JPH06155973A - Manufacture of optical card - Google Patents

Abstract

PURPOSE:To provide a method for manufacture of a low cost optical card by using a high priced optical recording material usefully. CONSTITUTION:In a method for manufacture of an optical card, a duplicated light permissible base material 101 having a peeling film wherein a required transfer peeling layer is provided on its rear surface from a roughened surface original plate 15 via a mother mask 23 is formed by using the roughened surface original plate 15 wherein a pattern of an optical recording material part unit 104 is minutely arranged. Then, an optical recording material layer 102 is formed on the roughened surface. Each optical recording material part unit is arranged at a specific position of an optical card base material 106 by a thermal transfer system or a pressure-sensitive transfer system on the optical recording material layer 102 side via an adhesive layer 108. After peeling the peeling film off, further a surface-hardened layer 111 is provided onto the transfer peeling layer side via an adhesive layer 109, which is punched by an optical card unit thereafter.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing an optical card which provides an inexpensive optical card by a simple method.

[0002]

2. Description of the Related Art Conventionally, as a card type recording medium, an optical card having a storage capacity exceeding that of a magnetic card or an IC card is known. The optical card recording method is R
There are an OM type, a write-once type, and an erasable type, and a recording medium and a structure are being examined for each. Among these, for example, in the case of the write-once type, the inorganic thin film type and the organic dye type are the mainstream, but the inorganic thin film type is often used from the viewpoint of weather resistance and stability. However, even in such a material system, if the optical recording medium is exposed to the outside due to its structure, there is a risk of deterioration of characteristics when it is attacked by chemicals or the like. For this reason, the surface of the optical recording medium is covered with a transparent protective layer, and the optical recording material portion is arranged in an island shape in the card in view of the specifications and design of the optical card. As an example of such a card,
No. 22299 is cited.

FIG. 2 shows an example of a conventional recording medium forming process for an optical card. The inorganic thin film type optical recording medium is usually prepared by a vacuum thin film forming apparatus. In this case, a metal or film having an opening of a required size is formed on a substrate having a size larger than the card size. A masking process is performed with (A) or the like to form the optical recording medium in the island shape. In the figure, the dotted line indicates the size of the optical card (B). As described above, the recording medium is formed only on a part of the light-transmitting base material, and the material attached to the metal mask is wasted completely (C). The width is 8.5 cm, the opening length is 1.6 cm, and the width is 8.4.
In the case of cm, only 4 cards could be produced from a 20 cm ² square substrate (D). With such a manufacturing method, the use efficiency of the expensive optical recording material is poor, and the cost of the optical card cannot be reduced.

[0004]

SUMMARY OF THE INVENTION An inexpensive card is provided by using an expensive optical recording material without waste.

[0005]

According to the present invention, in a method for manufacturing an optical card, a roughened original plate 15 in which a pattern of an optical recording material unit 104 is finely arranged is used. Through the mother mask 23, a duplicated light-transmissive substrate 101 having a peeling film 100a provided with a transfer peeling layer 100b on the back surface when necessary is formed, and the optical recording material layer 102 is formed on the roughened surface thereof. To form the optical recording material layer 10
After the peeling film 100a is peeled off by arranging it in a predetermined position of the optical card substrate 106 by a thermal transfer system or a pressure-sensitive transfer system for each optical recording material unit through the adhesive layer 108 on the second side. A method of manufacturing an optical card is characterized in that after the surface hardened layer 111 is provided on the transfer peeling layer 100b side via an adhesive layer 109, the surface hardened layer 111 is punched out in optical card units. The transfer peeling layer 100b can be omitted if the peeling film 100a itself has peeling property. Peeling film 100a
For this, a PET film is typically used. Further, the surface protective layer 110 may be provided between the adhesive layer 109 and the surface hardened layer 111 in the final adhesion step.

[0006]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory view illustrating the steps of manufacturing the optical card of the present invention. First, a roughened original plate having a low reflection portion roughened according to an information recording pattern is finely arranged in a pattern size of an optical recording material unit. Less than,
Using each drawing and comparing partially with the prior art, FIG.
The manufacturing process of will be described. Some of the dimensions in the figure are exaggerated. FIG. 3 shows a cross-sectional view of the production process of the roughened master plate 15. The transparent substrate 11 (acrylic plate having a thickness of 400 μm) is coated with a photoresist layer evenly with a thickness of 5000 Å by a rotary coater. The resist layer 12 is formed. As a photoresist, a positive type resist (quinone diazide-based) "Chipley Microposit 14
00 ”is used (FIG. 3 (A)).

Next, in the second step, a photomask 13 formed in accordance with the information recording pattern is formed on the photoresist layer 12 by using a mask aligning device (12a, 12b, 12c are the changes in the remaining resist in each step. (FIG. 3B), and the first exposure (patterning exposure) is performed. However, as the photomask 13 used here, an original plate in which the pattern size 104p of the optical recording material portion is finely arranged in the vertical direction or the horizontal and vertical directions as shown in FIG. 4B is used.

Subsequently, as a third step, a glass plate 14 having one surface roughened into fine irregularities (average roughness 0.3 μm,
Exposure L (roughening exposure) is performed again using # 3000 polished glass (FIG. 3C).

After the exposure, as a fourth step, when the photoresist layer 12 is developed, the photoresist where the ultraviolet rays are exposed flows away, the photoresist where the ultraviolet rays are not exposed remains, and the pattern of the photomask 13 is changed to the transparent substrate 11.
Is transcribed on. As a result, the photoresist layer 12 (12c) having a roughened surface is formed as a guide track with a width of about 5 μm and a pitch of about 15 μm. (FIG. 3 (D)) FIG. 4 is a plan view of the original plate of the conventional (A) and the present invention (B) in which the pattern 104p of the optical recording material portion is arranged.

FIG. 5 is a cross-sectional view of a step of duplicating the mother mask of the present invention, in which an optical recording medium having an information recording pattern formed of a low reflectance portion having a roughened surface is formed (see FIG. (Shown in D)) is used as the roughened original plate 15, and the mother mask is reproduced from this roughened original plate 15 by a molding press. Specifically, on the transparent substrate 21 (12 mm-thick acrylic plate), the rough surface prepared above is inserted via the molding material 22 made of the molding resin such as the ionizing radiation curable resin or the thermosetting resin. The chemical master 15 is laminated, and ultraviolet rays are radiated in a state of being pressed by a pressing machine (FIG. 5 (A)).

After that, the roughened original plate 15 and the transparent substrate 21 are released from each other, and the pattern is duplicated on the transparent substrate 21 side to form the mother mask 23 (FIG. 5B). In this embodiment, as a molding resin, a UV curable resin (made by The Inktech, SE9-XA (mainly composed of polyester acrylate oligomer and neopentyl glycol diacrylate, and added with Irgacure 184 (photopolymerization initiator)) )) Is used.

FIG. 6 is a cross-sectional view of a step of forming a reproduction master plate and an optical recording material portion from the mother mask of the present invention, wherein the mother mask 23 is used as a replication master plate for mass replication and is molded by a molding resin. The light-transmissive base material 101 made of 31 is duplicated. Specifically, the peeling film 100a
The transfer peeling layer 100b is formed to a thickness of 50 μm. The transfer peeling layer 100b is a layer that is peeled from the peeling film 100a when heat is applied or pressure is applied, and the acrylic resin, the cellulose resin, the vinyl resin, the polyester resin, the urethane resin, the olefin. Resin,
Conventionally known release layers such as amide resins and epoxy resins can be widely used. This transfer peeling layer 100
The film thickness of b is 0.05 to 10 μm, preferably 0.2 to
It is preferably 2 μm.

The peeling film 100a and the transfer peeling layer 1
00b and the pattern surface of the mother mask 23 are sandwiched between the duplicating resins 31 and irradiated with ultraviolet rays while being pressed by a pressing machine (FIG. 6A). Then, the light-transmissive base material 101 is released from the mother mask 23 to duplicate the pattern (FIG. 6B). In this way, the replication resin 31
A low reflectance portion is formed on the surface of the
Serves as the light-transmissive base material 101 in the optical card. In this embodiment, an ultraviolet curable resin (SS-120, urethane acrylate type, manufactured by ThreeBond Co., Ltd.) is used as the replication resin 31. Subsequently, the optical recording material layer 102 is laminated on the entire surface of the light transmissive base material 101. (FIG. 6 (C)).

FIG. 7 is an explanatory view showing a state in which a light-transmissive base material 101 is attached to a carousel type sputtering apparatus for forming an optical recording material. FIG. 7A shows a conventional one, and FIG. 7B shows this embodiment. With this device,
A film of TeOx (x = 0.4) having a thickness of 500 Å is formed by reactive sputtering of oxygen.

FIG. 8 shows the optical recording material layer 102 of FIG. 6C.
It is sectional drawing which formed the adhesive layer 108 at the side of. Adhesive layer 1
As 08, widely known resins such as acrylic resins, vinyl resins, polyester resins, urethane resins, amide resins, and epoxy resins are widely used. The film thickness is 0.
1 to 50 μm, preferably 0.5 to 10 μm is preferable. Gravure coating method, spin coating method, knife coating method, silk screen method,
It is formed by the Miyabar coating method or the like. This layer is a layer that does not have adhesiveness when heat is not applied in the thermal transfer system and functions as an adhesive only when heat is applied. In the pressure-sensitive transfer system, adhesion and adhesion can be achieved by applying pressure. It is a sticky layer.

Apart from the above series of steps, as shown in FIG. 9, an optical card base material 106 serving as a supporting substrate is prepared. The optical card substrate 106 is made of opalescent vinyl chloride.
The core sheet 106b having a thickness of 0 μm and the oversheets 106a and 106c made of transparent vinyl chloride, each having a thickness of 50 μm, are formed by bonding. In this case, the optical card substrate 106 is
Since it has a three-layer structure, it does not warp during hot pressing. Further, at the time of hot pressing, the oversheet 106a does not stick to the core sheet 106b, but it sticks to the core sheet 106b when silkscreen ink is used, so the printed layer 107 is formed by silkscreen printing.

Next, in the thermal transfer step shown in FIG.
The adhesive layer 108 is formed at a predetermined position on the optical card substrate 106 on the optical recording material layer 102 side of FIG.
The optical recording material unit 104 is thermally transferred by the hot stamp method, and the peeling film (100a) is peeled off. For this thermal transfer, a Navitas flat press machine or the like is used to supply as many optical recording material unit units 104 as desired in the form of a hot stamp. The transfer pressure is preferably 4 to 10 kg / cm ² , and the transfer temperature is preferably 80 to 120 ° C. If the transfer pressure and temperature are too low, the transfer will not work properly and uneven transfer will occur.
If the peeling is not successful and both are too high, the optical recording part will be damaged. This step may use a pressure sensitive transfer method.

Next, FIGS. 11A and 11B show two modes of the final product. FIG. 11A shows the transfer peeling layer 100b of the optical recording material unit 104 after the thermal transfer.
The surface protective layer 110 and the surface hardened layer 111 are provided on the surface via the adhesive layer 109. After only the surface hardened layer 111 is provided via the adhesive layer 109 in FIG. It is punched out in optical card units.

Here, a polycarbonate (PC) having a thickness of 400 μm is used as a base material for the surface protective layer 110. In addition, polymethylmethacrylate (PMMA), acrylonitrile-styrene copolymer (AS resin), cellulose propionate (CP) cellulose acetate butyrate (CAB), polyvinyl chloride (PVC), polyester, etc. can be used. As a preferred embodiment, PC, PMMA or the like having low birefringence is used. As the surface hardened layer 111, an acrylic UV curable hard coat agent (UH-001, manufactured by Toray Industries, Inc.) is used. other,
A UV curable resin (oligomer, monomer initiator) thermosetting resin or the like can also be used.

Since the adhesive layer 109 is a layer that transmits light for optical recording, it is desirable to select a material having a small thickness and a small birefringence, and transparency is also required. In the case of FIG. 11 (A) as the bonding step, an acrylic UV curable hard coat agent (manufactured by Toray Co., UH
-001), the adhesive layer 109 (UV curable adhesive) is sandwiched between the surface protective layer 110 having the surface hardened layer 111 formed thereon and adhered by a laminator, and then the surface hardened layer 111 is irradiated with ultraviolet rays. And cured. As the UV curable adhesive, "863 manufactured by Kyoritsu Chemical Industry Co., Ltd." is used (FIG. 10 (C)). After that, according to the punching line, punching is performed to a card size to prepare an optical card.

In the case of FIG. 11B, the optical recording material unit 1
The UV-curable adhesive “Kyoritsu Chemical Industry Co., Ltd. 863” having a thickness of 450 μm was previously applied as the adhesive layer 109 on the release PET film to the light-transmissive substrate 101 side of No. 04. And press, and irradiate ultraviolet rays from the PET film side. After curing, the PET film is peeled off. Then, a surface-hardened layer 111 made of an acrylic UV-curable hard coat agent (UH-001, manufactured by Toray Industries, Inc.)
Is evenly coated with a roller type coating machine, and is further irradiated with ultraviolet rays to be cured, and then is punched into a card size by a punching line to prepare an optical card.

FIG. 12 shows the light-transmissive substrate 10 of FIG.
It is explanatory drawing of the apparatus which produces 1 in a winding state. First, the peeling film 10 on which the transfer peeling layer 100b is formed.
0a is supplied in the form of a discharge roll.

Next, an ultraviolet irradiation device having a mother mask 23 on its upper surface is arranged below the transfer peeling layer 100b, and between the transfer peeling layer 100b and the mother mask 23,
Inject UV curable resin. (FIG. 12 (A)) Next, the injection hole of the UV curable resin is removed, and the peeling film 100a is brought into contact with the UV curable replication resin 31 injected into the mother mask 23 (FIG. 12 (B). )), The upper surface of the peeling film 100a is irradiated with ultraviolet rays from the lower side in a state of being pressed by the upper press die (FIG. 12 (C),
(D)) Next, the upper press die and the rolls before and after it are released, and the peeling film 100a and the transfer peeling layer 10 are removed.
0b and the light-transmissive base material 101 are wound up as a winding roll (FIG. 12 (E)).

FIG. 13 shows formation of an optical recording medium on a winding duplicate substrate, and is an explanatory view of forming an optical recording medium using a light-transmissive substrate 101 by winding. Figure 12 above
The light-transmissive base material 101 wound and duplicated in (E) is cut into the length of the circumference of the drum of the device, and the original fabric is attached to a carousel type sputtering device for forming an optical recording material by an attachment jig. By forming the continuous film of the optical recording medium by the above-mentioned reactive sputtering, a larger effect can be obtained.

[0025]

According to the present invention, an inexpensive optical card manufacturing method can be realized by utilizing an expensive optical recording material without waste.

[Brief description of drawings]

FIG. 1 is an explanatory view illustrating the manufacturing process of an optical card of the present invention.

FIG. 2 shows an example of a conventional recording medium forming process of an optical card.

FIG. 3 shows a cross-sectional view of a roughened original plate manufacturing process.

FIG. 4 is a plan view of a conventional and an original plate of the present invention in which a pattern of an optical recording material portion is arranged.

FIG. 5 shows a cross-sectional view of a step of replicating the mother mask of the present invention.

FIG. 6 is a cross-sectional view showing a process of forming a replication original plate and an optical recording material portion from the mother mask of the present invention.

FIG. 7 is an explanatory diagram of a conventional and the present invention showing a state in which a light-transmissive base material is attached to a carousel type sputtering apparatus for forming an optical recording material.

FIG. 8 is a cross-sectional view in which an adhesive layer is formed on the optical recording material layer side of FIG. 6 (C).

FIG. 9 is a cross-sectional view of an optical card substrate serving as a supporting substrate.

FIG. 10 is a sectional view showing a step of transferring an optical recording material unit to an optical card substrate.

FIG. 11 is a cross-sectional view illustrating a laminated state of an optical card completed by the method of the present invention.

12 is an explanatory diagram of an apparatus for producing the light-transmitting substrate of FIG. 6 in a wound state.

FIG. 13 is an explanatory diagram of forming an optical recording medium using a light-transmissive base material by winding.

[Explanation of symbols]

 11 Transparent Substrate 12 Photoresist Layer 13 Photomask 14 Glass Plate 15 Roughening Master Plate 21 Transparent Base Material 22 Molding Material 23 Mother Mask 31 Copying Resin 100a Peeling Film 100b Transfer Peeling Layer 101 Light Transmissive Base Material 102 Light Recording material layer 104 Optical recording material unit 106 Optical card substrate 106a Oversheet 106b Core sheet 106c Oversheet 107 Printing layer 108 Adhesive layer 109 Adhesive layer 110 Surface protective layer 111 Surface hardening layer

Claims (1)

[Claims] 1. A method of manufacturing an optical card, wherein a roughened original plate (15) in which a pattern of an optical recording material unit (104) is finely arranged is used, and the roughened original plate (15) is changed to a mother mask. The peeling film (100
forming a replicated light transmissive substrate (101) having a) and forming an optical recording material layer (102) on the roughened surface thereof,
Adhesive layer (108) formed on the optical recording material layer (102) side
Each of the optical recording material units (104) is arranged at a predetermined position of the optical card substrate (106) by a thermal transfer method or a pressure-sensitive transfer method, and after peeling the peeling film (100a), Adhesive layer (109) on the release surface side of the transparent substrate (101)
A method of manufacturing an optical card, comprising: providing a surface-hardened layer (111) through a die, and then punching in optical card units.