JPH06168857A - Method and machine for soldering electronic component to lead wire - Google Patents

Abstract

PURPOSE:To mount linear solder on a lead wire while entangling thereabout in order to allow soldering of the lead wire and a component using a constant length of linear solder. CONSTITUTION:While feeding a linear solder 7 intermittently, by a predetermined cutting length at a time, along a guide 1 by means of feed rollers 13, 13, a cutting molded item 2 is reciprocated vertically along the end face of a cutting guide 3 thus cutting the solder 7 into a predetermined length. The solder 7 thus cut is then bent into inverted U-shape by means of a molding die 4 and a molding pin 6 when the cutting molded item 2 lowers. After retraction of the molding pin 6 in the molding die 4, the cutting molded item 2 lowers further downward to insert the solder 7 into the lead wire 10 of an electronic component 8 being set thereunder. Thereafter, a pair of caulking dies 12, 12 approach each other in synchronism with elevation of the cutting molded item 2 and the lead wire 7 is caulked at the opposite ends thereof. The electronic components are fed sequentially to a position immediately below the molding pin every time when the operation is conducted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component such as a feedthrough capacitor having a lead wire penetrating the component body. TECHNICAL FIELD The present invention relates to a method and an apparatus for entanglement with a wire.

[0002]

2. Description of the Related Art A feedthrough capacitor is composed of a cylindrical component body having a through hole at the center and a lead wire penetrating the through hole. The lead wire is one electrode led to the end face of the component body. To be soldered to. Conventionally, when a lead wire is soldered to the component body of this feedthrough capacitor, it is performed as follows. First, with the lead wire penetrating the through hole of the component body, the lead wire is mounted on the jig at regular intervals, and the component body is temporarily fixed to the lead wire. Here, the end surface of the component body on the side to be soldered is arranged so that all of the feedthrough capacitors have substantially the same surface. In this state, the end surface of the electronic component on the side to be soldered is directed downward, and the portion is immersed in the melting solder. After that, the molten solder is pulled up to cure the attached solder.

[0003]

However, in the conventional soldering means, when the end face side of the component body to be soldered is immersed in the molten solder, the immersion depth must be adjusted very accurately. Otherwise, the amount of deposited solder becomes too small or too large, and the amount of soldered varies greatly, causing troubles in soldering failure. Moreover, much more solder than the solder required for actual soldering must be melted and prepared in the solder bath, and moreover, the level of the liquid must be accurately maintained while preventing oxidation of the liquid surface. You have to control it.

For these reasons, the conventional soldering method has a drawback in that the solder management and the waste of heat energy for melting the solder are complicated and the solder management is troublesome. In view of this, the present invention enables the lead wire and the component body to be soldered by using a linear solder having a fixed length without using molten solder. It is an object of the present invention to provide a method and an apparatus capable of doing the above.

[0005]

That is, according to the present invention,
In a method of entanglement and mounting a linear solder on a lead wire of an electronic component, a step of cutting the solder into a predetermined length, a step of bending the cut solder along a mold pin into an inverted U shape, and an inverted U shape An electronic component characterized by including a step of inserting the bent solder in the radial direction of the lead wire of the electronic component from the open portion and hanging it, and a step of caulking both ends of the inverted U-shaped solder inside and closing the solder. To provide a method of attaching solder to the lead wire of the above.

Further, in an apparatus for entanglement and mounting a linear solder on a lead wire of an electronic component, in an apparatus for entanglement and attachment of a linear solder on a lead wire of an electronic component, the solder is guided along a longitudinal direction thereof. In addition to having a solder supply mechanism that intermittently feeds each predetermined cutting dimension and an inverted U-shaped molding die that molds solder, cutting that reciprocates up and down along the end face of the guide orthogonal to the solder feeding direction. A molded body, a mold pin that is arranged orthogonally to the feeding direction of the solder, and that reciprocates between a position directly below the center of the molding die portion of the cutting molded body and a position deviated from the position, and a lead wire on the component body. A component supply mechanism that supplies the electronic component through which the lead wire is directly below the mold pin and that the electronic component is sequentially stopped in parallel to the pin, and a component supply mechanism directly below the lead wire of the stopped electronic component. Both Opposite, to provide a solder mounting device to the leads of the electronic component characterized in that it comprises a pair of crimping type which approach each other in synchronization with rise of the cutting shaped body.

[0007]

In the solder mounting method according to the present invention, after the solder is cut to a predetermined length, the solder is bent along the mold pin into an inverted U shape, and the solder is cut from the open portion to the lead wire of the electronic component. Since it is inserted in the radial direction and hung, and further both ends of the inverted U-shaped solder are caulked and closed, the linear solder can be reliably attached to the lead wire.

Further, in the solder mounting apparatus according to the present invention, the solder supply mechanism intermittently feeds the solder along the guide in the longitudinal direction at predetermined cutting dimensions, and the cut molded body is vertically moved along the end face of the guide. By moving back and forth,
The solder can be cut into a predetermined length. Immediately after being cut, the cut solder descends from the cut molded body to form an inverted U-shaped molding die portion at the tip,
It is molded in an inverted U shape with the mold pin in the center position. After the mold pin is retracted, the cut molded body is further moved downward, so that the solder is inserted into the lead wire of the electronic component stopped therebelow from the open portion below. After that, the pair of caulking dies are brought closer to each other in synchronization with the rise of the cut-molded body, so that both ends of the lead wire are caulked so as to be closed. Then, for each of these operations, the electronic component that penetrates the lead wire through the component body is sequentially supplied by the supply mechanism directly below the die pin. As described above, since the respective steps of the present invention are sequentially performed while the cut compact descends and rises, all the steps can be performed in a short time.

[0009]

Embodiments of the present invention will now be described in detail with reference to the drawings. First, an embodiment of a solder mounting apparatus for a lead wire of an electronic component according to the present invention will be described with reference to FIGS. As shown in these figures, a guide 1 for horizontally guiding the linear solder 7, so-called thread solder, is provided. The solder 7 is fed along the guide 1 by the feed rollers 13 and 13 as shown in FIG. ), Intermittent feed is performed in the direction indicated by the arrow, that is, in the longitudinal direction of the solder 7. Then, in the same drawing, it is sent out to the right side through the through hole of the cutting guide 3 standing upright at the right end of the guide 1.
The pitch of the feeding is set to the length of the solder 7 which is about to be entangled with the lead wire 10 of the electronic component 8.

The cut compact 2 reciprocates up and down along the right end surface of the cutting guide 3. The vertical movement of the cut molded body 2 is synchronized with the intermittent feed of the solder 7 by the feed rollers 13 and 13, and every time the feed rollers 13 and 13 feed the solder 7 by one pitch, from the position shown in FIG. The operation of descending from the top to the position shown in FIG. 3 and returning to the original position is repeated.

This cut-molded body 2 has a molding die portion 4 at the center of its tip, which is composed of an inverted U-shaped concave portion for molding the solder 7 into an inverted U-shaped shape. , It corresponds to the bent external dimensions of the solder to be formed into the inverted U shape. Further, on the lower end surfaces on both sides of this molding die part 4,
A concave groove 5 is formed parallel to the feeding direction of the solder 7 by the guide 1.

Immediately below the center of the mold part 4 of the cut molded body 2, below the guide position of the solder 7 by the guide 1,
The tip of the cylindrical rod-shaped die pin 6 is arranged. The die pin 6 is arranged in a direction orthogonal to the feeding direction of the solder 7, and moves in the left and right directions in FIG. 1 to FIG. The part reciprocates between a position directly below the cut-molded body 2 and a position displaced from the cut-molded body 2. That is, when the cut-molded body 2 is in the position shown in FIGS. 1 and 2, the tip of the mold pin 6 is located directly below the cut-molded body 2 or in the mold part 4, but the cut-molded body 2 is Before the die lowers below that, the die pin 6 moves in the direction indicated by the arrow in FIG. 2 (b), and as shown in FIG. The mold 4 is retracted. Then, when the cut molded body 4 returns to the position shown in FIG. 1, the mold pin 6 also returns to the position shown in FIG. This type pin 6
The diameter corresponds to the bent inner diameter of the solder to be formed into the inverted U shape.

Below the mold pin 6, an electronic component 8 such as a feedthrough capacitor having a lead wire 10 penetrating a through hole at the center of the component body 14 is supplied. In the illustrated embodiment, for example, as shown in FIG. 5, the ends of the lead wires 10 of the electronic component 8 on the side opposite to the side on which the soldering is performed are parallel to the jig 9 at regular intervals. The component body 14 is temporarily fixed to the lead wire 10. In this state, the end faces of the component body 14 to be soldered, that is, the end faces facing the front in FIGS. 1 to 3A and 4 are aligned side by side.

The jig 9 with the lead wire 10 fixed in this way
Is intermittently fed by the feed roller 11 in the arrow direction in FIGS. The intermittent feed is in synchronization with the operation of the caulking dies 12, 12 described later. After the caulking dies 12, 12 have moved and returned to their original positions, the lead wire 10 is fed by one interval and the next lead is fed. Line 1
The position at which it is about to be half-attached to the component body 14 of 0, that is, the base portion derived from the component body 14 is stopped immediately below the cut molded body 2.

Further, a pair of caulking dies 12, 12 are arranged so as to face each other immediately below the position where the lead wire 10 stops. The caulking dies 12, 12 operate in synchronization with the cutting molded body 2, and immediately after the cutting molded body 2 is lifted from the position shown in FIG.

Next, the operation of this device and the method of mounting the lead wires of the electronic component by entwining the linear solder thereon will be described. First, as shown in FIG. 1, by the feed rollers 13 and 13, the linear solder 7 is intermittently fed along the guide 1 in the longitudinal direction at predetermined cutting dimensions, and the cutting guide of the guide 1 is moved by a predetermined dimension. 3 is extruded from the right end surface of FIG.

Subsequently, the cut molded body 2 is lowered to the position shown in FIG. 1, and the solder 7 extruded from the end surface of the cutting guide 3 is fitted into the grooves 5 on both sides of the tip thereof. When the cut molded body 2 is further lowered, the solder 7 is cut at the end face position where the cutting guide 3 and the cut molded body 2 are in contact with each other. As a result, the solder 7 is cut into a predetermined length. Immediately thereafter, as shown in FIG. 2, the center of the arcuate portion of the inverted U-shaped forming die portion 4 formed at the tip of the cut formed body 2 descends until it reaches the die pin 6. Then, the solder 7 cut by the mold pin 6 is bent, and at the same time, the molding die portion 4 of the cut molded body 2 is molded into an inverted U-shape. After that, the mold pin 6 is retracted as shown by the arrow in FIG.
Evacuate from inside.

Then, as shown in FIG.
Moves further down and stops below that electronic component 8
Solder 7 bent into an inverted U shape on the lead wire 10 of
It is inserted from the open part below it. Further, as shown in FIG. 4, the pair of caulking dies 12, 12 slightly ascend in synchronization with the ascent of the cut molded body 2 and approach each other, whereby both ends of the lead wire 7 are caulked. , Closed.

After that, the cut molded body 2, the mold pin 6, and the crimping dies 12, 12 are respectively returned to their original positions, and one lead wire 10 of the electronic component 8 is fed to the next electronic component 8.
The lead wire 10 is stopped immediately below the cut molded body 2. This completes one cycle of operation. Hereinafter, by repeating this, cutting and molding of the solder 7 and the lead wire 10
The steps of inserting into and caulking are sequentially repeated. FIG. 5 shows the electronic component 8 in which the linear solder 7 is attached to the lead wire 10 in this manner. The electronic component 8 is sent to the reflow furnace as it is, the solder 7 is reflowed, and the lead wire 10 and the component body 14 are soldered.

The constituent elements of the solder mounting apparatus according to the above embodiments are merely examples, and can be appropriately modified as long as they satisfy the essential requirements of the present invention. For example, the feed rollers 13, 13 for the solder 7 can be changed to a clamper type feed mechanism that moves linearly. In addition, the electronic component 8
Can be taped without fixing to a jig,
Further, it may be of a type in which each piece is individually supplied directly below the cut-molded body and held by a chuck or the like.

As described above, according to the present invention, since the linear solder can be surely attached to the lead wire of the electronic component, the lead wire can be used by using the linear solder without using the molten solder. It is possible to solder the wire to the component body. As a result, compared to the case of using molten solder, it is possible to perform soldering with a fixed amount of solder, the quality is stable, and highly reliable soldering is possible. Furthermore, since the solder can be soldered by reflowing the linear solder attached to the lead wire, it is also excellent in energy saving.

[Brief description of drawings]

FIG. 1 is a schematic front view (a) and a schematic side view (b) showing a state in which a step of cutting solder is performed by a solder mounting device for a lead wire of an electronic component which is an embodiment of the present invention.

FIG. 2 is a schematic front view (a) and a schematic side view (b) of a state in which a step of bending the solder into an inverted U shape is performed by the same device.

FIG. 3 is a schematic front view (a) and a schematic side view (b) showing a state of performing a step of inserting solder bent into an inverted U shape into a lead wire of an electronic component by the same device.

FIG. 4 is a schematic front view of a state in which a step of caulking both ends of the solder inserted in the lead wire of the electronic component is performed by the same device.

FIG. 5 is a perspective view showing an example of an electronic component in which a lead wire is soldered by the same device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 guide 2 cutting molded body 3 cutting guide 4 molding die part of cutting molded body 6 mold pin 7 solder 8 electronic component 10 electronic component lead wire 11 feeding roller for feeding electronic component 13 solder feeding roller

Claims (2)

[Reference number] 0040417-01 [Claims] 1. A method for mounting a lead wire of an electronic component by entwining a linear solder, the step of cutting the solder into a predetermined length, and the step of bending the cut solder along a mold pin into an inverted U shape. A step of inserting the solder bent into an inverted U shape in the radial direction of the lead wire of the electronic component from the open portion and hanging it, and a step of caulking both ends of the inverted U shape solder inside and closing A method of attaching solder to the lead wire of a characteristic electronic component. 2. A device for mounting a lead wire of an electronic component by entwining a linear solder, and a solder supply mechanism for intermittently feeding the solder along a guide in a longitudinal direction thereof at a predetermined cutting dimension, and forming the solder. While having a reverse U-shaped forming die part, the cutting formed body that reciprocates up and down along the end face of the guide that is orthogonal to the solder feeding direction, and is arranged orthogonal to the solder feeding direction, A mold pin that reciprocates between a position directly below the center of the mold part of the cut molded body and a position deviated therefrom, and an electronic component having a lead wire penetrating the component body, the lead wire being directly below the mold pin. And the component supply mechanism that supplies the electronic components so that the electronic components are sequentially stopped in parallel with the pin, facing both sides directly below the lead wires of the stopped electronic components, and approaching each other in synchronization with the rise of the cut molded body. A pair of caulking An apparatus for mounting solder on a lead wire of an electronic component, comprising: a mold.