JPH06188593A - Part installation method and device - Google Patents

Abstract

PURPOSE:To provide a part mounting equipment which successively mounts parts at prescribed mounting points on a board, wherein a remounting operation is efficiently carried out for mounting points where non part has been mounted. CONSTITUTION:Mounting points on a board are grouped into blocks corresponding to the demarcated regions of the board, the blocks are optimized and determined in mounting operation sequence, and the mounting points are also optimized and determined in part mounting sequence by a computer. A control device built in a part mounting equipment is made to read in mounting data block by block (S1), and the part mounting equipment carries out a part mounting operation (S4). When a mounting point is missed due to mounting failure (S4: Yes), the data of the missed mounting point are sent to the computer (S7). The part mounting sequence of another block located adjacent to the missed mounting point is redetermined by the computer so as to contain the missed mounting point.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board having a plurality of mounting points, in which a mounting head for transporting components such as electronic parts is moved relative to the board while the mounting points are sequentially arranged. The present invention relates to a component mounting method and a component mounting device for mounting a component.

[0002]

2. Description of the Related Art As a device for automatically mounting electronic components on a substrate, the present applicant has developed a component mounting device which speeds up component mounting by a so-called continuous rotation cycloid system. I am applying. FIG. 11 schematically shows the main body 1 of the component mounting apparatus as seen from the top, and the main body 1 is provided at the front and rear parts of the rotary drum 2 with the substrate 3
Is provided and a mounting station 4 for mounting the components and a supply station 5 for supplying the components are configured.

On the outer circumference of the rotary drum 2, for example, 12
The individual mounting heads 6 (only a part of which are shown) are provided at equal intervals, and the mounting heads 6 are configured to rotate about an axis extending in the radial direction of the rotary drum 2.
With this, as the rotary drum 2 rotates, the mounting head 6
Perform a cycloid curve motion having a predetermined plurality of bottom dead centers (the ground speed is zero) around the rotary drum 2.

The supply station 5 is provided with a plurality of component feeders 7 for each component type, and the component supply point of the component feeder 7 is set to any one of the bottom dead points (suction points) of the mounting head 6. By making them coincide with each other, the mounting head 6 sucks a predetermined component. On the other hand, the mounting station 4 is provided with an XY table 9 for freely moving the substrate 3 between the conveyors 8 for loading and unloading the substrate 3. Here, a plurality of component mounting points P (indicated by white circles for convenience) are provided on the substrate 3 as shown in FIG. 12, and the XY table 9 defines the predetermined component mounting points P on the substrate 3. The substrate 3 is freely movable so as to coincide with the bottom dead center (mounting point Q) of the mounting head 6.

As a result, each mounting head 6 repeatedly sucks the component from the predetermined component feeder 7 at the suction point and releases the suction of the component at the mounting point Q (it becomes a positive pressure). By sequentially moving the board 3 with respect to the mounting point Q by the XY table 9, the component mounting work for the plurality of mounting points P on the board 3 is continuously executed at high speed.

In this case, the control device 10 including a microcomputer stores the coordinate values of a plurality of mounting points P on the board 3, and the types of parts and their mounting order for each mounting point P are stored. It is stored in advance as a mounting program, and the control device 10 follows the mounting program and mounts the mounting head 6, the component feeder 7, and the X-axis.
The Y table 9 and the like are controlled.

Here, since the time from the mounting of one component to the mounting of the next component is short, the substrate 3 can be moved in a short time when determining the mounting sequence for each mounting point P. The so-called optimization is performed in such an order. In FIG. 12, the parts mounting order for each mounting point P is indicated by an arrow, and
The component mounting order is determined so that when the plurality of mounting points P are connected by a single stroke, the total length of the path is short and the individual moving distances are short.

[0008]

In the component mounting apparatus as described above, a mounting error rarely occurs, for example, the mounting head 6 does not suck the component in a proper state. . In such a case, the suction failure is automatically detected by a camera or the like and the component is automatically excluded, and the corresponding mounting point Po (see FIG. 1).
2 is shown as a black circle for convenience)
The mounting head 6 will pass through.

When such a mounting error occurs,
A new component mounting work (referred to as “retry work”) for the unmounted mounting point Po is required. For example, the next mounting head 6 has already picked up the component for the next mounting point P and has the mounting point Q Since each mechanism of the main body 1 is operating according to the mounting program in which the mounting order is specified such as reaching the position immediately before, it is not possible to interrupt the retry work during the component mounting work on one board 3. It was difficult. Therefore, conventionally, as shown by a broken line in FIG. 12, after the mounting work of the last mounting point P of the mounting program is finished, the retry work is performed by returning to the mounting point Po which is not mounted.

However, in this method, the distance between the last mounting point P and the mounting point Po which has not been mounted is expected to be large in most cases. It becomes necessary to move the substrate 3 a large distance as compared with the amount of movement for each operation. Therefore, the conventional retry work method has a drawback that the time required for the retry work becomes long and the work efficiency is significantly deteriorated.

As another method of retry work, when a mounting error occurs, the subsequent component mounting work is temporarily stopped, that is, the suction mounting operation of another mounting head 6 and the XY table 9 (substrate 3) are left as they are. In the stopped state, the mounting head 6 in which the mounting error has occurred performs the operation from the suction of the component to the mounting point Po that has not been mounted again to continue the work, thereby changing the mounting sequence of the mounting program. It is possible to perform retry work. However, even with this method, a time loss corresponding to one rotation of the rotary drum 2 is generated, and thus the work efficiency is significantly deteriorated.

The present invention has been made in view of the above circumstances, and even if a mounting error occurs, the retry work associated therewith can be completed in a short time, and the decrease in work efficiency can be suppressed as much as possible. And to provide a component mounting apparatus.

[0013]

According to the component mounting method of the present invention, a plurality of mounting points on a board are divided into a plurality of blocks by areas on the board, and the component mounting work is performed for each of these blocks. At the same time, even if there is a mounting point where a component has not been mounted due to a mounting error, the mounting work for that block is continued as it is, and at the time of mounting a component in another block that is located near the mounting point that has not been mounted and has no component mounted. The feature is that the component mounting work of the mounting point that has not been mounted is also executed.

Further, the component mounting apparatus of the present invention divides a plurality of mounting points on the board into a plurality of blocks according to the area on the board, determines a mounting work order between the blocks, and determines each block. The mounting order determining means for determining the mounting order of the components at each mounting point belonging to the inside, and when the mounting point where the component is not mounted occurs due to a mounting error during the component mounting work, the mounting position is determined in the vicinity of the mounting point. Further, the component mounting order in another block in which the components have not been mounted is re-determined so as to include the mounting points that have not been mounted, and the component mounting work is performed in accordance with the determination of the mounting sequence determining unit and the retry sequence determining unit. It is characterized in that it comprises a control means for execution.

[0015]

According to the component mounting method of the present invention, a plurality of mounting points on the substrate are divided into a plurality of blocks, and the component mounting work is sequentially performed for each of these blocks. Then, even when a mounting point where the component is not mounted due to a mounting error occurs, the mounting work for the block is continued as it is, but the mounting work of the new component for the unmounted mounting point, that is, the retry work, This is also performed at the time of component mounting work in another block in which the component is not mounted and which is located in the vicinity of the mounting point where the component has not been mounted.

Therefore, unlike the case where the retry work is performed after completion of the work for mounting other mounting points or when the component mounting work is temporarily stopped, the retry work is executed in the middle of the component mounting work. It can be done in a workflow. Then, since the retry work is performed during the component mounting work in the block located near the unmounted mounting point, the relative movement amount of the substrate can be small, and as a result, the retry work can be performed in a short time. .

Further, according to the component mounting apparatus of the present invention, the mounting order determining means divides the plurality of mounting points on the board into a plurality of blocks, determines the mounting work order between the blocks, and By determining the component mounting order at each mounting point belonging to each block, the component mounting order for all mounting points is determined. Then, the control unit executes the component mounting work in accordance with the determined component mounting order.However, when a mounting point where a component is not mounted occurs due to a mounting error during the component mounting work, the retry order determination unit , The component mounting order in another block which is located near the unmounted mounting point and in which the component is not mounted is re-determined to include the unmounted mounting point.

Therefore, unlike the case where the retry work is performed after completion of the work for mounting to another mounting point or when the component mounting work is temporarily stopped, the retry work is executed in the middle of the component mounting work. It can be done in a workflow. Then, since the retry work is performed during the component mounting work in the block located near the unmounted mounting point, the relative movement amount of the substrate can be small, and as a result, the retry work can be performed in a short time. .

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the present invention is applied to a so-called continuous rotation cycloid type component mounting apparatus will be described below with reference to FIGS. First, the schematic configuration of the component mounting apparatus according to the present embodiment will be described. FIG. 4 shows the main body 11 of the component mounting apparatus from above, in which the rotary drum 13 is provided at the center of the base 12 with the shaft 1
It is provided rotatably in the horizontal direction around 3a. The rotary drum 13 is rotationally driven by a drive motor (not shown) provided on the base 2 in a clockwise direction in the drawing through a speed reduction mechanism.

On the outer peripheral surface of the rotary drum 13, a plurality of, for example, 12 mounting heads 14 (only a part of which are shown) are provided. Although not shown in detail, the mounting head 14 is provided with a suction / adsorption nozzle for adsorbing an electronic component on a lower end portion thereof and mounting it on a substrate 15 (see FIG. 5, etc.) described later, and the suction / adsorption nozzle has a fixed posture. In a state of (downward) being maintained, the rotary drum 13 is configured to rotate (swing motion) in a counterclockwise direction when viewed from the side centering on an axis extending in the radial direction of the rotary drum 13.

With this, the rotation (revolution) of the rotary drum 13
As the mounting head 14 rotates (rotates), the suction mounting nozzle performs a cycloidal curve motion having a predetermined plurality of bottom dead centers (ground speed is zero) around the rotary drum 13. The suction / mounting nozzle is connected to a pressure adjusting mechanism (not shown) so that negative pressure and positive pressure can be switched.

A supply station 16 for supplying electronic parts (chip parts) is provided on the back side of the base 2 at the periphery of the rotary drum 13, and at the front side. A printed wiring board, etc.
Mounting station 1 for mounting the above components on
7 is provided.

Of these, the supply station 16 is constructed by detachably attaching a plurality of component feeders 18 (only some of which are shown) having different component types to a supply table 16a having an arc shape. The component feeder 18 is, for example, a well-known tape feeder, accommodates a large number of components, and supplies one electronic component to a predetermined supply position. These parts feeder 18
The respective supply positions of are matched with any one of the bottom dead points on the inner side of the mounting head 14 (adsorption point R).

On the other hand, the mounting station 17 is provided with XY tables 19 for freely moving the substrate 15 set in the mounted state in the horizontal direction, and the substrates 15 are placed on both sides of the XY table 19 to be placed on the XY table 19. It is provided with a carry-in conveyor 20 and a carry-out conveyor 21 for carrying in and carrying out. The XY table 19 moves the substrate 15 based on an XY coordinate system unique to the device,
Each component mounting point P (shown by a white circle in FIGS. 5 to 10) provided on the mounting point 5 is made to coincide with the mounting point Q (a predetermined bottom dead center on the front side) of the mounting head 14.

At the front side portion of the base 12, a control device 2 as control means for controlling the above-mentioned mechanisms is provided.
Two are provided. The control device 22 is composed of a microcomputer and the like, and according to a mounting program including a mounting sequence described later, the mounting head 14 sucks a predetermined component at the suction point R of the supply station 16 and mounts the component. It is configured to carry out the component mounting operation of transporting to the station 17 and mounting at a predetermined mounting point P on the substrate 15 at the mounting point Q continuously.

Although not shown, the mounting head 1 is located on the right side of the rotary drum 13 on the base 2.
There is provided a detection mechanism including a camera or the like for detecting whether or not 4 (suction-mounting nozzle) is properly sucking the component. In this case, the mounting head 1
When it is detected that 4 does not pick up the component correctly,
Even when the mounting head 14 reaches the mounting station 17, the control device 22 stops the mounting work for the corresponding mounting point P, and the component is removed at the discharge point after the mounting station 17. .
Such a mounting point Po where a component has not been mounted due to a mounting error.
When this occurs, it is necessary to perform a component mounting work (retry work) for the mounting point Po again later. When the detection mechanism detects a slight deviation of the component pickup position within the correctable range, the XY table 19 is used to make the correction.

In the present embodiment, for example, a workstation class computer 23 is connected to the control device 22 via a high speed network (LAN), and the coordinates of all the mounting points P on the board 15 and the mounting position P are mounted. The computer 23 determines the component mounting sequence and creates a mounting program based on the type of the component to be input in advance.

At this time, as will be apparent from the description of the operation later, the computer 23 uses the software configuration of the computer 23 to set a plurality of mounting points P on the substrate 15 to the substrate 15.
The upper area is divided into a plurality of blocks, the mounting work order between the blocks is determined, and the component mounting order at each mounting point P belonging to each block is determined by the movement distance of the XY table 19 (board 15). It is designed to be the shortest (optimization). Therefore, the computer 23 functions as the mounting order determining means according to the present invention.

The control device 22 is the computer 2
The component mounting work for each block in the order determined by 3 is sequentially executed. At this time, the mounting point Po where the component is not mounted due to a mounting error such as the above-described component suction error.
When the occurrence occurs, the component mounting work on the block to which the mounting point Po belongs is continued as it is, and the information (coordinates, component type, etc.) of the mounting point Po that has not been mounted is sent to the computer 23.

At this time, the computer 23, based on the information received when the unattached attachment point Po occurs,
The component mounting order in another block which is located in the vicinity of the unmounted mounting point Po and in which the components are not mounted is re-determined so as to include the corresponding mounting point Po. Therefore, the computer 23 also functions as the retry order determining means according to the present invention. This allows
The control device 22 is configured to execute the retry work for the mounting point Po at the same time as the component mounting work in another block which is located near the unmounted mounting point Po and in which no component is mounted. .

Next, the operation of the above configuration will be described with reference to FIGS. 1 to 3 and FIGS. 5 to 10. Here, as shown in FIG. 5, a substrate 15 having 120 component mounting points P (shown by white circles for convenience) will be described as a specific example.

First, as described above, before starting the component mounting work, the computer 23 determines the components based on the coordinates of all the mounting points P on the board 15 and the component types to be mounted in advance. The mounting sequence is determined and a mounting program is created. The determination of the component mounting order is performed by the procedure shown in FIG.

That is, first, in step S11, the substrate 1
A process of dividing the plurality of mounting points P on the 5 into a plurality of blocks is performed. This process is performed, for example, so that the number of mounting points P in one block is within 10. Depending on the capability of the computer 23, if the number of attachment points P in one block is 10 or more, the number of combinations of routes to be searched for in the subsequent optimization processing will be 300,000 or more, and the time required for calculation will be enormous. Because it becomes a thing.

Specifically, for example, the minimum number of blocks is obtained from the number of mounting points P, the area on the substrate 15 is equally divided so that the number of blocks is equal to the number of mounting points, and the mounting in each block thus divided is performed. When the number of points P exceeds 10, the block is further divided into two.
In the example of the board 15 of FIG. 5, since the mounting points P are 120, the minimum number of blocks is 12 (120 ÷ 10), and the area on the board 15 is 12 blocks of 3 squares × 4 squares. After that, as shown in FIG. 6, among these blocks, three blocks including 11 or more mounting points P are further vertically divided into two. With this,
As shown in FIG. 6 by being divided by broken lines, 120 mounting points P are divided into 15 blocks A to 15 by the area on the substrate 15.
It is classified as O.

In the next step S12, the mounting work order between the blocks is determined. In order to determine this order, for example, the lower left block in the figure is the first mounting order, and if it goes horizontally to the end, it goes up, and if it goes to the side again, it goes up to the end. It is done as if to fold. At the same time, the mounting points P that are closest to each other between adjacent blocks are determined as the end point and the start point in each block.

In the specific example of FIG. 5, as shown in FIG. 7, the mounting work sequence between blocks is determined to be block A, block B, ... Block N, block O, and at that time, The end point and the start point in each block are as shown by arrows. The mounting point P corresponding to the base end portion of the arrow is the end point, and the mounting point P corresponding to the tip end portion of the arrow is the start point.

In the final step S13, the component mounting order between the mounting points P belonging to each block is determined. In this process, in each of the blocks A to O, the length of the route from the start point to the end point while passing through all the mounting points P in the block is calculated for all combinations, and the length of the route is calculated. Is shortest (the movement distance of the XY table 19 is shortest).
In the specific example of FIG. 5, the component mounting order for each mounting point P is as shown by the arrow in FIG.

In this way, when the computer 23 determines the component mounting sequence and creates the mounting program, the mounting program is read into the controller 22 of the component mounting apparatus and the component mounting work is executed. However, at this time, the control device 22 sequentially reads not the entire mounting program but the mounting program for each block (referred to as block data) to execute the component mounting work. The procedure of this component mounting work is shown in the flowchart of FIG.

First, in step S1, the mounting program (block data) for one block is read from the computer 23 into the memory of the control device 22. In this case, when this step S1 is first passed, the block data regarding the block A having the first mounting order is read, and the block data according to the mounting order is sequentially read as the second block B, the third block C, .... Read.

In step S2, it is determined whether or not the component mounting work has been completed for all blocks. If not completed (No), the process proceeds to step S3 and step S1.
The component mounting work for the block read in is executed. This component mounting work is performed by mounting all the mounting points P belonging to the block in the mounting order according to the block data.
On the other hand, the mounting operation for the final mounting point P (end point) of the block is completed (step S6).

Here, during the component mounting work, as described above, a mounting point Po where the component is not mounted may occur due to a mounting error such as a component suction error (Y in step S4).
es). In such a case, the component mounting work for the block to which the mounting point Po belongs is continued as it is, and the information (coordinates, component type, etc.) of the unmounted mounting point Po is stored in the memory of the control device 22. (Step S5).

When the component mounting work for one block is completed (Yes in step S6), if an unmounted mounting point Po occurs during the component mounting work of the block, the next step S7 is performed. , Its unattached attachment point Po
Information is sent to the computer 23. As will be described later, the computer 23 determines where to retry the unmounted mounting point Po based on the information of the unmounted mounting point Po. After this, the component mounting work for all blocks (all mounting points P) is completed (Yes in step S2).
Until then, the process from step S1 for the next block is repeated.

FIG. 3 shows a processing procedure in which the computer 23, which has obtained the above-mentioned information about the unattached mounting point Po, determines where to retry the unattached mounting point Po. That is, first, in step S21, a block which is located closest to the non-mounted mounting point Po and has no mounted component is selected. In this case, if there is a component non-mounting block adjacent to the block to which the non-mounting mounting point Po belongs, it is selected, and if not, the component non-mounting block with the shortest distance is selected from the separated blocks.

Then, in step S22, the component mounting order for each mounting point P of the selected component non-mounting block (selected block) is re-determined including the non-mounting mounting point Po as the mounting point. The determination of the component mounting order is also performed in step S13 in the flowchart of FIG.
It is done in the same way as.

As a result, in the component mounting operation by the control device 22, when the block data of the selected block is read (step S1), the block data redetermined in step S22 is read. As a result, the retry work for the unmounted mounting point Po, which is originally another block, is also executed at the time of the component mounting work for the selected block.

As a concrete example, as shown in FIG. 9, if an unmounted mounting point Po (indicated by a black circle) occurs during the component mounting work on the block G, the unmounted mounting point Po is closest to the unmounted mounting point Po. The block M is selected as a block that is located and has no component mounted, and the mounting point P belonging to the block M
Therefore, the mounting order of is re-determined including the unmounted mounting points Po. Then, when the component mounting work up to the block L is completed, the re-determined block data is read, and the component mounting work for the block M is a retry work for the unmounted mounting point Po as shown by the broken line in FIG. It is done while interrupting on the way.

As described above, according to this embodiment, even when the mounting point Po where the component is not mounted occurs due to a mounting error, the mounting work for the block is continued as it is, and the retry work for the unmounted mounting point Po is performed. , And it is also executed when the component mounting work is performed on another block located in the vicinity thereof. Therefore, unlike the conventional one in which the retry work is performed after the mounting work is completed or the component mounting work is temporarily stopped, the movement amount of the substrate 15 relating to the retry work is small, or the rotating drum 13 is used.
There is no need to spin the wheel for one rotation.

As a result, even if a mounting error occurs,
The retry work associated therewith can be completed in a short time, the work efficiency can be prevented from deteriorating, and the work time can be greatly shortened.

In the above embodiment, the computer 23, which is separate from the control device 22 of the main body 11 of the component mounting apparatus, determines the component mounting order and the like. However, for example, by the control device incorporated in the main body. The present invention may be appropriately modified and implemented without departing from the scope of the invention, such as making the decision.

[0050]

As is apparent from the above description, according to the component mounting method of the present invention, the retry work is performed by mounting the component in another block which is located near the mounting point where the component is not mounted and in which the component is not mounted. Since I tried to do it at the time of work,
Even if an attachment error occurs, the retry work associated therewith can be completed in a short time, and the excellent practical effect that the decrease in work efficiency can be suppressed as much as possible is achieved.

Further, according to the component mounting apparatus of the present invention, the retry order determining means determines the component mounting order in another block which is located in the vicinity of the unmounted mounting point and in which the component has not been mounted yet. Since the re-determination is performed so as to include it, even if a mounting error occurs, the retry work associated therewith can be completed in a short time, and the reduction in work efficiency can be suppressed as much as possible.

[Brief description of drawings]

FIG. 1 shows an embodiment of the present invention and is a flow chart showing a procedure of component mounting work.

FIG. 2 is a flowchart showing a procedure for determining a component mounting order.

FIG. 3 is a flowchart showing a procedure for re-determining a component mounting order including a retry work.

FIG. 4 is a plan view of the component mounting apparatus.

FIG. 5 is a plan view of a board showing an example of mounting points.

FIG. 6 is a plan view of a substrate showing a state of block division.

FIG. 7 is a plan view of a board showing an example of a mounting order between blocks.

FIG. 8 is a plan view of a board showing an example of the entire component mounting sequence.

FIG. 9 is a plan view of a substrate showing a mounting error.

FIG. 10 is a plan view of a board showing an example of a component mounting sequence including a retry operation.

FIG. 11 is a view corresponding to FIG. 4 showing a conventional example.

FIG. 12 is a view equivalent to FIG.

[Explanation of symbols]

In the drawings, 11 is a component mounting apparatus main body, 12 is a base, and 13
Is a rotating drum, 14 is a mounting head, 15 is a substrate, 16 is a supply station, 17 is a mounting station, and 19 is an X.
A Y table, 22 is a control device (control means), 23 is a computer (mounting means determining means, retry means determining means), and P is a component mounting point.

Claims (2)

[Claims] 1. A substrate having a plurality of mounting points,
In a component mounting method in which a mounting head that conveys components is relatively moved with respect to the substrate, and components are sequentially mounted at each of the mounting points, the plurality of mounting points are defined by an area on the substrate. It is divided into a plurality of blocks, and the component mounting work is performed sequentially for each block, and even if there is a mounting point where a component has not been mounted due to a mounting error, the mounting work for that block is continued as it is. The component mounting method is characterized in that, at the time of component mounting work in another block which is located in the vicinity of and the component is not mounted, the component mounting work at the mounting point where the component is not mounted is also executed. 2. A substrate having a plurality of mounting points,
In a component mounting apparatus configured to sequentially mount a component at each of the mounting points while moving a mounting head that conveys the component relative to the substrate, the plurality of mounting points are defined by an area on the substrate. It is divided into a plurality of blocks, the mounting work order between the blocks is determined, and the mounting order determining means for determining the mounting order of the components at each mounting point belonging to each block, and the component due to a mounting error during the component mounting work. When an unmounted mounting point occurs, a retry is performed to redetermine the component mounting order in another block which is located near the unmounted mounting point and in which no component has been mounted so as to include the unmounted mounting point. A component actualizing device comprising: an order determining unit; and a control unit that executes a component mounting operation according to the determinations of the mounting order determining unit and the retry order determining unit. Apparatus.