JPH06182968A - Transfer device - Google Patents
Transfer deviceInfo
- Publication number
- JPH06182968A JPH06182968A JP33406892A JP33406892A JPH06182968A JP H06182968 A JPH06182968 A JP H06182968A JP 33406892 A JP33406892 A JP 33406892A JP 33406892 A JP33406892 A JP 33406892A JP H06182968 A JPH06182968 A JP H06182968A
- Authority
- JP
- Japan
- Prior art keywords
- transfer
- circuit board
- printed circuit
- cream solder
- vibrator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えばクリーム半田な
どの転写物をプリント基板に転写させるための転写装置
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer device for transferring a transfer material such as cream solder onto a printed circuit board.
【０００２】[0002]
【従来の技術】従来のこの種の転写装置は、転写具に複
数の転写ピンを植設し、その転写ピンの先端部にクリー
ム半田を付着させ、それをプリント基板の所定位置に転
写させるようになっていた。2. Description of the Related Art In a conventional transfer device of this type, a plurality of transfer pins are planted in a transfer tool, cream solder is attached to the tips of the transfer pins, and they are transferred to a predetermined position on a printed circuit board. It was.
【０００３】[0003]
【発明が解決しようとする課題】従来のものにおいて、
問題となるのはプリント基板へのクリーム半田付着量が
安定しないことであった。すなわち、転写ピンの先端に
付着したクリーム半田は、ある転写ピンにおいては、そ
の先端からすべてがプリント基板に転写されずに残って
しまい、この時には、プリント基板においては、クリー
ム半田不足となり、次にその転写ピンに新たなクリーム
半田が付着させられた状態では逆に、プリント基板への
転写量が多くなってしまうこともあり、このような結果
として、転写量が安定しなくなるのであった。SUMMARY OF THE INVENTION In the conventional one,
The problem was that the amount of cream solder deposited on the printed circuit board was not stable. That is, the cream solder attached to the tips of the transfer pins remains untransferred from the tips to the printed circuit board at a certain transfer pin, and at this time, the cream solder runs short on the printed circuit board. On the contrary, when new cream solder is attached to the transfer pins, the transfer amount to the printed circuit board may be increased, and as a result, the transfer amount becomes unstable.
【０００４】そこで本発明は、この転写量を安定させる
ことを目的とするものである。Therefore, the present invention aims to stabilize this transfer amount.
【０００５】[0005]
【課題を解決するための手段】そして、この目的を達成
するために、本発明の転写装置は転写具に、それを振動
させるための振動子を連結したものである。To achieve this object, the transfer device of the present invention comprises a transfer tool and a vibrator for vibrating the transfer tool.
【０００６】[0006]
【作用】以上の構成とすれば、転写具が振動することに
より、そこに付着させられている転写物は、例えばプリ
ント基板などの被転写物に容易に、しかもその実質的に
全部を転写させることができるので、転写量は極めて安
定したものとなる。With the above construction, the transfer tool is vibrated so that the transfer material attached thereto can be easily and substantially transferred to the transfer target material such as a printed circuit board. Therefore, the transfer amount becomes extremely stable.
【０００７】[0007]
【実施例】図１において、１はアルミニウムの直方体で
形成した転写具でその上面には、ホーン型の振動子２が
固着されている。また、振動子２の上端には振動体３が
固定されている。一方、転写具１の下面には一体成形で
複数の転写ピン４が植設された状態となっている。DESCRIPTION OF THE PREFERRED EMBODIMENTS In FIG. 1, reference numeral 1 is a transfer tool formed of an aluminum rectangular parallelepiped, and a horn type vibrator 2 is fixed to the upper surface thereof. A vibrating body 3 is fixed to the upper end of the vibrator 2. On the other hand, the lower surface of the transfer tool 1 is in a state in which a plurality of transfer pins 4 are integrally formed and implanted.
【０００８】この構成において転写ピン４の下端には、
クリーム半田がクリーム半田槽への移動時に付着させら
れており、この図１に示す状態に戻った後に、下降して
プリント基板５の上面の図示していない導電パターンに
転写される。この時転写ピン４の下端は水平方向に高い
周波数で振動しており、これによりクリーム半田はプリ
ント基板５側に、そのほとんどすべてが容易に転写させ
られることになる。In this structure, at the lower end of the transfer pin 4,
The cream solder is adhered when it is moved to the cream solder tank, and after returning to the state shown in FIG. 1, it descends and is transferred to a conductive pattern (not shown) on the upper surface of the printed circuit board 5. At this time, the lower end of the transfer pin 4 vibrates in the horizontal direction at a high frequency, so that almost all of the cream solder is easily transferred to the printed circuit board 5 side.
【０００９】なお転写ピン４の下端は、図２に示すごと
く、その断面形状をほぼ台形状とすることが好ましい。
なぜならこの転写ピン４は水平方向に振動するので、そ
の振動方向が図２に示すごとく、切り欠かれた状態とな
っていると、水平方向への移動時にクリーム半田を押し
広げてしまうおそれが少なくなるからである。The lower end of the transfer pin 4 preferably has a substantially trapezoidal cross section as shown in FIG.
Because the transfer pin 4 vibrates in the horizontal direction, if the vibration direction is in a notched state as shown in FIG. 2, there is less possibility of spreading the cream solder when moving in the horizontal direction. Because it will be.
【００１０】[0010]
【発明の効果】以上のように、本発明の転写装置は転写
具に、それを振動させるための振動子を連結したもので
ある。そして、以上の構成とすれば、転写具が移動する
ことにより、そこに付着させられている転写物は、例え
ばプリント基板などの被転写物に容易に、しかも実質的
にその全部を転写させることができるので、転写量は極
めて安定したものとなる。As described above, the transfer device of the present invention comprises a transfer tool and a vibrator for vibrating the transfer tool. With the above configuration, by moving the transfer tool, the transfer material attached thereto can be easily and substantially transferred to the transferred material such as a printed circuit board. Therefore, the transfer amount becomes extremely stable.
【図１】本発明の一実施例の正面図FIG. 1 is a front view of an embodiment of the present invention.
【図２】その転写ピンの一部拡大正面図FIG. 2 is a partially enlarged front view of the transfer pin.
１ 転写具 ２ 振動子 ４ 転写ピン 1 Transfer tool 2 Transducer 4 Transfer pin
フロントページの続き (72)発明者 川口 勲 大阪府門真市大字門真1006番地 松下電器 産業株式会社内Front page continuation (72) Inventor Isao Kawaguchi 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.
Claims (2)
とを備え、前記転写具は転写物を接着させる転写部を有
する転写装置。1. A transfer device comprising a transfer tool and a vibrator for vibrating the transfer tool, the transfer tool having a transfer section for adhering a transfer material.
もに前記転写ピンの先端部は、その断面形状を略台形状
とした請求項１に記載の転写装置。2. The transfer device according to claim 1, wherein a plurality of transfer pins are implanted in the transfer tool, and a tip portion of the transfer pin has a substantially trapezoidal cross section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04334068A JP3074985B2 (en) | 1992-12-15 | 1992-12-15 | Transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04334068A JP3074985B2 (en) | 1992-12-15 | 1992-12-15 | Transfer device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06182968A true JPH06182968A (en) | 1994-07-05 |
| JP3074985B2 JP3074985B2 (en) | 2000-08-07 |
Family
ID=18273157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP04334068A Expired - Fee Related JP3074985B2 (en) | 1992-12-15 | 1992-12-15 | Transfer device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3074985B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110816093A (en) * | 2019-11-20 | 2020-02-21 | 江苏上达电子有限公司 | Processing technology of seal type ink for printed circuit board |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014036973A (en) * | 2012-08-13 | 2014-02-27 | Ｑｅｌ 株式会社 | Molten solder coating apparatus |
| JP7004359B1 (en) | 2021-04-28 | 2022-01-21 | 株式会社Ｗ | Coffee storage bag and coffee storage method |
-
1992
- 1992-12-15 JP JP04334068A patent/JP3074985B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110816093A (en) * | 2019-11-20 | 2020-02-21 | 江苏上达电子有限公司 | Processing technology of seal type ink for printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3074985B2 (en) | 2000-08-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |