JPH0615719B2 - Method for manufacturing metal body having through pattern formed on curved surface - Google Patents

Description

TECHNICAL FIELD The present invention relates to a method for producing a curved metal body having a penetrating pattern used for an anode or a grid of an electron tube.

<Prior Art> Conventionally, a metal curved surface body having a penetrating pattern used for an anode or a grid of an electron tube has been manufactured by the following manufacturing method using, for example, a metal molybdenum plate as a material.

That is, a molybdenum plate is coated with a photoresist, several tens of lines extending radially from the center, and several negatives or positives on which a ring-shaped pattern supporting the lines is formed are used for contact exposure and development, followed by etching. Then, a predetermined penetrating pattern was formed and the resist was peeled off, and thereafter, a molding process was carried out so that the central portion was extruded into a dome shape of several mm to finish the product.

<Problems to be Solved by the Invention> The conventional manufacturing method as described above has the following problems.

First, after etching, when the center part is extruded by 2 mm, the width of the line extending radially from the center is 100 μm.
In the case of a thin wire as described below, it has a drawback that molybdenum is insufficiently stretched and cut off. Therefore, 2 mm
In the case of performing the above-mentioned extrusion processing, a line width of 100 μ or more is necessary, and when it is 100 μ or less, only the extrusion processing of about 1 mm can be performed. This is a constraint in designing the structure of the electron tube, and there are many disadvantages.

<Means for Solving the Problem> The object of the present invention is to improve the above-mentioned drawbacks. When the central portion is required to have an extrusion amount of 2 mm or more, the width of the line extending radially from the center as the through pattern is 100 μm or less. However, it is to provide a method for manufacturing a curved metal body which is possible.

That is, the present invention is, in part, to coat a photosensitive resist on a metal plate, then cover with a protective film, and form a latent image by performing pattern exposure on the photosensitive resist using a positive or negative mask. Molding into a predetermined curved surface shape, peeling off the protective film, and performing a development treatment to form a patterned resist, which forms a through pattern by an etching method. It is a manufacturing method.

However, the constitution of the present invention is not limited to the one in which the protective film is coated after coating the photosensitive resist as described above, and the photosensitive resist coated on the metal plate is used as the timing of coating the protective film. It is also possible to form a latent image by performing pattern exposure on the.

(Function) In the present invention, the protective film is coated on the photosensitive resist coated on the metal plate or on the latent image-formed photosensitive resist. Since a protective film is laminated on,
The compatibility between the resist layer and the protective film is good, and the resist film is not damaged during the subsequent molding step.

The contents of the present invention will be described in the order of manufacture. First, a molybdenum plate is coated with a photoresist on one side or both sides by means such as roll coating, spraying, dipping or spinner coating. At this time, the photoresist used may be either a negative type represented by a cyclized rubber type or a positive type represented by a quinonediazide type. After the resist is dried, a protective film is attached to one side or both sides. The protective film used here has excellent optical transparency as long as it is coated on a resist coated on a metal plate. Polyethylene-based, polyester-based, polyurethane-based materials are acrylic-based on one side, An adhesive such as a urethane type is applied.

On the other hand, when the resist film is patterned and exposed to form a latent image, the protective film need not be transparent. A negative or positive corresponding to the type of resist is prepared, and exposure is performed by closely contacting one side or both sides of the resist-coated molybdenum. When pattern exposure is performed through a transparent protective film as in the former invention, the exposure light beam tends to be slightly diffused,
When the mask is directly adhered to the photosensitive resist for exposure as in the latter invention, there is no such tendency. After exposure, with the protective film covered, after processing by a means such as extrusion processing, pressing processing or drawing processing into a hemispherical shape with a protrusion amount of 2 mm or more, a dome shape, a convex shape, etc., Remove the protective film by peeling method. Thereafter, the development work is performed to complete the patterning of the resist. This pattern has a line width extending radially from the center of 100 μm or less. The metal plate having a three-dimensional curved surface processed as described above is etched by a chemical or electrochemical means to form a predetermined penetrating pattern. After etching is completed,
The resist film is removed with a specified chemical, washed thoroughly with water, dried, and finished as a product. Examples of the present invention will be described below.

Example 1 A molybdenum plate having a thickness of 50 μ was coated with a cyclized rubber negative resist Way coat SC (trade name, manufactured by Fuji Hunt Electronics Technology Co., Ltd.) on one side by a spinner coating method. After drying, a polyester-based protective film having optical transparency, Nitto Neomask (trade name, manufactured by Nitto Denko Corporation) was attached to the resist surface. Thereafter, a negative film having 30 lines radially extending from a center having a width of 90 μm and two ring-shaped patterns having the same line width supporting the lines was prepared and exposed from one side by a contact exposure method. (Ultra-high pressure mercury lamp 365 nm) After that, processing was performed by a drawing method so that the center was extruded by 2.5 mm. After that, the protective film was peeled off and the unexposed area was removed with xylene to complete the development. Tape the back side and use ferric nitrate 9-hydrate aqueous solution (concentration 2.5 kg /
1) was used to perform one-sided etching under the conditions of a spray pressure of 2.0 kg / cm ² and a liquid temperature of 40 ° C., and a predetermined penetrating pattern could be obtained by the treatment for 5 minutes.

After the tape was peeled off, the resist was peeled off with concentrated sulfuric acid, and the product was thoroughly washed with water and dried to complete the product.

The maximum pattern width of molybdenum after etching was 60μ, and it was possible to obtain fine lines that could not be obtained by the conventional method.

Example 2 A molybdenum plate having a thickness of 100 μm was coated on both surfaces by a dipping method using a quinonediazide positive resist AZ-1350 (trade name, manufactured by Hoechst Co., Ltd.). After drying
Polyethylene-based protective film Hitalex T-910
(Hitachi Chemical Co., Ltd.) was pasted on both sides. Prepare a positive mask with 40 lines extending radially from the center with a width of 75μ and two ring-shaped patterns with the same line width to support it, and form a latent image by exposing from both sides by the contact exposure method. did. (Exposure amount 30 to 30 mJ / cm ² After that, polyethylene protective film Hitalex T-910 (Hitachi Chemical
(Trade name, manufactured by Co., Ltd.) was pasted on both sides, and then processed by a drawing method such that the center was extruded by 2.0 mm.

After the protective film was peeled off, the portion exposed and decomposed with an alkaline AZ developer was removed. After that, double-sided etching was performed by an electrochemical method (electrolytic etching method). The conditions were as follows: Chromic anhydride 70 g /, concentrated sulfuric acid 300 ml /, an object to be treated as an anode, a lead plate as a cathode, and a voltage of 4.5 V was applied for 10 minutes to obtain a predetermined opening pattern. Then, the resist was peeled off with acetone, and the product was sufficiently washed with water and dried to complete the product. The maximum pattern width of molybdenum after etching was 50 μm, and it was possible to obtain a fine line without any disconnection that was generated by the conventional method.

<Effects of the Invention> As described above, according to the manufacturing method of the present invention, since the molding is performed in the state where the protective film is coated on the unpatterned resist film before development, the photosensitive resist is molded. Sometimes, the resist film is developed and etched after the molding process without damaging it. By doing so, the pattern width of the grid or electrode plate used in the electron tube can be made smaller or the molybdenum pattern with a larger extrusion amount can be obtained. Curved bodies can now be easily obtained.

This means that when designing the structure of an electron tube, the idea with more freedom than before has a great effect on the industry.

Claims (2)

[Claims] 1. A metal plate is coated with a photosensitive resist, which is then covered with a protective film, and the photosensitive resist is subjected to pattern exposure using a positive or negative mask to form a latent image. A method for producing a metal body having a through pattern on a curved surface, which comprises forming into a patterned resist by performing a molding process, peeling off the protective film, and performing a development treatment, and forming a through pattern by an etching method. 2. A metal plate is coated with a photosensitive resist,
The photosensitive resist is subjected to pattern exposure through a positive or negative mask to form a latent image, and then a protective film is covered and molded into a predetermined curved shape, the protective film is peeled off, and development processing is performed. A patterned resist is thus formed, and a through pattern is formed by an etching method, which is a method for producing a metal body having a through pattern on a curved surface.