JPH06177313A - Semiconductor device and its manufacture and lead frame used in the same - Google Patents

Abstract

PURPOSE:To surely prevent generation of cracks in a resin encapsulated package. CONSTITUTION:Four cut and erected parts 20 are formed in a tab 18 of a QFP-IC 29. Each cut and erected segment 22 is made toward the side opposite to a pellet 24 in a resin encapsulated package 27. Thereby the cut part 20 effectively exhibits anchor-casting effect in the resin encapsulated package, and sufficiently cope with the peeling force caused by the thermal expansion coefficient difference of constituent material on the interface of the tab 18 and the resin at the time of heating the QFP IC 29. Hence the peeling is prevented, and generation of cracks due to peeling can be prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a technique for preventing cracks in a resin-sealed package. For example, a semiconductor integrated circuit device (hereinafter referred to as IC) equipped with a surface-mounted resin-sealed package. () Related to effective technology.

[0002]

2. Description of the Related Art Generally, in an IC provided with a surface mount type resin-sealed package for realizing high-density mounting, when the resin-sealed package is exposed to a high temperature and then cooled, the resin-sealed package is sealed. It is known that there is a problem that a crack is generated in the stationary package from the back surface of the tab. The reason why cracking occurs is considered as follows.

That is, the material forming the pellets such as silicon, the 42 alloy or copper forming the lead frame, and the resin forming the package have greatly different thermal expansion coefficients. Therefore, the surface mount type resin encapsulation package IC can be used for temperature cycle tests, thermal shock tests, etc.
When heated in the solder dipping process or reflow soldering process during mounting, peeling occurs at the adhesive interface between the resin of the resin-sealed package and the pellets and tabs, and the resin package cracks starting from the back surface of the tabs. Occurs.

Therefore, conventionally, as an IC provided with a surface mount type resin-sealed package for solving this problem, an IC having a large number of circular small holes formed in the tab or four linear shapes in the tab is used. An IC having a slit formed in a cross shape has been proposed.

In the IC having the small holes or slits formed in the tabs as described above, due to repeated stress due to thermal stress, these are separated from the interface between the lower surface of the tab and the resin of the package or the interface between the tab and the pellet. Even if the force that tries to act is applied, the resin of the package filled in the small holes or slits exerts the anchoring effect, so that the peeling force can be sufficiently resisted. Peeling can be prevented.
If peeling does not occur, even if stress concentrates near the outer edge of the back surface of the tab inside the resin-sealed package, cracks originating from that point do not occur.

Further, when the slit is formed in a cross shape in the tab, the cross-sectional area of each tab is reduced by dividing the cross-sectional area of the tab into four blocks. The amount of growth will be reduced. As a result, the magnitude of the concentrated stress generated by the difference in thermal expansion between the metal of the tab and the resin of the package on the outer edge of the tab is suppressed to a small level, so that even if peeling occurs, the resin-sealed package The generation of cracks starting from the stress concentration point inside is prevented.

An example of an IC having a surface mount type resin-sealed package in which tabs are provided with small holes and slits is disclosed in JP-A-59-16357 and JP-A-62-62. No. 115752 and Japanese Patent Application No. 62-
12833 and drawings.

[0008]

Recently, as an IC having a surface mount type resin-sealed package for realizing high density mounting and increasing the number of outer leads,
uad Flat Package IC (hereinafter QF
It is called PIC. ) Has been used.

This QFP / IC includes a semiconductor pellet (hereinafter referred to as a pellet), a tab to which the pellet is bonded, and a plurality of pads electrically connected to each bonding pad of the pellet via a bonding wire. It is provided with a lead, a pellet, a tab, and a package for sealing a part of each lead with a resin. The outer part of each lead projects from the four sides of the resin-sealed package at right angles in the horizontal plane, and is bent into a gull wing shape to be located at the height position of the lower main surface of the resin-sealed package. It is almost aligned.

However, in this QFP / IC, if a small hole or slit is formed in the tab as in the prior art described above, a vapor explosion is caused when moisture is absorbed in the resin-sealed package, The present inventor has revealed that there is a problem that it may not be possible to prevent the occurrence of cracks in the resin-sealed package.

An object of the present invention is to provide a semiconductor device capable of reliably preventing the occurrence of cracks in a resin-sealed package.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0013]

The typical ones of the inventions disclosed in the present application will be outlined below.

That is, the semiconductor pellet, the tab to which the semiconductor pellet is bonded, the plurality of leads electrically connected to each bonding pad of the semiconductor pellet, the semiconductor pellet, the tab, and part of each lead are In a semiconductor device including a resin-sealed package, a cut-and-raised portion is formed in at least one of the tab and a tab suspension lead for suspending the tab, and a cut-out hole and a cut-and-raised portion of the cut-and-raised portion are formed. The raised piece is surrounded by the resin of the resin-sealed package.

[0015]

According to the above-mentioned means, due to the repeated stress due to the thermal stress, the force for peeling off the interface between the lower surface of the tab and the resin-sealed package and the resin or the interface between the tab and the pellet is removed. Even if it works, the resin of the package filled in the cutout hole of the cut-and-raised part and the resin of the package surrounding the cut-and-raised piece of the cut-and-raised part exert the anchoring effect, so that the peeling occurs. Since it can sufficiently resist the force, peeling is surely prevented. If peeling does not occur, even if stress concentrates near the outer edge of the back surface of the tab inside the package, cracks originating there will not occur.

Further, since the cut-out hole of the cut-and-raised portion is formed in the tab, the cross-sectional area of the tab is divided into a plurality of blocks by the cut-out hole, so that the cross-sectional area of each block is reduced. . As a result, the amount of expansion of the tab due to thermal expansion is reduced, and the magnitude of the concentrated stress generated due to the difference in thermal expansion between the tab and the package resin on the outer edge of the tab itself is suppressed to be small. Even if peeling occurs, it is possible to prevent the occurrence of cracks originating from the stress concentration points inside the package.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a QFP / IC which is an embodiment of the present invention.
FIG. 4A is a front cross-sectional view, and FIG. FIG. 2 and subsequent drawings are explanatory views showing each step in the manufacturing method.

In this embodiment, the semiconductor device according to the present invention is constructed as a QFP IC. This QFP
The IC 29 includes a pellet 24, a tab 18 to which the pellet 24 is bonded, a plurality of leads 19 electrically connected to each bonding pad 24 a of the pellet 24 via a bonding wire 25, a pellet 24, A tab 18 and a resin-sealed package 27 for sealing a part of each lead 19 with a resin are provided. And
A cut-and-raised portion 20 is formed on the tab 18, and the cut-out hole 21 and the cut-and-raised piece 22 of the cut-and-raised portion 20 are surrounded by the resin of the resin-sealed package 27. Is cut and raised toward the side opposite to the pellet 24 in the resin-sealed package 27.

This QFP which is one embodiment of the present invention will be described below.
-Explain the method of manufacturing an IC. By this explanation, QF
Details of the above-mentioned configuration of the PIC will be disclosed together.

In the present embodiment, the multiple lead frame 11 shown in FIG. 2 is used in the manufacturing method of the QFP IC, and this multiple lead frame 11 is manufactured by the multiple lead frame molding process. Has been prepared. The multiple lead frame 11 is made of a thin plate made of a spring material having a relatively large mechanical strength, such as an iron-nickel alloy or phosphor bronze, and is suitable for punching or etching. Are integrally molded by. A plating process using silver (Ag) or the like is partially or entirely applied to the surface of the multiple lead frame 11 so as to appropriately perform the wire bonding described later (not shown). A plurality of unit lead frames 12 are arranged side by side in a row in the multiple lead frame 11. However, only one unit is shown.

The unit lead frame 12 has a positioning hole 13
There is provided a pair of outer frames 13 in which a is provided, and both outer frames 13 are arranged in parallel at a predetermined interval and extend in series. Adjacent unit lead frame 1
A pair of section frames 14 are provided between the outer frame 13 and the outer frame 13,
The unit lead frames 12 are arranged in parallel with each other between the 13 and are integrally installed. The unit lead frame 12 is formed in a substantially square frame body (frame) formed by the outer frame and the section frame.

In each unit lead frame 12, a dam suspension member 15 is disposed at a connection portion of the outer frame 13 and the section frame 14 in a substantially right angle direction and integrally provided so as to project integrally. The four dam members 16 are arranged so as to have a substantially square frame shape and are integrally suspended.

A tab suspension lead 17 is provided at one end of each dam member 16 on the side of the section frame 14, and the tab suspension lead 17 is provided at approximately 4
The tabs 18, which are integrally provided so as to face each other in the direction of 5 degrees and are formed in a substantially square flat plate shape at the tips of the tab suspension leads 17, are substantially concentric with the frame shape of the dam member 16 group. The tab suspension leads 17 are integrally arranged so as to be suspended by the tab suspension leads 17.

The tab suspension leads 17 are bent near the tabs 18, respectively.
Due to the bending, the tab 18 is lowered from the surface of the lead group described later by the thickness of the pellet described later (so-called tab lowering).

Further, a plurality of leads 19 as electric wiring are arranged on the dam member 16 at equal intervals in the longitudinal direction, and are integrally projected so as to be parallel to each other and orthogonal to the dam member 16. . The inner end of each lead 19 has a tab 1 at the tip.
The inner portion 19 is arranged by surrounding 8
a respectively. On the other hand, the outer extension of each lead 19 has its tip at the outer frame 13 and the section frame 1.
4 and each constitute an outer portion 19b. The portion between the adjacent leads 19 of the dam member 16 substantially constitutes a dam 16a that blocks the flow of the resin during the later-described package molding.

In the present embodiment, each cut-and-raised portion 20 is formed on the tab 18 at a peripheral position of the tab 18 on the center line of the tab 18 in the front-rear direction and on the center line of the left-right direction. Each of the cut-and-raised parts 20 has a cutout hole 21 and a cut-and-raised piece 22, and the cut-and-raised piece 22 is substantially constituted by a substantial piece formed by cutting out the cutout hole 21.

Each cutout hole 21 is formed in a rectangular shape, and is arranged so as to extend long along the center line. Therefore, the four cutout holes 2
1 are in a state of being opened in a cross shape with their short sides facing each other.

Each cut-and-raised piece 22 has a width of the cut-out hole 21.
Is formed into a rectangular plate shape whose width is narrower than that of the cutout hole 21 and whose length is slightly shorter than the entire length of the cutout hole 21, and one short side is connected to the outer short side of the cutout hole 21, The respective cutout holes 21 are arranged so that their center lines are aligned and extend long. Further, each cut-and-raised piece 22 is bent obliquely in the tab lowering direction at the connecting portion with the cut-out hole 21, and the bent lower end portion is included in the same plane parallel to the tab 18 as much as possible. Each is bent as shown. And
This plane parallel to the tab 18 including the tip group of the cut-and-raised pieces 22 is set to be located on the opposite side of the pellet in the resin-sealed package described later.

Incidentally, when the multiple lead frame is manufactured by press working, the cut-out hole 21 and the cut-and-raised piece 22 of the cut and raised portion 20 can also be formed by press working. When the multiple lead frame is manufactured by etching, the tongue is formed by forming the cut-out hole 21 of the cut-and-raised portion 20 into a concave slit shape by etching, and then enclosing it on three sides by the concave slit. The cut and raised piece 2 is obtained by bending the piece by pressing as described above.
2 will be formed. In this case, cut and raised piece 2
The press working for 2 can be performed simultaneously with the tab lowering work described above.

The multiple lead frame 11 having the above-mentioned structure prepared in the multiple lead frame molding step is
In the pellet bonding process and the wire bonding process, the pellet bonding work and then the wire bonding work are performed. These bonding operations are sequentially performed for each unit lead frame by laterally pitching multiple lead frames.

First, as shown in FIGS. 3 and 4, a pellet 24 as a semiconductor integrated circuit structure in which an integrated circuit is formed in a so-called pre-process in a semiconductor device manufacturing process by a pellet bonding operation is shown. In addition, the unit lead frame 12 is disposed at a substantially central portion on the tab 18 and is mechanically fixed by a bonding layer 23 formed between the tab 18 and the pellet 24 for bonding. As a method for forming the pellet bonding layer 23, a bonding method using a gold-silicon eutectic layer, a soldering layer, a silver paste adhesive layer, etc. can be used. However, it is desirable to form the bonding layer 23 so that it does not become a barrier to heat transfer from the pellet to the tub, if necessary.

Then, by wire bonding work,
Bonding pad 2 of pellet 24 bonded onto tab 18 as shown in FIGS. 3 and 4.
4a and the leads 19 in each unit lead frame 12
The both ends of the bonding wire 25 are bonded to the inner part 19a of the same by using a suitable wire bonding device (not shown) such as an ultrasonic thermocompression bonding wire bonding device. Bridged. As a result, the integrated circuit built in the pellet 24 is electrically pulled out to the outside through the bonding pad 24a, the bonding wire 25, the inner portion 19a and the outer portion 19b of the lead 19.

In the assembly 26 thus pelletized and wire-bonded, a package 27 group for resin-sealing each unit lead frame is used, and a transfer molding device 30 as shown in FIG. 5 is used. Has been
Simultaneous molding is performed for a unit lead frame group.

The transfer molding apparatus 30 shown in FIG. 5 comprises a pair of upper mold 31 and lower mold 32 which are clamped together by a cylinder device or the like (not shown).
On the mating surface of the upper mold 31 and the lower mold 32, a plurality of upper mold cavity recesses 33a and a plurality of lower mold cavity recesses 33b are provided so as to cooperate with each other to form the cavity 33.

A pot 34 is opened on the mating surface of the upper mold 31, and a cylinder device (not shown) is provided in the pot 34.
A plunger 35 that is advanced and retracted by is inserted so that a resin (hereinafter, referred to as a resin) as a molding material can be fed.

On the mating surface of the lower mold 32, a cull 36 is disposed so as to face the pot 34 and is recessed.
A plurality of runners 37 are radially arranged so as to be respectively connected to the pots 34 and are recessed. The other end of each runner 37 is connected to the lower cavity recess 33b, and a gate 38 is formed at that connection so that the resin can be injected into the cavity 33. Further, the multiple lead frame 11 is provided so that an escape recess 39 can escape the thickness of the lead frame on the mating surface of the lower die 32.
It has a rectangular shape slightly larger than the outer shape, and is submerged at a constant depth of a size approximately equal to its thickness.

When the resin-sealed package is transfer-molded by using the assembly 26 having the above structure,
Each cavity 33 in the upper mold 31 and the lower mold 32 is a pair of dams 16a in each unit lead frame 12,
It corresponds to the space between 16a.

At the time of transfer molding, in the assembly 26 having the above-mentioned structure, the multiple lead frame 11 has the lower die 3
It is housed in the escape recess 39 that is buried in the unit 2, and the pellets 24 of each unit lead frame 12 are arranged and set so as to be housed in each cavity 33. At this time, in this embodiment, the four cut-and-raised pieces 22 that are bent obliquely downward to the tab 18 are separated from the bottom surface of the lower mold cavity recess 33b.

Subsequently, the upper mold 31 and the lower mold 32 are clamped, and the resin 40 is moved from the pot 34 by the plunger 35 through the runner 37 and the gate 38 to each cavity 3.
It is sent to 3 and press-fitted. Since the resin 40 press-fitted into the cavity 33 is filled in the cavity 33 without any gap, the resin 40 is also filled in the inside of the cut-and-raised holes 21 of the cut-and-raised portions 20 formed in the tab 18 without any gap.

After the injection, when the resin is thermoset to form the resin-sealed package 27, the upper mold 31 and the lower mold 3 are formed.
The mold 2 is opened, and the resin-sealed package 27 group is released from the mold by ejector pins (not shown). Thus, as shown in FIGS. 6 and 7,
The assembly 28 in which the group of resin-sealed packages 27 is molded is removed from the transfer molding device 30. The inner portion 1 of the tab 18, the pellet 24, and the lead 19 is placed inside the resin-sealed package 27 resin-molded as described above.
9a and the wire 25 are resin-sealed.

In this embodiment, the cut-out holes 21 and the cut-and-raised pieces 22 of the four cut-and-raised parts 20 formed on the tab 18 are surrounded by the resin of the resin-sealed package 27.

Although not shown, the assembly 28, which is a semi-finished product in which the resin-sealed package is molded, is not shown in the drawing, but in the lead cutting step, the outer frame 13 is sequentially arranged for each unit lead frame.
The dam 16a is cut off, and the outer portion 19b of each lead 19 is bent and formed into a gull wing shape.

Resin-encapsulated type Q manufactured as described above
The FP / IC 29 is mounted on the printed wiring board as shown in FIG.

A plurality of lands 42 are arranged on the printed wiring board 41 so as to correspond to the leads 19 of the resin-sealed QFP / IC 29 to be mounted, and a substantially rectangular thin plate made of a solder material is used. The leads 42 of the IC 29 are aligned and abutted on the lands 42, and the leads 19 and the lands 42 are formed by a reflow soldering process. (Not shown) electrically and mechanically connected.

Next, the operation will be described. Q related to the above configuration
The FP / IC is inspected before shipment. Environmental tests including temperature cycle tests and thermal shock tests are carried out as sampling inspections. Further, when this QFP / IC is mounted on a printed wiring board or the like, the QFP / IC is heated by solder dip processing or reflow soldering processing.

When a thermal stress is applied to the QFP / IC 29 having the above-mentioned structure during such an environmental test or mounting, a stress is generated inside the resin-sealed package 27 due to the difference in the thermal expansion coefficient of the constituent materials.

By the way, when the outer peripheral edge of the tab is formed in a sharp right angle, the internal stress of the resin-sealed package is concentrated near the outer edge on the back surface of the tab. However, cracks in the resin-sealed package do not occur with such stress concentration. However, if peeling occurs at the interface between the bottom surface of the tab and the resin of the package or the interface between the tab and the pellet due to repeated stress due to repeated thermal stress, excessive stress acts on the stress concentration point, and so there is a starting point there. Then cracks occur.

Furthermore, if the moisture absorbed inside the resin-sealed package in the storage process after the completion of the resin-sealed package intrudes into the gap generated by peeling between the lower surface of the tab and the package, QFP. When the IC is heated, the moisture expands due to the heating, so-called steam explosion occurs, so that even more stress is generated. Therefore, the present inventor has clarified that there is a problem that cracks starting from the stress concentration portion are more likely to be generated.

A study similar to this analysis is published in "14th Reliability Symposium Announcement Bulletin" published by The Japan Science and Technology Federation, May 29, 1984, P303-P306.

When a lead frame made of 42 alloy is used, peeling occurs at the interface between the lower surface of the tab and the resin of the package, and when a lead frame made of copper is used. When peeling occurs at the interface between the pellet and the tab, the stress at the lower end of the tab increases significantly, causing cracks in the resin-sealed package. In particular, even when a lead frame made of copper, whose coefficient of thermal expansion is almost the same as that of the resin used in the package, is used, if peeling occurs at the interface between the pellet and the tab, the resin portion of the package that contacts the side surface of the tab Opens, and excessive stress acts to cause cracks.

When such a crack occurs in the QFP / IC 29, the crack is likely to reach the surface of the resin-sealed package 27 because the resin-sealed package 27 is thinly formed. Moisture resistance of the QFP / IC 29 is drastically reduced due to the intrusion of moisture into the inside of the resin-sealed package 27 from the opening of the crack reaching the surface.

However, in this embodiment, since the cut-and-raised parts 20 are formed at four positions on the tab 18, the resin-sealed package 27 does not crack.

That is, it is attempted to peel off the interface between the lower surface of the tab 18 and the resin of the resin-sealed package 27 or the interface between the tab 18 and the pellet 24 by the repeated stress due to the thermal stress as described above. Even if a force to act is applied, the resin filled in the cutout hole 21 of the cut-and-raised portion 20 and the resin-sealed package 2
Since the cut-and-raised pieces 22 embedded in the resin of No. 7 exert the anchoring effect, the peeling force can be sufficiently resisted. Due to these anchoring effects, peeling at the interface between the lower surface of the tab 18 and the resin of the resin-sealed package 27 or the interface between the tab 18 and the pellet 24 is reliably prevented. As described above, when the peeling does not occur, even if the stress is concentrated near the outer edge of the back surface of the tab 18, the crack originating from the stress does not occur. By the way, cutout hole 2
If 1 is formed as a tapered hole having a large diameter on the pellet mounting surface side, the anchoring effect in the cutout hole 21 is further enhanced.

Further, since the cut-out holes 21 of the cut-and-raised portion 20 are formed in the tabs 18 at four positions in a cross shape, the cross-sectional area of the tabs 18 is divided into four blocks, and each block is divided into four blocks. Since the cross-sectional area is reduced, the amount of expansion due to the thermal expansion of the tab 18 is reduced accordingly. As a result, the magnitude of the concentrated stress generated due to the difference in thermal expansion between the tab 18 and the resin of the package 27 on the outer edge of the tab 18 is suppressed to a small level, so that the inside of the resin-sealed package 27 should be as described above. Even if such peeling occurs, the occurrence of cracks originating from the stress concentration point is prevented.

As described above, in this embodiment,
Since the peeling is surely prevented by the anchoring effect of the cut-and-raised portion 20 and the dividing effect of the cross-sectional area, cracks in the resin-sealed package 27 due to so-called steam explosion caused by the temperature rise of the resin-sealed package 27. Can also be prevented. That is, the moisture absorbed by the resin-sealed package 27 collects in the gap formed at the interface between the lower surface of the tab 18 and the resin of the resin-sealed package 27, and the resin-sealed package 2 at the time of heating described above.
Although a so-called steam explosion is caused as the temperature of No. 7 rises, a gap due to peeling does not occur in the present embodiment, so that the moisture absorbed by the resin-sealed package does not accumulate in the gap. . In other words, it is possible to avoid the phenomenon that the steam explosion occurs inside the resin-sealed package 27, so that the occurrence of cracks is prevented.

According to the above embodiment, the following effects can be obtained. By forming the cut-and-raised portion on the tab, it is possible to prevent the tab and the resin of the resin-encapsulated package from being separated from each other due to the stress generated due to the thermal stress. Therefore, the outer peripheral edge of the tab is used as a starting point. It is possible to prevent the occurrence of cracks in the resin-sealed package.

By preventing peeling between the tab and the resin of the resin-sealed package, it is possible to prevent water absorbed by the resin-sealed package from accumulating in the gap due to peeling, and therefore, when various heating is performed. The so-called steam explosion caused by the temperature rise of the resin-sealed package can be avoided in advance, and as a result, the resin-sealed package can be prevented from cracking due to the steam explosion.

With the above, since it is possible to reliably prevent the occurrence of cracks in the resin-sealed package, it is possible to make the surface mount type package thinner and more compact, and to provide the surface mount type package. The integration density and packaging density of existing ICs can be further increased.

Since the cut-and-raised portion can be formed simultaneously with the tab when forming the multiple lead frame, it is possible to suppress a decrease in productivity.

FIG. 9 shows a second embodiment of the present invention, QFP.I.
It is a figure which shows C, (a) is front sectional drawing, (b) is a partially cut bottom view.

The difference of the second embodiment from the first embodiment is that the cut-out hole 21A in the cut-and-raised portion 20A is opened in a series of cross shapes and the cut-and-raised piece 22A is formed.
Is that they are integrally connected in a cross shape.

In the second embodiment, the cut and raised piece 22 is used.
Since A is holding the resin portion on the lower surface of the tab 18, the anchoring effect is further enhanced.

FIG. 10 shows QFP, which is Embodiment 3 of the present invention.
It is a figure which shows IC, (a) is front sectional drawing, (b) is a partially cut bottom view.

The difference of the third embodiment from the first embodiment is that
The cut-out hole 21B in the cut-and-raised portion 20B is opened in a series of one-letter shapes, and the cut-and-raised piece 2 is formed.
The point is that 2B is integrally connected in a one-letter shape.

In the third embodiment, the cut and raised portion 20
Although the area of B is reduced, since the cut-and-raised piece 22B is in a state of holding the resin portion on the lower surface of the tab 18, the anchoring effect is enhanced, so that the tab 18 and the resin-sealed package 27 are separated. It is possible to reliably prevent peeling from the resin.

FIG. 11 is a view showing a QFP / IC having a radiation fin according to a fourth embodiment of the present invention. (A) is a partially cut bottom view, and (b) is an enlarged portion taken along line bb. FIG.

The difference of the fourth embodiment from the first embodiment is that
The tab suspension leads 17C with fins in which the fins 17a are projected to the outside from the four corners of the resin-sealed package 27.
In addition, each cut-and-raised portion 20C is formed,
In addition, each cut-and-raised hole 21C is opened in a straight line shape, and each cut-and-raised piece 22C is cut and raised vertically.

In the fourth embodiment, the cut-and-raised portions 20 are formed on the tab suspension leads 17C projecting from the four corners of the tab 18.
Since each C is formed, each tab suspension lead 1
7C is fixed to the resin-sealed package 27 by the anchoring effect of the cut-and-raised portion 20C, and as a result, the tab 18 is strongly fixed to the resin-sealed package 27 and the tab 18 and the resin of the resin-sealed package 27 are prevented from peeling off. Will be done.

Although the invention made by the present inventor has been specifically described based on the embodiments, the invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, the shape of the cut-out hole and the cut-and-raised piece in the cut-and-raised portion is not limited to a rectangle, but may be a square, a triangle, an ellipse, a curve, or a combination of straight lines and curves. It doesn't matter. further,
The number of cut-and-raised parts is not limited to four and may be three or more.

In the above description, the invention made mainly by the present inventor is a field of application which is the background of the invention.
The case of application to an IC has been mainly described, but the present invention is not limited to this and can be applied to all semiconductor devices including a resin-sealed package. In particular, the present invention can be applied to a manufacturing technique of a semiconductor device having a thin surface-mounting resin-sealed package to obtain excellent effects.

[0072]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

By forming the cut-and-raised portion on at least one of the tab and the tab suspension lead, it is possible to reliably prevent the occurrence of cracks originating from the corners of the tab in the resin-sealed package.

[Brief description of drawings]

FIG. 1 is a diagram showing a QFP / IC according to an embodiment of the present invention, in which (a) is a front sectional view and (b) is a partially cut bottom view.

FIG. 2 is a partially omitted plan view showing a multiple lead frame used in the method for manufacturing the QFP / IC.

FIG. 3 is a partially omitted plan view showing a state after a pellet and wire bonding step.

FIG. 4 is a front sectional view taken along line IV-IV in FIG.

FIG. 5 is a partially omitted vertical sectional view showing a molding step of a resin-sealed package.

FIG. 6 is a partially cutaway plan view showing the assembly after molding the resin-sealed package.

FIG. 7 is a vertical sectional view of the same.

FIG. 8 is a perspective view showing a mounted state of a QFP / IC.

9A and 9B are diagrams showing a QFP / IC that is Embodiment 2 of the present invention, in which FIG. 9A is a front sectional view and FIG.

10A and 10B are views showing a QFP / IC that is Embodiment 3 of the present invention, in which FIG. 10A is a front sectional view and FIG.

11A and 11B are views showing a QFP / IC having a radiation fin according to a fourth embodiment of the present invention, in which FIG. 11A is a partially cutaway bottom view and FIG. 11B is an enlarged partial sectional view taken along line bb. Is.

[Explanation of symbols]

11 ... Multiple lead frame, 12 ... Unit lead frame, 13 ... Outer frame, 14 ... Section frame, 15 ... Dam suspension member, 16 ... Dam member, 16a ... Dam, 17 ... Tab suspension lead, 17C ... Fin tab suspension Lead, 18 ... Tab, 19 ... Lead, 19a ... Inner portion, 19b ... Outer portion, 20, 20A, 20B, 20C ... Cut and raised portion, 2
1, 21A, 21B, 21C ... Cutout holes, 22, 22
A, 22B, 22C ... Cut and raised piece, 23 ... Bonding layer, 24 ... Pellet, 24a ... Bonding pad,
25 ... Wire, 26 ... Assembly, 27 ... Resin-sealed package, 28 ... Assembly after resin-sealed package molding, 29 ...
QFP / IC (semiconductor device), 30 ... Transfer molding device, 31 ... Upper mold, 32 ... Lower mold, 33 ... Cavity,
33a ... upper mold cavity recess, 33b ... lower mold cavity recess, 34 ... pot, 35 ... plunger, 36 ... cull, 37 ... runner, 38 ... gate, 39 ... escape recess, 4
0 ... Resin, 41 ... Printed wiring board, 42 ... Land.

Claims (3)

[Claims] 1. A semiconductor pellet, a tab to which the semiconductor pellet is bonded, a plurality of leads electrically connected to each bonding pad of the semiconductor pellet, a semiconductor pellet, a tab, and a part of each lead. In a semiconductor device including a resin-sealed package, a cut-and-raised portion is formed on at least one of the tab and a tab suspension lead for suspending the tab, and a cut-out hole and a cut-and-raised portion of the cut-and-raised portion are formed. A semiconductor device, wherein the raised piece is surrounded by the resin of the resin-sealed package. 2. A semiconductor pellet, a tab to which the semiconductor pellet is bonded, a plurality of leads electrically connected to each bonding pad of the semiconductor pellet, a part of each of the semiconductor pellet, the tab and each lead. A method of manufacturing a semiconductor device, comprising: a resin-sealed package; and a lead frame molding for manufacturing a lead frame in which a cut-and-raised portion is formed in at least one of the tab and a tab suspension lead for suspending the tab. A step, a pellet bonding step in which the semiconductor pellet is bonded to the tab in the lead frame, and a lead connecting step in which each bonding pad of the semiconductor pellet and each lead of the lead frame are electrically connected. , This lead frame is The tab and the cut-and-raised piece are arranged and housed in the cavity, and a resin is injected into the cavity to form a package for resin-sealing the semiconductor pellet, the tab, and a part of each lead. A method of manufacturing a semiconductor device, further comprising: a resin-sealed package molding step in which the cutout hole and the cut-and-raised piece of the cut-and-raised portion are surrounded by a resin of a resin-sealed package. 3. A lead frame comprising a tab to which a semiconductor pellet is bonded and a lead electrically connected to a bonding pad of the semiconductor pellet bonded to the tab, wherein the tab and the tab for suspending the tab are provided. A lead frame, wherein a cut-and-raised part is formed on at least one of the suspension leads.