JPH06145420A - Phenolic resin molding material - Google Patents

Phenolic resin molding material

Info

Publication number
JPH06145420A
JPH06145420A JP29844892A JP29844892A JPH06145420A JP H06145420 A JPH06145420 A JP H06145420A JP 29844892 A JP29844892 A JP 29844892A JP 29844892 A JP29844892 A JP 29844892A JP H06145420 A JPH06145420 A JP H06145420A
Authority
JP
Japan
Prior art keywords
hexamethylenetetramine
parts
phenolic resin
molding material
microcapsules
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP29844892A
Other languages
Japanese (ja)
Inventor
Tamotsu Ishida
保 石田
Hidenori Saito
英紀 斎藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP29844892A priority Critical patent/JPH06145420A/en
Publication of JPH06145420A publication Critical patent/JPH06145420A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To provide a composition comprising a phenolic resin, hexamethylenetetramine microcapsules having a specific wall material and a filler, and excellent in thermal stability in a plasticized melted state in the cylinder of an injection molding machine on its injection molding and in curability in molds. CONSTITUTION:The objective composition comprises (A) a phenolic resin, (B) hexamethylenetetramine microcapsules having a wall material having a softening point of 10-150 deg.C (preferably polymethyl methacrylate and its copolymer), and (C) a filler, preferably in amounts of 100 pts.wt., 7-30 pts.wt. and 50-150 pts.wt., respectively. The component A is preferably an ordinary novolak phenolic resin. The component B is produced e.g. by dispersing fine powdery hexamethylenetetramine in a solution of polymethyl methacylate in ethylene dischloridecharging the dispersion in a large volume of water containing a dispersion stabilizer, evaporating the ethylene dichloride from the produced dispersion, and subsequently drying the residue.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は成形加工性、硬化性に優
れたフェノール樹脂成形材料に関するものであり、特に
射出成形において射出成形機のシリンダー内では硬化反
応が殆ど進行せず、金型内では極めて早く硬化するよう
な成形加工性の著しく優れたフェノール樹脂成形材料を
提供するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a phenol resin molding material excellent in molding processability and curability, and particularly in injection molding, the curing reaction hardly progresses in the cylinder of the injection molding machine, and The present invention provides a phenol resin molding material having extremely excellent molding processability that cures extremely quickly.

【0002】[0002]

【従来の技術】フェノール樹脂成形材料は耐熱性、電気
性能、機械性能などが優れているため、自動車部品、電
子・電気部品、機械部品などの広範囲の用途に利用され
ている。しかし、従来のフェノール樹脂成形材料は、9
0〜125℃に可塑化された溶融状態では材料中の樹脂
の硬化反応の進行によって、粘度が増大し、10〜30
分間で流動性を失う性質を有しており、可塑化溶融樹脂
の熱安定性が極めて低い。このため、従来のフェノール
樹脂成形材料を射出成形する場合、射出成形機のシリン
ダー内での可塑化溶融された成形材料の熱安定性が著し
く劣り、適正な成形条件幅が極めて狭い問題がある。従
来この問題を解決する方法として成形材料の流動性を増
大させるなどの各種の方法が知られているが、可塑化溶
融状態での熱安定性を向上させると金型内での150〜
200℃における硬化反応が遅くなり、また逆に、金型
内での硬化性を向上させると、熱安定性が劣るようにな
り、可塑化溶融状態の熱安定性と金型内の硬化性との両
方を同時に向上したフェノール樹脂成形材料を得ること
は困難である。
2. Description of the Related Art Phenolic resin molding materials are excellent in heat resistance, electrical performance, mechanical performance and the like, and are therefore used in a wide range of applications such as automobile parts, electronic / electrical parts and mechanical parts. However, the conventional phenol resin molding material is 9
In the molten state plasticized to 0 to 125 ° C., the viscosity increases due to the progress of the curing reaction of the resin in the material.
It has the property of losing fluidity in minutes, and the thermal stability of the plasticized molten resin is extremely low. Therefore, when a conventional phenol resin molding material is injection-molded, there is a problem that the plasticization-melted molding material in the cylinder of the injection molding machine is significantly inferior in thermal stability and an appropriate molding condition range is extremely narrow. Conventionally, various methods such as increasing the fluidity of the molding material have been known as a method for solving this problem. However, if the thermal stability in the plasticized and molten state is improved, it is 150-
The curing reaction at 200 ° C. slows down, and conversely, when the curability in the mold is improved, the thermal stability becomes poor, and the thermal stability in the plasticized and molten state and the curability in the mold are reduced. It is difficult to obtain a phenol resin molding material in which both of the above are simultaneously improved.

【0003】[0003]

【発明が解決しようとする課題】本発明は、可塑化溶融
状態での熱安定性と金型内での硬化性とが両立向上した
成形加工性性の優れたフェノール樹脂成形材料を得るた
め種々の検討の結果なされたものであり、その目的とす
るところは特に、射出成形においてシリンダー内での可
塑化溶融状態での熱安定性が著しく優れ、金型内での硬
化性が極めて優れたフェノール樹脂成形材料を提供する
にある。
DISCLOSURE OF THE INVENTION The present invention provides various kinds of phenol resin molding materials having excellent molding processability in which both thermal stability in a plasticized and molten state and curability in a mold are improved. The result of the study was that the purpose of the phenol is particularly excellent in the thermal stability in the plasticized molten state in the cylinder in injection molding, and the curability in the mold is extremely excellent. To provide a resin molding material.

【0004】[0004]

【課題が解決するための手段】本発明は、(a)フェノ
ール樹脂、(b)軟化点110〜150℃の壁材を持つ
ヘキサメチレンテトラミンのマイクロカプセル、(c)
充填剤を含有することを特徴とするフェノール樹脂成形
材料に関するものである。本発明のフェノール樹脂は、
フェノール類とホルムアルデヒド類との反応で得られる
通常のノボラック型フェノール樹脂が用いられる。該フ
ェノール樹脂のフェノール類としては、フェノール、ク
レゾール、キシレノール、ナフトール、p−t−ブチル
フェノール、ビスフェノールA、レゾルシン等の1価並
びに多価のフェノール類およびそれらの置換体の1種ま
たは2種以上を例示することが出来る。該ホルムアルデ
ヒド類としては、ホルマリン、パラホルムアルデヒドな
どをあげることが出来る。また本発明のフェノール樹脂
は芳香族炭化水素樹脂、ジメトキシパラキシレン、ジシ
クロペンタジエンなどで適宜変性したものを用いること
が出来る。
The present invention provides (a) a phenol resin, (b) hexamethylenetetramine microcapsules having a wall material having a softening point of 110 to 150 ° C., (c).
The present invention relates to a phenolic resin molding material containing a filler. The phenolic resin of the present invention is
A normal novolac type phenol resin obtained by the reaction of phenols and formaldehyde is used. As the phenols of the phenolic resin, one or more of monovalent and polyvalent phenols such as phenol, cresol, xylenol, naphthol, pt-butylphenol, bisphenol A, resorcin and their substitution products are used. It can be illustrated. Examples of the formaldehydes include formalin and paraformaldehyde. Further, as the phenol resin of the present invention, those modified with aromatic hydrocarbon resin, dimethoxyparaxylene, dicyclopentadiene and the like can be used.

【0005】本発明の軟化点110〜150℃の壁材を
持つヘキサメチレンテトラミンのマイクロカプセルは、
110℃以下では強固であって、フェノール樹脂には殆
ど溶解せず、110〜150℃では軟化し、更に高い温
度では流動状態となる壁材でカプセル化されたヘキサメ
チレンテトラミンであり、0.5 〜30μmの粒径を有
する球状ないしフロック状のものを1種又は2種以上用
いることができる。該マイクロカプセルの壁材として
は、ポリスチレン、ポリカーボネート、エチルセルロー
ス、スチレンブタヂエン共重合体、酢酸ビニルエチレン
共重合体、ポリ塩化ビニル、ポリアクリル酸エステル、
ポリアミドなどを例示することができる。好ましい壁材
はポリアクリル酸エステルであり、さらに好ましくはポ
リメチルメタクリレート及びその共重合体である。
The hexamethylenetetramine microcapsules having a wall material having a softening point of 110 to 150 ° C. according to the present invention are
Hexamethylenetetramine, which is strong at 110 ° C or lower, hardly dissolves in a phenol resin, softens at 110 to 150 ° C, and becomes fluid at higher temperatures, is hexamethylenetetramine, which is 0.5. One type or two or more types of spherical or flocked particles having a particle size of ˜30 μm can be used. As the wall material of the microcapsule, polystyrene, polycarbonate, ethyl cellulose, styrene butadiene copolymer, vinyl acetate ethylene copolymer, polyvinyl chloride, polyacrylic ester,
Polyamide etc. can be illustrated. The preferred wall material is polyacrylic acid ester, more preferably polymethylmethacrylate and its copolymer.

【0006】このようなヘキサメチレンテトラミンのマ
イクロカプセルは例えば、ポリメチルメタクリレートを
二塩化エチレンに溶解し、これに微粉末状のヘキサメチ
レンテトラミンを分散させ、次いでこれを分散安定剤を
含む多量の水中に投入、分散させ、真空下で二塩化エチ
レンを蒸発させ、次いでろ過して、乾燥することにより
得ることができる。本発明において、ヘキサメチレンテ
トラミンのマイクロカプセルはフェノール樹脂100重
量部に対して、7〜30重量部配合して用いられる。こ
の配合量が7重量部以下では樹脂の硬化が不十分とな
り、30重量部以上では硬化物の機械的、電気的特性が
低下するようになる。
Such hexamethylenetetramine microcapsules are prepared, for example, by dissolving polymethylmethacrylate in ethylene dichloride, dispersing hexamethylenetetramine in fine powder form, and then dispersing this in a large amount of water containing a dispersion stabilizer. , Ethylene dichloride is evaporated under vacuum, followed by filtration and drying. In the present invention, the hexamethylenetetramine microcapsules are used by mixing 7 to 30 parts by weight with respect to 100 parts by weight of the phenol resin. If the content is 7 parts by weight or less, the curing of the resin will be insufficient, and if it is 30 parts by weight or more, the mechanical and electrical properties of the cured product will be deteriorated.

【0007】本発明において、硬化促進剤を併用するこ
とにより、さらに熱安定性、硬化性の優れたフェノール
樹脂成形材料を得ることができる。該硬化促進剤として
は、特に限定されず、通常の硬化促進剤を用いることが
出来、例えば、酸化マグネシウム、水酸化カルシウム、
水酸化バリウムなどのアルカリ土類金属の酸化物又は水
酸化物、サリチル酸、安息香酸などの芳香属カルボン酸
を例示することができる。これらの硬化促進剤はフェノ
ール樹脂100重量部に対して、0.5 〜20重量部の
割合で適宜配合して用いられる。本発明の充填剤として
は、木粉、パルプ粉、各種織物粉砕物、熱硬化性樹脂積
層板・成形品の粉砕品などの有機質のもの、シリカ、ア
ルミナ、水酸化アルミニウム、ガラス、タルク、クレ
ー、マイカ、炭酸カルシウム、カーボンなどの無機質の
粉末のもの、ガラス繊維、カーボン繊維、アスベストな
どの無機質繊維が用いられ、これらの1種又は2種以上
を用いることが出来る。これらの充填剤はフェノール樹
脂100重量部に対して50〜150重量部配合して用
いられる。
In the present invention, a phenol resin molding material having more excellent thermal stability and curability can be obtained by using a curing accelerator together. The curing accelerator is not particularly limited, and a usual curing accelerator can be used, such as magnesium oxide, calcium hydroxide,
Examples thereof include alkaline earth metal oxides or hydroxides such as barium hydroxide, and aromatic carboxylic acids such as salicylic acid and benzoic acid. These curing accelerators are used by appropriately blending them in a proportion of 0.5 to 20 parts by weight with respect to 100 parts by weight of the phenol resin. Examples of the filler of the present invention include wood powder, pulp powder, various pulverized products of woven fabric, organic products such as pulverized products of thermosetting resin laminates and molded products, silica, alumina, aluminum hydroxide, glass, talc, clay. Inorganic powders such as mica, calcium carbonate, and carbon, and inorganic fibers such as glass fiber, carbon fiber, and asbestos are used, and one or more of these can be used. These fillers are used by mixing 50 to 150 parts by weight with respect to 100 parts by weight of the phenol resin.

【0008】本発明において、必要により難燃剤、着色
剤、離型剤などの添加剤を適宜配合して用いることがで
きる。また、本発明において、必要によりレゾール型フ
ェノール樹脂、レゾルシン、ビスフェノールF、ビフェ
ノールなどのフェノール化合物をフェノール樹脂100
重量部に対して20重量部以内で適宜配合して用いるこ
とが出来る。本発明のフェノール樹脂成形材料は、フェ
ノール樹脂、ヘキサメチレンテトラミンのマイクロカプ
セル、充填剤及び硬化促進剤などの各種添加剤を配合
し、ロールミル、2軸混練機などで溶融混練し、冷却
後、粉砕して製造する方法等、通常の方法で製造するこ
とが出来る。このような成形材料の製造過程では、ヘキ
サメチレンテトラミンのマイクロカプセルはその壁材が
破壊されることなく形状を保持している。
In the present invention, additives such as a flame retardant, a coloring agent and a release agent can be appropriately blended and used. In the present invention, if necessary, a phenol compound such as a resole type phenol resin, resorcin, bisphenol F or biphenol may be added to the phenol resin 100.
It can be used by appropriately mixing within 20 parts by weight with respect to parts by weight. The phenol resin molding material of the present invention contains various additives such as a phenol resin, microcapsules of hexamethylenetetramine, a filler and a curing accelerator, melt-kneaded with a roll mill, a twin-screw kneader, etc., cooled, and then ground. It can be manufactured by a usual method such as a method of manufacturing. During the manufacturing process of such a molding material, the hexamethylenetetramine microcapsules retain their shape without breaking the wall material.

【0009】[0009]

【作用】本発明のフェノール樹脂成形材料は、90〜1
25℃の可塑化溶融状態で著しく熱安定性が優れてお
り、金型内での150〜200℃での硬化性が極めて優
れている。この理由は、90〜125℃の可塑化溶融状
態の成形材料中では、ヘキサメチレンテトラミンのマイ
クロカプセルの壁材がフェノール樹脂とヘキサメチレン
テトラミンとの接触を遮蔽して硬化反応の進行を防止し
ているが、150〜200℃では壁材が溶融破壊し、硬
化反応が進行することによる。
The function of the phenol resin molding material of the present invention is 90 to 1
It is remarkably excellent in thermal stability in a plasticized and melted state at 25 ° C., and is extremely excellent in curability in a mold at 150 to 200 ° C. The reason for this is that in the molding material in a plasticized molten state at 90 to 125 ° C., the wall material of the hexamethylenetetramine microcapsules shields the contact between the phenol resin and hexamethylenetetramine to prevent the progress of the curing reaction. However, at 150 to 200 ° C., the wall material melts and breaks, and the curing reaction proceeds.

【0010】[0010]

【実施例】以下、実施例により本発明を説明する。ここ
において「部」は重量部を表す。 [実施例1]フェノールとホルムアルデヒドとの反応で
得たノボラック樹脂(数平均分子量800)44部、壁
材にポリメチルメタクリレートを用いたヘキサメチレン
テトラミンのマイクロカプセル(壁材の割合はヘキサメ
チレンテトラミン70重重量部に対して30重量部であ
る)10部、水酸化カルシウム3.5 部、木粉30部、
炭酸カルシウム10部、離型剤2部を混合し、2本ロー
ルミルにて溶融混練し、冷却後粉砕してフェノール樹脂
成形材料を得た。 [実施例2]実施例1のヘキサメチレンテトラミンのマ
イクロカプセルの代わりに、ポリスチレンを壁材とした
ヘキサメチレンテトラミンのマイクロカプセル(壁材の
割合はヘキサメチレンテトラミン70重重量部に対して
30重量部である)10部を用い、実施例1と同様にし
てフェノール樹脂成形材料を得た。 [比較例1]フェノールとホルムアルデヒドとの反応で
得たノボラック樹脂(数平均分子量800)44部、ヘ
キサメチレンテトラミン粉末7部、水酸化カルシウム4
部、木粉32部、炭酸カルシウム11部、離型剤2部を
混合し、2本ロールミルにて溶融混練し、冷却後粉砕し
てフェノール樹脂成形材料を得た。
EXAMPLES The present invention will be described below with reference to examples. Here, "parts" represent parts by weight. [Example 1] 44 parts of a novolak resin (number average molecular weight 800) obtained by the reaction of phenol and formaldehyde, hexamethylenetetramine microcapsules using polymethylmethacrylate as a wall material (the proportion of the wall material is hexamethylenetetramine 70). 10 parts by weight, which is 30 parts by weight with respect to heavy parts, 3.5 parts of calcium hydroxide, 30 parts of wood flour,
10 parts of calcium carbonate and 2 parts of a release agent were mixed, melt-kneaded with a two-roll mill, cooled and pulverized to obtain a phenol resin molding material. [Example 2] Instead of the hexamethylenetetramine microcapsules of Example 1, hexamethylenetetramine microcapsules containing polystyrene as a wall material (the ratio of the wall material is 30 parts by weight with respect to 70 parts by weight of hexamethylenetetramine). Was obtained) and a phenol resin molding material was obtained in the same manner as in Example 1. [Comparative Example 1] 44 parts of novolac resin (number average molecular weight 800) obtained by the reaction of phenol and formaldehyde, 7 parts of hexamethylenetetramine powder, and 4 parts of calcium hydroxide.
Parts, 32 parts of wood powder, 11 parts of calcium carbonate, and 2 parts of a release agent were mixed, melt-kneaded with a two-roll mill, cooled and pulverized to obtain a phenol resin molding material.

【0011】実施例1〜2及び比較例1で得たフェノー
ル樹脂の材料特性を表1に示す。
Table 1 shows the material properties of the phenolic resins obtained in Examples 1 and 2 and Comparative Example 1.

【表1】 [Table 1]

【0012】表1の熱安定性は可塑化溶融状態での成形
材料の熱安定性を表すものであり、次の方法で測定した
ものである。100℃に保たれたラボプラストミル(東
洋精機株式会社製)に粉末状の成形材料を28g仕込
み、ロータを回転させて成形材料を可塑化溶融させ、ロ
ータ回転のトルクを測定する。樹脂の硬化進行によって
粘度が増大するにしたがってトルクは増大し、ついには
流動性を失ってトルクが急激増加する。測定開始からこ
の急にトルクが立ち上げるまでの時間を測定し、この時
間を熱安定性とした。時間が長いほど熱安定性が良好で
ある。表1の硬化性は金型内での成形材料の硬化速度を
表すものであり、直径50mm,厚さ3mmのキャビテ
ィーを有し、175℃に保たれた金型を有するトランス
ファー成形機に高周波予熱機で100〜105℃に余熱
されたタブレット状の30gの成形材料を仕込んで40
秒間成形し、ついで成形品を取り出し10秒後の成形品
硬度をバーコール硬度計No.935で測定したもので
ある。硬度が高いほど硬化速度が早く、硬化性が優れて
いる。
The thermal stability in Table 1 represents the thermal stability of the molding material in the plasticized and molten state, and was measured by the following method. 28 g of a powdery molding material is charged into a Labo Plastomill (manufactured by Toyo Seiki Co., Ltd.) kept at 100 ° C., the rotor is rotated to plasticize and melt the molding material, and the torque of rotor rotation is measured. The torque increases as the viscosity increases with the progress of curing of the resin, and finally the fluidity is lost and the torque rapidly increases. The time from the start of measurement to the sudden rise in torque was measured, and this time was defined as thermal stability. The longer the time, the better the thermal stability. The curability in Table 1 represents the curing speed of the molding material in the mold, and a transfer molding machine having a cavity with a diameter of 50 mm and a thickness of 3 mm and having a mold kept at 175 ° C. was used for high frequency. 40g was prepared by charging 30g of tablet-shaped molding material that was preheated to 100-105 ° C with a preheater.
Molded for 2 seconds, taken out of the molded product, and the hardness of the molded product after 10 seconds was measured by a Barcol hardness tester No. It was measured at 935. The higher the hardness, the faster the curing speed and the better the curability.

【0013】表1から、実施例1〜2に示した本発明の
フェノール樹脂成形材料は、比較例1の従来のフェノー
ル樹脂成形材料に比較して、極めて熱安定性に優れかつ
硬化性も優れていることがわかる。また、実施例1〜2
及び比較例1のフェノール樹脂成形材料を射出成形し、
途中で成形機を停止してシリンダー内に可塑化溶融状態
の成形材料をそのまま静置したところ、実施例1〜2の
材料はいずれも90分間は放置したのちも、成形機を再
運転すると、成形が出来たが、比較例1の材料は30分
放置間すると、シリンダー内で硬化しまい、再運転する
ことは困難であった。
From Table 1, the phenolic resin molding materials of the present invention shown in Examples 1 and 2 are excellent in thermal stability and curability as compared with the conventional phenolic resin molding material of Comparative Example 1. You can see that Moreover, Examples 1-2
And injection molding the phenolic resin molding material of Comparative Example 1,
When the molding machine was stopped in the middle and the molding material in the plasticized and molten state was allowed to stand in the cylinder as it was, after leaving all the materials of Examples 1 and 2 for 90 minutes, when the molding machine was restarted, Although molding was possible, the material of Comparative Example 1 hardened in the cylinder after being left for 30 minutes, and it was difficult to restart.

【0014】[0014]

【発明の効果】上記の実施例からもわかるように、本発
明のフェノール樹脂成形材料は可塑化溶融状態での熱安
定性と高温時の硬化性が極めて優れている。このため、
特に射出成形において、射出成形機のシリンダー内で可
塑化溶融樹脂の硬化反応の進行が著しく抑制され、かつ
金型内では急速に硬化するため、幅広い成形条件に適応
出来、極めて成形加工性に優れている。また、本発明の
フェノール樹脂成形材料は可塑化溶融状態での熱安定性
が極めて優れているため、スプルー・ランナーレス成形
にも極めて適している。
As can be seen from the above examples, the phenol resin molding material of the present invention has extremely excellent thermal stability in the plasticized and molten state and curability at high temperature. For this reason,
Particularly in injection molding, the progress of the curing reaction of the plasticized molten resin in the cylinder of the injection molding machine is significantly suppressed, and it rapidly cures in the mold, so it can be applied to a wide range of molding conditions and has excellent molding processability. ing. Further, the phenol resin molding material of the present invention is extremely suitable for sprue / runnerless molding because it has extremely excellent thermal stability in a plasticized and molten state.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 (a)フェノール樹脂、(b)軟化点1
10〜150℃の壁材を持つヘキサメチレンテトラミン
のマイクロカプセル、(c)充填剤を含有することを特
徴とするフェノール樹脂成形材料。
1. A phenolic resin (a), a softening point 1 (b)
A phenol resin molding material comprising hexamethylenetetramine microcapsules having a wall material of 10 to 150 ° C., and (c) a filler.
JP29844892A 1992-11-09 1992-11-09 Phenolic resin molding material Pending JPH06145420A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29844892A JPH06145420A (en) 1992-11-09 1992-11-09 Phenolic resin molding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29844892A JPH06145420A (en) 1992-11-09 1992-11-09 Phenolic resin molding material

Publications (1)

Publication Number Publication Date
JPH06145420A true JPH06145420A (en) 1994-05-24

Family

ID=17859846

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29844892A Pending JPH06145420A (en) 1992-11-09 1992-11-09 Phenolic resin molding material

Country Status (1)

Country Link
JP (1) JPH06145420A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6506494B2 (en) 1999-12-20 2003-01-14 3M Innovative Properties Company Ambient-temperature-stable, one-part curable epoxy adhesive
EP1358214A2 (en) * 2001-02-07 2003-11-05 Bakelite AG Thermosetting resin-fiber composite and method and apparatus for the manufacture thereof
US7659327B2 (en) * 2005-08-11 2010-02-09 Ashland Licensing And Intellectual Property, Llc Coated microspheres and their use

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6506494B2 (en) 1999-12-20 2003-01-14 3M Innovative Properties Company Ambient-temperature-stable, one-part curable epoxy adhesive
EP1358214A2 (en) * 2001-02-07 2003-11-05 Bakelite AG Thermosetting resin-fiber composite and method and apparatus for the manufacture thereof
US7659327B2 (en) * 2005-08-11 2010-02-09 Ashland Licensing And Intellectual Property, Llc Coated microspheres and their use
US20100099794A1 (en) * 2005-08-11 2010-04-22 Aufderheide Ronald C Coated microspheres and their uses
US8367749B2 (en) * 2005-08-11 2013-02-05 Ask Chemicals L.P. Coated microspheres and their uses

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