JPH0613738A - Printed-circuit board - Google Patents

Abstract

PURPOSE:To widen the mounting space following the element data functions without forming the element data patterns by silk screening printing step. CONSTITUTION:This printed wiring board is provided with the first mounting part 2 where one kind of diode is mounted and the second mounting part 3 where the other kind of diode is mounted. At this time, the lands 5, 6 in the first mounting part 2 are formed in circular planar shape while the lands 7, 8 in the second mounting part 3 are formed in square planar shape. Furthermore, the first and second lands 5, 6 are formed respectively in small and large circular planar shape, likewise, the first and second lands 7, 8 are formed respectively in small and large square planar shape. On the other hand, a solder resist 13 is formed on the periphery of respective second lands 6, 8 while the planar shape of the solder not yet formed parts in the second lands 6, 8 are formed almost similar to that of respective first lands 5, 7.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board, and more particularly to a printed wiring board suitable for mounting components such as diodes and electrolytic capacitors having a plurality of terminals and having different functions between the terminals. A board (including a flexible wiring board).

[0002]

2. Description of the Related Art Conventionally, a printed wiring board disclosed in Japanese Patent Laid-Open No. 3-141690 has been known.

This conventional printed wiring board is provided with a check pattern indicating a positional deviation permissible range so that the positional deviation of the parts when the parts are mounted on the printed wiring board can be easily visually inspected. , The terminal of the component is attached to the land to be soldered.

[0004]

However, in the above-mentioned conventional printed wiring board, the lands corresponding to the terminals are formed in the same shape, so that one terminal is the anode terminal and the other is the same as a diode. The terminal is a cathode terminal, and one terminal is an anode terminal like an electrolytic capacitor and the other terminal is an apparent cathode terminal, so that the functions are clearly distinguished from each other. In order to mount the components correctly, the correspondence between each terminal and each land must be clearly visible. Therefore, normally, for example, as shown in FIGS.
Land 10 to which the anode terminal of the diode is soldered
1 and the element information pattern 10 indicating the element number and the polarity in the vicinity of the land 102 to which the cathode terminal is soldered.
3, 104 was subjected to silk cleaning printing.

However, such element information pattern 10
Forming 3, 104, on the other hand, has a problem that the mounting area is reduced.

The present invention solves the above problems and makes it possible to clearly recognize the correspondence between each terminal and each land of a component without performing silk cleaning printing, thereby increasing the mounting area. An object of the present invention is to provide a printed wiring board that can achieve the above.

[0007]

In order to solve such a problem, a printed wiring board according to the present invention is a printed wiring board having a land to which each terminal of a component having a plurality of terminals is soldered, It is characterized in that the land is formed in a shape different from each other according to a difference in function between the terminals of the component.

[0008]

According to the present invention, since the shape of the land is associated with the function of each terminal of the component, each terminal can be correctly aligned with the corresponding land without providing the element information pattern as described above. In addition to being mounted, erroneous mounting (for example, erroneous connection of diode polarity) can be easily detected during visual inspection after mounting. Therefore, it is possible to increase the mounting area while exhibiting the function as element information.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

The printed wiring board according to the first embodiment has a plane structure as shown in FIG. 5, for example, and a portion 1 where a plurality of diodes having different element numbers are mounted is shown in FIGS. Each has a plane structure and a cross-sectional structure as shown.

In FIGS. 1 and 2, the left side of the broken line is a portion (hereinafter referred to as the first mounting portion) 2 on which one diode is mounted, and the right side is another diode whose element number is different from that of one diode. It corresponds to the part to be mounted (hereinafter referred to as the second mounting part) 3, respectively.

The first mounting portion 2 and the second mounting portion 3 are provided on a common substrate 4 with first lands 5 and 7 to which cathode terminals of respective diodes are soldered and second lands to which anode terminals are soldered. Lands 6, 8 and connection patterns 9, 10, 11, 12 for connecting the respective lands 5, 6, 7, 8 and other lands (not shown) are formed.

Although the first land 5 and the second land 6 in the first mounting portion 2 are both circular in plan view, the first land 5 is formed into a small circle and the second land 6 is formed into a large circle. The first land 5 and the second land 6 are formed in similar shapes to each other. In other words, the first land 5 and the second land 6
Are formed in different shapes.

The planar shapes of the first land 7 and the second land 8 in the second mounting portion 3 are both quadrangular, but
The land 7 is formed in a small quadrangle, the second land 8 is formed in a large quadrangle, and the first land 7 and the second land 8 are formed in similar shapes to each other.

As described above, the lands 5, 6 in the first mounting portion 2 are formed in a circular plan shape, and the lands 7, 8 in the second mounting portion 3 are formed in a quadrangular shape. Lands 5, 6 and 2 in part 2
The lands 7 and 8 in the mounting portion 3 are formed in different shapes.

The substrate 4 and the connection patterns 9, 10, 11,
A solder resist 13 is formed on the surface 12. The solder resist 13 is also formed on the peripheral portions of the second lands 6 and 8, and the planar shape of the central portion of the second lands 6 and 8, that is, the portion where the solder resist 13 is not formed is the first land 5 and 5. 7 is substantially the same as the planar shape. The solder resist 13 is formed of a material that allows the peripheral portions of the second lands 6 and 8 to be confirmed from above.

In mounting one diode and another diode, as described above, the lands 5 and 6 of the first mounting portion 2 have a circular planar shape, while the lands 7 and 2 of the second mounting portion 3 have a circular shape. The planar shape of 8 is a quadrangle, and
Since it can be easily confirmed that the lands 5 and 6 of the mounting portion 2 and the lands 7 and 8 of the second mounting portion 3 have different planar shapes, one diode is mounted on the first mounting portion 2. Moreover, it can be easily and surely determined that the other diodes should be mounted on the second mounting portion 3.

Further, in each of the mounting portions 2 and 3, it can be easily confirmed that the first lands 5 and 7 and the second lands 6 and 8 are similar to each other. It can be easily and reliably determined that the cathode terminal and the anode terminal should be soldered to the second lands 6 and 8, respectively.

The cathode terminal of one diode is connected to the first land 5 of the first mounting portion 2, the anode terminal is connected to the second land 6, and the cathode terminal of another diode is connected to the first land 7 of the second mounting portion 3. When soldering the terminals to the second lands 8 and the anode terminals respectively, as described above, the planar shapes of the portions of the second lands 6 and 8 where the solder resist 13 is not formed and the first lands 5 and 7 are formed. Since the planar shape is substantially the same, a special distinction should be made between the work of soldering the cathode terminal to the first lands 5 and 7 and the work of soldering the anode terminal to the second lands 6 and 8. You can do the same with each other without losing.

At the time of visual inspection after mounting, the mounted diode is associated with the first mounting portion 2, and the other diode is associated with the second mounting portion 3, respectively. , 7 and 8 are compared with the type of diode to determine whether another diode is erroneously mounted on the first mounting portion 2 and one diode is erroneously mounted on the second mounting portion 3, respectively. Can be easily and surely determined.

As described above, in the printed wiring board according to the first embodiment, each terminal can be correctly mounted on the corresponding land without forming the element information pattern by silk cleaning printing as in the conventional case. At the same time, erroneous mounting (for example, erroneous connection of diode polarity) can be easily detected during visual inspection after mounting. Therefore,
It is possible to increase the mounting area while exhibiting the function as element information.

FIG. 3 is a plan view of a first mounting portion 2 and a second mounting portion 3 of the printed wiring board according to the second embodiment, which are similar to those of the first embodiment.

The first mounting portion 2 and the second mounting portion 3 according to the second embodiment are constructed in the same manner as in the first embodiment. However, the second land 6 of the first mounting portion 2 of the second embodiment is not formed in a shape similar to the circular plane shape of the first land 5, and is cut with respect to the circular plane shape of the first land 5. The second land 8 of the second mounting portion 3 is formed in a shape similar to that of the quadrangle of the first land 7. However, the first land 7 is formed in a planar shape such that the triangular portion 17 having the cutout portion 15 is added to the rectangular planar shape of the first land 7. Further, the solder resist 13 is also formed on the triangular portions 16 and 17 having the cutout portions 14 and 15 of the second lands 6 and 8 as described above.

Therefore, also in the printed wiring board according to the second embodiment, the lands 5, 6 of the first mounting portion 2 and the lands 7, 8 of the second mounting portion 3 are flat as in the first embodiment. Since it is possible to easily confirm that the shapes are different, it is easy to mount one diode on the first mounting portion 2 and another diode on the second mounting portion 3. And it is possible to make a reliable judgment. Further, in each mounting portion 2 and 3, the first land 5,
Since it can be easily confirmed that the planar shape of 7 and the planar shape of the second lands 6 and 8 are different from each other, the cathode terminals are provided on the first lands 5 and 7, and the second lands 6 and 8 are also provided. It is possible to easily and surely determine that each of the anode terminals should be soldered. Further, since the planar shape of the portions of the second lands 6 and 8 where the solder resist 13 is not formed and the planar shape of the first lands 5 and 7 are substantially the same, the cathode terminals are provided on the first lands 5 and 7. The operation of soldering and the operation of soldering the anode terminal to the second lands 6 and 8 can be performed in the same manner without special distinction. Further, at the time of visual inspection after mounting, the correspondence between the mounted one diode and the first mounting portion 2 and the correspondence between the other diode and the second mounting portion 3 are set to the lands 5, 6, 7, respectively. 8
By matching the planar shape of and the type of diode,
For example, in the first mounting portion 2, another diode is
It is possible to easily and surely determine whether or not one diode is erroneously mounted on the mounting portion 3.

Further, the triangular portions 16 and 17 of the second land
By forming the notches 14 and 15 in the above, the heat generated from the second lands 6 and 8 due to diode conduction or the like can be diffused as compared with the case where the notches are not formed.

The triangular portion 1 of the second lands 6 and 8
As shown in FIGS. 4 (A) and 4 (B), 6 and 17 may have a planar shape without a cutout portion.

[Brief description of drawings]

FIG. 1 is a plan view of a main portion of a printed wiring board according to a first embodiment, which is denoted by reference numeral 1 in FIG.

FIG. 2 is a sectional view of the same portion.

FIG. 3 is a plan view of a main portion of a printed wiring board according to a second embodiment, which is indicated by reference numeral 1 in FIG.

FIG. 4 is a plan view showing a planar shape of a land in another embodiment.

FIG. 5 is a plan view showing the overall configuration of a printed wiring board according to this embodiment.

FIG. 6 is a plan view showing a configuration of a conventional example.

FIG. 7 is a sectional view of the same.

[Explanation of symbols]

 5,7 1st land 6,8 2nd land

Claims (1)

[Claims] 1. A printed wiring board having a land to which each terminal of a component having a plurality of terminals is soldered, wherein the land is formed in a shape different from each other depending on the difference in function between the terminals of the component. A printed wiring board characterized in that