of the upper and lower surfaces of the semiconductor device 1 is performed by one fluidization. Also, by a half-mirror and a reflecting mirror, UV light from one UV lamp can be divided into to beam to illuminate the upper and lower surface of the semiconductor device 1. Accordingly, steps of process are halved, and time of process can be reduced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a V-ink imprinting method and imprinting apparatus for a resin-encapsulated semiconductor device, and more particularly to an ink transfer method for imprinting the upper and lower surfaces of the semiconductor device. And a method of UV drying after transfer and a structure of a marking device.

[0002]

2. Description of the Related Art Conventionally, regarding a structure of a marking device for a semiconductor device of this type, FIG. 5 shows an overall view of an embodiment of a conventional marking device. The structure of a conventional marking device for a semiconductor device is an elevator or the like. And a transfer path 4 of a semiconductor device adjacent to the loader section 3, a transfer plate A11 for imprinting a stamp such as a rubber stamp provided in the middle of the transfer path 4 and above the transfer path 4, and a plate for moving the transfer plate up and down. A marking head 5 composed of a driving system, a UV lamp 10 provided next to the marking head 5 above the transport path 4 and a drying furnace 6 whose periphery is covered with a metal plate; and an elevator and the like. The structure has an unloader section 7 for removing and storing the semiconductor device 1 after marking, a control system 8 and a drive system 9 for the entire device. FIG. 6 shows a marking head and a drying oven in an embodiment relating to a conventional marking device. Shows a partial enlarged view of There, a semiconductor device of a resin sealing type 1
Is set on the loader unit 3, is supplied to the conveying path 4 by a suction head or the like, and the ink is transferred only on the upper surface by the transfer plate A11 that has descended from above in the imprinting head 5 during the conveyance (imprinting), While being transported along the transport path 4, only the upper surface of the UV lamp is irradiated with UV light by the UV lamp provided above the drying path 6 adjacent to the marking head 5, and the ink is cured. Since the semiconductor device 1 is stored, when the back surface of the semiconductor device 1 is to be imprinted, after the imprinting of the upper surface is completed, the semiconductor device is set again in the loader unit 3 and the above imprinting work of the upper surface is repeated. .

[0003]

SUMMARY OF THE INVENTION In the above prior art,
When it is necessary to mark the upper and lower surfaces of the semiconductor device, the upper surface of the semiconductor device is first marked once and stored in the unloader unit, and then the semiconductor device is taken out, turned over, and set again in the loader to mark the upper surface. As in the case, the marking work must be repeated once again, and there was a problem that the number of man-hours required for the marking was about twice as much as when the marking was performed only on the upper surface.

An object of the present invention is to complete the ink-printing on the upper and lower surfaces of a semiconductor device in a single process as in the case of the upper surface, which has conventionally been done once for each of the upper surface and the back surface. An object of the present invention is to provide a marking method and a marking device for such a semiconductor device.

[0005]

The above object can be achieved by the following method and apparatus.

1. When marking on the upper and lower surfaces of the UV ink semiconductor device, the upper and lower surfaces of the semiconductor device are simultaneously marked on the upper and lower surfaces of the semiconductor device, and in the subsequent stage,
A method for imprinting a semiconductor device, wherein the imprinting process on both the upper and lower surfaces of the semiconductor device is performed by a single flow by irradiating the semiconductor device with UV light (ultraviolet light) from both directions.

2. A marking path having a transfer path of a semiconductor device to be marked, a transfer means for transferring a marking pattern such as a rubber stamp provided on the upper and lower surfaces of the transfer path, a UV lamp was installed adjacent to the marking head, and along the upper and lower surfaces of the transfer path. A marking device for a semiconductor device, which has a UV drying furnace and is capable of marking the upper and lower surfaces of the semiconductor device in one flow.

3. A conveying path of a semiconductor device to be imprinted, a marking head having transfer means for imprinting patterns such as rubber stamps provided on the upper and lower surfaces of the conveying path, and a UV lamp installed on the upper surface of the conveying path adjacent to the imprinting head. UV drying provided with a plurality of reflection mirrors so that the reflected light from the half mirror provided between the LED and the UV lamp and the half mirror provided at the destination of the reflected light reaches the back surface of the semiconductor device on the transport path. A stamping device for a semiconductor device, which has a furnace and stamps the upper and lower surfaces of the semiconductor device in one flow.

[0009]

According to the above configuration of the present invention, when marking is performed on both upper and lower surfaces of a semiconductor device, ink transfer is performed from the upper and lower surfaces simultaneously and drying after the transfer is performed. For example, a UV lamp is provided on the upper and lower surfaces of the semiconductor device. U is installed from both upper and lower sides
By illuminating V light, or by dividing the UV light from one UV lamp into the upper and lower surfaces of the semiconductor device by the half mirror and the reflecting mirror and illuminating it, the semiconductor device can be moved up and down by a single marking process. Since both sides can be transferred (printed) and dried at the same time, the number of steps is almost the same as in the case of printing on only one side.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described with reference to the drawings.

FIG. 1 is an external view of an embodiment of the marking method of the present invention. According to the marking method of the present invention, a transfer plate A is installed on each of the upper and lower surfaces of a semiconductor device.
11, a transfer plate B12 is installed, and a supply source of UV light 17 is installed on the upper and lower surfaces of the semiconductor device adjacent to the transfer plate, and the transfer plate A11 and the transfer plate B12 are used to simultaneously form a marking pattern on the upper and lower surfaces of the semiconductor device. By transferring and then irradiating the UV light 17 from the upper and lower surfaces of the semiconductor device to cure the UV ink 18 on the upper and lower surfaces, the marking on the upper and lower surfaces of the semiconductor device is performed by one flow.

FIG. 2 shows an overall view of the first embodiment of the marking device according to the marking method of the present invention. According to the first embodiment of the marking device of the present invention, as shown in FIG. Loader unit 3 in which the semiconductor devices 1 are set and sequentially supplied
A transfer path 4 adjacent to the loader section 3, a transfer plate A11 such as a rubber stamp above and below the transfer path 4, a transfer plate B12, a plate drive system 13 for moving these transfer plates up and down, and a semiconductor device fixing device. A marking head 5 provided on the conveyance path 4 having a stopper 15, and a drying oven 6 provided on the conveyance path 4 adjacent to the marking head 5 having UV lamps above and below the conveyance path,
The semiconductor device 1 includes an unloader unit 7 having an elevator or the like for housing the stamped semiconductor device 1, a control system 8 for controlling the entire device, and a drive system 9. The semiconductor device is set on the loader unit 3 and then the suction head is provided. It is supplied to the transport path 4 by 14 or the like, and is sequentially fed on the transport path 4 by the feed pin 16 or the like. Next, FIG. 3 shows a partially enlarged view of the marking head and the drying furnace in the semiconductor device 1 in the first mounting example.
1. The transfer plate B12 is extruded from the vertical direction onto the upper and lower surfaces of the plate by the plate driving system 13, and the semiconductor device 1 is imprinted from the upper and lower surfaces simultaneously. Further, the semiconductor device 1 is supplied with UV from the upper and lower sides of the drying furnace 6 while being conveyed through the carrier furnace 4.
The upper and lower surfaces of the semiconductor device 1 are simultaneously cured by UV light from the lamp 10, are further sent and stored in the unloader section 7, and the marking of the upper and lower surfaces of the semiconductor device 1 is completed. Next, according to the second embodiment of the marking device by the marking method of the present invention, FIG. 4 shows a partially enlarged view of the marking head and the drying oven of the second embodiment, but the second mounting example is the first. In the embodiment, with respect to the drying oven 6, the UV lamp 10 is installed above the transport path 4, the half mirror 19 is installed in the optical path until the UV light 17 reaches the semiconductor device 1 on the transport path 4, and further Reflection mirror A20, reflection mirror B21, and reflection mirror C so that the reflected light reaches the back surface of the semiconductor device 1 in the reflection direction of
22 is installed to irradiate the semiconductor device 1 with the UV light 17, and only one UV lamp is provided at the upper side, and the UV light is divided by the half mirror 19 so that the UV light is applied to the back surface of the semiconductor device 1.
It is designed to allow the light 17 to reach, and is characterized in that only one UV lamp 10 is required.

[0013]

According to the present invention, in regard to the stamping process for the upper and lower surfaces of the semiconductor device, what was conventionally put into the device twice, once for each of the upper and lower sides, can be done by one time. Therefore, it is possible to reduce the number of processing steps and the processing time.

In the first embodiment of the marking device according to the present invention, since the UV lamps above and below the semiconductor device are independent,
Since the illuminance of UV light can be adjusted individually for each UV lamp, the illuminance can be easily adjusted.

In the second embodiment of the marking device according to the present invention, since only one UV lamp is provided above the semiconductor device, the UV lamp is used.
Lamp maintenance costs are low, lamp replacement time can be shortened, and rationalization can be achieved.

[Brief description of drawings]

FIG. 1 is an external view of an embodiment of a marking method according to the present invention.

FIG. 2 is an overall view of a first mounting example of a marking device according to the marking method of the present invention.

FIG. 3 is a partially enlarged view of a marking head and a drying oven of a first mounting example according to the present invention.

FIG. 4 is a partially enlarged view of a marking head and a drying oven of a second mounting example according to the present invention.

FIG. 5 is an overall view of an example of a conventional marking device.

FIG. 6 is a partially enlarged view of a marking head and a drying oven according to an embodiment of a conventional marking device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor device 2 Ink marking machine 3 Loader section 4 Conveying path 5 Marking head 6 Drying furnace 7 Unloader section 8 Control system 9 Driving system 10 UV lamp 11 Transfer plate A 12 Transfer plate B 13 Plate driving unit 14 Adsorption head 15 Stopper 16 Transport pin 17 UV light 18 UV ink 19 Half mirror 20 Reflective mirror A 21 Reflective mirror B 22 Reflective mirror C

Claims (3)

[Claims] 1. A marking method and a marking device for a semiconductor device, wherein a semiconductor chip is wire-bonded to a lead frame, resin-sealed, and then UV resin is used to imprint the resin surface, and the upper and lower surfaces of the semiconductor device are imprinted. At this time, the upper and lower surfaces of the semiconductor device are simultaneously imprinted by the transfer plates provided on the upper and lower sides of the semiconductor device, and UV light (ultraviolet light) is illuminated from both the upper and lower directions of the semiconductor device on the subsequent stage to imprint the upper and lower surfaces of the semiconductor device. A method for imprinting a semiconductor device, wherein the process is performed by a single flow. 2. A marking method and a marking device for a semiconductor device, wherein a semiconductor chip is wire-bonded to a lead frame, resin-sealed, and then UV resin is used to mark the resin surface. When imprinting on both sides, imprinting on the upper and lower sides of the semiconductor device at the same time by imprinting on the upper and lower sides of the semiconductor device, and at the subsequent stage, imprinting of the semiconductor device such that UV light (ultraviolet ray) is radiated from both upper and lower directions of the semiconductor device A marking device using the method, in particular, a conveyance path of a semiconductor device to be marked, a marking head having a transfer plate of a marking pattern such as a rubber stamp provided on the upper and lower surfaces of the conveyance path, and an upper and lower surface of the conveyance path adjacent to the marking head. It has a structure consisting of a drying oven for UV curing with a UV lamp installed along with, a control system for the entire device, a drive system, a product loader, and an unloader. Stamping device wherein a. 3. The marking device for a semiconductor device according to claim 2, wherein, regarding the structure of the drying furnace, a UV lamp is installed on the upper surface of the transfer path, and a half mirror provided between the transfer path and the UV lamp and reflected light are provided. A marking device for a semiconductor device, comprising a plurality of reflecting mirrors arranged so that reflected light from a half mirror provided at a destination reaches the back surface of the semiconductor device on a conveyance path.