JPH06131889A - Semiconductor filing device - Google Patents

Semiconductor filing device

Info

Publication number
JPH06131889A
JPH06131889A JP27473692A JP27473692A JPH06131889A JP H06131889 A JPH06131889 A JP H06131889A JP 27473692 A JP27473692 A JP 27473692A JP 27473692 A JP27473692 A JP 27473692A JP H06131889 A JPH06131889 A JP H06131889A
Authority
JP
Japan
Prior art keywords
erase
erasing
circuit
blocks
time
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP27473692A
Other languages
Japanese (ja)
Inventor
Hiroshi Sukegawa
博 助川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP27473692A priority Critical patent/JPH06131889A/en
Publication of JPH06131889A publication Critical patent/JPH06131889A/en
Pending legal-status Critical Current

Links

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

Abstract

PURPOSE:To provide a semiconductor file device which can reduce the erasing time of plural erasing blocks and also can reduce the power consumed for the erasion of these blocks. CONSTITUTION:The range designating circuit 122 of an erasing circuit 12 designates an erasing range based on the erasing commands which are set at a register 121 by a controller 2 to plural erasing blocks. Then the erasing range is given to a voltage application circuit 123. The circuit 123 applies the voltage at one time to the erasing range of a flush type EEPROM 11. Thus plural erasing blocks are erased at one time in the erasing range.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はフラッシュ型EEPRO
Mにデータを読み書きする半導体ファイル装置に係わ
り、特に前記EEPROM内のデータの消去に関する。
FIELD OF THE INVENTION The present invention relates to a flash type EEPRO.
The present invention relates to a semiconductor file device for reading and writing data from and to M, and particularly to erasing data in the EEPROM.

【0002】[0002]

【従来の技術】従来、フラッシュ型EEPROMは特定
のメモリ領域を一度に消去することができ、前記特定の
メモリ領域を消去ブロックと称する。このようなフラッ
シュ型EEPROMを用いた半導体ファイル装置は例え
ば図2に示すような構成を有している。コントローラ2
はメモリチップ1内のフラッシュ型EEPROM11に
データの書き込みを行う前に、このフラッシュ型EEP
ROM11の例えば消去ブロック(1)〜(3)を消去
する動作を行う。即ち、コントローラ2はメモリチップ
1内のフラッシュ型EEPROM11内の消去ブロック
(1)を消去する指令を出す。これにより、消去回路1
2は消去ブロック(1)に消去電圧をかけて消去する。
次にコントローラ2はフラッシュ型EEPROM11内
の消去ブロック(2)を消去する指令を出す。これによ
り、消去回路12は消去ブロック(2)に消去電圧をか
けて消去する。更にコントローラ2はフラッシュ型EE
PROM11内の消去ブロック(3)を消去する指令を
出す。これにより、消去回路12は消去ブロック(3)
に消去電圧をかけて消去する。従って、上記のように複
数の消去ブロックを消去する場合、消去ブロック
(1)、(2)、(3)の順番で逐次消去が行われる。
或いはコントローラ2が前記消去回路12に全消去ブロ
ックの消去を指令すると、消去回路12は消去ブロック
(1)〜(4)の全てを一度に消去する。
2. Description of the Related Art Conventionally, a flash type EEPROM can erase a specific memory area at a time, and the specific memory area is called an erase block. A semiconductor file device using such a flash type EEPROM has a structure as shown in FIG. 2, for example. Controller 2
Before writing data to the flash type EEPROM 11 in the memory chip 1, the flash type EEPROM 11
For example, an operation of erasing erase blocks (1) to (3) of the ROM 11 is performed. That is, the controller 2 issues a command to erase the erase block (1) in the flash type EEPROM 11 in the memory chip 1. As a result, the erase circuit 1
In No. 2, the erase block (1) is erased by applying an erase voltage.
Next, the controller 2 issues a command to erase the erase block (2) in the flash type EEPROM 11. As a result, the erase circuit 12 applies an erase voltage to the erase block (2) to erase. Further, the controller 2 is a flash type EE
A command to erase the erase block (3) in the PROM 11 is issued. As a result, the erase circuit 12 becomes the erase block (3).
Erase by applying an erase voltage to. Therefore, when a plurality of erase blocks are erased as described above, the erase blocks (1), (2), and (3) are sequentially erased in this order.
Alternatively, when the controller 2 instructs the erase circuit 12 to erase all erase blocks, the erase circuit 12 erases all the erase blocks (1) to (4) at once.

【0003】従って、上記従来の半導体ファイル装置で
は、複数の消去ブロックのデータを書き替える前に、前
記ブロックの消去を逐次行うため、消去時間が長くなる
と共に、消去のための消費電力が余計にかかるという欠
点があった。尚、消去回路12により消去ブロックを消
去する際に必要とする消去電圧は昇圧回路(図示せず)
にて昇圧して作るが、この昇圧に電力を要するため、ブ
ロック消去を行うごとに電力を喰うことになる。しか
も、消去ブロックの消去自体には消去電圧をかけるだけ
で余り電力を必要としないため、同一面積の領域を一度
で消去した場合と、複数回に亙って消去した場合では、
複数回に渡って消去した場合の方が余計に電力を喰うこ
とになる。
Therefore, in the conventional semiconductor file device described above, the blocks are sequentially erased before rewriting the data in a plurality of erase blocks, so that the erase time becomes long and the power consumption for the erase becomes extra. There was a drawback of this. The erase voltage required when the erase circuit 12 erases the erase block is a booster circuit (not shown).
Although the voltage is boosted at, the power is required for this boosting, so power is consumed each time the block is erased. Moreover, erasing the erase block itself requires only an erasing voltage and does not require much power. Therefore, when erasing a region of the same area at once and erasing multiple times,
If you erase multiple times, it will consume more power.

【0004】[0004]

【発明が解決しようとする課題】フラッシュ型EEPR
OMを用いる従来の半導体ファイル装置では、前記フラ
ッシュ型EEPROMにデータを書き込む前に、前記フ
ラッシュ型EEPROMの前記データが書かれる消去ブ
ロックを事前に消去しなければならないが、この消去は
逐次行われるため、消去に時間がかかると共に、消去に
かかる消費電力が大きくなってしまうという欠点があっ
た。
Flash type EEPR
In the conventional semiconductor file device using the OM, the erase block of the flash EEPROM in which the data is written must be erased in advance before writing the data in the flash EEPROM, but this erase is performed sequentially. However, there is a drawback that erasing takes time and power consumption required for erasing becomes large.

【0005】そこで本発明は上記の欠点を除去し、複数
の消去ブロックの消去を短時間に行うことができると共
に、前記消去にかかる消費電力を低減させることができ
る半導体ファイル装置を提供することを目的としてい
る。
Therefore, the present invention eliminates the above-mentioned drawbacks and provides a semiconductor file device capable of erasing a plurality of erase blocks in a short time and reducing the power consumption required for the erase. Has an aim.

【0006】[0006]

【課題を解決するための手段】本発明はフラッシュ型E
EPROMにデータを読み書きする半導体ファイル装置
において、前記フラッシュ型EEPROM内に割り付け
られた複数の任意に指定された消去ブロックに消去電圧
を一度にかけて前記複数の消去ブロックを一度に消去す
る消去手段を具備した構成を有する。
The present invention is a flash type E
A semiconductor file device for reading / writing data from / to an EPROM includes erase means for applying an erase voltage to a plurality of arbitrarily designated erase blocks allocated in the flash type EEPROM at a time to erase the plurality of erase blocks at a time. Have a configuration.

【0007】[0007]

【作用】本発明のフラッシュ型EEPROMにおいて、
消去手段はフラッシュ型EEPROM内に割り付けられ
た複数の任意に指定された消去ブロックに消去電圧を一
度にかけて、前記複数の消去ブロックを一度に消去す
る。
In the flash type EEPROM of the present invention,
The erasing means erases the plurality of erase blocks at a time by applying an erase voltage to a plurality of arbitrarily designated erase blocks allocated in the flash EEPROM.

【0008】[0008]

【実施例】以下、本発明の一実施例を図面を参照して説
明する。図1は本発明の半導体ファイル装置の一実施例
を示したブロック図である。1はメモリチップで、2の
コントローラと共に半導体ファイル装置を構成してい
る。メモリチップ1にはフラッシュ型EEPROM11
と消去回路12が内蔵されている。消去回路12は消去
ブロック情報などを保持するレジスタ121、フラッシ
ュ型EEPROM11内の消去範囲を電圧印加回路12
3に指定する範囲指定回路122、フラッシュ型EEP
ROM11の消去範囲に消去電圧を印加してデータの消
去を行う電圧印加回路123及び消去が正常に行われた
か否かをチェックするチェック回路124を有してい
る。又、フラッシュ型EEPROM11には消去ブロッ
ク(1)〜(4)が割り付けられている。尚、消去電圧
は図示されない昇圧回路から電圧印加回路123に供給
されるものとする。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram showing an embodiment of a semiconductor file device of the present invention. Reference numeral 1 is a memory chip, which together with the controller 2 constitutes a semiconductor file device. The memory chip 1 has a flash type EEPROM 11
And an erasing circuit 12 are incorporated. The erasing circuit 12 is a register 121 that holds erasing block information and the like.
Range designation circuit 122 designated for 3, flash type EEP
The ROM 11 includes a voltage application circuit 123 that applies an erase voltage to the erase range of the ROM 11 to erase data, and a check circuit 124 that checks whether the erase is normally performed. Erase blocks (1) to (4) are assigned to the flash type EEPROM 11. The erase voltage is supplied to the voltage application circuit 123 from a booster circuit (not shown).

【0009】次に本実施例の動作について説明する。コ
ントローラ2は例えば消去ブロック(1)、(2)、
(3)にデータを書き込む前に、これら消去ブロックを
消去する動作を行う。即ち、コントローラ2は消去回路
12のレジスタ121に消去ブロック(1)、(2)、
(3)を消去する指令を設定して、これら指令を保持さ
せる。範囲指定回路122はレジスタ121に設定され
ている消去対象消去ブロックに基づいて、今回一度に消
去するフラッシュ型EEPROM11の消去範囲を求
め、この消去範囲(ここでは消去ブロック(1)〜
(3))を電圧印加回路123及びチェック回路124
に与える。電圧印加回路123は与えられた範囲、即
ち、この例では消去ブロック(1)〜(3)の範囲に消
去電圧を一度にかけて、これら消去ブロック(1)〜
(3)内のデータを一度に消去する。チェック回路12
4は今し方消去された消去ブロック内をチェックして、
消去が完全に行われたことを確認すると、これをコント
ローラ2に知らせる。コントローラ2は消去が完全に行
われたことを知ると、前記消去ブロック(1)〜(3)
へのデータの書き込み動作に移行する。尚、チェック回
路124により消去が行われていない部分が見つかった
場合、コントローラ2は前記部分を含む消去ブロックの
消去指令を消去回路12に再度出して、前記消去ブロッ
クの消去を上記と同様に行う。
Next, the operation of this embodiment will be described. The controller 2 may, for example, erase blocks (1), (2),
Before writing data in (3), an operation of erasing these erase blocks is performed. That is, the controller 2 causes the register 121 of the erasing circuit 12 to erase blocks (1), (2),
A command for erasing (3) is set and these commands are held. The range designating circuit 122 obtains the erase range of the flash type EEPROM 11 to be erased once at this time based on the erase block to be erased set in the register 121, and the erase range (here, erase block (1) to
(3)) is applied to the voltage application circuit 123 and the check circuit 124.
Give to. The voltage application circuit 123 applies an erase voltage to a given range, that is, the range of the erase blocks (1) to (3) in this example, at a time, and erase blocks (1) to (3).
Erase the data in (3) at once. Check circuit 12
4 check the erased block that has been erased now,
When it is confirmed that the erasure is complete, the controller 2 is notified of this. When the controller 2 knows that the erase has been completed, the erase blocks (1) to (3) are erased.
The operation moves to write data to. If the check circuit 124 finds a portion that has not been erased, the controller 2 reissues an erase command for the erase block including the portion to the erase circuit 12, and erases the erase block in the same manner as above. .

【0010】次に上記コントローラ2が複数のメモリチ
ップ1を制御する構成のものでは、複数のメモリチップ
1に亙る複数の消去ブロックを一度に消去しなければな
らないことが生じるが、このような場合の動作は以下に
述べる如くである。即ち、コントローラ2は消去したい
消去ブロックを有するメモリチップ1の各消去回路12
のレジスタ121に、該当する消去ブロックの消去指令
を設定する。その後、各メモリチップ1の消去回路12
内の電圧印加回路123が、前記レジスタ121内の情
報に基づいて範囲指定回路122より求められたフラッ
シュ型EEPROM11の消去範囲に、消去電圧を一斉
に同期してかければ、複数のメモリチップ1に亙る複数
の消去ブロックが一度に消去される。
In the case where the controller 2 controls the plurality of memory chips 1, a plurality of erase blocks over the plurality of memory chips 1 may have to be erased at one time. In such a case, The operation of is as described below. That is, the controller 2 controls each erase circuit 12 of the memory chip 1 having an erase block to be erased.
In the register 121, the erase command of the corresponding erase block is set. After that, the erase circuit 12 of each memory chip 1
If the voltage applying circuit 123 therein synchronizes the erase voltage to the erase range of the flash type EEPROM 11 obtained by the range designating circuit 122 based on the information in the register 121, the plurality of memory chips 1 can be synchronized. Multiple erase blocks are erased at once.

【0011】本実施例によれば、メモリチップ1の消去
回路12はコントローラ2から指定された複数のフラッ
シュ型EEPROM11内の消去ブロックに一度に消去
電圧をかけることにより、前記複数の消去ブロックを一
度に消去することができる。このため、従来の如く複数
の消去ブロックを逐次消去することがなくなり、複数の
消去ブロックの消去時間を短縮化することができると共
に、消去で消費される電力を低減することができる。
又、消去時間を短縮化できるため、データの書き込みを
高速化することができる。更に、複数のメモリチップ1
に亙る複数の消去ブロックに対しても同様の方法で一度
に消去でき、同様の効果がある。
According to the present embodiment, the erasing circuit 12 of the memory chip 1 applies the erasing voltage to the erasing blocks in the plurality of flash type EEPROM 11 designated by the controller 2 at a time, thereby erasing the plurality of erasing blocks once. Can be erased. Therefore, it is not necessary to sequentially erase a plurality of erase blocks as in the prior art, the erase time of a plurality of erase blocks can be shortened, and the power consumed by the erase can be reduced.
Further, since the erasing time can be shortened, the data writing can be speeded up. Furthermore, a plurality of memory chips 1
A plurality of erase blocks can be erased at once by a similar method, and the same effect can be obtained.

【0012】[0012]

【発明の効果】以上記述した如く本発明の半導体ファイ
ル装置によれば、複数の消去ブロックの消去を短時間に
行うことができると共に、前記消去にかかる消費電力を
低減させることができる。
As described above, according to the semiconductor file device of the present invention, it is possible to erase a plurality of erase blocks in a short time and reduce the power consumption required for the erase.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の半導体ファイル装置の一実施例を示し
たブロック図。
FIG. 1 is a block diagram showing an embodiment of a semiconductor file device of the present invention.

【図2】従来の半導体ファイル装置の一例を示したブロ
ック図。
FIG. 2 is a block diagram showing an example of a conventional semiconductor file device.

【符号の説明】[Explanation of symbols]

1…メモリチップ 2…コントロー
ラ 11…フラッシュ型EEPROM 12…消去回路 121…レジスタ 122…範囲指
定回路 123…電圧印加回路 124…チェッ
ク回路
DESCRIPTION OF SYMBOLS 1 ... Memory chip 2 ... Controller 11 ... Flash type EEPROM 12 ... Erase circuit 121 ... Register 122 ... Range designation circuit 123 ... Voltage application circuit 124 ... Check circuit

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 フラッシュ型EEPROMにデータを読
み書きする半導体ファイル装置において、前記フラッシ
ュ型EEPROM内に割り付けられた複数の任意に指定
された消去ブロックに消去電圧を一度にかけて前記複数
の消去ブロックを一度に消去する消去手段を具備したこ
とを特徴とする半導体ファイル装置。
1. A semiconductor file device for reading / writing data from / into a flash type EEPROM, wherein an erase voltage is applied to a plurality of arbitrarily designated erase blocks allocated in the flash type EEPROM at a time so that the plurality of erase blocks are erased at a time. A semiconductor file device comprising an erasing means for erasing.
【請求項2】 前記任意に指定された複数の消去ブロッ
クが複数のメモリチップに亙ることを特徴とする請求項
1記載の半導体ファイル装置。
2. The semiconductor file device according to claim 1, wherein the plurality of arbitrarily specified erase blocks are spread over a plurality of memory chips.
JP27473692A 1992-10-14 1992-10-14 Semiconductor filing device Pending JPH06131889A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27473692A JPH06131889A (en) 1992-10-14 1992-10-14 Semiconductor filing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27473692A JPH06131889A (en) 1992-10-14 1992-10-14 Semiconductor filing device

Publications (1)

Publication Number Publication Date
JPH06131889A true JPH06131889A (en) 1994-05-13

Family

ID=17545866

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27473692A Pending JPH06131889A (en) 1992-10-14 1992-10-14 Semiconductor filing device

Country Status (1)

Country Link
JP (1) JPH06131889A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2711831A1 (en) * 1993-10-26 1995-05-05 Intel Corp Process and circuit for storing and hierarchising delete commands in a memory device
US6760259B1 (en) 2003-01-27 2004-07-06 Renesas Technology Corp. Non-volatile semiconductor memory device that can be fabricated with erasure unit modified
JP2010080031A (en) * 2008-09-29 2010-04-08 Renesas Technology Corp Nonvolatile semiconductor memory device
KR101231298B1 (en) * 2010-09-30 2013-02-07 후지쯔 가부시끼가이샤 Nonvolatile memory unit
US8694722B2 (en) 2001-09-28 2014-04-08 Micron Technology, Inc. Memory systems
US9026721B2 (en) 1995-07-31 2015-05-05 Micron Technology, Inc. Managing defective areas of memory
US9032134B2 (en) 2001-09-28 2015-05-12 Micron Technology, Inc. Methods of operating a memory system that include outputting a data pattern from a sector allocation table to a host if a logical sector is indicated as being erased
US9213606B2 (en) 2002-02-22 2015-12-15 Micron Technology, Inc. Image rescue
US9576154B2 (en) 2004-04-30 2017-02-21 Micron Technology, Inc. Methods of operating storage systems including using a key to determine whether a password can be changed

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2711831A1 (en) * 1993-10-26 1995-05-05 Intel Corp Process and circuit for storing and hierarchising delete commands in a memory device
US9026721B2 (en) 1995-07-31 2015-05-05 Micron Technology, Inc. Managing defective areas of memory
US8694722B2 (en) 2001-09-28 2014-04-08 Micron Technology, Inc. Memory systems
US9032134B2 (en) 2001-09-28 2015-05-12 Micron Technology, Inc. Methods of operating a memory system that include outputting a data pattern from a sector allocation table to a host if a logical sector is indicated as being erased
US9489301B2 (en) 2001-09-28 2016-11-08 Micron Technology, Inc. Memory systems
US9213606B2 (en) 2002-02-22 2015-12-15 Micron Technology, Inc. Image rescue
US6760259B1 (en) 2003-01-27 2004-07-06 Renesas Technology Corp. Non-volatile semiconductor memory device that can be fabricated with erasure unit modified
US9576154B2 (en) 2004-04-30 2017-02-21 Micron Technology, Inc. Methods of operating storage systems including using a key to determine whether a password can be changed
US10049207B2 (en) 2004-04-30 2018-08-14 Micron Technology, Inc. Methods of operating storage systems including encrypting a key salt
JP2010080031A (en) * 2008-09-29 2010-04-08 Renesas Technology Corp Nonvolatile semiconductor memory device
KR101231298B1 (en) * 2010-09-30 2013-02-07 후지쯔 가부시끼가이샤 Nonvolatile memory unit

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