JPH06151181A - Series-coupled type lc composite element and manufacture thereof - Google Patents
Series-coupled type lc composite element and manufacture thereofInfo
- Publication number
- JPH06151181A JPH06151181A JP30245192A JP30245192A JPH06151181A JP H06151181 A JPH06151181 A JP H06151181A JP 30245192 A JP30245192 A JP 30245192A JP 30245192 A JP30245192 A JP 30245192A JP H06151181 A JPH06151181 A JP H06151181A
- Authority
- JP
- Japan
- Prior art keywords
- coil
- electrode
- ferrite sheet
- ferrite
- sheet
- Prior art date
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Filters And Equalizers (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、OA,AV,FA用機
器などに使用される電源回路やディジタル化された回路
に生じる外来ノイズ,回路素子から発生するノイズを除
去するフィルタ等に応用される素子で、特に小型薄型化
を目的とした直列結合型LC複合素子及びその製造方法
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is applied to a power supply circuit used in equipment for OA, AV, FA and the like, a filter for removing external noise generated in a digitized circuit, noise generated by a circuit element, and the like. In particular, the present invention relates to a series-coupling type LC composite element for the purpose of downsizing and thinning, and a manufacturing method thereof.
【0002】[0002]
【従来の技術】電子回路に発生するノイズは、電源ライ
ンから来るノイズ、ラインとア−ス間で発生するノイ
ズ、回路に使用されている、特にスイッチ素子類、又は
半導体素子などから発生するノイズ、外来ノイズ等があ
り、これらノイズを消去する手段としていろいろな構造
のノイズフィルタが使用されている。これらノイズは基
本的にはフェライトの焼結体で構成したインダクタ,誘
電体で構成したコンデンサの各々単品を接合した複合素
子から成っており、形状は大きなものであった。2. Description of the Related Art Noise generated in an electronic circuit includes noise coming from a power supply line, noise generated between a line and an earth, and noise generated in a circuit, particularly a switch element or a semiconductor element. There are external noises, etc., and noise filters having various structures are used as means for eliminating these noises. These noises were basically composed of a composite element in which an inductor made of a ferrite sintered body and a capacitor made of a dielectric were joined to each other, and had a large shape.
【0003】[0003]
【発明が解決しようとする課題】電子機器システムの小
型化にともない、回路は高密度化し、高密度化に適した
電子部品の小型、薄型化ならびにIC化の要求が高まっ
ており、現在は高密度実装も含め検討が進められてい
る。電子部品のなかで小型、薄型化に対し遅れているの
は磁性材料から成る部品(L)とコンデンサ部品(C)
でありこれらの小型、薄型化に対しより要望が強い。With the miniaturization of electronic equipment systems, the density of circuits has increased, and there has been an increasing demand for miniaturization, thinning, and IC integration of electronic components suitable for high density. Investigations including density mounting are underway. Among electronic parts, the parts that are behind the miniaturization and thinning are parts (L) made of magnetic materials and capacitor parts (C).
Therefore, there is a strong demand for miniaturization and thinning of these.
【0004】本発明は、このような要望に応えることの
出来る直列結合型LC複合素子とその製造方法を提供す
ることを目的とするものである。It is an object of the present invention to provide a series-coupling type LC composite element and a method for manufacturing the same, which can meet such demands.
【0005】[0005]
【課題を解決するための手段】本発明は、コイルをフェ
ライトシ−トで挟み、一方のフェライトシ−ト面にコイ
ルならびに電極形状の凹型パタ−ンを予め形成し、これ
に、コイル、電極を埋め込むことにより製造したインダ
クタ(L)と、フェライトシ−ト面に薄膜またはシ−ト
状をしたコンデンサ(C)を接合して構成したものであ
る。SUMMARY OF THE INVENTION According to the present invention, a coil is sandwiched between ferrite sheets, and a coil and an electrode-shaped concave pattern are formed in advance on one ferrite sheet surface. And an inductor (L) manufactured by embedding a thin film or a sheet-like capacitor (C) on the ferrite sheet surface.
【0006】[0006]
【作用】本発明は、ドクタ−ブレ−ド法で作製したフェ
ライトシ−トに未焼成の状態でコイルと電極の形状をし
た凹型パタ−ンを形成し、その凹部に導電性材料でコイ
ルと電極を形成し、その面に同じ特性のフェライトシ−
トをはりつけて成るインダクタと、コイルを形成した面
と反対側に薄膜またはシ−トから構成したコンデンサを
直接接合して製造する。従って、従来のLとCを組み合
わせて成る複合素子より大幅に小型薄型のLC素子とす
ることができる。According to the present invention, a recessed pattern having the shape of a coil and an electrode is formed in an unfired state on a ferrite sheet produced by the doctor blade method, and a coil is made of a conductive material in the recess. An electrode is formed and a ferrite shield with the same characteristics is formed on the surface.
It is manufactured by directly joining an inductor formed by attaching a sheet and a capacitor formed of a thin film or a sheet on the side opposite to the surface on which the coil is formed. Therefore, it is possible to make the LC element significantly smaller and thinner than the conventional composite element formed by combining L and C.
【0007】[0007]
【実施例】以下、本発明の実施例について図面を参照し
て説明する。Embodiments of the present invention will be described below with reference to the drawings.
【0008】(実施例1)先ず、本発明の直列結合型L
C複合素子の製造方法を説明する。(Embodiment 1) First, the series connection type L of the present invention.
A method of manufacturing the C composite element will be described.
【0009】図1に示すように、Ni−Znフェライト
の微粉末と有機質粘結材を混練して成るぺ−ストを膜厚
を制御する隙間をもつ治具1で離けい紙3の表面に20
0ミクロンメ−トルの厚さに塗布し、指触乾燥させた後
離けい紙をはく離して未焼成Ni−Znフェライトシ−
ト2(図2参照)を作製した。As shown in FIG. 1, a paste prepared by kneading Ni--Zn ferrite fine powder and an organic binder is applied to the surface of the separating paper 3 by a jig 1 having a gap for controlling the film thickness. 20
It was applied to a thickness of 0 micron, dried by touching with a finger, and then the release paper was peeled off to leave unbaked Ni-Zn ferrite sheet.
2 (see FIG. 2) was produced.
【0010】図3は、平滑面上に高さ20ミクロンメ−
トル,幅30ミクロンメ−トル,ピッチ50ミクロンメ
−トルのスパイラル状コイルパタ−ン5ならびにコイル
の両端に設ける電極パタ−ン6,6’の凸型を形成した
金型を示す。図4は、図3の線A,A’で金型を切断し
て示した断面図である。FIG. 3 shows a smooth surface with a height of 20 μm.
A die having a spiral coil pattern 5 having a width of 30 μm, a pitch of 50 μm and a convex shape of electrode patterns 6 and 6 ′ provided at both ends of the coil is shown. FIG. 4 is a cross-sectional view showing the mold cut along the lines A and A ′ in FIG.
【0011】図5に示すように、図3の金型と、平滑な
面をもつ金型7の間に上記未焼成Ni−Znフェライト
2をはさみ加圧した。As shown in FIG. 5, the unsintered Ni—Zn ferrite 2 was sandwiched and pressed between the mold of FIG. 3 and a mold 7 having a smooth surface.
【0012】図6は、金型のパタ−ン5を転写し表面に
凹型を形成した未焼成Ni−Znフェライトシ−ト2で
ある。8は一方の電極部のフェライトシ−ト2に設けた
スルホ−ルである。FIG. 6 shows an unbaked Ni-Zn ferrite sheet 2 having a concave pattern formed on the surface by transferring a pattern 5 of a mold. Reference numeral 8 is a sulfol provided on the ferrite sheet 2 of one of the electrode portions.
【0013】このようにして作製した未焼成フェライト
シ−ト2を、空気中で加熱して、焼成フェライトシ−ト
2とした。The unsintered ferrite sheet 2 thus prepared was heated in air to obtain a sintered ferrite sheet 2.
【0014】他方、図7に示すように、チタン酸バリュ
ウム系の微粉末と有機質粘結材を混練して成るぺ−スト
を、膜厚を制御する隙間をもつ治具1で離けい紙10の
表面に10ミクロンメ−トルの厚さに塗布し、指触乾燥
した後離けい紙10を剥離除去し、空気中にて焼成しコ
ンデンサ用シ−トを作製した。このシ−トの上下両面
に、Cu電極膜11,11’をスパッタリング法で形成
した(図8参照)。On the other hand, as shown in FIG. 7, a paste 10 prepared by kneading barium titanate-based fine powder and an organic binder is separated by a jig 1 having a gap for controlling the film thickness. Was coated on the surface of No. 10 in a thickness of 10 μm, dried by touch with the finger, the release paper 10 was peeled off, and baked in the air to prepare a capacitor sheet. Cu electrode films 11 and 11 'were formed on the upper and lower surfaces of this sheet by a sputtering method (see FIG. 8).
【0015】図8に示したコンデンサシ−トを、上述の
ように焼成したフェライトシ−ト2の凹型パタ−ンを形
成した面と反対の面に導電性接着剤13で接合した(図
9参照)。またスルホ−ル8に導電性接着剤12を充填
した。The capacitor sheet shown in FIG. 8 is bonded with a conductive adhesive 13 to the surface of the ferrite sheet 2 fired as described above opposite to the surface on which the concave pattern is formed (FIG. 9). reference). In addition, the conductive adhesive 12 was filled in the sulfol 8.
【0016】次に焼成したフェライトシ−ト2の凹型を
設けた面にCu膜15をスパッタリング法で形成した
(図10参照)。Next, a Cu film 15 was formed on the surface of the fired ferrite sheet 2 on which the concave shape was provided by a sputtering method (see FIG. 10).
【0017】凹型パタ−ン以外に形成されたCu膜15
は図11に示した如く例えば研磨により除去し、コイル
パタ−ン5と電極パタ−ン6,6’を形成した。Cu film 15 formed other than the concave pattern
Then, as shown in FIG. 11, the coil pattern 5 and the electrode patterns 6, 6'are removed by polishing, for example.
【0018】このようにして製造された直列結合型LC
複合素子は、コイルの電極6とコンデンサの電極11’
は、スルホ−ル8を通して導電性接着剤12で電気的に
接合されている。なおコンデンサのサイズは4mm角と
した。Series-coupled LC manufactured in this way
The composite element includes a coil electrode 6 and a capacitor electrode 11 '.
Are electrically joined with a conductive adhesive 12 through the sulfol 8. The size of the capacitor was 4 mm square.
【0019】次に、図12に示すように、フェライトシ
−ト2と同じ磁気特性を持った厚みが200ミクロンメ
−トルのフェライトシ−ト14を、否導電性接着剤で接
合して磁性材外への磁束の漏れをなくした。このとき得
られたL値は10タ−ンの巻数で5MHzにて12マイ
クロヘンリ−であった。またCは7マイクロファラッド
であった。Next, as shown in FIG. 12, a ferrite sheet 14 having the same magnetic characteristics as the ferrite sheet 2 and a thickness of 200 μm is joined with a non-conductive adhesive to form a magnetic material. Eliminates the leakage of magnetic flux to the outside. The L value obtained at this time was 12 microhenry at 5 MHz with 10 turns. C was 7 microfarads.
【0020】(実施例2)実施例1のNi−Znフェラ
イトシ−トのかわりにMn−Znフェライトシ−トを用
い、実施例1と同じ直列結合型LC複合素子とした。こ
のときのL値は5MHzで8マイクロヘンリ−であっ
た。Example 2 The same series-coupling type LC composite device as in Example 1 was obtained by using Mn-Zn ferrite sheet instead of the Ni-Zn ferrite sheet of Example 1. The L value at this time was 8 microhenry at 5 MHz.
【0021】(実施例3)実施例1のチタン酸バリュウ
ムの代わりにタンタルの酸化物、ならびにタンタルの窒
化物の膜を反応性スパっタリング法で1ミクロンメ−ト
ルの厚みに形成し同じ直列結合型LC素子とした。たと
えばタンタルの酸化物膜の場合は4ミリメ−トル角サイ
ズで6マイクロファラッドであった。(Example 3) Instead of barium titanate of Example 1, a film of tantalum oxide and tantalum nitride was formed to a thickness of 1 micrometer by the reactive sputtering method, and the same series connection was performed. Type LC element. For example, in the case of a tantalum oxide film, the size was 4 microfarads and the size was 6 microfarads.
【0022】(実施例4)実施例1において、4ミリミ
リメ−トル角のチタン酸バリュウム系膜をプラズマ−C
VD法を用いて厚み1ミクロンメ−トルに構成した。こ
のときのCの値は18マイクロファラッドであった。(Embodiment 4) In Embodiment 1, a barium titanate-based film having a 4 mm millimeter angle is plasma-C.
The thickness was set to 1 micron using the VD method. The value of C at this time was 18 microfarads.
【0023】[0023]
【発明の効果】以上述べたところから明らかなように、
本発明にかかる直列結合型LC複合素子とその製造方法
によれば、構成が簡単で小型薄型化が達成でき、回路を
小型化にするに非常に有用である。As is apparent from the above description,
According to the series-coupling type LC composite element and the method of manufacturing the same according to the present invention, the structure is simple, the size and the thickness can be reduced, and it is very useful for downsizing the circuit.
【図1】本発明の一実施例で、ドクタブレ−ド法で離け
い紙上にフェライトシ−トを形成する方法を示す斜視図
である。FIG. 1 is a perspective view showing a method of forming a ferrite sheet on a release paper by a doctor blade method according to an embodiment of the present invention.
【図2】本発明の一実施例で作製されたフェライトシ−
トを示す斜視図である。FIG. 2 is a ferrite sheet prepared in one embodiment of the present invention.
FIG.
【図3】本発明の一実施例で、プレス用金型の表面に形
成したコイルならびに電極を形成するための凸型パタ−
ンを示す平面図である。FIG. 3 is a convex pattern for forming a coil and an electrode formed on the surface of a pressing die according to an embodiment of the present invention.
FIG.
【図4】本発明の一実施例で、図3の線A,A’で金型
を切断して示した断面図である。FIG. 4 is a cross-sectional view of the mold taken along the lines A and A ′ of FIG. 3 according to an embodiment of the present invention.
【図5】本発明の一実施例で、金型を用いて未焼成のフ
ェライトシ−トをプレスした状態を示す断面図である。FIG. 5 is a cross-sectional view showing a state where an unfired ferrite sheet is pressed using a mold in one example of the present invention.
【図6】本発明の一実施例で、金型表面のパタ−ンを転
写されたフェライトシ−トを示す断面図である。FIG. 6 is a cross-sectional view showing a ferrite sheet to which a pattern on the surface of a mold is transferred according to an embodiment of the present invention.
【図7】本発明の一実施例で、ドクタブレ−ド法で離け
い紙上にコンデンサシ−トを形成する方法を示す斜視図
である。FIG. 7 is a perspective view showing a method of forming a condenser sheet on a release paper by a doctor blade method according to an embodiment of the present invention.
【図8】本発明の一実施例で、焼成済みコンデンサシ−
トの両面に電極を設けた断面図である。FIG. 8 is an embodiment of the present invention in which a fired capacitor sheet is used.
It is sectional drawing which provided the electrode on both surfaces of the gutter.
【図9】本発明の一実施例で、フェライトシ−トの裏面
にコンデンサシ−トを導電性接着剤で接合し、またスル
ホ−ルを導電性接着剤で充填した状態を示した断面図で
ある。FIG. 9 is a cross-sectional view showing a state in which a capacitor sheet is joined to a back surface of a ferrite sheet with a conductive adhesive and a sulfur is filled with the conductive adhesive in an embodiment of the present invention. Is.
【図10】本発明の一実施例で、フェライトシ−ト凹型
パタ−ン面にコイルならびに電極用導電性膜を形製した
断面図である。FIG. 10 is a cross-sectional view showing a coil and an electrode conductive film formed on a ferrite sheet concave pattern surface in an embodiment of the present invention.
【図11】本発明の一実施例で、コイルパタ−ン部、な
らびに電極部以外に構成した導電性膜を除去した断面図
である。FIG. 11 is a cross-sectional view of the embodiment of the present invention, in which a conductive film formed except for the coil pattern portion and the electrode portion is removed.
【図12】本発明の一実施例で、フェライトシ−トのコ
イルならびに電極を設けた側に同じ特性のフェライトシ
−トを接合した断面図である。FIG. 12 is a cross-sectional view in which a ferrite sheet having the same characteristics is joined to a side where a coil and an electrode of the ferrite sheet are provided in one embodiment of the present invention.
1 ぺ−ストを塗布する治具 2 フェライトシ−ト 3、10 離けい紙 4 金型 5 コイルパタ−ン 6,6’ コイル用電極 7 金型 8 スルホ−ル 9 コンデンサ−用シ−ト 11、11’ コンデンサ用電極 12、13 導電性接着剤 14 フェライトシ−ト 1 jig for applying paste 2 ferrite sheet 3, 10 release paper 4 mold 5 coil pattern 6, 6'coil electrode 7 mold 8 sulfur 9 capacitor seat 11, 11 'Capacitor electrodes 12, 13 Conductive adhesive 14 Ferrite sheet
───────────────────────────────────────────────────── フロントページの続き (72)発明者 友澤 淳 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Atsushi Tomozawa 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.
Claims (10)
型パターンにコイルならびに電極を形成し、その表面に
そのフェライトシ−トと同等の磁気特性の別のフェライ
トシ−トをはり合わせてなるインダクタ(L)と、前記
コイルと電極を設けたフェライトシ−トの裏面上に接合
された、両面に電極を設けた誘電体の膜またはシ−トで
形成されたコンデンサ(C)とを備え、これらインダク
タ(L)とコンデンサ(C)の電極が前記コイルならび
に電極を有するフェライトシートに設けられたスルホ−
ルで結合されていることを特徴とする直列結合型LC複
合素子。1. A coil and an electrode are formed on a concave pattern provided on the surface of a ferrite sheet, and another ferrite sheet having magnetic characteristics equivalent to that of the ferrite sheet is attached to the surface of the coil and the electrode. An inductor (L) and a capacitor (C) formed of a dielectric film or sheet having electrodes on both sides, which is joined to the back surface of the ferrite sheet having the coil and the electrode. The electrodes of the inductor (L) and the capacitor (C) are provided on the ferrite sheet having the coil and the electrodes.
A series-combined LC composite device characterized by being coupled with each other.
イトまたはNi−Zn系フェライトから成ることを特徴
とする請求項1の直列結合型LC複合素子。2. The series-coupling type LC composite element according to claim 1, wherein the ferrite sheet is made of Mn—Zn based ferrite or Ni—Zn based ferrite.
ら成ることを特徴とする請求項1の直列結合型LC複合
素子。3. The series coupling type LC composite element according to claim 1, wherein the coil is made of Al, Cu, or a noble metal.
の電極は、酸化物系導電体または貴金属から成ることを
特徴とする請求項1の直列結合型LC複合素子。4. The series coupling type LC composite element according to claim 1, wherein the electrode on the ferrite sheet side of the capacitor (C) is made of an oxide-based conductor or a noble metal.
物またはチッ化物の薄膜、またはチタン酸バリュウム
系,の薄膜あるいは焼結シ−トから成ることを特徴とす
る請求項1の直列結合型LC複合素子。5. The series-coupled LC according to claim 1, wherein the capacitor dielectric comprises a thin film of tantalum oxide or nitride, a thin film of barium titanate, or a sintered sheet. Composite element.
なるぺ−ストを離けい紙上へ一定厚みに塗布し、乾燥し
たのち離けい紙を剥離した未焼成フェライトシ−トの表
面を、表面にコイルならびに電極の形状をした凸型パタ
−ンを形成した金型でプレスし、その表面にコイルなら
びに電極用の凹型パタ−ンを形成した後焼成し、そのフ
ェライトシ−トの裏面にコンデンサ用の一方の電極を形
成した後、その上にコンデンサ用誘電体膜を形成し、さ
らに、その誘電体膜の表面に他方の電極を設け、前記凹
型パターンを形成したフェライトシ−トの表面にコイル
ならびに電極となる金属膜を形成した後、凹型パターン
以外に形成した金属膜を除去し、コイルならびに電極を
形成し、さらに前記フェライトシ−トのコイル形成側
に、磁気特性が同等の別のフェライトシ−トを接合する
ことを特徴とする直列結合型LC複合素子の製造方法。6. A surface of unfired ferrite sheet obtained by kneading a ferrite powder and an organic binder on a release paper to a certain thickness, drying the release paper and then peeling the release paper. , The surface of the ferrite sheet is pressed with a die having a convex pattern in the shape of a coil and an electrode formed on the surface, and a concave pattern for the coil and the electrode is formed on the surface, followed by firing, and the back surface of the ferrite sheet After forming one electrode for the capacitor on the capacitor, a dielectric film for the capacitor is formed thereon, and the other electrode is further provided on the surface of the dielectric film, and the recessed pattern-formed ferrite sheet is formed. After forming a metal film to be a coil and an electrode on the surface, the metal film formed other than the concave pattern is removed to form a coil and an electrode, and the ferrite sheet has the same magnetic characteristics on the coil forming side. A method for manufacturing a series-coupling type LC composite element, which comprises bonding another ferrite sheet.
上へフェライトぺ−ストを塗布することを特徴とする請
求項6の直列結合型LC素子の製造方法。7. The method for manufacturing a serially coupled LC device according to claim 6, wherein a ferrite paste is applied onto the release paper by a doctor blade method.
の電極の接合は前記コイルならびに電極が形成されたフ
ェライトシ−トに設けたスルホ−ルにより接合すること
を特徴とする請求項6の直列結合型LC素子の製造方
法。8. The series according to claim 6, wherein one electrode of the coil and one electrode of the capacitor are joined by a sulfur provided on a ferrite sheet on which the coil and the electrode are formed. Method for manufacturing combined LC element.
ッタリング法,プラズマ−CVD法のいずれかで形成す
ることを特徴とする請求項6の直列結合型LC素子の製
造方法。9. The method for manufacturing a serially coupled LC device according to claim 6, wherein the dielectric film is formed by any one of a reactive vacuum deposition method, a reactive sputtering method and a plasma-CVD method.
てなるぺ−ストを離けい紙上へ一定厚みに塗布し、乾燥
したのち離けい紙を剥離した未焼成フェライトシ−トの
表面を、表面にコイルならびに電極の形状をした凸型パ
タ−ンを形成した金型でプレスし、その表面にコイルな
らびに電極用の凹型パタ−ンを形成した後焼成し、前記
凹型パターンを形成したフェライトシ−トの表面にコイ
ルならびに電極となる金属膜を形成した後、凹型パター
ン以外に形成した金属膜を除去し、コイルならびに電極
を形成し、他方、ドクタブレ−ド法により、離けい紙上
へ誘電体の粉体と有機粘結剤を混練りして成るぺ−スト
を塗布し、乾燥した後離けい紙を剥離し、焼結し、その
表面ならびに裏面に電極膜を形成した後、それを前記フ
ェライトシ−トの裏面に導電性接着剤で接合し、さらに
前記フェライトシ−トのコイル形成側に、磁気特性が同
等の別のフェライトシ−トを接合することを特徴とする
直列結合型LC複合素子の製造方法。10. A surface of an unsintered ferrite sheet obtained by kneading a ferrite powder and an organic binder on a release paper to a certain thickness, drying the release paper, and peeling the release paper. , A ferrite having a concave pattern formed by pressing with a die having a convex pattern formed in the shape of a coil and an electrode on the surface, forming a concave pattern for the coil and the electrode on the surface, and then firing After forming the metal film to be the coil and electrode on the surface of the sheet, the metal film other than the concave pattern is removed to form the coil and electrode, while the doctor blade method is used to insulate it onto the release paper. Apply a paste made by kneading the body powder and an organic binder, dry it, peel off the release paper, sinter it, and form an electrode film on its front and back surfaces. The back of the ferrite sheet A method for manufacturing a series-coupling type LC composite element, characterized in that it is bonded to the surface with a conductive adhesive and further another ferrite sheet having the same magnetic characteristics is bonded to the coil forming side of the ferrite sheet. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30245192A JPH06151181A (en) | 1992-11-12 | 1992-11-12 | Series-coupled type lc composite element and manufacture thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30245192A JPH06151181A (en) | 1992-11-12 | 1992-11-12 | Series-coupled type lc composite element and manufacture thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06151181A true JPH06151181A (en) | 1994-05-31 |
Family
ID=17909098
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30245192A Pending JPH06151181A (en) | 1992-11-12 | 1992-11-12 | Series-coupled type lc composite element and manufacture thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH06151181A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1343249A2 (en) | 2002-03-05 | 2003-09-10 | Samsung Electronics Co., Ltd. | Device having inductors and capacitors and a fabrication method thereof |
-
1992
- 1992-11-12 JP JP30245192A patent/JPH06151181A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1343249A2 (en) | 2002-03-05 | 2003-09-10 | Samsung Electronics Co., Ltd. | Device having inductors and capacitors and a fabrication method thereof |
US7169684B2 (en) | 2002-03-05 | 2007-01-30 | Samsung Electronics Co., Ltd. | Device having inductors and capacitors and a fabrication method thereof |
EP1343249A3 (en) * | 2002-03-05 | 2009-09-09 | Samsung Electronics Co., Ltd. | Device having inductors and capacitors and a fabrication method thereof |
US7939909B2 (en) | 2002-03-05 | 2011-05-10 | Samsung Electronics Co., Ltd. | Device having inductors and capacitors |
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