JPH06163552A - Method and equipment for transferring bump - Google Patents

Abstract

PURPOSE:To provide means for allowing transfer of bumps to various types of chip having different number of chips arranged differently. CONSTITUTION:An expanding/shrinking sheet 12 is employed as a carrier for forming a bump 2. The sheet 12 is then pressed by means of a presser 26 while moving a chip 3 horizontally with respect to the sheet 12 thus bonding the bump 2 formed on the rear surface of the sheet 12 to an electrode on the chip 3 while expanding the sheet 12. When the bump 2 is transferred to a different type of chip 3 having different number of electrodes arranged differently, relative moving stroke is regulated between the chip 2 and the sheet 12 thus allowing transfer of bump to different types of chip.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bump transferring apparatus and a transferring method, and more particularly to a bump transferring apparatus and a transferring method for transferring a bump formed on a surface of a carrier to an electrode of an electronic component. It is a thing.

[0002]

2. Description of the Related Art A flip chip is known in which bumps (protruding electrodes) are provided on electrodes of a chip such as an IC. 7 and 8 show a conventional bump transfer device for forming bumps on electrodes of a chip. Bumps 2 are formed on the upper surface of the plate-shaped carrier 1. In FIG. 7, reference numeral 3 denotes a chip, which is held by vacuum suction on a collet type nozzle 4. This is the electrode 5 of the chip 3.
After aligning the bump 2 with the bump 2, the chip 3 is lowered to press the electrode 5 against the bump 2 (see the chain line in the figure), and then the chip 3 is raised to collectively transfer the bump 2 to the chip 3. (See Figure 8).

[0003]

There are various types of chips 3, and the number and arrangement of the electrodes 5 differ depending on the types of chips 3. Therefore, in the above-mentioned conventional means, a predetermined number of bumps 2 have to be formed on the upper surface of the carrier 1 in a predetermined arrangement according to the type of the chip 3, and the manufacture of the carrier 1 is simply troublesome and the cost is increased. Not only that, there is a problem that handling and management of the carrier 1 is very troublesome.
Moreover, only the bumps of several chips can be formed on the upper surface of the carrier 1, which also causes an increase in cost.

Therefore, an object of the present invention is to provide a bump transfer device and a transfer method capable of easily forming bumps on various types of chips.

[0005]

To this end, according to the present invention, a carrier on which bumps are formed is a sheet having elastic elasticity, and a moving means for moving the chip in a horizontal direction relative to the sheet. A presser, which is provided above the sheet and presses the sheet while elastically expanding it to bond the bump to the electrode of the chip, and a vertically moving means for moving the presser up and down.

[0006]

In the above structure, the bumps are bonded to the electrodes of the chip and transferred while pressing the pressing element against the sheet and extending the sheet. In this case, the relative movement stroke of the chip with respect to the sheet is adjusted. As a result, the bump and the electrode can be transferred so as to face each other, so that the type of chip can be changed by adjusting the movement stroke.

[0007]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 is an overall perspective view of a bump transfer device, and FIG. 2 is a front view. In FIG. 1, a back plate 9 is erected on a base 8, and a supply reel 11 is pivotally supported on the back plate 9. This supply reel 11
A tape-shaped sheet 12 and an interlayer paper 13 are wound around the sheet. Below the supply reel 11, a take-up reel 14 for winding the interlayer paper 13 is provided. A take-up reel 15 that winds the sheet 12 is provided on the side of the supply reel 11. M1 and M2 are motors for rotating the take-up reels 14 and 15, and 16 and 17 are guide rollers for guiding the sheet 12. Sheet 12 is guide roller 1
It is fed horizontally between 6 and the guide roller 17.

The sheet 12 is formed of a stretchable synthetic resin film having elasticity. Below the seat 12, a first X table 21 and a first Y table 22 are provided.
Is provided. A heat block 23 is provided on the first X table 21. This heat block 2
3 heats the chip 3 placed on the bump 3 in order to improve the bondability of the bump. As shown in FIG. 3, the heat block 23 has suction holes 23a for vacuum suction and fixing of the chips 3. A plurality of bumps 2 are formed on the lower surface of the sheet 12 at a predetermined pitch. When the motors MX1 and MY1 are driven, the chip 3 placed on the heat block 23 horizontally moves in the X direction and the Y direction.

In FIG. 1, reference numeral 24 is a drive unit, which is mounted on an XY table (not shown). From the drive unit 24, a horn 25 extends upward from the X table 21. A rod-shaped pusher 26 is held at the tip of the horn 25. The horn 25 is moved in the vertical and horizontal directions (X direction, Y direction) by driving the device incorporated in the drive unit 24, and the presser 26 is moved vertically or horizontally. Also horn 2
5 vibrates ultrasonically. The drive unit 24 and the horn 25 are
The wire bonder is a publicly known one similar to the wire bonder, and a detailed description of its structure is omitted.

As shown in FIG. 2, a first camera 28 is provided below the traveling path of the sheet 12, and the first camera 28 is provided.
The camera 28 observes the bumps 2 attached to the lower surface of the sheet 12 to detect their positions, and also inspects the presence or absence of the bumps 2 and the shape. As shown in FIG. 1, a second camera 29 is provided above the X table 21, and the camera 29 observes the electrode of the chip 3 on the heat block 23 to detect its position. These two cameras 2
By driving the first X table 21 and the first Y table 22 based on the observation results of 8 and 29 to move the chip 3 on the heat block 23 in the X direction and the Y direction,
The bumps 2 on the sheet 12 side and the electrodes of the chip 3 are aligned with each other.

In FIG. 1, 31 is a second X table,
Reference numeral 32 denotes a second Y table, and a pickup head 34 having a nozzle 33 for vacuum-sucking the chip 3 is held at the tip of the Y table 32. Motor MX
2, when MY2 is driven, the pickup head 34 moves to X
The chip 3 provided on the tray 35 is vacuum-sucked by the nozzle 33 and picked up, and mounted on the heat block 23. Also, as described below,
Chip 3 on heat block 23 to which bump 2 is transferred
Are collected in the tray 35. 36 is a table on which the tray 35 is placed. The bump transfer device has the above-described structure, and its operation will be described below.

In FIG. 1, the chip 3 on the tray 35 is transferred onto the heat block 23 by the pickup head 34, and a suction means (not shown) is driven to fix the chip 3 onto the heat block 23. Next, as shown in FIG. 3, the bumps 2 a on the lower surface of the sheet 12 led out from the supply reel 11 are positioned directly below the pressing element 26. Further, the first X table 21 and the first Y table 22 are driven to position the electrode 5a of the chip 3 directly under the bump 2a. Next, by swinging the horn 25 downward, the pressing element 26 is pressed against the sheet 12 as shown in FIG. 4, and while the sheet 12 is elastically extended, the bump 2a is pressed against the electrode 5a.
Press to transfer. At this time, the presser 26 vibrates ultrasonically and the chip 3 is heated by the heat block 23, so that the bump 2a is transferred onto the electrode 5a without difficulty.

Next, the pusher 26 rises and returns to its original height. Next, by winding the sheet 12 on the take-up reel 15 by one pitch t of the bumps 2, the next bump 2b is moved to a position directly below the pressing element 26 in FIG.
The first X table 21 and the first Y table 22 are driven to move the next electrode 5b directly below the bump 2b, the bump 2b and the electrode 5b are opposed to each other, and the above operation is repeated to form the bump 2b. Transfer to the electrode 5b.

In this way, the bumps 2 are formed on all the electrodes 5.
When the chip 3 is transferred, the first X table 21 and the second Y table 22 are driven to move the chip 3 away from directly below the sheet 12, and then the chip 3 is picked up.
Vacuum suction to the nozzle 33 of the
The table 31 and the second Y table 32 are driven to move the transfer head 34 above the tray 35, and the chips 3 are collected in the tray 35. By repeating the above operation for all the chips 3 in the tray 35, all the operations are completed. According to this transfer device, even if the number and arrangement of the electrodes 5 are changed by changing the type of the chip 3, the first X
This can be dealt with by adjusting the movement strokes of the table 21 and the first Y table 22.

5 and 6 show a second embodiment of the present invention. In this structure, the bumps 2 are formed in a matrix on the lower surface of a sheet 41 which is held by a holder 42 and has elastic properties. This holder 42 is a bracket 4
The sheet 4 is held by the X table 44 and the Y table 45 via the sheet No. 3 and the motors MX3 and MY3 are driven.
1 moves in the X and Y directions. Therefore, also in this case, the bump 2 and the electrode 5 are opposed to each other and the sheet 4 is attached by the pressing element 26 in exactly the same manner as in the case shown in FIGS. 3 and 4.
The bump 2 is transferred to the electrode 5 while pressing 1 to extend it. Such transfer of the bump 2 is performed by the X table 21,
44 and the Y tables 22 and 45 are driven to move the chip 3 and the sheet 41 in the X and Y directions,
The bumps 2 and the electrodes 5 of the chips 3 are aligned with each other, and when the bumps 2 are transferred to all the electrodes 5, the chips 3 are collected in the tray 35. Of course, also in this case, the bumps 2 and the electrodes 5 are observed by the cameras 28 and 29, and their positions are aligned.

The present invention allows various design changes,
For example, in the first embodiment, the bumps 2 may be formed on the lower surface of the tape 12 in two or more rows, and in the second embodiment, if the pressing element 26 can be moved in the X direction and the Y direction, the sheet 41 is formed. May be fixed, and in short, the sheet and the chip may be horizontally moved relative to each other so that the bump of the sheet and the electrode of the chip can be aligned with each other.

[0018]

As described above, according to the present invention, the bump and the electrode can be opposed to each other and transferred by adjusting the relative stroke of movement of the chip with respect to the sheet. Even if the number or arrangement of electrodes changes, bumps can be transferred correspondingly without changing the sheet. Further, since a large number of bumps can be formed at high density on the sheet regardless of the number and arrangement of the chip electrodes, the bump manufacturing cost can be reduced.

[Brief description of drawings]

FIG. 1 is an overall perspective view of a bump transfer device according to an embodiment of the present invention.

FIG. 2 is a front view of a bump transfer device according to an embodiment of the present invention.

FIG. 3 is a front view of a main part of a bump transfer device according to an embodiment of the present invention.

FIG. 4 is a front view of a main part of a bump transfer device according to an embodiment of the present invention.

FIG. 5 is a perspective view of a main part of a bump transfer device according to another embodiment of the present invention.

FIG. 6 is a front view of a main portion of a bump transfer device according to another embodiment of the present invention.

FIG. 7 is a front view of a main part of a conventional bump transfer device.

FIG. 8 is a front view of a main part of a conventional bump transfer device.

[Explanation of symbols]

 2 bumps 3 chips 5 electrodes 12 sheets 21 X table 22 Y table 24 drive unit 25 horn 26 pusher 41 sheet 44 X table 45 Y table

Claims (2)

[Claims] 1. A bump transfer apparatus for transferring a bump formed on a surface of a carrier to an electrode of a chip, wherein the carrier is a sheet having elastic elasticity, and the chip is arranged relative to the sheet. Moving means for moving the sheet in the horizontal direction, a pusher provided above the sheet to push the sheet while elastically extending the sheet to transfer the bumps to the electrodes of the chip, and move the pusher up and down. A bump transfer device comprising a vertical movement unit. 2. A bump transfer method for transferring a bump formed on a surface of a carrier formed of a stretchable elastic sheet to a chip electrode, wherein the chip is relative to the sheet. The step of horizontally moving the chip to align the electrodes of the chip with the bumps, driving the vertical movement means to lower the pressing element, pressing the pressing element against the sheet to extend the sheet, A bump transfer method comprising: a step of transferring to the electrode; and a step of driving the up-and-down moving means to raise the pressing element.