JPH0621119A - Molding apparatus for mold part in semiconductor component - Google Patents

Molding apparatus for mold part in semiconductor component

Info

Publication number
JPH0621119A
JPH0621119A JP4177046A JP17704692A JPH0621119A JP H0621119 A JPH0621119 A JP H0621119A JP 4177046 A JP4177046 A JP 4177046A JP 17704692 A JP17704692 A JP 17704692A JP H0621119 A JPH0621119 A JP H0621119A
Authority
JP
Japan
Prior art keywords
cavity
mounting part
mold
molding
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4177046A
Other languages
Japanese (ja)
Inventor
Masahiro Tsuji
正博 辻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP4177046A priority Critical patent/JPH0621119A/en
Publication of JPH0621119A publication Critical patent/JPH0621119A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To suppress the intrusion of fused resin, which is injected into a cavity at a high pressure into the lower surface of a mounting part and to ensure the blocking of deviation of the mounting part in the lateral direction with the pressure of the fused resin by providing a recess part, wherein the mounting part is coupled, at the place of the mounting part at the inner surface of the cavity. CONSTITUTION:A mounting part 2 having a semiconductor chip 1 and the tip part of each lead terminal 3 are held with a lower metal mold A and an upper metal mold B. A cavity A) for molding is formed as a recess in the upper surface of the lower mold A. A cavity B. for molding is formed in the lower surface of the upper mold, B. A1 recess part C is provided at a place corresponding to the mounting part 2 in an inner bottom surface A2 in the cavity A1 in the lower mold A. When the mounting part 2 and the tip part of the lead terminal 3 are held with both metal molds A and B, the mounting part 2 is coupled into the recess part C. Thus, the floating of the mounting part 2 is prevented, the deviation in 'the lateral direction is decreased and the yield rate can be improved.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、図１に示すように、半
導体チップ１をダイボンディングしたマウント部２の部
分及び各リード端子３の先端部分を合成樹脂製のモール
ド部４にてパッケージして成る半導体部品のうち、前記
マウント部２における一部の表面を、前記モールド部４
の表面に露出することによって、このマウント部２を放
熱用のヒートシンクに構成するようにした半導体部品に
おいて、そのモールド部４を成形するための装置に関す
るものである。BACKGROUND OF THE INVENTION In the present invention, as shown in FIG. 1, a mount portion 2 to which a semiconductor chip 1 is die-bonded and a tip portion of each lead terminal 3 are packaged in a synthetic resin mold portion 4. A part of the surface of the mount portion 2 of the semiconductor component
The present invention relates to a device for molding the mold part 4 of a semiconductor component in which the mount part 2 is configured as a heat sink for heat dissipation by exposing the mount part 2 to the surface.

【０００２】[0002]

【従来の技術】従来、図１に示すような半導体部品にお
いて、その合成樹脂製のモールド部４を成形するに際し
ては、図２及び図３に示すように、半導体チップ１付き
マウント部２及び各リード端子３の先端部分を、下金型
Ａと上金型Ｂとで、前記マウント部２の下面が下金型Ａ
に凹み形成したキャビティーＡ1 の内底面Ａ2 に対して
密着するように挟み付けたのち、前記下金型Ａにおける
キャビティーＡ1 内と、上金型Ｂに凹み形成したキャビ
ティーＢ1 内とに、溶融状態の合成樹脂を高い圧力で注
入するようにしている。2. Description of the Related Art Conventionally, when molding a synthetic resin mold portion 4 of a semiconductor component as shown in FIG. 1, as shown in FIGS. The leading end of the lead terminal 3 is composed of a lower mold A and an upper mold B, and the lower surface of the mount portion 2 is a lower mold A.
After sandwiching in close contact with the inner bottom surface A 2 of the cavity A 1 which is recessed formed in the cavity A 1 in the lower tool A, cavity B 1 formed depressions in the upper die B The synthetic resin in a molten state is injected into the interior at a high pressure.

【０００３】[0003]

【発明が解決しようとする課題】しかし、この従来のも
のは、両金型Ａ，Ｂにて挟み付けたときマウント部２の
下面をキャビティーＡ1 の内底面Ａ2 に対して密着させ
るに過ぎないから、キャビティーＡ1 ，Ｂ1 内に高い圧
力で注入した溶融合成樹脂が、前記マウント部２の下面
とキャビティーＡ1 の内底面Ａ2 との間に侵入し、その
結果、前記マウント部２におけるモールド部４から露出
する面には、合成樹脂の薄い膜がマウント部２の表面を
覆うように形成されることになるから、当該マウント部
２における放熱性が低下すると言う問題が多発するので
ある。However, in this conventional device, the lower surface of the mount portion 2 is stuck to the inner bottom surface A 2 of the cavity A 1 when sandwiched between the two dies A and B. Therefore, the molten synthetic resin injected into the cavities A 1 and B 1 at a high pressure enters between the lower surface of the mount portion 2 and the inner bottom surface A 2 of the cavity A 1 , and as a result, Since a thin film of synthetic resin is formed on the surface of the mount portion 2 exposed from the mold portion 4 so as to cover the surface of the mount portion 2, there is a problem that heat dissipation in the mount portion 2 is deteriorated. It happens frequently.

【０００４】しかも、モールド部４の成形に際して、前
記マウント部２が、当該マウント部２とキャビティーＡ
1 の内底面Ａ2 との間に侵入する溶融合成樹脂のために
浮き上がって傾いたり、溶融合成樹脂の圧力によって横
方向にずれ変位したりすることが発生するから、商品価
値が低下するばかりか、歩留り率が低下すると言う問題
もあった。Moreover, when molding the mold portion 4, the mount portion 2 and the cavity A are
Tilting floats for molten synthetic resin from entering between the inner bottom surface A 2 of 1, because it is generated or shifted laterally displaced by the pressure of the molten synthetic resin, not only the commercial value decreases However, there is also a problem that the yield rate decreases.

【０００５】本発明は、このような問題を招来すること
がないようにした成形装置を提供することを技術的課題
とするものである。An object of the present invention is to provide a molding apparatus which does not cause such a problem.

【０００６】[0006]

【課題を解決するための手段】この技術的課題を達成す
るため本発明は、一対の成形用金型に、半導体部品にお
ける半導体チップ付きマウント部及び各リード端子の先
端部にこれをパッケージする合成樹脂製のモールド部を
成形するためのキャビティーを凹み形成して成る成形装
置において、前記キャビティーの内面うち前記マウント
部の箇所に、当該マウント部を嵌めるようにした凹み部
を設ける構成にした。In order to achieve this technical object, the present invention provides a pair of molding dies which are packaged in a mount portion with a semiconductor chip and a tip portion of each lead terminal in a semiconductor component. In a molding device in which a cavity for molding a resin mold portion is formed by recessing, a recessed portion for fitting the mount portion is provided at a position of the mount portion on the inner surface of the cavity. .

【０００７】[0007]

【作 用】このように、一対の成形用金型におけるキ
ャビティーの内面に凹み部を設けて、この凹み部内に、
マウント部を嵌めるように構成することにより、キャビ
ティー内に高い圧力で注入した溶融合成樹脂が、前記マ
ウント部の下面側に侵入することを、前記従来の場合よ
りも確実に抑制することができると共に、前記マウント
部が、溶融合成樹脂の圧力によって、横方向にずれ動く
ことを確実に阻止できるのである。[Operation] As described above, a recess is provided on the inner surface of the cavity of the pair of molding dies, and the recess is provided in the recess.
By configuring the mount portion to be fitted, it is possible to more reliably prevent the molten synthetic resin injected at a high pressure in the cavity from entering the lower surface side of the mount portion as compared with the conventional case. At the same time, it is possible to reliably prevent the mount portion from laterally shifting due to the pressure of the molten synthetic resin.

【０００８】[0008]

【発明の効果】従って、本発明によると、モールド部の
成形に際して、マウント部のうちモールド部からの露出
する表面に合成樹脂の薄い膜が形成されること、及び前
記マウント部が浮き上がって傾くことを確実に低減で
き、しかも、前記マウント部が横方向にずれ動くことを
も確実に低減できるから、放熱性及び商品価値の高い半
導体部品を製造できると共に、製造に際しての歩留り率
が向上してそのコストを低減できる効果を有する。According to the present invention, therefore, a thin film of synthetic resin is formed on the surface of the mount portion exposed from the mold portion, and the mount portion rises and tilts during molding of the mold portion. Can be reliably reduced, and further, it is possible to reliably reduce the lateral displacement of the mount portion, so that it is possible to manufacture a semiconductor component having high heat dissipation and high commercial value, and the yield rate at the time of manufacturing is improved. It has the effect of reducing the cost.

【０００９】[0009]

【実施例】以下、本発明の実施例を図４〜図７の図面に
ついて説明する。すなわち、半導体チップ半導体チップ
１付きマウント部２及び各リード端子３の先端部分を、
上面にモールド成形用のキャビティーＡ1 を凹み形成し
た下金型Ａと、下面にモールド部成形用のキャビティー
Ｂ1 を凹み形成した上金型Ｂとで挟み付けるに際して、
前記下金型ＡにおけるキャビティーＡ1 の内底面Ａ2 の
うち前記マウント部２の対応する箇所に、凹み部Ｃを設
けて、両金型Ａ，Ｂにて、前記マウント部２及び各リー
ド端子３の先端部分を挟み付けたとき、前記マウント部
２が、前記凹み部Ｃ内に嵌まるように構成するのであ
る。Embodiments of the present invention will be described below with reference to the drawings of FIGS. That is, the tip portion of the mounting portion 2 with the semiconductor chip 1 and the lead terminals 3 is
When sandwiching a lower mold A having a cavity A 1 for molding formed on the upper surface and an upper mold B having a cavity B 1 for molding on the lower surface formed by depression,
On the inner bottom surface A 2 of the cavity A 1 in the lower mold A, a recess C is provided at a corresponding position of the mount part 2 so that the mount part 2 and each lead are formed in both molds A and B. When the tip portion of the terminal 3 is sandwiched, the mount portion 2 is configured to fit in the recess portion C.

【００１０】このように、下金型Ａにおけるキャビティ
ーＡ1 の内底面Ａ2 に凹み部Ｃを設けて、この凹み部Ｃ
内に、マウント部２を嵌めるように構成することによ
り、両金型Ａ，ＢにおけるキャビティーＡ1 ，Ｂ1 内に
高い圧力で注入した溶融合成樹脂が、前記マウント部２
の下面側に侵入することを、前記従来の場合よりも確実
に抑制できると共に、前記マウント部２が、溶融合成樹
脂の圧力によって、横方向にずれ変位することを確実に
阻止できるのである。Thus, the recess C is provided on the inner bottom surface A 2 of the cavity A 1 in the lower mold A, and the recess C is formed.
By configuring the mount portion 2 to be fitted therein, the molten synthetic resin injected at high pressure into the cavities A 1 and B 1 in both molds A and B is
It is possible to more reliably suppress the intrusion into the lower surface side of the above-mentioned case than in the conventional case, and it is possible to surely prevent the mount portion 2 from being displaced laterally by the pressure of the molten synthetic resin.

【００１１】その結果、図７に示すように、前記マウン
ト部２における一部の表面を、モールド部４の表面より
確実に露出することができると共に、前記マウント部２
がモールド部に対して傾くことを確実に防止でき、しか
も、前記マウント部２が横方向にずれることをも確実に
防止できるのである。なお、前記凹み部Ｃの深さ寸法Ｓ
は、前記マウント部２における板厚さ寸法Ｔと略等しく
するか、或いは、マウント部２における板厚さ寸法Ｔを
越えない寸法に設定することが好ましい。また、本発明
者の実験によると、前記凹み部Ｃにおける内周面Ｃ
1 と、前記マウント部２の外周面２ａとの間に、最大値
でマウント部２の板厚さ寸法Ｔと略同じ程度の隙間が存
在しても、マウント部２の下面側への溶融合成樹脂の侵
入を確実に抑制することができるのであった。As a result, as shown in FIG. 7, a part of the surface of the mount portion 2 can be surely exposed from the surface of the mold portion 4, and the mount portion 2 can be securely exposed.
Can surely be prevented from inclining with respect to the mold portion, and further, the mount portion 2 can surely be prevented from shifting laterally. The depth dimension S of the recess C
Is preferably substantially equal to the plate thickness dimension T of the mount portion 2 or is set to a dimension that does not exceed the plate thickness dimension T of the mount portion 2. Further, according to an experiment by the present inventor, the inner peripheral surface C in the recess C is
1 and the outer peripheral surface 2a of the mount portion 2, even if there is a gap of about the same as the plate thickness dimension T of the mount portion 2 at the maximum value, fusion synthesis to the lower surface side of the mount portion 2 It was possible to reliably prevent the resin from entering.

【図面の簡単な説明】[Brief description of drawings]

【図１】半導体部品の縦断正面図である。FIG. 1 is a vertical sectional front view of a semiconductor component.

【図２】従来の成形装置を示す縦断正面図である。FIG. 2 is a vertical sectional front view showing a conventional molding apparatus.

【図３】従来の成形装置において両成形用金型で挟み付
けた状態の縦断正面図である。FIG. 3 is a vertical cross-sectional front view of a conventional molding apparatus sandwiched by both molding dies.

【図４】本発明の実施例による成形装置の縦断正面図で
ある。FIG. 4 is a vertical sectional front view of a molding apparatus according to an embodiment of the present invention.

【図５】図４のＶ−Ｖ視平面図である。5 is a plan view taken along line VV of FIG.

【図６】本発明の実施例による成形装置において両成形
用金型で挟み付けた状態の縦断正面図である。FIG. 6 is a vertical cross-sectional front view of the molding apparatus according to the embodiment of the present invention sandwiched between the molding dies.

【図７】本発明の成形装置による半導体部品の縦断正面
図である。FIG. 7 is a vertical sectional front view of a semiconductor component manufactured by the molding apparatus of the present invention.

【符号の説明】[Explanation of symbols]

１ 半導体チップ ２ マウント部 ３ リード端子 ４ モールド部 Ａ 下金型 Ａ1 下金型におけるキャビティー Ａ2 下金型におけるキャビティーの内
底面 Ｂ 上金型 Ｂ1 上金型におけるキャビティー Ｃ 凹み部1 Semiconductor Chip 2 Mount Part 3 Lead Terminal 4 Mold Part A Lower Mold A 1 Lower Mold Cavity A 2 Lower Mold Cavity Inner Bottom B Upper Mold B 1 Upper Mold C Cavity

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】一対の成形用金型に、半導体部品における
半導体チップ付きマウント部及び各リード端子の先端部
にこれをパッケージする合成樹脂製のモールド部を成形
するためのキャビティーを凹み形成して成る成形装置に
おいて、前記キャビティーの内面のうち前記マウント部
の箇所に、当該マウント部を嵌めるようにした凹み部を
設けることを特徴とする半導体部品におけるモールド部
の成形装置。1. A pair of molding dies is provided with a cavity for molding a mount part with a semiconductor chip in a semiconductor component and a mold part made of synthetic resin for packaging the mount part at the tip of each lead terminal. In the molding apparatus, the molding apparatus for a mold part in a semiconductor component is characterized in that a recessed portion for fitting the mount portion is provided at a location of the mount portion on the inner surface of the cavity.
JP4177046A 1992-07-03 1992-07-03 Molding apparatus for mold part in semiconductor component Pending JPH0621119A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4177046A JPH0621119A (en) 1992-07-03 1992-07-03 Molding apparatus for mold part in semiconductor component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4177046A JPH0621119A (en) 1992-07-03 1992-07-03 Molding apparatus for mold part in semiconductor component

Publications (1)

Publication Number Publication Date
JPH0621119A true JPH0621119A (en) 1994-01-28

Family

ID=16024196

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4177046A Pending JPH0621119A (en) 1992-07-03 1992-07-03 Molding apparatus for mold part in semiconductor component

Country Status (1)

Country Link
JP (1) JPH0621119A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11482350B2 (en) 2019-02-19 2022-10-25 Samsung Electronics Co., Ltd. Flexible flat cable and method of producing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11482350B2 (en) 2019-02-19 2022-10-25 Samsung Electronics Co., Ltd. Flexible flat cable and method of producing the same
US11742109B2 (en) 2019-02-19 2023-08-29 Samsung Electronics Co., Ltd. Flexible flat cable and method of producing the same

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