JP3390843B2 - Solder piece forming and mounting machine - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder piece forming and mounting machine, and more particularly to a method for press-forming a rod-shaped or thread-shaped solder to form a solder piece. The present invention relates to a solder piece forming and mounting machine that is mounted at a predetermined mounting position. 2. Description of the Related Art As one of soldering methods, soldering using a solder piece is known. This is a method in which a solder piece formed in a predetermined shape is placed on a portion to be soldered, and soldering is performed by applying heat to the solder piece and melting it. [0003] Conventionally, a solder piece used in such a method is formed by crushing a solder bar with a roller or a press plate into a plate shape, and using the plate-shaped solder in a mold. And was formed into a predetermined shape. Then, such solder pieces are aligned by a parts feeder and mounted at a predetermined mounting position. [0004] Therefore, since a solder piece is punched out of a plate-like solder, the waste of the solder has been extremely increased. In addition, it has to be supplied to a predetermined position by a supply device such as a parts feeder, which causes difficulty in supplying the solder pieces. SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and provides a solder piece forming / mounting machine capable of reducing the waste of solder and facilitating supply to a mounting position. The purpose is to do so. SUMMARY OF THE INVENTION According to the present invention, there is provided an insertion hole into which a sectional shape of an inner space is substantially the same as that of a solder piece to be molded, and a rod-like or thread-like solder is inserted from a side. And a punch die which is slidably fitted into the die to form a solder piece by shearing and pressing a rod-shaped or thread-shaped solder inserted through the insertion hole. And a pick-up means for taking out a solder piece press-molded in the mold and mounting it at a predetermined position. A rod-shaped or thread-shaped solder is inserted into a space inside a mold through an insertion hole, and a rod-shaped or thread-shaped solder inserted through the insertion hole by a punch die slidable in the mold. Is sheared and pressed. Then, the press-formed solder piece is taken out of the mold by the pickup means, and is mounted at a predetermined position. FIGS. 1 and 2 show a solder piece forming and mounting machine according to an embodiment of the present invention as viewed from the front and side, respectively. This machine includes a frame 10, and an upper portion of the frame 10 is formed of a top plate 11. A cylinder 12 is provided on the lower surface of the top plate 11.
Is fixed. Piston rod 13 of cylinder 12
, A lifting plate 14 is fixed thereto, and the cylinder 12 moves up and down. A holding plate 16 is held on a lower surface of the lifting plate 14 via a mounting plate 15. A plurality of thin pin-shaped punches 17 are formed by the holding plate 16.
Are held so as to protrude downward. Holding plate 1
6, a guide plate 18 is arranged below the guide hole 1 thereof.
9 through which the punch 17 is inserted. The guide plate 18 is connected to the top plate 1 of the frame 10 by a rod 20.
1 supported. The rod 20 is guided by a guide hole 21 formed in the elevating plate 14. A rail 26 extending in the lateral direction in FIG. 2 is fixed on the bottom plate 25 of the frame 10. A moving frame 27 is supported movably on the rail 26. The moving frame 27 is fixed to a piston rod 29 of a cylinder 28.
At the right and left directions. A bracket 30 is attached to the right end of the bottom plate 25 in FIG. 2, and a stopper bolt 31 is screwed to the bracket 30. The stopper bolt 31 is for regulating the forward movement position of the moving frame 27, and the stopper bolt 31 is provided at the position shown in FIG.
7 is positioned. A cylinder 35 is mounted on a frame 27 movable by rails 26.
A support plate 37 is fixed to the piston rod 36 of the cylinder 35, and the support plate 37
8 are supported. An elevating plate 40 is fixed to the piston rod 39 of the cylinder 38. As shown in FIG. 1, a pair of rods 41 is fixed on the elevating plate 40 so as to stand upright. An elevating plate 42 is supported on the upper end of the rod 41. The elevating plate 42 supports the plurality of cylindrical pins 43 in an upright state. Note that the cylindrical pins 43 are each opposed to the punch 17. The pair of rods 41 are vertically slidably guided by guide holes 45 of a guide plate 44 fixed to the frame 27. A center pin 47 is fixed on the guide plate 44 via a mounting plate 46. The center pin 47 is slidably fitted inside the cylindrical pin 43. As shown in FIG. 1, the cylindrical pin 43 into which the center pin 47 is fitted is slidably fitted in a small hole 51 of a forming plate 50 constituting a mold. Further, a guide hole 52 is formed in the formed plate 50 so as to guide a rod 53 held by a holding plate 16 holding the punch 17. An insertion hole 55 formed of a horizontal hole is formed in the small hole 51 of the formed plate 50. Next, a mechanism for picking up a solder piece press-molded in the mold 50 and mounting it at a predetermined position will be described. A side bar 57 is disposed above the frame 10 so as to extend in the horizontal direction. Have been. A cylinder 58 extending horizontally is attached to the front side of the side bar 57. And this sidebar 57
A linear motor rail 60 is mounted on the back side of the motor, and a linear motor guide 61 is slidably guided by the linear motor rail 60. A slide plate 62 is fixed to the linear motor guide 61. The slide plate 62 is fixed to the cylinder 58 via a connecting plate 59. An elevating cylinder 63 is fixed to the slide plate 62. The rod 64 of the cylinder 63 is connected to an elevating plate 66 via a connecting plate 65. As shown in FIG. 1, a pair of left and right cylinders 67 are supported by the lift plate 66. The rod 68 of the cylinder 67 supports the slide guide 69 movably in the up-down direction. A mounting pin 70 is attached to the lower end of the connecting plate 66 so as to protrude downward, and the mounting pin 70 is slidably fitted to a slide guide 69. Next, the operation of the machine having the above configuration will be described. Lateral hole 55 of molded plate 50 constituting the mold
Then, the thread solder 72 is inserted (see FIG. 4). In this state, the frame 27 is advanced by the cylinder 28 along the rail 26 from the position shown in FIG. 2 to the position shown in FIG. The frame 27 is correctly positioned by the stopper bolt 31. Thereafter, the elevating plate 14 is lowered by the cylinder 12 shown in FIG. 3, and the rod 53 is guided by the guide holes 52 of the mold 50 and positioned on the elevating plate 14 via the mounting plate 15 and the holding plate 16 while positioning. As shown in FIG. 5, the supported punch 17 is inserted into the small hole 51 of the mold 50, and first, the thread solder 72 is sheared, and the punch 17 is further lowered. The solder piece 73 is formed by being sandwiched between the pin 43 and the center pin 47 (see FIG. 6). Thereafter, the lifting plate 14 is moved by the cylinder 12.
Rises, and the formed solder piece 73 remains in the small hole 51 of the mold 50 as shown in FIG. Next, the moving frame 2 is moved by the cylinder 28.
7 moves from the position shown in FIG. 3 to the position shown in FIG. 2 along the rail 26, and returns to the original position. When the frame 27 returns to the position shown in FIG. 2, the lifting plate 40 is raised by the cylinder 38. Then, the cylindrical pin 43 implanted on the upper surface of the elevating plate 42 supported by the elevating plate 40 via the rod 41 comes to be lifted, and the inside of the small hole 51 of the mold 50 becomes as shown in FIG. As shown, it moves upward, thereby causing the small hole 51 of the mold 50 to move.
The solder piece 73 inside is lifted. The center pin 47 slidably fitted to the cylindrical pin 43 is supported by a guide plate 44, and its position in the height direction is constant. A space is created inside the pin 43 and on the upper end side thereof. In this state, the slide plate 61 is moved rightward in FIG. 1 by the cylinder 58. The solder piece 73 to be picked up by the mounting pin 70
When the cylinder 63 is moved to a position above the position corresponding to
As a result, the mounting pin 70 attached to the lower end of the lifting plate 66 enters the small hole 51 of the mold 50 as shown in FIG.
3 will be inserted into the center. Thereafter, the support plate 37 is moved by the cylinder 35.
Is raised, and the cylindrical pin 43 is moved through the cylinder 38, the elevating plate 40, and the elevating plate 42, as shown in FIG.
The inside of the small hole 51 is further raised. Thereby, the solder piece 73 is pushed upward from the upper surface of the mold 50, and the mounting pin 70 is inserted deeper into the solder piece 73 as shown in FIG. 10, whereby the solder piece 73 is securely held. Thereafter, the lifting plate 66 is moved by the cylinder 63.
Is raised, and the solder piece 73 inserted into the mounting pin 70 moves upward as shown in FIG. At the same time, the support plate 37 is
And the elevating plate 40 descend. Therefore, the cylindrical pin 43 supported by the lift plate 42 supported by the lift plate 40 via the rod 41 is lowered. When the mounting pin 70 moves upward while holding the solder piece 73, the cylinder 58 moves leftward in FIG. 1 and returns to the position above the printed board 74 shown in FIG. After this, the lifting plate 6 is moved by the cylinder 63.
6, the mounting pins 70 are lowered with the solder pieces 73 inserted, and the mounting pins 70 are moved to positions just above the leads 76 of the electronic components 75 mounted on the printed circuit board 74. Thereafter, the slide guide 69 is lowered by the cylinder 67. Then, the slide guide 69 descends relatively to the mounting pin 70, detaches the solder piece 73 from the mounting pin 70, and inserts the solder piece 73 into the lead 76 of the electronic component 75 as shown in FIG. Become. Thereafter, the slide guide 69 is moved upward by the cylinder 67.
The mounting pin 70 again projects from the slide guide 69 as shown in FIG. Thereafter, the lifting plate 66 is raised by the cylinder 63, and the mounting pin 70 attached to the tip of the lifting plate 66 is also raised. Thus, the solder piece 73 is mounted on the lead 76 of the electronic component 75 on the printed circuit board 74. After this, light rays are irradiated from above without contact,
The solder piece 73 melts, so that the solder piece 73 solders the lead 76 of the electronic component 75. According to the above embodiment, the thread solder 72 is
Since the solder piece 73 is manufactured by press-forming in the small hole 51, no waste is generated in the solder. Further, since the press-formed solder piece 73 is mounted to a predetermined mounting position by the mounting pin 70, the solder piece 73 such as a parts feeder is used.
And the supply of the solder pieces 73 is facilitated. Further, since flux is mixed in the thread solder 72 in advance, it is not necessary to use flux when soldering using such a solder piece. Next, modifications of the above embodiment will be described with reference to FIGS.
It will be explained by. In this embodiment, as shown in FIG. 15, the lower pin is constituted by a pin 43 which is not hollow and is empty. The other configuration is almost the same as that of the first embodiment, and only the operation of the main part will be described. As shown in FIG. 15, the thread solder 72 is inserted into the small hole 51 of the mold 50 through the horizontal hole 55 of the mold 50.
Then, the punch 17 is lowered from above.
As shown in FIG. 16, the thread solder 72 inserted from the horizontal hole 55 is sheared, and then the thread solder 72 sheared by the punch 17 is press-formed to form a solder piece 73. The thread solder 72 is composed of the upper punch 17 and the lower pin 4.
3 and pressed flat. Thereafter, as shown in FIG. 18, the punch 17 is lifted up and detached from the small hole 51 of the mold 50. Then, as shown in FIG. 19, the lower pin 43 is raised, and the press-molded solder piece 73 is moved upward in the small hole 51 of the mold 50. In such a state, the suction chuck 80 is lowered from above as shown in FIG.
As shown in FIG. 21, the solder piece 73 is sucked and held by vacuum. Then, the solder piece 73 is attached to the vacuum chuck 80.
22 and 23, the cylindrical pin 43 is lowered in the small hole 51 of the mold 50 as shown in FIGS. Next, the suction chuck 80 is moved by the moving means.
Then, the solder piece 73 sucked is moved, and the solder piece 73 is mounted on the mounting position 81 formed by the concave portion shown in FIG. Thereafter, the vacuum of the suction chuck 80 is released, the solder piece 73 is released, and the suction chuck 80 is retracted upward as shown in FIG. As a result, the solder piece 73 press-molded in the mold 50 is mounted at the mounting position 81. In place of mounting the solder piece 73 sucked by the suction chuck 80 at the mounting position 81 as shown in FIG. 25, an electronic component 75 shown in FIGS. 26 and 27 is used.
May be mounted on the printed circuit board 74 on which is mounted. In this case, press forming is performed so that the solder piece 73 has a center hole for receiving the lead 76 of the electronic component 75. Then, the solder piece 73 is moved onto the printed board 74 by the suction chuck 80 and mounted on the lead 76 of the electronic component 75 projecting from the upper surface of the printed board 24 as shown in FIG. Thereafter, as shown in FIG. 27, the vacuum of the suction chuck 80 is released, and the mounting is completed by moving the suction chuck 80 upward. As described above, according to the present invention, a rod-shaped or thread-shaped solder is inserted into an insertion hole of a mold, and the rod-shaped or thread-shaped solder is sheared and pressed by a punch. In this method, a piece is formed, and a solder piece pressed and formed in a mold by a pickup means is taken out and mounted at a predetermined position. Therefore, according to this configuration, the solder piece can be press-formed using the solder without waste, and the parts feeder can be mounted at a predetermined mounting position with the press-formed solder piece. Can be easily mounted without using a supply device such as

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a front view of a solder piece forming and mounting machine. FIG. 2 is a side view of the solder piece forming and mounting machine. FIG. 3 is a side view of the solder piece forming and mounting machine in a state where a moving frame has moved. FIG. 4 is a longitudinal sectional view of a main part showing insertion of thread solder. FIG. 5 is a vertical sectional view of a main part showing shearing of thread solder. FIG. 6 is a longitudinal sectional view of a main part showing press forming of a solder piece. FIG. 7 is a vertical cross-sectional view of a main part showing the operation of lifting the punch. FIG. 8 is a vertical cross-sectional view of a main part showing a lifting operation of the solder piece. FIG. 9 is a longitudinal sectional view of a main part showing a chuck of a solder piece by a mounting pin. FIG. 10 is a vertical cross-sectional view of a main part showing a lifting operation of the solder piece. FIG. 11 is a vertical sectional view of a main part showing a lifting operation of the solder piece by the mounting pin. FIG. 12 is a vertical sectional view of a main part showing a transfer operation of a solder piece. FIG. 13 is a vertical sectional view of a main part showing detachment of a solder piece from a mounting pin. FIG. 14 is a longitudinal sectional view of a main part in a state where mounting is completed. FIG. 15 is a vertical sectional view of a main part showing insertion of a solder piece in a device of a modified example. FIG. 16 is a longitudinal sectional view of a main part showing shearing of a solder piece. FIG. 17 is a longitudinal sectional view of a main part showing press forming of a solder piece. FIG. 18 is a vertical cross-sectional view of a main part showing the operation of lifting the punch. FIG. 19 is a vertical cross-sectional view of a main part showing a lifting operation of the solder piece. FIG. 20 is a vertical sectional view of a main part showing a lowering operation of the suction chuck. FIG. 21 is a vertical cross-sectional view of a main part showing a lifting operation of the suction chuck. FIG. 22 is a vertical sectional view of a main part showing a suction and a lifting operation of a solder piece. FIG. 23 is a vertical cross-sectional view of a main part showing a lifting operation by a suction chuck. FIG. 24 is a vertical sectional view of a main part showing a mounting operation. FIG. 25 is an essential part longitudinal cross sectional view showing the operation of completing suction and retracting the suction chuck. FIG. 26 is a vertical sectional view of a main part showing a mounting operation by a suction chuck. FIG. 27 is an essential part longitudinal cross sectional view showing the operation of retracting the suction chuck after the attachment is completed. DESCRIPTION OF SYMBOLS 10 Frame 11 Top plate 12 Cylinder 13 Piston rod 14 Lifting plate 15 Mounting plate 16 Holding plate 17 Punch 18 Guide plate 19 Guide hole 20 Rod 21 Guide hole 25 Bottom plate 26 Rail 27 Moving frame 28 Cylinder 29 Piston rod 30 Bracket 31 Stopper bolt 35 Cylinder 36 Piston rod 37 Support plate 38 Cylinder 39 Piston rod 40 Elevating plate 41 Rod 42 Elevating plate 43 Tubular pin 44 Guide plate 45 Guide hole 46 Mounting plate 47 Center pin 50 Molding plate (die) 51 Small Hole 52 Guide hole 53 Rod 55 Insertion hole (horizontal hole) 57 Sidebar 58 Cylinder 59 Connecting plate 60 Linear motor rail 61 Linear motor guide 62 Slide plate 63 Elevating cylinder 64 Rod 65 Connecting plate 66 Elevating plate 67 Cylinder 68 Rod 6 9 Slide guide 70 Mounting pin 72 Thread solder 73 Solder piece 74 Printed circuit board 75 Electronic component 76 Lead 80 Suction chuck 81 Mounting position (recess)

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Claims (1)

(57) [Claims 1] A cross-sectional shape of an inner space is substantially the same as that of a molded solder piece, and an insertion hole for inserting a rod-shaped or thread-shaped solder from the side is formed. A mold that has been sheared and soldered into a rod-shaped or thread-shaped solder inserted through the insertion hole, and a punch mold slidably fitted in the mold to form a solder piece; Pick-up means for taking out the solder piece press-molded in the mold and mounting it at a predetermined position.