JPH10144829A - Extension memory module board for computer and memory module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To effectively utilize a memory IC chip in the case of memory extension. SOLUTION: A memory module board is provided with a substrate 1, connecting terminals 2a provided on the substrate 1 and sockets 3 for arranging memory IC chips provided on the substrate 1. These sockets 3 are composed so as to detachably fit the memory IC chip 4. Furthermore, the terminals of the sockets 3 are electrically connected to the connecting terminals provided on the substrate 1. In the case of the memory extension, when the substrate 1 is pulled out of the slot for the memory module of the device and the memory IC chip 4 necessary for the sockets 3 for arranging the memory IC chip is arranged, the arranged memory IC chip 4 is electrically connected to the connecting terminals provided on the substrate 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an additional memory module board for a computer and a memory module.

[0002]

2. Description of the Related Art In recent years, computers, particularly those called personal computers, have slots for memory modules in order to increase the memory capacity. Then, by inserting the memory module into the memory module slot, the memory capacity can be increased.

[0003]

By the way, it is often necessary to increase the memory capacity after purchasing a personal computer. For example, OS such as Windows 95 that has recently appeared
, The recommended memory capacity is larger than that of the conventional OS. In addition, general users are also increasing opportunities to handle data that requires a large memory capacity, such as image data.

On the other hand, in a personal computer, there are usually four slots into which memory modules can be replaced. For example, two of these four slots are often occupied by memory modules with a small capacity in the early stage, and there is a limit to expanding with the remaining two slots,
As a result, when the initial memory modules were removed and all four were made into correspondingly large memory modules, the removed old memory modules were discarded, which was very wasteful.

Accordingly, an object of the present invention is to provide a technique which can effectively use a memory IC chip when adding a memory.

[0006]

SUMMARY OF THE INVENTION The above-mentioned object is to provide a substrate,
A connection terminal provided on the substrate; and a socket for disposing a memory IC chip provided on the substrate. The socket is configured such that the memory IC chip is removably attached thereto. Further, a terminal of a socket for disposing a memory IC chip provided on the substrate is electrically connected to a terminal for connection provided on the substrate. The substrate required for the socket for disposing the memory IC chip
When the C chip is provided, the provided memory IC chip is electrically connected to a connection terminal provided on the substrate. .

In particular, it comprises a substrate, connection terminals provided on both surfaces of the substrate, and sockets for disposing memory IC chips provided on both surfaces of the substrate, wherein the socket comprises a memory. The IC chip is configured to be removably attached, and furthermore, the terminal of the socket for disposing the memory IC chip provided on the substrate is electrically connected to the connection terminal provided on the substrate. When the memory is added, the substrate is removed from the memory module slot of the device, and the memory IC is removed.
When a necessary memory IC chip is provided in a chip mounting socket, the provided memory IC chip is electrically connected to connection terminals provided on the substrate. The problem is solved by an additional memory module board for a computer.

A first terminal for connection provided on one surface side of the substrate; a second terminal for connection provided on the other surface side of the substrate; and at least one surface of the substrate. And a memory IC chip provided on at least the other side of the substrate, and the memory IC chip is provided on the other side of the substrate.
A memory IC provided on one surface side of the substrate, wherein the C chip is configured to be detachably attached;
The chip is electrically connected to a connection first terminal provided on the substrate, and a terminal of a memory IC chip mounting socket provided on the other surface of the substrate is connected to a connection terminal provided on the substrate. Electrically connected to the second terminal for
At the time of adding a memory, the board is removed from the memory module slot of the device, and a necessary memory IC chip is provided in the socket for mounting the memory IC chip. The problem is solved by a memory module characterized in that the memory module is electrically connected to the second connection terminal.

The socket for disposing the memory IC chip may be provided on only one surface of the substrate, or may be provided on both surfaces of the substrate. In the memory module,
When the socket for disposing the memory IC chip is provided only on one surface of the substrate, it is preferable that a predetermined number of memory IC chips are fixedly mounted on the other surface of the substrate in advance. When a necessary memory is added, a required number of memory IC chips may be provided in an empty socket. Therefore, the memory can be easily added. In addition, since the memory can be added by adding the memory IC chip, the existing memory IC chip can be effectively used and there is no need to discard it.

[0010] Even when the sockets for arranging the memory IC chips are provided on both sides of the substrate, the necessary number of memory IC chips may be arranged in the empty sockets when adding the memory. Therefore, the memory can be easily added. In addition, since the memory can be added by adding the memory IC chip, the existing memory IC chip can be effectively used and there is no need to discard it.

Furthermore, since the memory IC chip can be disposed simply by inserting it into the socket, removal is easy. This makes it possible to easily replace a memory module that has been affected by a defect in a part of the memory IC chip in units of memory IC chips without using a special solder mounting machine. Therefore, there is no waste.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An additional memory module board for a computer according to the present invention comprises a substrate, a connection terminal provided on the substrate, and a memory IC provided on the substrate.
A socket for disposing a chip, wherein the socket is configured so that a memory IC chip can be detachably attached thereto, and further, a terminal of the socket for disposing a memory IC chip provided on the substrate. Is electrically connected to a connection terminal provided on the substrate, and when adding a memory, pulls out the substrate from a memory module slot of the device, and a memory IC required for a socket for disposing the memory IC chip. When the chip is provided, the provided memory IC chip is configured to be electrically connected to connection terminals provided on the substrate. In particular, it comprises a substrate, connection terminals provided on both surfaces of the substrate, and sockets for disposing memory IC chips provided on both surfaces of the substrate, wherein the socket is a memory IC chip. It is configured to be detachably attached, and further, a terminal of a socket for disposing a memory IC chip provided on the substrate is electrically connected to a connection terminal provided on the substrate,
At the time of adding a memory, the board is removed from the memory module slot of the device, and a necessary memory IC chip is provided in the socket for mounting the memory IC chip. It is configured to be electrically connected to the connection terminal.

[0013] The memory module of the present invention comprises:
A first terminal for connection provided on one surface side of the substrate;
A second terminal for connection provided on the other surface side of the substrate;
Memory IC provided on at least one side of the substrate
A chip, and a socket for disposing a memory IC chip provided on at least another side of the substrate,
The socket is configured such that a memory IC chip is detachably attached thereto, and the memory IC chip provided on one surface of the substrate is electrically connected to a first connection terminal provided on the substrate. And a terminal of a socket for arranging a memory IC chip provided on the other surface of the substrate is electrically connected to a second terminal for connection provided on the substrate. When the board is removed from the memory module slot of the device and the required memory IC chip is provided in the socket for providing the memory IC chip, the provided memory IC chip is connected to the connection board provided on the board. It is configured to be electrically connected to the second terminal.

The details will be described below. FIG. 1 is a plan view of one embodiment of the present invention. In FIG. 1, reference numeral 1 denotes a substrate. 2a is a first terminal for connection provided on the right end side of the surface of the substrate 1. A second terminal 2b (not shown) for connection similar to the terminal 2a is provided on the back surface of the substrate 1 at the same position as the terminal 2a.

Reference numeral 3 denotes a socket for disposing a memory IC chip. A predetermined number of sockets 3 (for example, eight on one side and one on both sides)
6) are provided. The connection terminal of the socket 3 provided on the front side of the substrate 1 is electrically connected to the terminal 2a, and the socket 3 provided on the back side of the substrate 1
Are electrically connected to the terminal 2b.

The socket 3 on the front side of the additional memory module board for a computer constructed as described above.
Has a predetermined number of memory IC chips 4 inserted therein. Therefore, when the memory IC chip 4 provided is defective, the memory IC chip 4
, It is easy to replace the defective memory IC chip.

The memory IC chip is not inserted into the socket 3 provided on the back side of the substrate 1 and is empty. Therefore, when it is necessary to increase the memory capacity, the board 1 is removed from the memory module slot of the device.
When the memory IC chip purchased separately is inserted into the empty socket 3 and disposed, the disposed memory IC chip is electrically connected to the terminal of the socket for disposing the memory IC chip, thereby increasing the memory capacity. It becomes possible. That is, since the memory IC chip is detachable from the socket 3, the memory capacity can be easily increased.

In the above embodiment, the sockets 3 are provided on both the front and back surfaces of the substrate 1. However, a memory IC chip may be mounted on one surface side of the substrate 1 in advance. This pre-installed memory IC
There is no need for a socket for the chip. That is,
As another embodiment of the present invention, there is a case where the socket 3 is only on one side. That is, in this case, the memory IC chip provided on the surface opposite to the socket 3 is fixed to the substrate 1. Other configurations are the same as those of the above-described embodiment, and a detailed description thereof will be omitted.

[0019]

According to the present invention, the memory IC chip is not wasted when the memory is added, and the cost for adding the memory is low.

[Brief description of the drawings]

FIG. 1 is a plan view of one embodiment of a memory module.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2a 1st terminal for connection 3 Socket 4 Memory IC chip

Claims (3)

[Claims] 1. A substrate, comprising: a connection terminal provided on the substrate; and a socket for disposing a memory IC chip provided on the substrate. The terminal of the socket for arranging the memory IC chip provided on the substrate is electrically connected to the terminal for connection provided on the substrate. At this time, the substrate is removed from the memory module slot of the device, and the necessary memory IC chip is disposed in the socket for disposing the memory IC chip. An additional memory module board for a computer, wherein the additional memory module board is configured to be electrically connected to terminals of the computer. 2. A semiconductor device comprising: a substrate; connection terminals provided on both surfaces of the substrate; and sockets for disposing memory IC chips provided on both surfaces of the substrate. The IC chip is configured to be removably attached. Further, a terminal of a socket for disposing a memory IC chip provided on the substrate is electrically connected to a connection terminal provided on the substrate. When the memory is added, the board is removed from the memory module slot of the device, and the necessary memory IC chip is provided in the socket for mounting the memory IC chip. The provided memory IC chip is provided on the board. An additional memory module board for a computer, wherein the additional memory module board is configured to be electrically connected to the connection terminal. A first terminal for connection provided on one surface side of the substrate; a second terminal for connection provided on the other surface side of the substrate; and at least one surface of the substrate Memory IC provided on the side
A chip, and a memory IC provided on at least another side of the substrate.
A socket for disposing a chip, wherein the socket is configured such that a memory IC chip is removably attached thereto. Further, the memory IC chip provided on one surface side of the substrate is provided on the substrate. A memory I which is electrically connected to the provided first connection terminal and is provided on the other surface of the substrate.
The terminal of the socket for arranging the C chip is electrically connected to the second terminal for connection provided on the substrate, and when the memory is added, the substrate is removed from the memory module slot of the device, When the necessary memory IC chip is arranged in the socket for disposing the IC chip, the arranged memory IC chip is electrically connected to the second connection terminal provided on the substrate. A memory module characterized by the following.