JPH06202761A - Up-grade method for cpu - Google Patents

Abstract

PURPOSE:To provide the up-grade method of a CPU in which the limit of the package type of the CPU can be eased, a low cost can be attained, and reliability can be improved by exchanging or adding and mounting a sub-board in which the CPU for up-grade is mounted on a compact substrate. CONSTITUTION:A sub-board 100 in which a CPU chip 11 and connectors 13 and 14 which connect the CPU 11 with outside peripheral circuits 3 and 4 are mounted on a compact substrate 12 is prepared. Also, connectors 6 and 7 which connect and mount the sub-board are prepared on a CPU board 5 on which the outside peripheral circuits 3 and 4 integrated in a system are mounted. Then, the sub-board mounted on the CPU board 5 is exchanged with the sub- board on which the CPU chip for the up-grade is mounted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a CPU upgrade method, and more particularly to a high-performance CPU that is upward compatible with the current CPU.
Regarding how to upgrade by sub board.

[0002]

2. Description of the Related Art Upward-compatible high performance in which the numerical calculation speed is faster than the CPU chip already mounted in the system, the calculation accuracy is higher, and the processing capability is higher in all the processes executed by the CPU. By mounting the CPU chip, that is, by upgrading the CPU, the processing capacity of the entire system can be improved.

In a conventional CPU upgrade method, as shown in FIG. 3, an IC socket 2 is mounted on a substrate 5, and initially, the CPU chip 1 mounted from the beginning is used.
It operates in a system composed of two memory chips 3, a CPU control chip 4, etc., and when upgrading the CPU to improve the processing capacity, a high-performance CPU chip for upgrade with upward compatibility is used. It is carried out by mounting it on the IC socket 2.

Further, as described in Japanese Utility Model Laid-Open No. 64-112, the CPU board is made into a cartridge and is detachably attached to the main body to upgrade the CPU.

[0005]

SUMMARY OF THE INVENTION The conventional CPU described above.
The upgrade method requires an IC socket suitable for the CPU chip to be used, and an expensive IC socket must be used to ensure system reliability, resulting in an expensive device price. It has the drawback of being lost.

Further, when using a CPU enclosed in a completely new IC package, there is a disadvantage that it may be necessary to develop a dedicated IC socket only for using the intended CPU.

Further, in the case of using a surface mount type CPU which will be mainstream in the future to reduce the cost and reduce the size and weight of the CPU chip itself, a contact failure between the CPU chip and the IC socket terminal will occur. Is likely to occur or is vulnerable to external shocks, so when considering the CPU upgrade method, surface mount type C
Despite the many merits of PU chips, it has been determined that they are difficult to implement at the early stage of consideration, and despite the fact that inexpensive surface mount types are supplied to CPU chips for CPU upgrades. However, there is a problem that only those that are enclosed in expensive packages such as ceramic packages can be used.

The cartridge type described in Japanese Utility Model Laid-Open No. 64-112 has the drawbacks that the cartridge is expensive and that a large space is required for mounting.

SUMMARY OF THE INVENTION An object of the present invention is to eliminate the above-mentioned drawbacks, provide an inexpensive method of upgrading a CPU with high reliability and easy switching.

[0010]

According to a first aspect of the present invention, there is provided a CPU upgrade method, which comprises preparing a sub board in which a CPU chip and a connector for connecting the CPU chip and its external peripheral circuit are mounted on a small board. A connector for connecting and mounting the sub board is prepared for the CPU board on which the external peripheral circuit incorporated in the system is mounted.
It is characterized in that the sub board mounted on the PU board is replaced with a sub board mounted with an upgrade CPU chip.

According to the second aspect of the present invention, there is provided a sub-board in which a CPU chip and a connector for connecting the CPU chip and its external peripheral circuit are mounted on a small board and incorporated into the system. A connector for connecting and mounting the sub board is prepared for the CPU board on which the external peripheral circuit and the CPU chip are mounted.
It is characterized in that a sub board having an upgrade CPU chip is additionally mounted on the CPU board.

[0012]

Next, a first embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing a first embodiment of a CPU upgrade method according to the present invention.

In the first embodiment, first, as shown in FIG. 1, a sub-chip in which a CPU chip 11 and connectors 13 and 14 for connecting the CPU chip 11 and an external peripheral circuit are mounted on a small-sized board 12 is provided. Prepare the board 100.

On the other hand, the memory chip 3 and the CPU control chip 4
Substrates 5 in which peripheral circuits such as the above are mounted and incorporated in the system are provided with connectors 6 and 7 corresponding to the connectors 13 and 14 of the sub-board 100, which are connected and connected to the connectors 13 and 14, respectively. A sub board 100 having a low CPU chip 11 is mounted on a substrate 5 and incorporated in the system.

According to the first embodiment of the CPU upgrade method, the sub board 100 having the CPU chip 11 mounted on the board 5 incorporated in the system is provided with a CPU having higher performance and higher compatibility than the CPU chip 11. It is performed by replacing the chip with a sub board.

By adopting this method, it becomes possible to use a CPU chip enclosed in a surface mount type IC package, which could not be used conventionally.

Although the CPU has various package shapes, when changing the package shape of the CPU, it is only necessary to change the mounting on the sub board, and the impact on the system can be minimized.

Next, a second embodiment will be described with reference to FIG.

FIG. 2 is a perspective view showing a second embodiment of the CPU upgrade method of the present invention.

In the second embodiment, similar to the first embodiment,
First, as shown in FIG. 2, the CPU chip 11 and this CP
A sub board 100 is prepared in which a U-chip 11 and connectors 13 and 14 for connecting an external peripheral circuit are mounted on a small board 12.

On the other hand, the memory chip 3 and the CPU control chip 4
Substrates 5 in which peripheral circuits such as are mounted and which are incorporated in the system are provided with connectors 6 and 7 corresponding to the connectors 13 and 14 of the sub-board 100 so as to be connected to them, and initially, CPU chip 1 with low performance
Is mounted on the substrate 5 and incorporated in the system.

The CPU upgrade method of the second embodiment is such that a sub board 100 having a CPU chip 11 having higher performance and higher compatibility than the CPU chip 1 mounted on the board 5 incorporated in the system is mounted by a connector. This is performed by additionally mounting on the board 5 incorporated in the system.

[0024]

As described above, according to the CPU upgrade method of the present invention, the CPU package type is replaced by replacing the sub-board in which the upgrade CPU is mounted on a small board or additionally mounting it. There is an effect that the restriction can be relaxed, the cost can be reduced, and the reliability can be improved.

[Brief description of drawings]

FIG. 1 is a perspective view showing a first embodiment of a CPU upgrade method of the present invention.

FIG. 2 is a perspective view showing a second embodiment of the CPU upgrade method of the present invention.

FIG. 3 is a perspective view showing a substrate provided with a conventional CPU upgrade IC socket.

[Explanation of symbols]

 1, 11 CPU chip 2 IC socket 3 Memory chip 4 CPU control chip 5, 12 Board 6, 7, 13, 14 Connector 100 Sub board

Claims (2)

[Claims] 1. A sub-board in which a CPU chip and a connector for connecting the CPU chip and its external peripheral circuit are mounted on a small-sized board is prepared, and a sub-board mounted on the system is mounted on the CPU board. Prepares a connector for connecting and mounting the sub board, and upgrades the sub board mounted on the CPU board to the upgrade C
A method of upgrading a CPU, characterized in that the PU board is replaced with a sub board. 2. A sub board having a CPU chip and a connector for connecting the CPU chip and its external peripheral circuit mounted on a small board is prepared, and the external peripheral circuit and the CPU chip to be incorporated into a system are mounted. A method of upgrading a CPU, characterized in that a connector for connecting and mounting the sub board is prepared on the CPU board, and a sub board having an upgrade CPU chip is additionally mounted on the CPU board.