JPH06143885A - Module structure of ic card - Google Patents

Abstract

PURPOSE:To make it easy to manufacture an IC card module of a simple structure having superb impact resistance and light shielding properties. CONSTITUTION:The finger part 6 of a single layer circuit board 1 with a single face pattern is molded by bending leaving a light-shielding pattern 5, in a device hole 3, and in such a manner that the part 6 comes to almost the equal position to the lower face. Further, the end of the finger part 6 is connected to an IC chip by a bump 7, and both parts are side potted using a holding bracket 8. Further, the IC chip 2 is allowed to protrude from the circuit board 1 and mounted by permitting a resin area 11 to cover an area from the same plane as an electroconductive pattern 4 on the circuit board 1 to the lateral surface of the IC chip including the thickness of the circuit board 1. Consequently, it is possible to protect the IC chip against external impacts and also external light and manufacture the module structure of an IC card having high reliability and productivity at low cost without the necessity of a molding die.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card module structure in which a conductive pattern is formed on one surface of a circuit board on which an IC chip is mounted.

[0002]

2. Description of the Related Art In recent years, various kinds of cards such as cash cards, credit cards, various members' cards, hospital medical tickets, etc. have been distributed, and are becoming indispensable for our daily lives. Currently, magnetic cards are the mainstream of these cards, but the magnetic cards have a limit in expanding functions because of their small storage capacity, and also have a limit in terms of security and reliability. As a multi-function card that has a high storage capacity and breaks the limit of this magnetic card and has a high security function, C
It is well known that an IC card equipped with a PU, a memory chip, etc. has appeared.

Therefore, as a module structure of a conventional IC card in which a conductive pattern is formed on one surface of a circuit board on which an IC chip is mounted, concrete examples are disclosed in Japanese Patent Publication No. 1-58657 and Japanese Patent Application Laid-Open No. 57-10258. It is disclosed.

First, an outline of the conventional technique disclosed in Japanese Patent Publication No. 1-58657 will be described with reference to FIG. The IC chip 32 arranged in the window 31 of the film 30 is bonded to the end portion of the contact lead 33 formed in another step by another appropriate device, and is connected to the contact region 34 at one end of the contact lead 33. A conductive layer 35 is formed. After that, it is sealed with resin 36 using a molding die, but the conductive layer 35 is formed slightly higher than the molding surface, and when incorporated in the identification card, this layer 35 forms a film with the coating of the identification card body. If the layers 35 are coplanar and the layer 35 is a conductive material, a direct contact method can be used. When this layer is formed of a non-conductive material, a technique is disclosed in which the contact region of the needle may be penetrated through this layer.

Next, as another conventional technique, Japanese Patent Laid-Open No. 57-
The outline of Japanese Patent No. 10258 will be described with reference to FIG. The film-shaped support 40 has an opening 4 for receiving the IC chip 41.
2 and a support 4 by a known photoetching method.
A lead 43 formed of a conductive film laminated on the substrate 0 extends into the opening 42 and is connected to the IC chip 41. The thickness of the support 40 is the same as that of the IC chip 41.
And the thickness of the connection lead 43 provided on the IC chip 41 are added. Furthermore, I
The opening 42 for mounting the C chip 41 is filled with a moldable material 44 that can be poured into the opening 42 after connecting the IC chip. By this I
Techniques such as protecting the C chip 41 and the connection leads 43 are disclosed.

[0006]

However, each of these conventional techniques has the following problems. In the conventional technique disclosed in Japanese Patent Publication No. 1-58657, as shown in FIG.
It is necessary to accurately align the C chip, and the IC chip cannot be fixed unless the whole is molded,
Since it is necessary to form the external connection terminals slightly higher than the molding surface, high molding accuracy is required.
The manufacturing cost increases due to the IC chip alignment device and the molding die. In addition, there is a problem in that the thickness of the single unit is increased due to the whole molding.

Further, in another prior art disclosed in the above-mentioned Japanese Patent Laid-Open No. 57-10258, as shown in FIG. 5, the IC chip and the connection lead are housed in the thickness of the support and resin-sealed. However, since the resin sealing region is thin and small with respect to the thickness of the support, the upper surface of the IC chip cannot be sufficiently protected from external impacts and light rays, resulting in problems with impact resistance and light shielding. Yes Unreliable.

The present invention has been made in view of the above problems of the prior art, and an object thereof is to provide an IC card module having a simple structure, excellent impact resistance and light shielding properties, and easy to manufacture. .

[0009]

In order to achieve the above object, a module structure of an IC card according to the present invention has a conductive pattern formed on a top surface of a circuit board having an opening for mounting an IC chip. And the light-shielding pattern is left inside the opening of the circuit board, and the finger portions of the conductive pattern are bent and formed so as to be substantially in the same position as the lower surface of the circuit board. , And the resin region is covered with the conductive pattern formed on the upper surface of the circuit board so that the side of the IC chip including the thickness of the circuit board is covered with the conductive pattern formed on the upper surface of the circuit board. When stopped, the IC chip is projected from the lower surface of the circuit board.

[0010]

Therefore, in the module structure of the IC card obtained according to the present invention, the IC chip is mounted on the one-sided circuit board having the conductive pattern formed on one surface thereof so that the IC chip projects from the surface opposite to the surface on which the conductive pattern is formed. Since the resin region can be ensured to be thicker than the thickness of the circuit board, the strength of the opening of the circuit board can be increased and the impact resistance of the IC chip can be improved.
The light-shielding property can be improved.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below with reference to the drawings. 1 is a cross-sectional view showing a module structure of an IC card of the present invention, FIG. 2 is a cross-sectional view showing a state where the IC card module of FIG. 1 is housed in a card substrate, and FIG.
FIG.

First, referring to FIGS. 1 and 3, the circuit board 1
Is made of glass epoxy resin, for example, FR-4, and has a thin plate thickness of, for example, about 0.1 mm.
The device hole 3 is arranged at a position corresponding to the mounting portion of the IC chip 1 in one layer. A conductive pattern 4 is formed by forming a copper foil pattern on one surface (upper surface) of the circuit board 1 and then etching it into a predetermined shape. Next, in the conductive pattern 4, the light-shielding pattern 5 is left so as to cover the IC chip 2, and the finger portions 6 are placed in the device holes 3 arranged in the circuit board 1 at substantially the same position as the lower surface of the circuit board 1. Forming processing (bending forming) is performed as described above, and further, the ends of the formed finger portions 6 and the IC chip 2 are connected by the pump 7. The above-described forming process is performed with the lower surface of the circuit board 1 placed on a flat surface plate and using the lower surface as a reference, so that the bending dimension does not vary and is accurately formed. Then, a conductive pattern 4 and a light-shielding pattern whose Teflon surface is formed on the circuit board 1 by a substance having a property of easily peeling off from the resin on at least one surface, for example, a Teflon plate or a plate-shaped holding jig 8 coated with Teflon. Press 5 to prevent the flow of the sealing resin. When a black potting resin having a thermoplastic and light-shielding property is injected by a so-called side potting method from the side of the IC chip 2 on the lower surface of the circuit board 1 by using a so-called side potting method, the resin 10 is capillarity. And the circuit board 1 to be sealed together. At this time, the resin region 11 reaches a range covering the side surface of the IC chip 2 including the thickness of the circuit board 1 from the same plane as the conductive pattern 4 of the circuit board 1, and the thick resin region 11 of the thin one-layer circuit board 1 By increasing the strength of the device hole 3 and improving the light blocking effect, the IC chip 2
It has the function of protecting the unit from external impacts and light rays.
The light-shielding pattern 5 located above the IC chip 2 is I
It is useful for shading the C chip 2. By removing the holding jig 8 after the side potting is completed, the potted resin 10 is flush with the conductive pattern 4 without bulging on the upper surface of the circuit board 1, and
The IC chip 2 is mounted so as to project from the lower surface of the circuit board 1 to complete the IC card module 12.

Next, referring to FIG. 2, the IC completed as described above.
In order to store and fix the card module 12 in the card substrate 20, the IC card module 12 is mounted on the card substrate 20.
A concave portion 21 for accommodating the above is provided, and the stepped portion 22 with which the lower surface of the circuit board 1 abuts is securely fixed by an adhesive means such as a thermocompression bonding sheet 23. However, the upper surface of the card substrate 20 and the module 12 of the stored IC card 12 It is preferable to preset the mutual thicknesses of the members so that the conductive pattern 4, the light shielding pattern 5 and the upper surface of the resin 10 are flush with each other. As is clear from FIG. 2, the IC chip 2 has the concave portion 21 of the card substrate 20.
Since it goes inside, it is not necessary to cover the resin region 11 to the lower surface of the IC chip 2.

Therefore, the feature of this embodiment is that
As mentioned above, it is a single-sided thin circuit board,
The IC chip protrudes from the lower surface of the circuit board on the side opposite to the pattern, and the pattern side is pressed by a pressing jig for side potting, so that the resin area has the upper surface flush with the pattern surface and fills the device hole for reinforcement. And
Since the resin region on the upper surface of the IC chip is thick, it protects the IC chip from external impact and light rays in cooperation with the light shielding pattern covering the upper surface of the IC chip.

[0015]

As described above, according to the present invention,
The IC card module is a circuit board having a single layer and a thin single-sided pattern, and the IC chip is side-potted by protruding from the lower surface of the circuit board, and the resin region is flush with the conductive pattern on the upper surface of the circuit board, which is suitable as an IC card. is there. Further, since the resin region fills the thickness of the circuit board, the strength of the opening is increased, and the thick resin region protects the element forming surface of the IC chip from external impact and light rays. Further, the resin encapsulation can provide a low-priced IC card module which has a simple structure and is excellent in reliability and productivity, such as eliminating the need for a molding die which requires high equipment cost.

[Brief description of drawings]

FIG. 1 is a sectional view showing a module structure of an IC card according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a state where the module of the IC card of FIG. 1 is housed in a card substrate.

FIG. 3 is a plan view of an essential part of FIG.

FIG. 4 is a sectional view showing a module structure of a conventional IC card.

FIG. 5 is a sectional view showing a module structure of another conventional IC card.

[Explanation of symbols]

 1 Circuit board 2 IC chip 3 Device hole 4 Conductive pattern 5 Light-shielding pattern 6 Finger part 8 Holding jig 10 Resin 11 Resin area 12 IC card module 20 Card board

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location H01L 23/28 Z 8617-4M T 8617-4M

Claims (1)

[Claims] 1. A conductive pattern is formed on an upper surface of a circuit board having a single layer in which an opening for mounting an IC chip is provided,
Inside the opening of the circuit board, the light-shielding pattern is left, and the finger portion of the conductive pattern is bent and formed so as to be substantially in the same position as the lower surface of the circuit board, and the end of the bent finger portion and the IC chip are connected by a pump. Then, the IC chip is integrally resin-sealed on the circuit board so that the resin region covers the side surface of the IC chip including the thickness of the circuit board from the same plane as the conductive pattern formed on the upper surface of the circuit board. A module structure of an IC card, wherein the IC chip projects from a lower surface of a circuit board.