JPH06185883A - Insulation type heat pipe and cooling device - Google Patents

Abstract

PURPOSE:To provide a heat pipe and a cooling device provided with this heat pipe in which there are a plurality of heat generating sources and each of the heat generating sources requires an electrical insulation. CONSTITUTION:There are provided a first pipe having a nozzle at one end thereof and a second pipe having its one end sealed. In addition, there are provided one or a plurality of third pipes connected in series with between the other ends of the first and second pipes. Each of the pipes is connected by another pipe having an electrical insulation. An insulating heat pipe having a working liquid with electrical insulation in it and having the nozzle sealed therein, for example, the first pipe is provided with cooling fins so as to form a thermal radiation part. Each of the second and third pipes is provided with a metallic block so as to form the cooling device having a plurality of heat absoprtion parts.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an insulating heat pipe in which a plurality of pipes are connected via an insulating portion, and a cooling unit for cooling the heat of a plurality of heat generating parts using the insulating heat pipe. It is a thing.

[0002]

2. Description of the Related Art In recent electronic devices, a cooling structure utilizing a phase change of a heat medium by a heat pipe has begun to be used. In this cooling structure, a heat pipe is mounted on a heat generating component such as a semiconductor component, and the heat absorbing part (evaporating part) of this heat pipe absorbs the heat of the heat generating component and transfers this heat to the heat radiating part (condensing part). This is a structure in which heat-generating components are cooled by radiating heat.

Since the heat pipe transfers large latent heat at high speed by steam, it can transfer heat with almost no temperature difference and has excellent thermal response. Therefore, it is widely used for cooling heat generating parts such as thyristors. .

[0004]

By the way, since a semiconductor surface such as a thyristor has a potential, there is a risk of electric shock if this is energized to a heat radiating portion through a metal heat pipe. Therefore, when a heat pipe is attached to a semiconductor component for a power source that handles a large current such as a thyristor, as shown in FIG.
An electrically insulating pipe 2 is provided between the heat absorbing portion 11 and the heat radiating portion 12 of the heat pipe 1 for insulation.
The cover 3 is used so as to cover the.

However, as shown in FIG. 7, three-phase (U
When the thyristor S is used for each phase of the power supply (phase, V phase, W phase), it is necessary to provide an individual cooling unit for each thyristor S in order to insulate each other. However, if a cooling unit is individually provided for each thyristor S, if there is a large difference in heat radiation amount between the thyristors S, it is necessary to design the cooling fins F according to the highest heat radiation amount. Has the disadvantage that the cooling fin F is too large for the amount of heat generation.

Further, the cover 3 is placed so as not to come into contact with the thyristor S and receive an electric shock, and the pipe 1a of the heat pipe 1 and the cooling fins F, which have been electrically insulated, are covered with the cover 3.
However, it is desirable that the number of sealing points between the heat pipe 1 and the cover 3 is small, and it is desirable that the number of cooling units can be designed as small as possible.

Therefore, the present invention has a plurality of heat generation sources,
Moreover, the purpose of the present invention is to provide a heat pipe that can be applied when each heat source requires electrical insulation.
Using this heat pipe, the amount of heat radiated in each heat generation source is increased by soaking each heat generation source, the number of cooling units and thus the volume of cooling fins and the number of heat pipes is reduced, It is an object of the present invention to provide a cooling unit that can meet the demands of increased layout flexibility and weight reduction.

[0008]

An insulated heat pipe according to the present invention comprises a first pipe having a nozzle at one end, a second pipe having one end sealed, and a first pipe and a second pipe. One or a plurality of third pipes connected in series between the other ends are provided, and each pipe is connected by an electrically insulating pipe, and an electrically insulating hydraulic fluid is sealed inside. It has a configuration in which the nozzle is sealed.

Further, the cooling unit according to the present invention has a first pipe having a nozzle at one end, a second pipe having one end sealed, and a series connection between each of the other ends of the first and second pipes. And one or a plurality of third pipes connected to each other, each pipe is connected by an electrically insulating pipe, and a working liquid having electrically insulating property is sealed inside to seal the nozzle. Type heat pipe first to third
Structure in which cooling fins are attached to any of the pipes to form a heat radiating portion, and a plurality of heat absorbing portions are formed by attaching metal blocks to each of the first to third pipes except the pipes to which the cooling fins are attached. Have.

Further, the cooling unit according to the present invention has a first pipe having a nozzle at one end, a second pipe having one end sealed, and a series connection between the other ends of the first and second pipes. And one or a plurality of third pipes connected to the second pipe, a cooling fin is attached to the second or third pipe to form a heat dissipation portion, and a metal block is attached to each of the other pipes. The structure has a plurality of heat absorbing parts.

[0011]

In the structure of the present invention, the heat of a plurality of heat-generating components such as thyristors mounted on the metal blocks of the heat absorbing section and requiring cooling is transmitted to the corresponding pipes via the metal blocks, and The heat is dissipated by being transmitted to the pipe that constitutes the heat dissipation portion. In this case, since an electrically insulating pipe is provided between the pipes, the potential of each heat generating component is not transmitted to the pipe of the heat radiating portion, and there is no risk of electric shock. Further, since the working fluid sealed inside is also electrically insulating, safety is secured also in this respect. Further, since each pipe of the heat absorbing portion is electrically insulated, cooling of a plurality of heat generation sources that require electrical insulation from each other, such as when a thyristor is used for each phase of a three-phase power supply, is used. Is also possible.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a block diagram showing an embodiment in which the insulated heat pipe according to the present invention is used as a cooling unit for three thyristors for a three-phase power source, and the same parts as those of FIG. Will be described with the same reference numerals.

In the cooling unit according to this embodiment, a plurality of (four in this example) pipes 1a are provided with a large number of cooling fins F.
To form the heat dissipation portion 12, and adjacent to the heat dissipation portion 12, a plurality of pipes 1b, 1c, 1d to which the metal blocks 4a, 4b, 4c are attached are provided, and the pipes 1a to 1d are connected to each other. It is a heat pipe type cooling unit which is connected by electrically insulating pipes 2a, 2b, 2c, and which constitutes the heat absorbing portion 11 by the pipes 1b to 1d.

In this structure, each metal block 4a ...
The heat generated in the thyristors S1 to S3 placed on the 4c is transmitted to the corresponding pipes 1b to 1d via the metal blocks 4a to 4c, and further to the pipe 1a constituting the heat radiating portion 12. Is dissipated. At this time, the electrically insulating pipes 2a to 2c are provided between the pipes 1a to 1d, so that the cooling of the thyristors S1 to S3 requiring electrical insulation can be performed by one cooling unit.

Further, since the electrically insulating pipes 2a to 2c are provided and the working liquid sealed in the pipes 1a to 1d is also electrically insulating, the heat radiating portion 12 is heated. Only transmitted, there is no risk of electric shock. Further, in this embodiment, the number of sealing points between the heat pipe 1 and the cover 3 is reduced from the conventional three to one, and the number of heat pipes is reduced from twelve to four.

Next, the manufacturing process of the insulated heat pipe and cooling unit of the present invention will be described with reference to FIGS. FIG. 2 is a cross-sectional view showing an embodiment of an insulating heat pipe according to the present invention in which a plurality of pipes are connected by an electrically insulating pipe. In the figure, each pipe 1a-1
d is the height of the mountain in the axial direction of 0.3mm due to the plug pulling,
It is composed of a copper pipe with an outer diameter of 15.88 mm and a V-shaped groove with a pitch of 0.6 mm.
A is formed into a hemispherical shape in which a nozzle 5 having a fine hole portion is formed by spinning the upper end of this copper pipe. The lower end of the pipe 1d in the lower part of the figure is formed into a hemispherical shape by spinning, and the tip is sealed by welding.

Between each of the pipes 1a-1d,
The alumina pipe 7 brazed to the sealing metal Kovars 6a and 6b is inserted, and the pipes 1a to 1d are connected by brazing the pipes at both ends to the Kovars 6a and 6b by high frequency heating.

Among the pipes connected in this manner, metal blocks 4a-4c made of aluminum as illustrated in FIG. 3 are respectively attached to the pipes 1b-1d, as shown in FIG. It is fixed by soldering. The metal blocks 4a to 4c are heat absorbing parts 11a and 11c.
b and 11c.

In this case, the metal blocks 4a to 4c may be integrally molded, but if they are of a split type as shown in FIG. 3, they can be easily assembled and manufactured. In the case of using the one formed integrally, it is necessary to insert the pipe into the block in advance when connecting the pipes.

Next, perfluorocarbon is injected as an electrically insulating working fluid 9 from the nozzle 5 of the pipe 1a, the metal blocks 4a to 4c are heated to 50 ° C. or higher by a heater, and the working fluid 9 is boiled to heat the heat pipe 1. Degas the inside of the. After that, the nozzle 5 is crimped by a crimping jig, and T
It is welded and sealed by IG welding to form a heat pipe as a whole. After that, as shown in FIG. 5, a large number of aluminum cooling fins F are attached to the pipe 1a to form the heat radiating portion 12, thereby completing the cooling unit.

In the above embodiment, the heat pipe is formed after the metal block is attached.
A metal block may be attached after heat pipe formation. In this case, the pipe 1a side can be used as the heat absorbing portion and the pipe 1d side can be used as the heat radiating portion. Further, for example, as shown in FIG.
You may comprise so that it may be an intermediate position of c.

[0022]

According to the present invention, even if a semiconductor component such as a thyristor is directly attached to the surface of the metal block, it is electrically insulated in the middle of the heat pipe.
Only the heat is transmitted without the electric potential of the semiconductor component being transmitted to the heat radiating portion, and the risk of electric shock can be prevented.

Further, the heat pipe type cooling unit is
Since it has a plurality of heat absorbing parts that are electrically insulated from each other, it is possible to cool a plurality of semiconductor components that need to be electrically insulated from each other, and increase the amount of heat radiation in each phase by equalizing the temperature of each semiconductor component. It is possible to meet demands such as a reduction in volume and the number of heat pipes, an increase in the degree of freedom in layout of semiconductor components and cooling fins, and a reduction in weight, and it can be expected to have a significant industrial effect.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing an embodiment of a cooling unit using an insulating heat pipe according to the present invention.

FIG. 2 is a cross-sectional view showing an example of an insulating heat pipe according to the present invention.

FIG. 3 is a perspective view of a split-type metal block attached to an insulated heat pipe according to the present invention.

FIG. 4 is a view showing a state in which a plurality of metal blocks are attached to an insulating heat pipe according to the present invention to form a heat absorbing portion.

5 is a diagram showing a state in which cooling fins are attached to the heat pipe having the configuration shown in FIG. 4 to form a heat radiating portion.

FIG. 6 is a configuration diagram showing another embodiment of a cooling unit using an insulating heat pipe according to the present invention.

FIG. 7 is a configuration diagram showing an example of a conventional cooling unit.

[Explanation of symbols]

 1 Heat Pipe 1a, 1b, 1c, 1d Pipe 2, 2a, 2b, 2c Electric Insulating Pipe 3 Cover 4a, 4b, 4c Metal Block 5 Nozzle 6a, 6b Kovar 7 Alumina Pipe 8 Soft Brazing Material 9 Working Fluid 11, 11a , 11b, 11c Heat absorption part 12 Heat dissipation part F Cooling fins S, S1, S2, S3 Thyristor

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[Procedure amendment]

[Submission date] February 2, 1993

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be amended] Claims

[Correction method] Change

[Correction content]

[Claims]

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0010

[Correction method] Delete

Claims (3)

[Claims] 1. A first pipe having a nozzle at one end,
A second pipe whose one end is sealed; and one or a plurality of third pipes connected in series between the other ends of the first and second pipes. Is connected by a pipe having an electric insulation property, and a working liquid having an electric insulation property is sealed inside to seal the nozzle. 2. A first pipe having a nozzle at one end,
A second pipe whose one end is sealed; and one or a plurality of third pipes connected in series between the other ends of the first and second pipes. Are connected by an electrically insulating pipe, and a cooling fin is attached to any one of the first to third pipes of the insulating heat pipe in which the electrically insulating working fluid is sealed and the nozzle is sealed. A cooling unit, wherein the cooling unit is mounted to form a heat radiating unit, and a metal block is mounted to each of the first to third pipes except the pipe to which the cooling fin is mounted to configure a plurality of heat absorbing units. 3. A first pipe having a nozzle at one end,
A second pipe having one end sealed, and one or a plurality of third pipes connected in series between the other ends of the first and second pipes, the second or A cooling unit in which a cooling fin is attached to the third pipe to form a heat radiating portion, and a metal block is attached to each of the other pipes to form a plurality of heat absorbing portions.