JPH06142953A - Laser beam machine - Google Patents
Laser beam machineInfo
- Publication number
- JPH06142953A JPH06142953A JP3049028A JP4902891A JPH06142953A JP H06142953 A JPH06142953 A JP H06142953A JP 3049028 A JP3049028 A JP 3049028A JP 4902891 A JP4902891 A JP 4902891A JP H06142953 A JPH06142953 A JP H06142953A
- Authority
- JP
- Japan
- Prior art keywords
- scanner
- output
- laser
- laser beam
- laser light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Numerical Control (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【0001】[0001]
【技術分野】本発明はレーザ加工装置に関し、加工位置
検出補正機能付きのレーザ加工装置に関するものであ
る。TECHNICAL FIELD The present invention relates to a laser processing apparatus, and more particularly to a laser processing apparatus having a processing position detection / correction function.
【0002】[0002]
【従来技術】従来のこの種の加工位置検出,補正機能付
きのレーザ加工装置の模式的構成図を図2に示す。2. Description of the Related Art FIG. 2 shows a schematic configuration diagram of a conventional laser processing apparatus having such a processing position detecting and correcting function.
【0003】被加工物44の近傍位置に予め設けられて
いる複数の基準マーク44をCCDカメラ1にて撮像
し、これを画像認識部40を介してモニタ41に表示す
る。そして、この映像から複数の基準マーク44の相互
間の重心位置つまり被加工部44の中心位置を画像認識
部40により認識する。A plurality of reference marks 44 provided in advance in the vicinity of the workpiece 44 are imaged by the CCD camera 1 and displayed on the monitor 41 via the image recognition section 40. Then, the image recognition unit 40 recognizes the position of the center of gravity between the plurality of reference marks 44, that is, the center position of the processed portion 44 from this image.
【0004】この認識されたデータを基に、スキャナミ
ラー付きオプティカルスキャナ9,10による加工レー
ザ光の走査範囲中心位置の補正量をコンピュータ42に
より算出する。この補正結果に応じて制御部43はオプ
ティカルスキャナ9,10の走査制御を行うようになっ
ている。Based on the recognized data, the computer 42 calculates the correction amount of the central position of the scanning range of the processing laser light by the optical scanners 9 and 10 with scanner mirrors. The control unit 43 controls the scanning of the optical scanners 9 and 10 according to the correction result.
【0005】すなわち、レーザ光の走査範囲中心位置
と、画像認識を行った結果の基準マーク間中心位置(被
加工物中心位置)との差を、コンピュータにて算出し、
その差分を指令座標値にフィードバックして補正するこ
とで、常に被加工物中心位置とオプティカルスキャナ原
点位置及び移動座標指令値に対する実際の移動量を一致
するようにしているのである。That is, the difference between the center position of the scanning range of the laser beam and the center position between the reference marks (the center position of the workpiece) resulting from image recognition is calculated by a computer,
By feeding back the difference to the command coordinate value and correcting it, the actual position of the workpiece center position is consistent with the optical scanner origin position and the actual moving amount with respect to the moving coordinate command value.
【0006】尚、5,12は全反射ミラー,11はfθ
レンズ,16は加工時の不要物を吹飛ばすアシストガス
ノズル,17は透明窓を夫々示している。Reference numerals 5 and 12 are total reflection mirrors, and 11 is f θ.
Reference numeral 16 is a lens, 16 is an assist gas nozzle for blowing away unnecessary substances during processing, and 17 is a transparent window.
【0007】この様な従来のレーザ加工装置では、高分
解態で高精度の画像認識を行う場合、基準となるマーク
を新たに被加工物近傍に設けなければならず、またこの
基準マークを取込むための高倍率の観察光学系及び画像
認識装置が必要となって、小型化及びローコスト化を妨
げる要因となる。In such a conventional laser processing apparatus, in order to perform high-resolution and high-accuracy image recognition, a reference mark must be newly provided in the vicinity of the workpiece, and the reference mark must be removed. A high-magnification observing optical system and an image recognition device are required for this purpose, which is a factor that hinders downsizing and cost reduction.
【0008】また、加工能力的にも、認識,計算,補
正,あるいは切断,加工に必要なX−Yステージに取付
けてあるアシストガスノズルが退避する時間が必要であ
り、一連の加工処理動作に大幅な時間を費やすという欠
点がある。Further, in terms of processing capability, it is necessary to take time for the assist gas nozzle attached to the XY stage required for recognition, calculation, correction, cutting, and processing to retreat, which greatly affects a series of processing operations. Has the disadvantage of spending a lot of time.
【0009】[0009]
【発明の目的】本発明の目的は、オプティカルスキャナ
の温度ドリフトによる影響を簡単な構成でかつ高速に除
去することが可能なレーザ加工装置を提供することであ
る。SUMMARY OF THE INVENTION An object of the present invention is to provide a laser processing apparatus capable of removing the influence of temperature drift of an optical scanner with a simple structure and at high speed.
【0010】[0010]
【発明の構成】本発明によれば、加工用及び位置検出用
レーザ光を夫々出射するレーザ発振器と、これ等両レー
ザ光を走査するスキャナ光学部と、前期スキャナ光学部
を経た前記位置検出用レーザ光の基準位置からの変位状
態を検出する変位検出部と、この変位検出部による変位
量に応じて前記スキャナ光学部の制御を行う制御部とを
含むことを特徴とするレーザ加工装置が得られる。According to the present invention, a laser oscillator for emitting a laser beam for processing and a laser oscillator for emitting a laser beam for position detection, a scanner optical section for scanning these laser beams, and the position detecting section through the scanner optical section in the previous period. A laser processing apparatus including: a displacement detection unit that detects a displacement state of a laser beam from a reference position; and a control unit that controls the scanner optical unit according to a displacement amount by the displacement detection unit. To be
【0011】[0011]
【実施例】次に、本発明の実施例を図面を参照して詳細
に説明する。Embodiments of the present invention will now be described in detail with reference to the drawings.
【0012】まず、本発明の実施例に用いられる光学系
の構成を図2を用いて説明する。位置検出用半導体レー
ザ発振器3より出力した半導体レーザ光3−aはコリメ
ータ4により平行光になって、全反射ミラー5で折り返
され、加工用YAGレーザ光6と同軸になる。First, the structure of the optical system used in the embodiment of the present invention will be described with reference to FIG. The semiconductor laser light 3-a output from the position detecting semiconductor laser oscillator 3 becomes parallel light by the collimator 4, is reflected by the total reflection mirror 5, and becomes coaxial with the processing YAG laser light 6.
【0013】YAGレーザ光6はコリメータ7で平行光
になり、全反射ミラー8で折り返され、ミラー付きX軸
オプティカルスキャナ9とY軸オプティカルスキャナ1
0とで走査される。The YAG laser light 6 is collimated by the collimator 7 and is reflected by the total reflection mirror 8. The X-axis optical scanner 9 with a mirror and the Y-axis optical scanner 1 are provided.
0 and scan.
【0014】fθレンズ11で絞られながらYAGレー
ザ光全反射ミラー12でYAGレーザは下方へ折り返さ
れ、ノズル窓ガラス17とアシストガスノズル16とを
通過し、加工部19で集光することになる。アシストガ
スノズル16は窓ガラス17と共にX−Yステージ18
でYAGレーザ光6と同期移動を行ない、加工時不要物
を吹きとばす。アシストガスノズル16には高圧気体が
流入している。While being focused by the f θ lens 11, the YAG laser beam is totally reflected back by the YAG laser beam total reflection mirror 12, passes through the nozzle window glass 17 and the assist gas nozzle 16, and is condensed by the processing section 19. . The assist gas nozzle 16 and the window glass 17 together with the XY stage 18
And the YAG laser light 6 are moved in synchronism with, to blow away unnecessary objects during processing. High-pressure gas is flowing into the assist gas nozzle 16.
【0015】一方、YAGレーザ光全反射ミラー12を
透過した半導体レーザ光3−aは半導体レーザ光全反射
ミラー13により上方へ折り返され、位置検出用分割型
フォトダイオード14,15に入光される。分割型フォ
トダイオード14,15からはオプティカルスキャナ
9,10が予め設定されている原点へ移動した場合と、
予め設定されているゲイン検出点に移動した場合との設
定位置からの変移量を信号として出力するようになって
いる。On the other hand, the semiconductor laser light 3-a transmitted through the YAG laser light total reflection mirror 12 is returned upward by the semiconductor laser light total reflection mirror 13 and is incident on the position detecting split type photodiodes 14 and 15. . When the optical scanners 9 and 10 are moved from the split type photodiodes 14 and 15 to a preset origin,
The amount of displacement from the set position when moving to a preset gain detection point is output as a signal.
【0016】図1は本発明の実施例の制御系ブロック図
である。コンピュータ20は半導体レーザ駆動部22へ
位置検出・補正時開始信号を出力し、半導体レーザ3は
駆動部22からの信号でレーザ発振する。FIG. 1 is a block diagram of a control system according to an embodiment of the present invention. The computer 20 outputs a position detection / correction start signal to the semiconductor laser drive unit 22, and the semiconductor laser 3 oscillates with a signal from the drive unit 22.
【0017】フォトダイオード(原点検出用,ゲイン検
出用)14,15はこのレーザ光を受け、予め設定して
ある位置からの変位量を信号として増幅・演算・A/D
変換部24に出力する。この演算結果はコンピュータ2
0に入力され、位置変動量を計算し、補正値を求め補正
後の値でオプティカルスキャナ制御部29へ信号を出力
する。Photodiodes (for origin detection and gain detection) 14 and 15 receive this laser light and amplify / calculate / A / D as a signal the amount of displacement from a preset position.
Output to the conversion unit 24. This calculation result is the computer 2
0 is input, the amount of position variation is calculated, a correction value is calculated, and a signal after correction is output to the optical scanner control unit 29.
【0018】オプティカルスキャナ9,10は制御部2
9からの補正後駆動信号に従い、加工用YAGレーザ発
振器21により出力されたレーザ光をX,Y走査する。
X−Yステージ18にはアシストガスノズルが取付けら
れており、YAGレーザ光と同期して移動する。この移
動量はコンピュータ20より計算された値で駆動部27
からの信号により決定される。The optical scanners 9 and 10 include a control unit 2
In accordance with the corrected drive signal from 9, the laser beam output from the processing YAG laser oscillator 21 is scanned in X and Y directions.
An assist gas nozzle is attached to the XY stage 18 and moves in synchronization with the YAG laser light. This movement amount is a value calculated by the computer 20 and is used by the drive unit 27.
Is determined by the signal from.
【0019】図3に本発明で用いる分割型フォトダイオ
ード14,15と変位信号増幅・演算・A/D 変換部24
との関係の詳細を示す。この分割型フォトダイオードは
X方向エリアギャップ34aとY方向エリア分割ギャッ
プ34bとで4分割されている。4分割されたエリアを
夫々A,B,C,D領域とした時、半導体レーザ光33
bがA領域でのみ集光されている場合、このフォトダイ
オードからの出力はA領域のみから信号が出力される。FIG. 3 shows the split type photodiodes 14 and 15 used in the present invention and the displacement signal amplifying / calculating / A / D converter 24.
Details of the relationship with This split photodiode is divided into four by an X direction area gap 34a and a Y direction area division gap 34b. When the four-divided areas are A, B, C, and D areas, respectively, the semiconductor laser light 33
When b is condensed only in the A region, the output from this photodiode is a signal output only from the A region.
【0020】半導体レーザ33aがA,B,C,D領域
に均等に集光される場合、フォトダイオードからの出力
はA,B,C,D領域から均等に出力される。When the semiconductor laser 33a is uniformly focused in the A, B, C and D areas, the output from the photodiode is evenly output from the A, B, C and D areas.
【0021】フォトダイオードのA,B,C,Dの各領
域から出力された信号を増幅器40,41,42,43
で各々増幅し、B領域とC領域とから出力された信号を
加算し、フォトダイオードのマイナス(−)X方向の出
力信号とし、X方向の増幅器46でA領域、D領域の加
算出力と,マイナス(−)X方向加算出力との差を求め
ることで、X方向の出力信号を得る。The signals output from the A, B, C and D regions of the photodiode are amplified by amplifiers 40, 41, 42 and 43.
Respectively, and the signals output from the B area and the C area are added to each other to form an output signal in the negative (-) X direction of the photodiode, and the amplifier 46 in the X direction adds the output in the A area and the D area, An output signal in the X direction is obtained by obtaining the difference from the minus (-) X direction addition output.
【0022】一方、マイナス(−)Y方向の増幅器45
でC領域とD領域との加算出力を得、Y方向増幅器47
でA領域,B領域の加算出力とマイナス(−)Y方向加
算出力との差を求めることで、Y方向の出力信号を得
る。On the other hand, the minus (-) Y direction amplifier 45
Then, the addition output of the C area and the D area is obtained, and the Y direction amplifier 47
The output signal in the Y direction is obtained by calculating the difference between the added output in the A and B areas and the added output in the negative (-) Y direction.
【0023】X方向,Y方向出力はA/D変換部48で
デジタル変換され、コンピュータ20へ信号を送る。こ
の信号は分割型フォトダイオード上の半導体レーザの集
光位置を表わすので、コンピュータ20は即座に位置デ
ータを読取ることが可能となる。The X-direction and Y-direction outputs are digitally converted by the A / D converter 48 and a signal is sent to the computer 20. Since this signal represents the focus position of the semiconductor laser on the split type photodiode, the computer 20 can immediately read the position data.
【0024】半導体レーザ光集光位置を分割型フォトダ
イオードのセンター位置(0,0),つまり分割型フォ
トダイオードのA,B,C,D各領域からの半導体レー
ザ集光による出力信号が均等になる位置に予め設定して
おくことで、オプティカルスキャナに絶対原点位置を持
つことができる。The semiconductor laser beam focusing position is set to the center position (0, 0) of the split type photodiode, that is, the output signals by the semiconductor laser focusing from the regions A, B, C and D of the split type photodiode are made uniform. The optical scanner can have an absolute origin position by presetting to the position.
【0025】オプティカルスキャナを絶対原点位置へ移
動させた時、オプティカルスキャナ及び制御部の温度ド
リフト等により、必ずしも絶対原点位置に移動できると
は限らない。この時の位置変動量は分割型フォトダイオ
ードセンターからの変位量として表われるので、移動座
標指令値に変動量分オフセットを与えることで、常に絶
対原点位置へ移動することができる。When the optical scanner is moved to the absolute origin position, it cannot always be moved to the absolute origin position due to temperature drift of the optical scanner and the control unit. Since the position variation amount at this time is expressed as a displacement amount from the split type photodiode center, it is possible to always move to the absolute origin position by giving the movement coordinate command value an offset corresponding to the variation amount.
【0026】オプティカルスキャナの移動座標指令値に
対し、温度ドリフト等が原因で実際の移動量は必ずしも
移動座標指令値に一致しないことが多い。この様なゲイ
ン変動に対しても前述の様に分割型フォトダイオードを
オプティカルスキャナのスキャンエリア最大座標値のと
ころに設置しておくことにより、ゲイン変動倍率を算出
し、補正をかけ、常に移動座標指令値に一致する位置に
移動することが可能となる。With respect to the movement coordinate command value of the optical scanner, the actual movement amount often does not always match the movement coordinate command value due to temperature drift or the like. Even for such gain fluctuations, the split photodiode is installed at the maximum scan area coordinate value of the optical scanner as described above, so that the gain fluctuation magnification is calculated and corrected, and the moving coordinates are constantly adjusted. It is possible to move to a position that matches the command value.
【0027】予め、移動座標指令値Xのところにゲイン
変動検出用の分割型フォトダイオード15のセンタを設
置しておき、移動座標指令値に対し分割型フォトダイオ
ード15からの出力により求められる実際に移動した移
動量がX+αであったとすると、X/(X+α)×100
(%)でゲインの補正変動倍率を求めることができる。The center of the split photodiode 15 for gain variation detection is set in advance at the moving coordinate command value X, and the output from the split photodiode 15 is actually obtained for the moving coordinate command value. If the amount of movement is X + α, X / (X + α) × 100
The correction variation rate of the gain can be obtained by (%).
【0028】上記で計算された補正変動倍率を、全ての
座標指令値に係数としてかけた値でオプティカルスキャ
ナを移動させれば、常に移動座標指令値に一致した量だ
け移動することができる。If the optical scanner is moved by a value obtained by multiplying the correction variation rate calculated above by all the coordinate command values as a coefficient, the optical scanner can always be moved by an amount that matches the moving coordinate command value.
【0029】回路系は図3と同一の演算回路がもう1式
必要となる。尚、ゲイン変動を検出する前に絶対原点位
置の補正を行なっておくことが条件となる。The circuit system requires another set of the same arithmetic circuit as that shown in FIG. The condition is that the absolute origin position is corrected before the gain variation is detected.
【0030】[0030]
【発明の効果】本発明によれば、位置検出用レーザ光の
スキャナ光学系を経た移動位置の補正を、極めて簡単に
かつ高速に行うことができるので、スキャナ光学系の温
度ドリフトの悪影響を高速かつローコストでなくすこと
が可能となるという効果がある。According to the present invention, the movement position of the position detecting laser light passing through the scanner optical system can be corrected very easily and at high speed. Therefore, the adverse effect of temperature drift of the scanner optical system can be suppressed at high speed. And there is an effect that it can be eliminated at low cost.
【図1】本発明の実施例のシステムブロック図である。FIG. 1 is a system block diagram of an embodiment of the present invention.
【図2】本発明の実施例に用いる光学系の模式図であ
る。FIG. 2 is a schematic diagram of an optical system used in an example of the present invention.
【図3】本発明の実施例における位置検出用フォトダイ
オードとその位置検出信号処理系との関係を示す図であ
る。FIG. 3 is a diagram showing a relationship between a position detection photodiode and a position detection signal processing system in the embodiment of the present invention.
【図4】従来のレーザ加工装置の構成を示す図である。FIG. 4 is a diagram showing a configuration of a conventional laser processing apparatus.
3 位置検出用半導体レーザ発振器 6 加工用YAGレーザ光 9,10 ミラー付きオプティカルスキャナ 14 原点位置検出補正用分割型フォトダイオード 15 ゲイン変動倍率検出補正用分割型フォトダイオー
ド 20 コンピュータ 21 加工用YAGレーザ発振器 24 変位信号増幅・演算・A/D 変換部3 Position Detection Semiconductor Laser Oscillator 6 Processing YAG Laser Light 9, 10 Optical Scanner with Mirror 14 Origin Position Detection Correction Split Photodiode 15 Gain Variation Magnification Detection Correction Split Photodiode 20 Computer 21 Processing YAG Laser Oscillator 24 Displacement signal amplification / calculation / A / D converter
Claims (3)
射するレーザ発振器と、これ等両レーザ光を走査するス
キャナ光学部と、前期スキャナ光学部を経た前記位置検
出用レーザ光の基準位置からの変位状態を検出する変位
検出部と、この変位検出部による変位量に応じて前記ス
キャナ光学部の制御を行う制御部とを含むことを特徴と
するレーザ加工装置。1. A laser oscillator that emits laser beams for processing and position detection respectively, a scanner optical unit that scans these laser beams, and a reference position of the laser beam for position detection that has passed through the scanner optical unit in the previous period. A laser processing apparatus comprising: a displacement detecting section for detecting the displacement state of the scanner and a control section for controlling the scanner optical section according to the displacement amount by the displacement detecting section.
予め設定された原点位置にあるときの前記位置検出用レ
ーザ光の位置であることを特徴とする請求項1記載のレ
ーザ加工装置。2. The laser processing apparatus according to claim 1, wherein the reference position is a position of the position detecting laser beam when the scanner optical unit is at a preset origin position.
予め設定されたゲイン検出位置にあるときの前記位置検
出用レーザ光の位置であることを特徴とする請求項1記
載のレーザ加工装置。3. The laser processing apparatus according to claim 1, wherein the reference position is a position of the position detection laser beam when the scanner optical unit is at a preset gain detection position.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP03049028A JP3088117B2 (en) | 1991-02-21 | 1991-02-21 | Laser processing equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP03049028A JP3088117B2 (en) | 1991-02-21 | 1991-02-21 | Laser processing equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH06142953A true JPH06142953A (en) | 1994-05-24 |
JP3088117B2 JP3088117B2 (en) | 2000-09-18 |
Family
ID=12819648
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP03049028A Expired - Fee Related JP3088117B2 (en) | 1991-02-21 | 1991-02-21 | Laser processing equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3088117B2 (en) |
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JP2005262311A (en) * | 2004-03-22 | 2005-09-29 | Fine Device:Kk | Laser beam machining device and laser beam machining method |
SG132490A1 (en) * | 2000-06-02 | 2007-06-28 | Nec Electronics Corp | An abstract processing a gate portion in a semiconductor manufacturing apparatus, which removes a gate correspondence portion from a semiconductor package connected to a lead frame, and a resin burr deposited on a lead portion associated with the semiconductor package |
EP2457685A1 (en) * | 2010-11-30 | 2012-05-30 | PowerPhotonic Ltd | Methodof and apparatus for generating a laser pulse by controlling a modulator |
CN111843190A (en) * | 2020-06-22 | 2020-10-30 | 常州捷佳创智能装备有限公司 | Laser processing apparatus and calibration method for laser processing apparatus |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6001155B1 (en) * | 2015-12-08 | 2016-10-05 | 東英商事株式会社 | Skewers |
DE102018105877B3 (en) | 2018-03-14 | 2019-02-28 | Precitec Gmbh & Co. Kg | Device for determining an alignment of an optical device of a coherence tomograph, coherence tomograph and laser processing system |
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1991
- 1991-02-21 JP JP03049028A patent/JP3088117B2/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG132490A1 (en) * | 2000-06-02 | 2007-06-28 | Nec Electronics Corp | An abstract processing a gate portion in a semiconductor manufacturing apparatus, which removes a gate correspondence portion from a semiconductor package connected to a lead frame, and a resin burr deposited on a lead portion associated with the semiconductor package |
JP2002210578A (en) * | 2001-01-17 | 2002-07-30 | Sumitomo Heavy Ind Ltd | Device for laser beam irradiation and method for laser beam machining |
JP2005262311A (en) * | 2004-03-22 | 2005-09-29 | Fine Device:Kk | Laser beam machining device and laser beam machining method |
EP2457685A1 (en) * | 2010-11-30 | 2012-05-30 | PowerPhotonic Ltd | Methodof and apparatus for generating a laser pulse by controlling a modulator |
US9089927B2 (en) | 2010-11-30 | 2015-07-28 | Powerphotonic, Ltd. | Laser pulse generation method and apparatus |
CN111843190A (en) * | 2020-06-22 | 2020-10-30 | 常州捷佳创智能装备有限公司 | Laser processing apparatus and calibration method for laser processing apparatus |
Also Published As
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JP3088117B2 (en) | 2000-09-18 |
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