JPH06152175A - Enclosure structure of electronic apparatus and its recycling treatment method - Google Patents

Enclosure structure of electronic apparatus and its recycling treatment method

Info

Publication number
JPH06152175A
JPH06152175A JP29843092A JP29843092A JPH06152175A JP H06152175 A JPH06152175 A JP H06152175A JP 29843092 A JP29843092 A JP 29843092A JP 29843092 A JP29843092 A JP 29843092A JP H06152175 A JPH06152175 A JP H06152175A
Authority
JP
Japan
Prior art keywords
conductive sheet
bottom case
casing
electronic device
supported
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP29843092A
Other languages
Japanese (ja)
Inventor
Makoto Watanabe
誠 渡邊
Isanori Itou
功徳 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP29843092A priority Critical patent/JPH06152175A/en
Publication of JPH06152175A publication Critical patent/JPH06152175A/en
Pending legal-status Critical Current

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

PURPOSE:To perform the recycling treatment of an enclosure by a method wherein a structure for supporting a conductive sheet is installed at the enclosure for an electronic apparatus and the conductive sheet can be detached easily from the enclosure. CONSTITUTION:A bottom case 1 is constituted of a conductive sheet 2. Holes which are smaller than protrusion parts 3 are made in positions of the protrusion parts 3 in the conductive sheet 2. When the conductive parts 3 are passed through the holes, the bonding of the bottom case 1 to the conductive sheet 2 is supported by the protrusion parts 3. In the recycling treatment of the bottom case 1, the conductive sheet 2 supported only by the protrusion parts 3 can be detached easily from the bottom case, and the bottom case 1 made of a genuine material can be reused. In addition, a conductive sheet 5 is hooked by claws 6 formed at the bottom case 1, and the bonding of the bottom case 1 to the conductive sheet 5 is supported by the claws 6. When a bottom case 4 is recycled and treated, the conductive sheet 5 supported only by the claws 6 can be detached easily.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】本発明は、電子機器の筐体が電磁波ノイズ
等を目的として、導電シ−トを有している電子機器にお
ける当該筐体の構造及びその再生処理方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of an electronic device having a conductive sheet for the purpose of electromagnetic noise and the like, and a method of reproducing the same.

【0002】[0002]

【産業上の利用分野】電子機器の廃棄時、筐体を容易に
再生処理でき、また筐体の原料を新規に再利用出来るも
のである。
[Field of Industrial Application] When an electronic device is discarded, the housing can be easily recycled, and the raw material of the housing can be newly reused.

【0003】[0003]

【従来の技術】従来の電子機器の筐体は、特開平1−1
88000号公報に記載の様に、電磁波ノイズ等を目的
とした純製プラスチックに導電材料を混ぜたり、メッキ
処理を施したり、また前記導電性シ−トを使用して接着
剤により貼付けたりしているのが一般的である。
2. Description of the Related Art A conventional housing for electronic equipment is disclosed in Japanese Patent Laid-Open No. 1-1.
As described in Japanese Patent No. 88000, a conductive material may be mixed with a pure plastic for the purpose of electromagnetic wave noise or the like, a plating treatment may be performed, or an adhesive may be applied by using the conductive sheet. It is common to have

【0004】[0004]

【発明が解決しようとする課題】上記従来技術は、電子
機器の筐体原料の再利用化という点において配慮されて
おらず、通常の筐体は、電磁波ノイズ対策等のために導
電性材料、メッキ等が使用されていることにより不純物
が含まれているため筐体の再生処理が不可能という問題
があった。
The above-mentioned prior art does not take into consideration the reuse of the raw material for the casing of the electronic equipment, and the ordinary casing is made of a conductive material for the countermeasure against electromagnetic noise, Due to the use of plating and the like, impurities are included, so that there is a problem that the casing cannot be recycled.

【0005】また、筐体が前記導電性シ−トと接着剤等
により貼り付けられている場合は、前記問題点の他に、
筐体の再生処理時、前記導電性シ−トとの分離が困難と
いう問題があった。
When the case is attached to the conductive sheet with an adhesive or the like, in addition to the above problems,
There was a problem that it was difficult to separate the conductive sheet from the conductive sheet during the recycling process of the case.

【0006】本発明の目的は、電子機器の筐体に前記導
電性シ−トを支持する構造を有して当該筐体から前記導
電性シ−トを容易に取外し可能とすることにより、当該
筐体の再生処理を可能とし電子機器の筐体原料を再利用
することにある。
An object of the present invention is to provide a structure for supporting the conductive sheet in a housing of an electronic device so that the conductive sheet can be easily removed from the housing, The purpose is to make it possible to recycle the casing and reuse the casing material of the electronic device.

【0007】[0007]

【課題を解決するための手段】上記目的を達成するため
に電子機器の筐体に前記導電性シ−トを支持する構造を
設け、当該筐体の廃棄時、容易に前記導電性シ−トを当
該筐体から取外し可能とするものである。
In order to achieve the above object, a structure for supporting the conductive sheet is provided in a casing of an electronic device, and the conductive sheet can be easily disposed when the casing is discarded. Is removable from the case.

【0008】[0008]

【作用】電子機器の筐体を容易に前記導電性シ−トを取
外し可能な構造とすることにより当該筐体を再生処理可
能とし、当該筐体の原料を再利用出来る。更に、筐体が
メッキ処理及び接着剤により前記導電性シ−トを貼付け
る場合に比べて、筐体の加工時間が短く、材料費も安価
となる。
By making the casing of the electronic device a structure in which the conductive sheet can be easily removed, the casing can be recycled and the raw material of the casing can be reused. Furthermore, the processing time of the housing is shorter and the material cost is lower than in the case where the housing is attached with the conductive sheet by plating and adhesive.

【0009】[0009]

【実施例】以下、本発明の一実施例を図1〜図4にて説
明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

【0010】図1は、本発明の一実施例を示す電子機器
筐体ボトムケ−スの断面図であり、1は、電子機器筐体
のボトムケ−スであり再生処理して再利用可能な純製の
材料とする。2は、電磁ノイズ対策を目的とした導電シ
−ト、3は、前記導電性シ−トを支持ための突起部であ
る。図2は、図1の部分拡大図であり、図3は、図1の
分解図、図4は、図3の部分拡大図である。
FIG. 1 is a sectional view of an electronic equipment casing bottom case showing an embodiment of the present invention. Reference numeral 1 denotes a bottom case of the electronic equipment casing, which is a pure case that can be recycled for reuse. Made of materials. 2 is a conductive sheet for the purpose of countermeasures against electromagnetic noise, and 3 is a protrusion for supporting the conductive sheet. 2 is a partially enlarged view of FIG. 1, FIG. 3 is an exploded view of FIG. 1, and FIG. 4 is a partially enlarged view of FIG.

【0011】図1、2において、ボトムケ−ス1は、導
電性シ−ト2とから構成されている。導電性シ−ト2に
は、突起部3の位置に突起部3より小さい穴が開けられ
ていて、この穴に突起部3を通すことによりボトムケ−
ス1と導電性シ−ト2との接合は突起部3により支持さ
れる。
1 and 2, the bottom case 1 is composed of a conductive sheet 2. The conductive sheet 2 has a hole smaller than the protrusion 3 at the position of the protrusion 3, and the bottom case is formed by inserting the protrusion 3 into the hole.
The joint between the space 1 and the conductive sheet 2 is supported by the protrusion 3.

【0012】図3において、ボトムケ−ス1の再生処理
時は、ボトムケ−ス1と導電性シ−ト2との接合は突起
部3のみにより支持されている導電性シ−ト2は、容易
にボトムケ−ス1より取外すことが可能であり、このた
め純製材料のボトムケ−ス1は再利用出来る。
In FIG. 3, when the bottom case 1 is recycled, the bottom case 1 and the conductive sheet 2 are easily joined to each other by the conductive sheet 2 supported only by the protrusions 3. The bottom case 1 made of pure material can be reused.

【0013】図5〜図8は、本発明の他の実施例を示し
ている。
5 to 8 show another embodiment of the present invention.

【0014】図5は、電子機器筐体ボトムケ−スの断面
図、図6は、図5の部分拡大図であり、4は、電子機器
筐体のボトムケ−スであり再生処理して再利用可能な純
製の材料とする。5は、電磁ノイズ対策を目的とした導
電性シ−ト、6は、前記導電性シ−トを支持ためのツメ
である。 図7は、図5の分解図、図8は、図7の部分
拡大図である。
FIG. 5 is a sectional view of the bottom case of the electronic device casing, FIG. 6 is a partially enlarged view of FIG. 5, and 4 is a bottom case of the electronic device casing, which is recycled for reuse. Use possible pure materials. Reference numeral 5 is a conductive sheet for the purpose of preventing electromagnetic noise, and 6 is a claw for supporting the conductive sheet. 7 is an exploded view of FIG. 5, and FIG. 8 is a partially enlarged view of FIG.

【0015】図5、6において、ボトムケ−ス4は、導
電性シ−ト5とから構成されている。導電性シ−ト5
は、ツメ6によって引っ掻けられ図6の状態となること
によりボトムケ−ス4と導電性シ−ト5との接合はツメ
6により支持される。
5 and 6, the bottom case 4 is composed of a conductive sheet 5. Conductive sheet 5
By being scratched by the tabs 6 and in the state shown in FIG. 6, the joint between the bottom case 4 and the conductive sheet 5 is supported by the tabs 6.

【0016】図7において、ボトムケ−ス4の再生処理
時は、ボトムケ−ス4と導電性シ−ト5との接合はツメ
6のみにより支持されている導電性シ−ト5は、容易に
ボトムケ−ス4より取外すことが可能であり、このため
純製材料のボトムケ−ス4は再利用出来る。
In FIG. 7, when the bottom case 4 is being regenerated, the bottom sheet 4 and the conductive sheet 5 are joined together only by the tabs 6. It can be removed from the bottom case 4, so that the bottom case 4 made of pure material can be reused.

【0017】図9は、電子機器の全体斜視図であり、7
は、電子機器筐体のボトムケ−ス、8は、電子機器筐体
のトップカバ−である。前記実施例を電子機器筐体のボ
トムケ−ス及びトップカバ−に適用することにより、電
子機器の筐体は再生処理ができ再利用可能となる。
FIG. 9 is an overall perspective view of the electronic device,
Is a bottom case of the electronic equipment casing, and 8 is a top cover of the electronic equipment casing. By applying the above-mentioned embodiment to the bottom case and top cover of the electronic device housing, the electronic device housing can be recycled and reused.

【0018】[0018]

【発明の効果】以上詳述した様に、本発明によれば電子
機器の廃棄時、筐体の再生処理が可能であり、当該筐体
原料の再利用を図る事が出来る。 更に、当該筐体へ前
記導電シ−トを取付け及び取外し手段も容易であり、メ
ッキ処理等の工程も不要なため当該筐体の加工時間が短
く、材料費も安価である。
As described above in detail, according to the present invention, the housing can be recycled when the electronic device is discarded, and the housing material can be reused. Further, the conductive sheet can be easily attached to and detached from the casing, and no processing such as plating is required, so that the casing can be processed in a short time and the material cost is low.

【図面の簡単な説明】[Brief description of drawings]

【図1】図1は本発明の一実施例を示す電子機器筐体ボ
トムケ−スの断面図である。
FIG. 1 is a sectional view of an electronic equipment casing bottom case showing an embodiment of the present invention.

【図2】図2は、図1における部分拡大図である。FIG. 2 is a partially enlarged view of FIG.

【図3】図3は、図1における分解図である。FIG. 3 is an exploded view of FIG.

【図4】図4は、図3における部分拡大図である。4 is a partially enlarged view of FIG.

【図5】図5は本発明の他の実施例を示す電子機器筐体
ボトムケ−スの断面図である。
FIG. 5 is a cross-sectional view of a bottom case of an electronic device casing showing another embodiment of the present invention.

【図6】図6は、図5における部分拡大図である。FIG. 6 is a partially enlarged view of FIG.

【図7】図7は、図5における分解図である。FIG. 7 is an exploded view of FIG.

【図8】図8は、図7における部分拡大図である。8 is a partially enlarged view of FIG.

【図9】図9は本発明の一実施例を示す電子機器の全体
斜視図である。
FIG. 9 is an overall perspective view of an electronic device showing an embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1:ボトムケ−ス、2:導電性シ−ト、3:突起部、
4:ボトムケ−ス、5:導電性シ−ト、6:ツメ、7:
ボトムケ−ス、8:トップカバ−
1: bottom case, 2: conductive sheet, 3: protrusion,
4: bottom case, 5: conductive sheet, 6: claw, 7:
Bottom case, 8: Top cover

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】電子機器の筐体が電磁波ノイズ等を目的と
して、導電性シ−トを有している電子機器において、当
該筐体が導電性シ−トを支持する構造を有して当該筐体
から導電性シ−トを容易に取外し可能とすることによ
り、当該筐体を再生処理し、原料を再利用可能とするこ
とを特徴とした電子機器の筐体構造及びその再生処理方
法。
1. An electronic device, wherein the housing of the electronic device has a conductive sheet for the purpose of electromagnetic noise and the like, and the housing has a structure for supporting the conductive sheet. (EN) A casing structure of an electronic device and a regeneration treatment method thereof, wherein a conductive sheet can be easily removed from the casing so that the casing can be recycled and raw materials can be reused.
JP29843092A 1992-11-09 1992-11-09 Enclosure structure of electronic apparatus and its recycling treatment method Pending JPH06152175A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29843092A JPH06152175A (en) 1992-11-09 1992-11-09 Enclosure structure of electronic apparatus and its recycling treatment method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29843092A JPH06152175A (en) 1992-11-09 1992-11-09 Enclosure structure of electronic apparatus and its recycling treatment method

Publications (1)

Publication Number Publication Date
JPH06152175A true JPH06152175A (en) 1994-05-31

Family

ID=17859606

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29843092A Pending JPH06152175A (en) 1992-11-09 1992-11-09 Enclosure structure of electronic apparatus and its recycling treatment method

Country Status (1)

Country Link
JP (1) JPH06152175A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11071209B2 (en) 2016-02-09 2021-07-20 Nec Platforms, Ltd. Fitting structure for conductive sheet and electronic device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11071209B2 (en) 2016-02-09 2021-07-20 Nec Platforms, Ltd. Fitting structure for conductive sheet and electronic device

Similar Documents

Publication Publication Date Title
EP1235613A4 (en) Fluid processing systems and methods using extracorporeal fluid flow panels oriented within a cartridge
WO2005038800A8 (en) Secure access and copy protection management system
US6958445B1 (en) Electromagnetic interference shield for electronic devices on a circuit board
JPH06152175A (en) Enclosure structure of electronic apparatus and its recycling treatment method
US20130000969A1 (en) Shielding plate and shielding assembly with same
JPH0857190A (en) External frame structure for washing machine
JPS63274200A (en) Substrate fixing device
JP2001332886A (en) Shield case
JPH0669668A (en) System for mounting parts on printed wiring board
JP2731511B2 (en) Electric control device of pachinko machine
US7082038B2 (en) Front cover protector
JP2001332885A (en) Holding structure of printed board and electronic apparatus
JPH1070373A (en) Case of portable electronic apparatus
JPH04326586A (en) Printed circuit board
JPH0595097U (en) Electromagnetic interference protection structure
JP3653876B2 (en) Filter mounting device
JP3119549B2 (en) Electromagnetic shield device
JPH06233950A (en) Masking method and masking material
JPS6035278Y2 (en) housing device
JPS6091593A (en) High frequency heater
JPH05226566A (en) Lead frame
DE59301735D1 (en) Process for producing an electromagnetically sealed holder for two metallic components, and shielded subrack with such components
JP2000133966A (en) Electronic equipment
JPH0822812A (en) Battery pack
JPH1011169A (en) Information processor