JP2600618B2 - Semiconductor device manufacturing method and manufacturing apparatus - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a manufacturing process for encapsulating a semiconductor element in a package, and more particularly to a method and an apparatus for manufacturing a semiconductor device capable of simplifying the manufacturing process and shortening the processing time. About.

[0002]

2. Description of the Related Art Generally, in a semiconductor device, a semiconductor element is mounted on a ceramic base formed of ceramic or the like.
A package is formed by placing a cap on the ceramic base after making electrical connection to the leads and fixing the cap to the ceramic base with an adhesive (sealing agent) made of a thermosetting resin or the like. When the cap is fixed with the adhesive, a so-called sealing cure process is performed in which the adhesive is kept at a high temperature for a predetermined time and cured while pressing the cap against the ceramic base.

[0003] In addition, the type and number of the packaged semiconductor device are stamped. When the package is made of a ceramic material, it cannot be engraved with a laser beam like a mold material, and therefore, the thermosetting curable resin is used. Transfer the ink to the surface of the package by the stamp method using the ink of
Thereafter, so-called marking cure, in which the package is maintained at a high temperature and the ink is dried and cured, is performed. Note that an ink using UV (ultraviolet) ink instead of the thermosetting ink has been proposed. In this case, the ink is transferred and then irradiated with UV light to dry and cure the ink.

[0004]

As described above, in the conventional semiconductor device packaging process, two processes of sealing cure and stamping cure are necessary. Particularly, in the former sealing cure process, heat curing of the adhesive is performed. Requires a long time (usually about 3 hours), and the manufacturing time becomes long.
Also, in the latter type of curing, when a thermosetting ink is used, a time of about 2 hours is required, and similarly, there is a problem that the manufacturing time is prolonged. In this regard, UV
In the case where the ink is used, since the ink can be dried and cured by irradiating UV light, it is possible to cure the seal in a relatively short time.

[0005] However, even if the UV ink is used as described above to shorten the process time of the seal cure, it is difficult to shorten the process time of the former encapsulation cure, and as a result, the entire manufacturing process is reduced. It would be difficult to shorten the time. In addition, if an attempt is made to configure the sealing device and the stamping device as an inline device, the flow of the product will be stagnant in the sealing and curing process. Processing is difficult. For this reason, conventionally, each process of sealing cure and seal cure is batch-processed.For this reason, before and after each process, an operation of refilling a semiconductor device between a magazine case and a tray for cure is required, There is a problem that extra man-hours are required.

[0006]

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing a semiconductor device in which a sealing step and a stamping step are simplified and the processing time is shortened. Another object of the present invention is to
It is an object of the present invention to provide an apparatus for manufacturing a semiconductor device in which a sealing device and a marking device are inlined and a semiconductor device can be manufactured by line processing.

[0007]

According to the manufacturing method of the present invention, there are provided a step of applying a UV adhesive which is cured by irradiation of UV light to a package on which a semiconductor element pellet is mounted, and a step of placing a cap on the package. A step of stamping one surface of the package or cap with UV ink that is cured by irradiation with U light, and irradiating the UV adhesive and UV ink with UV light to seal the cap and fix the stamp. It is characterized by including the step of performing.

When the present invention is applied to the manufacture of a semiconductor device having a hollow package, a step of removing foreign matters in the hollow package on which semiconductor element pellets are mounted and cleaning the same, and irradiating the hollow package with UV light A step of applying a UV adhesive that cures by: a step of placing a cap on the hollow package; a step of irradiating the UV adhesive with UV light to seal the cap; and Filling the through holes with UV adhesive;
U cured on one surface of the package by irradiation with UV light
It is preferable to include a step of performing a seal using the V ink, and a step of irradiating the UV adhesive and the UV ink with UV light to seal the hollow package by filling and fix the seal.

Further, the manufacturing apparatus of the present invention includes means for applying a UV adhesive which is cured by irradiation with UV light to a lead frame having a package on which semiconductor element pellets are mounted, and mounting a cap on the package. Means for placing, imprinting characters and numerals using UV ink which is cured by irradiation of UV light on one surface of the package or the cap, irradiating the package with UV light, and applying the UV adhesive And means for curing the UV ink.

In this case, the semiconductor device manufacturing apparatus provided with the hollow package includes a means for turning the lead frame upside down in a part of the process, applying a UV adhesive to the package from above or below, or It is preferable that UV ink can be stamped on the upper or lower surface of the package.

Further, the manufacturing apparatus of the present invention preferably includes a cleaning means for applying a vibration to the lead frame to remove foreign matter in the package at least before the step of applying the UV adhesive.

[0012]

[Function] A UV adhesive for sealing a package,
By simultaneously curing the UV ink for stamping the package by irradiating the UV light, it is possible to perform the sealing cure and the marking cure simultaneously and in a short time. It is possible to reduce the number of steps and the processing time.

[0013] Further, by sharing a part of the device for performing sealing and the device for performing stamping, and making both devices in-line, a part of the processing steps can be omitted to shorten the manufacturing process time,
In addition, the device space can be reduced.

[0014]

Next, an embodiment of the present invention will be described with reference to the drawings. 1A is a plan view of a unit configuration of a semiconductor device to be manufactured by the present invention, and FIG. 1B is a cross-sectional view thereof. As shown in these drawings, for example, a semiconductor device 1 such as a solid-state imaging device is A package 3 is formed of a thermosetting resin on a lead frame 2.
A semiconductor element pellet 4 composed of a solid-state imaging device such as the above is mounted, and is electrically connected to a lead 6 by a thin metal wire 5. The package 3 has an opening on the upper surface, and the opening 3a is sealed by bonding a glass cap 7 with an adhesive 8 as shown by a chain line. A mark such as a character or a number is stamped on a part of the cap 7 with the UV ink 9. As shown in FIG. 3C, a plurality of the semiconductor devices having the unit configuration are housed in a magazine case to be described later as a plurality of structures 10 connected by the lead frame 2. (Hereinafter, this connected structure is referred to as a lead frame structure 10), and the sealing and stamping processes described below are performed.

FIG. 2 is a schematic plan view of an apparatus for manufacturing a semiconductor device according to an embodiment of the present invention. In particular, FIG. 2 shows a configuration example in which a sealing device for a semiconductor device package and a marking device are inlined. In the figure, reference numeral A denotes a loader unit, which accommodates a magazine case 11 accommodating a lead frame structure 10 as shown in FIG. 1 in which a semiconductor element pellet 4 is already mounted in a package 3 and pushes the lead frame structure 10 to a pusher. The configuration 12 allows the magazine cases 11 to be taken out one by one. B denotes a cavity cleaner for cleaning the inside of the package 3. Reference numeral C denotes a dispense unit, which applies the UV adhesive 8 to the package 3. D is a cap set part, and mounts the cap 7 on the package 3 to which the UV adhesive 8 has been applied. Reference numeral E denotes a seal portion on which required characters, numerals, and the like are printed on one surface of the package 3, here, a corner of the surface of the cap 7 using UV ink. F is a UV irradiator, and the UV adhesive 8 or U
The V ink is irradiated with UV light. G denotes an unloader unit, which is configured to operate in the opposite direction to the loader unit, and in which the lead frame structure 10 in which the package 3 is sealed.
And stored in the makajin case 11. Also,
A linear transport rail 13 extends from the cavity cleaner section B to the unloader section G, and a transport section H is configured.

FIG. 3 shows the structure of the cavity cleaner portion B. As shown in FIG. 3A, two pairs of clamp claws each having a lead frame structure 10 whose upper surface is directed downward are formed in a gate frame shape. After the vibration plate 15 is vibrated in the left and right direction and the vertical direction by the vibrator 16 and the air cylinder 17 while being fixed on the vibration plate 15 by being sandwiched by 14, and the lead frame assembly 10 is vibrated integrally therewith, Foreign matter in the package 3 is dropped through the opening, and the foreign matter is removed by a hopper-shaped dust collector 18. The cavity cleaner B is provided with a reversing mechanism as shown in FIG. 3 (b). The lead frame assembly 10 cleaned by dust collection is clamped by clamp claws 19, and is rotated by a rotary actuator 20 in the vertical direction. Then, the package 3 is transferred onto the transport rail 13 with the opening of the package 3 facing upward.

FIG. 4 shows the structure of the dispensing section C, which has an XY robot 21 which is moved in a plane XY direction. Upper and lower cylinder mechanism 24 provided
A plurality of discharge nozzles 23 are arranged and supported. Then, each package 3 is moved from the discharge nozzle 23 to the lead frame structure 10 moved on the transport rail 13.
, A UV adhesive 8 is discharged and applied to the upper surface thereof.

FIG. 5 shows the configuration of the cap setting section D. As shown in FIG. 5A, the cap setting section D has an XY robot 25 which is moved in a plane XY direction. A cap suction section 26 for performing suction is provided so as to be vertically movable by a vertical cylinder mechanism 27. Due to the plane XY movement of the XY robot 25 and the vertical movement of the cap suction part 26 by the vertical cylinder mechanism 27, the cap suction part 26 is moved to the cap 7 stored in the cap tray 28.
And is transferred onto a positioning stage 29 provided at another location as shown in FIG. 5B. A guide rod 30 is horizontally provided between the positioning stage 29 and the transfer rail 13 in a horizontal direction, and a cap set arm 31 is supported by the guide rod 30 so as to be reciprocally movable. The cap set arm 31 is provided with a cap suction portion 33 by an up-down cylinder mechanism 32, which sucks the cap 7 placed on the positioning stage 29,
It is transferred onto each package 3 of the lead frame structure 10 on the transport rail 13.

FIG. 6 shows the structure of the seal portion E.
The transport rail 1 is provided for the Z robot 34 that is moved
A plurality of ink jet nozzles 35 are arranged at a portion facing the surface 3, and predetermined characters and numerals are applied to the cap 7 placed on each package 3 of the lead frame structure 10 moved on the transport rail 13 by UV ink. To print.

FIG. 7 shows the structure of the UV irradiation section F. A UV light source 36 extends along the transport rail 13.
Lead frame structure 10 moved on transport rail 13
Is configured to be able to irradiate each package 3 with UV light.

A method of manufacturing a semiconductor device using the semiconductor manufacturing apparatus having the above configuration will be described. FIG. 8 is a view showing the semiconductor device shown in FIG. 1 in the order of steps. First, as shown in FIG. 1B, the package 3 is integrated with the lead 6, and the semiconductor element pellet 4 is mounted in the package 3 so that the thin metal wire 5 is formed.
The lead frame structures 10 electrically connected by the above are taken out one by one from the magazine case 11 in the loader section A and transferred to the cavity cleaner section B. In this state, the package is upside down as shown in FIG. 8A, and in this state, the vibrator 16 is turned on as shown in FIG.
As a result, the foreign matter in the package 3 falls to the dust collector, and the inside of the package 3 is cleaned. Thereafter, the lead frame structure 10 is turned upside down by the rotary actuator 20, and FIG.
The state is returned to the state of (b).

Next, the lead frame structure 10 is transferred to the dispense section C by the transport rail 13, and the UV adhesive 8 discharged from the discharge nozzle 23 shown in FIG.
Is an opening 3a on the upper surface of the package 3 as shown in FIG.
Is applied to the periphery. Further, in synchronization with this, in the cap setting section D, as shown in FIG. 5, the cap suction section 26 transfers the cap 7 from the cap tray 28 to the positioning stage 29. Then, simultaneously with the completion of the application of the UV adhesive 8, the cap set arm 31 moves the cap 7 of the positioning stage 29 onto the transport rail 13, and as shown in FIG. Are placed so as to cover the opening of each package 3.

Thereafter, the lead frame structure 10 is transferred to the stamped portion E by the transport rail 13, and the cap 7 is moved by the ink jet nozzle 35 of the Z robot 34 shown in FIG. 6 as shown in FIG. A predetermined character, numeral, or the like is printed with UV ink 9 on the surface of the. Further, the lead frame structure 10 is moved to the UV irradiation part F,
Here, the UV light from the UV light source 36 shown in FIG.
Irradiation is performed as shown in (f). Since the UV adhesive 8 is cured by the irradiation of the UV light, the cap 7 placed on the package 3 is adhered and fixed to the package 3 by the UV adhesive 8, and the sealing of the opening 3a is completed. Further, since the UV ink 9 is dried and cured immediately by the irradiation of the UV light, the printing with the UV ink is fixed. In this case, a mechanism for pressing the cap 7 against the package 3 may be provided to ensure the sealing of the cap 7.

As described above, the lead frame structure 10 that has simultaneously sealed the cap 7 with the UV adhesive 8 and fixed the printing with the UV ink 9 is moved to the unloader section G by the transport rail 13, where each magazine is used. It is stored in the case 11 and used for the next step. Therefore,
In this semiconductor device manufacturing apparatus, processes corresponding to the conventional sealing cure and seal cure can be realized by irradiation with UV light, so that processing can be performed in an extremely short time. This makes it possible to inline the sealing step and the stamping step, shorten the processing time of all steps including the sealing step and the stamping step, and refill the lead frame between the two steps. Is unnecessary, and the processing time can be further reduced. On the other hand, it is also possible to reduce the specifications of the manufacturing apparatus.

Here, in recent years, as shown in FIG. 9, a so-called hollow package in which a through hole is provided in a part of the package has been proposed, but the present invention is applied to this hollow package. A manufacturing method in the case of performing the above will be described. The hollow package is shown in a bottom view in FIG.
As shown in the cross-sectional views of FIG.
In the package 3 'integrated with the above, a through hole 3b' is opened in the lower part together with the upper opening 3a '. The upper opening 3a 'is sealed with the cap 7 and the adhesive 8, while the lower through hole 3b' is filled with the adhesive 8 'and sealed. In this semiconductor device, the back surface of the package 3 'is stamped with UV ink 9.

When performing the sealing step and the stamping step in the manufacturing apparatus of the present invention on the lead frame assembly having such a hollow package 3 ', first, the lead frame assembly is removed from the loader section A to the cavity cleaner section B. In this state, the package 3 'is vibrated as described above with the upper part of the package facing upward as shown in FIG. ′ To clean the package 3 ′.
Thereafter, the substrate is transferred to the dispenser section C without being turned upside down. As shown in FIG. 10B, the UV adhesive 8 is applied to the upper surface of the package 3 'in exactly the same manner as in the previous embodiment, and the cap is set. In part D, the cap 7 is placed.
Then, without stamping, UV light is directly irradiated in the UV irradiation section F, thereby curing the UV adhesive 8, fixing the cap 7 to the package 3 ', and sealing the upper opening 3a' of the package 3 '. Complete the shutdown. The sealed lead frame structure is stored in the magazine case 11 in the unloader section G.

Next, the magazine case 11 containing the sealed lead frame structure is again loaded into the loader section A.
, And transferred from here to the cavity cleaner section B. At this time, when the lead frame structure is turned upside down, the lead frame structure is turned upside down by the rotary actuator 20 and transferred to the dispenser section C. When the lead frame structure is turned upside down, the dispenser is not turned upside down. Transfer to Part C. Then, in the dispenser section C, as shown in FIG. 10C, a UV adhesive 8 'is applied to the through hole 3b' at the bottom of the package 3 ', and
The through holes 3b 'are filled with the adhesive 8'.

Thereafter, as shown in FIG. 10D, the lead frame structure is printed on the back surface of the package 3 'with the UV ink 9 without setting the cap by the cap setting section D, as shown in FIG. Then, the lead frame structure is transferred to the UV irradiating section F by the transport rail 13, where irradiation of UV light is performed.
The UV adhesive 8 'filled in the through holes 3a' is cured,
At the same time as sealing the through hole 3a ', the UV ink 9 is dried and cured, and the print is fixed. Thereafter, the lead frame structure in the unloader section G is stored in the magazine case 11 in the same manner.

Therefore, in the semiconductor device using the hollow package 3 ', the sealing step and the stamping step can be automatically performed by passing the lead frame structure twice through the manufacturing apparatus. Also in this case, the UV adhesive 8 for sealing the cap is irradiated by UV light, and the curing of the UV adhesive 8 'for filling the through hole 3b' and the fixing of the UV ink 9 are performed. Since the irradiation is performed by irradiation with UV light, the processes of sealing cure and stamping cure can be performed in a short time, and the manufacturing process time can be reduced. Further, different processes can be executed by one manufacturing apparatus, and the space of the manufacturing apparatus can be reduced.

Various mechanisms can be applied to the components of the manufacturing apparatus of the above embodiment as long as they have equivalent functions. In the embodiment using the hollow package, each part of the manufacturing apparatus is selectively operated at the time of processing, but this control can be easily realized by computer control.

[0031]

As described above, according to the manufacturing method of the present invention, a package on which a semiconductor element pellet is mounted is coated with a UV adhesive which is cured by irradiation with UV light, and a cap is placed on the package. Sealing is performed on one surface of the package or cap using UV ink that cures by irradiation with U light, and then UV light is applied to the UV adhesive and UV ink to seal the cap and fix the seal. Since the process includes a process, the package can be cured and sealed in a short time at the same time, and the number of processes of the sealing process and the stamping process can be reduced, and the processing time can be shortened. effective.

When the present invention is applied to the manufacture of a semiconductor device having a hollow package, foreign matter in the hollow package is removed and cleaned, and then the hollow package is first used.
A step of applying a V adhesive and placing a cap on the hollow package, irradiating this with UV light to seal the cap, and then filling the through-hole of the hollow package with the UV adhesive, and Including a process of stamping one surface of the package with UV ink, and then irradiating UV light to the UV adhesive and the UV ink to seal the hollow package by filling the adhesive and fix the stamp Accordingly, even in a semiconductor device using a hollow package, the sealing step and the stamping step can be performed with less man-hours, and the processing time can be reduced.

Further, the manufacturing apparatus of the present invention includes means for applying a UV adhesive to a package, means for placing a cap on a package, and characters and numerals using UV ink on one surface of the package or the cap. And a means for irradiating the package with UV light to cure the UV adhesive and the UV ink, thereby providing a sealing process using the UV adhesive and using the UV ink. The stamping process can be performed while sharing a part of the device, reducing the number of manufacturing processes, shortening the manufacturing time, and enabling the construction of a device in which the means for performing each process is inlined. There is also an effect that the space of the device can be reduced.

A semiconductor device manufacturing apparatus having a hollow package is provided with a means for turning a lead frame upside down in a part of the process, applying a UV adhesive to the package from above or below, or By being configured so that the UV ink can be imprinted on the upper surface or the lower surface, it is possible to execute a sealing step using a cap and a sealing step using filling with an adhesive.

Further, in the manufacturing apparatus of the present invention, at least before the step of applying the UV adhesive, the lead frame is provided with cleaning means for removing foreign matter in the package by applying vibration to the lead frame, whereby the package is sealed. Foreign matter in the package can be removed, and a highly reliable semiconductor device can be manufactured.

[Brief description of the drawings]

FIG. 1 is a diagram showing an example of a semiconductor device to be manufactured by the present invention.

FIG. 2 is a schematic plan view of a manufacturing method according to the present invention.

FIG. 3 is a perspective view showing a schematic configuration of a cavity cleaner section.

FIG. 4 is a perspective view showing a schematic configuration of a dispensing unit.

FIG. 5 is a perspective view showing a schematic configuration of a cap setting section.

FIG. 6 is a perspective view illustrating a schematic configuration of a seal unit.

FIG. 7 is a perspective view illustrating a schematic configuration of a UV irradiation unit.

FIG. 8 is a sectional view of a package for explaining a manufacturing method of the present invention in the order of steps.

FIG. 9 is a diagram illustrating an example of a semiconductor device using a hollow package.

FIG. 10 is a sectional view of a package for describing a method of manufacturing a semiconductor device using a hollow package in the order of steps.

[Explanation of symbols]

 A Loader section B Cavity cleaner section C Dispense section D Cap setting section E Marking section F UV irradiation section G Unloader section 1 Semiconductor device 2 Lead frame 3 Package 4 Semiconductor element pellet 7 Cap 8 UV adhesive 9 UV ink

Claims (5)

(57) [Claims] 1. A semiconductor device comprising: a package having a semiconductor element pellet mounted thereon, a cap fixed to the package, sealing of the package, and characters or numerals stamped on one surface of the package or the cap. A step of applying a UV adhesive that cures by irradiation with UV light, a step of placing a cap on the package, and stamping on one surface of the package or the cap using a UV ink that cures by irradiation with U light. Process and the UV adhesive and UV
A method for manufacturing a semiconductor device, comprising a step of irradiating UV light to ink to seal a cap and fix a seal. 2. A cap is fixed to an opening of a hollow package in which a semiconductor element pellet is mounted, a resin is filled in a through hole to seal the cap, and characters or numerals are stamped on one surface of the package or the cap. A step of removing and cleaning foreign matter in the hollow package, a step of applying a UV adhesive that cures by irradiation of UV light to the hollow package, and a cap on the hollow package. Mounting, and irradiating UV light to the UV adhesive to seal the cap,
A step of filling a through-hole of the hollow package with a UV adhesive, a step of stamping one surface of the package with a UV ink that is cured by irradiation with UV light, and a step of applying a UV to the UV adhesive and the UV ink. A method for manufacturing a semiconductor device, comprising a step of irradiating light to seal a hollow package and fix a seal by filling. 3. A means for applying a UV adhesive which is cured by irradiation with UV light to a lead frame having a package on which semiconductor element pellets are mounted, a means for placing a cap on the package, and the package A means for stamping characters, numerals, or the like using a UV ink which is cured by irradiation of UV light on one surface of the cap; and irradiating the package with UV light, and applying the UV adhesive and U
Means for curing V ink and a semiconductor device. 4. A part of the process is provided with a means for turning the lead frame upside down so that a UV adhesive is applied to the package from above or below, or UV ink can be stamped on the upper or lower surface of the package. An apparatus for manufacturing a semiconductor device according to claim 3. 5. The semiconductor device manufacturing apparatus according to claim 3, further comprising cleaning means for applying a vibration to the lead frame to remove foreign matter in the package at least before the step of applying the UV adhesive.