JPH06169197A - Positioning of cap to circuit board - Google Patents

Abstract

PURPOSE:To make it possible to position rightly the center of a cap to the center of a circuit board by a method wherein the tapered parts of the inner surfaces of pawls provided on the periphery of a cap press are brought into contact with the outer periphery of the flange of the cap, the cap press is further made to descend and the upper surface of the cap is pressed by the lower surface of the cap press to fix the cap. CONSTITUTION:A cap press 8 provided over a pallet 5 is made to descend, whereby as the tapered parts of the inner surfaces of pawls 7 provided on the periphery of the press 8 come into contact with the outer periphery of a flange 4a of a cap 4, the cap 4 is properly positioned to the center of the pallet 5. When the press 8 is further made to descend, the lower surface of the press 8 presses the upper surface of the cap 4 to fix the cap 4. Thereby, even in the case where the dimension of the external shape of a sealing frame 3 of a circuit board 1 is not coincident with that of the external shape of the flange of the cap, the center of the cap can be properly positioned to the center of the circuit board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cap positioning method for mounting an integrated circuit on a circuit board and mounting the cap thereon.

[0002]

2. Description of the Related Art FIG. 2 is a sectional view showing an example of a working state of a conventional method for positioning a cap with respect to a circuit board in the order of steps.

As shown in FIG. 2A, the conventional method for positioning the cap when the integrated circuit is mounted on the circuit board and the cap is mounted on the circuit board 1 is that the integrated circuit 2 is mounted on the circuit board 1. By positioning the sealing frame 3 and the brim of the cap 4 with reference to the positioning pins 16 provided on the pallet 15, the cap 4 for the circuit board 1 is positioned.
The method of positioning the mounting position of is adopted.

[0004]

The conventional method for positioning the cap on the circuit board as described above is shown in FIG.
As shown in (b), the outer dimensions of the sealing frame 3 and the cap 4
If there is an error from the outer dimensions of the collar, the center of the cap 4 is displaced from the center of the circuit board 1, so that the cap 4
Due to this, there is a drawback that the integrated circuit 2 may not be completely sealed.

[0005]

A method of positioning a cap with respect to a circuit board according to the present invention comprises mounting a cap on a sealing frame of a circuit board on which an integrated circuit is mounted and temporarily fixing the cap.
The circuit board is mounted on a pallet with the positioning pins as a reference, and the cap retainer provided above the pallet is lowered so that the taper portion of the inner surface of the claw provided around the cap retainer and the collar of the cap retainer are provided. The outer periphery of the cap is further brought into contact with the outer periphery of the cap, the cap is further lowered, and the upper surface of the cap is pressed and fixed by the lower surface of the cap retainer.

[0006]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 is a sectional view showing an example of a working state of one embodiment of the present invention in the order of steps.

In this embodiment, first, as shown in FIG. 1A, the integrated circuit 2 is mounted at a predetermined position on the circuit board 1 having the sealing frame 3 of the circuit board 1.

Next, as shown in FIG. 1B, the sealing frame 3
The brim 4a of the cap 4 is mounted on the top. At this time, there are a case where the outer dimensions of the sealing frame 3 and the collar 4a of the cap 4 match, and a case where the outer dimension of the collar 4a of the cap 4 is larger than the outer dimension of the sealing frame 3. There are three kinds of states, that is, the outer dimension of the collar 4a of the cap 4 is smaller than the outer dimension of the sealing frame 3.

External dimensions of the sealing frame 3 and the collar 4a of the cap 4
1b, the flange 4a of the cap 4 is temporarily mounted on the sealing frame 3 in FIG. 1B, and then the circuit board 1 is integrated as shown in FIG. 1C. It is mounted on the pallet 5 together with the circuit 2 and the cap 4. At this time,
The circuit board 1 is correctly positioned at the center of the pallet 5 by the positioning pins 6 provided on the pallet 5.

Next, as shown in FIG. 1 (d), the cap retainer 8 provided above the pallet 5 is lowered. As a result, the tapered portion of the inner surface of the claw 7 provided around the cap retainer 8 comes into contact with the outer circumference of the collar 4a of the cap 4, so that the cap 4 is correctly positioned at the center of the pallet 5. When the cap retainer 8 is further lowered, the lower surface of the cap retainer 8 presses and fixes the upper surface of the cap 4.

When the outer dimension of the collar 4a of the cap 4 is larger than the outer dimension of the sealing frame 3 and when the outer dimension of the collar 4a of the cap 4 is smaller than the outer dimension of the sealing frame 3, FIG. After temporarily mounting the collar 4a of the cap 4 on the sealing frame 3 in b), the circuit board 1 in FIG.
Are mounted on the pallet 5. As a result, the circuit board 1
Are correctly positioned at the center of the pallet 5 by the positioning pins 6 provided on the pallet 5. Next, in FIG. 1D, the cap retainer 8 is lowered to bring the taper portion of the inner surface of the claw 7 into contact with the outer periphery of the collar 4a of the cap 4. As a result, the cap 4 is correctly positioned at the center of the pallet 5.

When the outer dimension of the collar 4a of the cap 4 is larger than the outer dimension of the sealing frame 3, the claw 7 has the outer dimension of the sealing frame 3 and the outer dimension of the collar 4a of the cap 4 which coincide with each other. If the outer dimensions of the collar 4a of the cap 4 are smaller than the outer dimensions of the sealing frame 3, the cap 4 is in contact with the cap 4 at a lower position. In either case, the cap 4 is correctly positioned in the center of the pallet 5. After that, when the cap retainer 8 is further lowered, the lower surface of the cap retainer 8 presses and fixes the upper surface of the cap 4.

[0014]

As described above, according to the method of positioning the cap with respect to the circuit board of the present invention, the cap is temporarily mounted and mounted on the sealing frame of the circuit board on which the integrated circuit is mounted, and then the circuit board is mounted. Mounted on a pallet with the positioning pin as a reference, lower the cap retainer provided above the pallet, and bring the taper part of the inner surface of the claw provided around the cap retainer into contact with the outer periphery of the collar of the cap retainer, By further lowering the cap retainer and pressing the upper face of the cap with the lower face of the cap retainer to fix it, even if the external dimensions of the sealing frame of the circuit board and the external dimensions of the collar of the cap do not match, the circuit The effect is that the center of the cap can be correctly positioned with respect to the center of the substrate, and thus the cap can completely seal the integrated circuit. A.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an example of a work state of an embodiment of the present invention in process order.

FIG. 2 is a cross-sectional view showing an example of a working state of a conventional method for positioning a cap with respect to a circuit board in the order of steps.

[Explanation of symbols]

 1 Circuit Board 2 Integrated Circuit 3 Sealing Frame 4 Cap 4a Tsuba 5 ・ 15 Pallet 6 ・ 16 Positioning Pin 7 Claw 8 Cap Presser

Claims (2)

[Claims] 1. A cap mounted on a sealing frame of a circuit board on which an integrated circuit is mounted and temporarily fixed, and then mounted on the pallet at a central position of the circuit board and above the pallet. The presser foot is lowered to bring the taper portion of the inner surface of the claw provided around the cap presser into contact with the outer circumference of the brim of the cap presser, and then the cap presser is lowered to make the upper surface of the cap by the lower surface of the cap presser. A method for positioning a cap with respect to a circuit board, the method including pressing and fixing. 2. A cap is mounted on a sealing frame of a circuit board on which an integrated circuit is mounted and temporarily fixed, and then the circuit board is mounted on a pallet with reference to a positioning pin and provided above the pallet. The cap retainer is lowered to bring the taper portion of the inner surface of the claw provided around the cap retainer into contact with the outer periphery of the brim of the cap retainer, and further lower the cap retainer to cause the lower surface of the cap retainer to move. A method of positioning a cap with respect to a circuit board, comprising pressing and fixing the upper surface of the cap.