JPH0616364Y2 - High precision movement stage device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial field of application) The present invention relates to a high-precision moving stage device for placing a material to be processed in, for example, a reticle defect inspection device or a size measuring device. .

(Prior Art) Generally, a reticle defect inspecting apparatus or a dimension measuring apparatus or other related apparatus for manufacturing a semiconductor device, which is used to place a processing object such as a semiconductor wafer, a mask, or a reticle on a stage for processing. When handling different sizes of wafers, masks, reticles, or wafers and masks, reticles in the same device, hold them in their respective holders for the workpieces (hereinafter, simply referred to as dedicated holders) and then fix Many of them are mounted and fixed together with a dedicated holder on the stage.

Further, in such an apparatus, as shown in FIG. 3, an apparatus that needs to adjust the rotational position of a material to be processed such as a wafer placed on a stage together with a dedicated holder is usually X-
A theta stage 3 that is rotatable in the horizontal direction in the θ direction is installed on a stage 2 that is movable in the X-Y axis direction, to which a plane L-shaped laser mirror 1 for position measurement in the Y axis direction is attached. A dedicated holder 4 on which a workpiece W such as a wafer is mounted and fixed is positioned and fixed on the theta stage 3 for processing. The theta stage 3 is configured to be rotationally controlled along the theta guide 5 by the theta drive mechanism section 6.

(Problems to be Solved by the Invention) As described above, in the conventional device, the laser mirror 1, X
・ Y stage 2, theta stage 3, theta guide 5, and theta drive mechanism section 6 are all integrated,
During processing, after the workpiece W such as a wafer is placed and fixed on the dedicated holder 4, the dedicated holder 4 is automatically or manually positioned and fixed on the theta stage 3 to perform processing on the workpiece W. There is a problem that not only the stage structure becomes complicated and the cost is increased, but also the precision of processing of the apparatus is lowered. The present invention has been made in view of the above circumstances, and its purpose is to simplify the stage structure and to greatly improve the accuracy of the apparatus to be processed. To provide a device.

[Structure of the Invention] (Means for Solving the Problems) In order to solve the above-mentioned problems, the present invention provides a dedicated processing target on a stage according to the type and size of the processing target material. In a high-precision moving stage device in which a material to be processed is exclusively placed via a holder for material, the holder is detachably formed on the holder placed on the stage. A guide member provided on the stage for imparting a rotation center, and a holding member that is also placed on the stage and is engaged with the guide member, faces the guide member, and holds the holding member. And a rotation drive mechanism portion provided on the stage for rotating the holder about the guide member.

(Operation) That is, according to the present invention, with the above configuration,
Since the theta stage becomes unnecessary, the stage structure can be simplified, so that the processing accuracy of the apparatus can be greatly improved and the cost can be reduced.

(Embodiment) An embodiment of the present invention will be described in detail below with reference to the drawings shown in FIGS. 1 and 2. In the illustrated embodiment according to the present invention, the same parts as those of the conventional device shown in FIG.

That is, the high-precision moving stage device according to the present invention, as shown in FIGS. 1 and 2, has a guide member 7 with which a dedicated holder 4 provided on the stage 2 engages, and a theta drive mechanism in a conventional device. 1 is provided with an auxiliary drive mechanism section 8 for moving the section 6 up and down freely so that the dedicated holder 4 engages with the guide member 7 when placed on the stage 2, While being rotatable about the member 7, the auxiliary drive mechanism section 8 moves the theta drive mechanism section 6 upward in FIG.
The engaging portion 62 moved by the feed screw 61 of the theta driving mechanism portion 6 is engaged with the locking portion 41 of the dedicated holder 4 placed on the stage 2, whereby the theta driving mechanism portion 6 is engaged. Drive the dedicated holder 4 to the guide member 7
The rotational position of the dedicated holder 4 can be adjusted by rotationally driving the holder. Also, 6 in the figure
Reference numerals 3 and 64 denote a reference roller and a pressing roller provided on the engaging portion 62 of the theta drive mechanism portion 6, and these roller 6
The locking portion 41 of the dedicated holder 4 can be engaged between the portions 3 and 64.

Therefore, according to the above configuration, when the dedicated holder 4 that is exchanged according to the type or size of the workpiece W is placed on the stage 2, one side of the dedicated holder 4 is engaged with the guide member 7. In this state, the auxiliary drive mechanism section 8 is driven to raise the theta drive mechanism section 6 in this state so that the engagement section 62 of the theta drive mechanism section 6 is engaged with the locking section 41 of the dedicated holder 4. Next, using an alignment mark or the like (not shown) provided on the material W to be processed, the inclination of the material W to be processed with respect to the XY laser mirror 1 is measured to calculate a necessary rotational position adjustment amount, and then theta drive is performed. By rotating the feed screw 61 of the mechanism section 6, the dedicated holder 4 is moved in the left-right direction with the guide member 7 as the center of rotation, and the rotational position is adjusted. At this time, attach the dedicated holder 4 to the stage 2
The later-described clamping mechanism portion for clamping is in a released state during rotation of the dedicated holder 4, and can clamp the dedicated holder 4 after adjusting the rotational position.

The theta drive mechanism section 6 is adapted to be moved downward in FIG. 1 by the auxiliary drive mechanism section 8 after the rotational position is adjusted so as to be disengaged from the engaged state with the dedicated holder 4. Engagement portion 62 of theta drive mechanism portion 6
No mechanical contact is made between the reference roller 63 and the pressing roller 64 provided in the above, the influence of heat from the theta drive mechanism section 6 and its feed screw 61 is eliminated, or residual stress of the driving force causes the dedicated holder 4 Is prevented from being minutely rotated.

Therefore, with the above-described configuration, the portion corresponding to the theta stage as in the conventional case is eliminated, and there is no error factor due to thermal deformation, vibration, displacement of the clamp portion, etc. due to the use of the theta stage, The processing accuracy can be improved and the cost can be reduced.

When the dedicated holder 4 is rotated, the vacuum sluice valve 21 of the clamp mechanism 20 is closed and the air sluice valve 22 is opened, as shown in FIG.
3 and connect from the vacuum chuck and air outlet 24,
A compressed gas of air is blown out between the coupling surfaces between the dedicated holder 4 and the stage 2 to reduce the coefficient of friction between the dedicated holder 4 and the stage 2. on the other hand,
On the contrary, when clamping after rotating position adjustment, the vacuum gate valve 21
Is opened to close the air sluice valve 22, thereby connecting with the vacuum source 25, and the vacuum chuck and air outlet 24
Is evacuated and the space between the dedicated holder 4 and the stage 2 can be suction-clamped.

In the above embodiment, the vacuum chuck was used to clamp between the dedicated holder 4 and the stage 2.
If this part is used as a mechanical friction clamp, or if it is received by a roller to reduce friction during rotation, or if a piezo motor is used as the driving force for adjusting the rotational position, the rotation must be adjusted in the vacuum chamber. It can be applied to an electron beam drawing apparatus and the like.

It should be noted that the present invention is not limited to the above-described embodiments, and it goes without saying that various modifications can be made without departing from the spirit of the present invention.

[Effects of the Invention] As is clear from the above description, according to the present invention, a dedicated holder for a material to be processed is provided on the stage according to the type and size of the material to be processed. In a high-precision moving stage device in which a material to be processed is placed on the stage, the holder placed on the stage is formed to be detachable from the stage so as to give the holder a center of rotation on the stage. And a guide member provided on the stage, facing the guide member via the holding tool that is also placed on the stage and engaged with the guide member, and is formed to be detachable from the holding tool. The rotary drive mechanism section is provided on the stage to rotate the holder about the guide member.

Therefore, the rotation angle position can be positioned without using the theta stage for positioning the rotation angle position as in the prior art, and the stage structure can be simplified, thereby significantly improving the processing accuracy of the device. Thus, it is possible to provide a high-precision moving stage device having an excellent effect that the cost can be reduced.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of a high-precision moving stage device according to the present invention, FIG. 2 is a sectional view showing the same stage movement control state, and FIG. 3 is a plan view showing a conventional high-precision moving stage device. It is a figure. 1 ... Laser mirror, 2 ... Stage, 4 ... Processing material holder (dedicated holder), 41 ... Locking part, 6 ... Rotation drive mechanism part (theta drive mechanism part), 62 ... Joint part, 8 ... Auxiliary drive mechanism part, 20 ... Clamping mechanism part, W ... Material to be processed.

Claims (3)

[Scope of utility model registration request] 1. A high-precision moving stage apparatus in which a material to be processed is exclusively placed on a stage via a dedicated holder for the material to be processed according to the type and size of the material to be processed. A guide member that is detachably formed on the holding tool placed on the stage and is provided on the stage to give the holding tool a center of rotation on the stage, and is also placed on the stage. The stage is formed so as to face the guide member via the holder engaged with the guide member and be detachable from the holder, and to rotate the holder about the guide member. A high-precision moving stage device comprising: a rotation drive mechanism portion provided on the above. 2. A high precision moving stage apparatus according to claim 1, wherein the stage has means for fixing the holder on the stage. 3. A high precision moving stage apparatus according to claim 2, wherein the stage has a vacuum chuck and an air outlet on the upper surface thereof.