JPH0617311Y2 - マルチチップパッケージにおける回路素子の冷却構造 - Google Patents

マルチチップパッケージにおける回路素子の冷却構造

Info

Publication number
JPH0617311Y2
JPH0617311Y2 JP15298287U JP15298287U JPH0617311Y2 JP H0617311 Y2 JPH0617311 Y2 JP H0617311Y2 JP 15298287 U JP15298287 U JP 15298287U JP 15298287 U JP15298287 U JP 15298287U JP H0617311 Y2 JPH0617311 Y2 JP H0617311Y2
Authority
JP
Japan
Prior art keywords
heat
circuit element
heat pipe
conduction block
pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP15298287U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0158952U (enrdf_load_stackoverflow
Inventor
正孝 望月
道雄 高岡
恒明 馬渡
隆一 置鮎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP15298287U priority Critical patent/JPH0617311Y2/ja
Publication of JPH0158952U publication Critical patent/JPH0158952U/ja
Application granted granted Critical
Publication of JPH0617311Y2 publication Critical patent/JPH0617311Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP15298287U 1987-10-06 1987-10-06 マルチチップパッケージにおける回路素子の冷却構造 Expired - Lifetime JPH0617311Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15298287U JPH0617311Y2 (ja) 1987-10-06 1987-10-06 マルチチップパッケージにおける回路素子の冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15298287U JPH0617311Y2 (ja) 1987-10-06 1987-10-06 マルチチップパッケージにおける回路素子の冷却構造

Publications (2)

Publication Number Publication Date
JPH0158952U JPH0158952U (enrdf_load_stackoverflow) 1989-04-13
JPH0617311Y2 true JPH0617311Y2 (ja) 1994-05-02

Family

ID=31428408

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15298287U Expired - Lifetime JPH0617311Y2 (ja) 1987-10-06 1987-10-06 マルチチップパッケージにおける回路素子の冷却構造

Country Status (1)

Country Link
JP (1) JPH0617311Y2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5589620B2 (ja) * 2010-07-01 2014-09-17 日本電気株式会社 電子部品の冷却構造、電子部品装置、ヒートシンク
JP5805838B1 (ja) 2014-09-29 2015-11-10 株式会社日立製作所 発熱体の冷却構造、電力変換器ユニットおよび電力変換装置
JP5908156B1 (ja) * 2015-09-02 2016-04-26 株式会社日立製作所 発熱体の冷却構造

Also Published As

Publication number Publication date
JPH0158952U (enrdf_load_stackoverflow) 1989-04-13

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