JPH06126614A - Carrier for lapping - Google Patents

Abstract

PURPOSE:To make the internal residual stress strain diverge to the outside so as to prevent distorsion generated during rotation by providing a carrier for lapping which comprises teeth of the outer peripheral part, slits formed between the teeth with a designated length and holes for a work for holding a member to be polished. CONSTITUTION:A carrier 8 for lapping is pressed to a lower surface plate 2 by an upper surface plate 1, and rotated on its axis and revolved between the upper surface plate 1 and the lower surface plate 2 by the rotation of an inner peripheral gear 3 and an outer peripheral gear 5, and a member 7 to be polished held in the interior is oscillated to the upper surface plate and the lower surface plate to be polished. The carrier 8 for lapping is comprises teeth 11 respectively meshed with the inner peripheral gear and the outer peripheral gear, slits 17 formed extending from the root position between the respective teeth 11 toward the center with a designated length and plural holes 13 for a work formed according to the shape of a member to be polished. Thus, the internal residual stress strain of a steel material generated at the time of forming a carrier for lapping is released to the outside to be diverged.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a silicon wafer,
The present invention relates to a lapping carrier used for guiding the object to be polished when precision lapping the surface of the object to be polished such as a crystal oscillator, glass, and a magnetic material.

[0002]

2. Description of the Related Art A conventional lapping machine is, for example, as shown in FIG. 7, a thin gear-shaped lapping carrier (hereinafter, carrier) 1 for holding a thin polishing body (hereinafter, work).
00, an upper platen (not shown) and a lower platen 110 for holding the carrier 100, a drive shaft 130 having an inner peripheral gear 120 with which the carrier 100 meshes, and an outer peripheral gear 140 with which the carrier 100 meshes. At least.

The carrier 100 includes the inner peripheral gear 12
0 and a plurality of teeth meshing with the outer peripheral gear 140 are provided on the outer periphery,
Further, a plurality of work holes 150 for holding a work are provided inside.
A hole is provided in the center, and the work is held in the work hole 150 and is sandwiched between the upper surface plate and the lower surface plate. The work hole 150 changes its shape in accordance with the shape of the work, and FIG. 7 discloses a circular shape.

In this state, the carrier 100 rotates (solid arrow C in FIG. 7) by the rotation of the inner gear 120 (solid arrow A in FIG. 7) and the outer gear 14 rotates.
0 (solid arrow B in FIG. 7) revolves (solid arrow D in FIG. 7) and rotationally slides between the upper surface plate 110 and the lower surface plate 110 to which the aqueous polishing solution is supplied, and the work hole 150 The work held at is polished.

[0005]

In recent years, along with the progress of technology, there has been an increasing demand for precision ultra-thin finishing of workpieces, and accompanying this, it has become necessary to form carriers extremely thin.
For this reason, the carrier is formed of a steel material because it is easy to form a thin film, is homogeneous, has strength, and is inexpensive, but internal residuals that occur during rolling and quenching and tempering of the steel material. Due to stress strain or strain (external stress strain) that occurs due to the load applied to the carrier during rotation, uneven wear of the carrier occurs, uneven wrapping of the work piece, and work piece falling off the carrier. There was a problem.

Therefore, the present invention is to provide a lapping carrier having a structure in which internal residual stress strain or external stress strain is diverged to the outside to prevent the strain generated during rotation.

[0007]

According to the invention of claim 1, the upper surface plate presses the lower surface plate, and the inner peripheral gear and the outer peripheral gear rotate to rotate between the upper surface plate and the lower surface plate. In the lapping carrier that revolves and slides the object to be polished held inside by sliding on the upper platen and the lower platen, each tooth formed on the outer peripheral portion and meshing with the inner peripheral gear and the outer peripheral gear. And a slit formed in a predetermined length from the root position between the teeth toward the center, and a plurality of slits formed according to the shape of the object to be held to hold the object to be polished. According to the invention of claim 2, the upper surface plate presses the lower surface plate, and the rotation of the inner peripheral gear and the outer peripheral gear causes the space between the upper surface plate and the lower surface plate. Rotated and revolved at In the lapping carrier that slides the body on the upper platen and the lower platen for polishing, each tooth formed on the outer peripheral portion and meshing with the inner peripheral gear and the outer peripheral gear, and for holding the object to be polished It is composed of a plurality of work holes formed according to the shape of the object to be polished and a plurality of fine recesses formed on one surface or both surfaces. Further, in the invention according to claim 3, the upper surface plate presses the lower surface plate, and the inner peripheral gear and the outer peripheral gear rotate and revolve between the upper surface plate and the lower surface plate.
In the lapping carrier that slides and polishes the object to be polished held on the upper surface plate and the lower surface plate, each tooth formed on the outer peripheral portion and meshing with the inner peripheral gear and the outer peripheral gear, and each of these teeth. Slits formed in a predetermined length from the root position between the teeth toward the center, and a plurality of work holes formed according to the shape of the object to be held to hold the object to be polished. And a plurality of fine recesses formed on one surface or both surfaces.

[0008]

Therefore, according to the first aspect of the invention, the internal residual stress strain of the steel material generated when the lapping carrier is formed is provided by providing the slit having a predetermined length in the center direction from the root of each tooth. At the time of lapping (when the lapping carrier is rotating) while escaping to the outside and diverging
In addition, since the elastic buffering function against the rotational stress load applied to the teeth formed on the outer periphery of the lapping carrier is fulfilled, the external stress strain can be eliminated and the above-mentioned problems can be achieved.

According to the second aspect of the present invention, by forming a plurality of fine and shallow concave portions on one surface or both surfaces of the lapping carrier, internal residual stress strain can be diffused from the plurality of concave portions. In addition, since the external stress strain generated by the rotational stress load can also be diverged, the above problem can be achieved.

Further, according to the third aspect of the present invention, a slit having a predetermined length is provided in the center direction from the root of each tooth, and a plurality of fine and shallow recesses are formed on one surface or both surfaces of the lapping carrier. When formed, the internal residual stress strain and the external stress strain can be effectively diverged, so that the above problems can be achieved.

[0011]

Embodiments of the present invention will be described below with reference to the drawings.

As shown in FIG. 1, the lapping machine includes an upper surface plate 1, a lower surface plate 2, a central shaft 4 provided with a rotation gear 3, and an outer case 6 provided with a revolving gear 5 rotatably. And a gear-shaped lapping carrier (hereinafter referred to as carrier) 8 for holding an object to be polished (eg, silicon wafer, crystal oscillator, glass, magnetic material, etc.) 7.

In this lapping machine, as shown in FIG. 2, first, a carrier 8 for holding an object to be polished (hereinafter referred to as a work) 7 is attached by meshing with a rotating gear 3 and a revolving gear 5, and then an upper platen. The carrier 8 is pressed against the lower platen 2 by 1. After that, by rotating the rotation gear 3 and the revolution gear 5 in the same direction (arrows A and B in FIG. 2),
The carrier 8 is rotated by the rotation gear 3 in the direction of arrow C and revolves in the direction of arrow D. The work 7 held by the carrier 8 slides while rotating between the upper surface plate 1 and the lower surface plate 2, and thus the upper surface plate 1 and the lower surface plate 2
The surface is polished by the abrasive 9 (FIG. 1) supplied to the surface of the.

The carrier 8 according to the invention of claim 1 used in the lapping machine shown in FIG. 3 has a predetermined thickness (40 μm to 300 μm) according to the thickness of the work 7 after polishing.
The disk-shaped main body 10 formed on the main body 10, a predetermined number of teeth 11 formed on the outer peripheral portion of the main body 10, a waste hole 12 formed in the center of the main body 10, and the main body 10 in the shape of the work 7. It is composed of a plurality of work holes 13 (circular in this embodiment) formed correspondingly, and a slit 17 formed in the center direction from the root 14 between the teeth 11. The slit 17 is composed of a notch 15 formed in the center direction from the tooth bottom 14 and a roundness 16 formed at the tip of the notch 15. The roundness 16 is not an essential condition of the slit 17, but Roundness 1
By providing 6, the effect of the slit 17 can be further increased.

The carrier 8 is usually 0.08, for example.
After rolling a steel material of about mm into a film, quenching it at a temperature of 800 ° C, tempering it at a temperature of 300 ° C, first forming teeth by pressing, and then matching the shape of the workpiece with a hole for the workpiece. Is formed by a processing step of forming by pressing. Further, instead of pressing, it can be formed by etching.

The internal residual stress strain generated during rolling, quenching and tempering, or pressing is absorbed by the buffering action of the slit 17, and further, as shown in FIG. Rotational stress load E applied to the teeth 11 of the carrier 8 by the diversion gear 3 and the revolution gear 5
However, since it can be absorbed by the slit 17, problems such as uneven polishing of the work 7 and dropping of the work 7 can be eliminated.

A carrier 8 according to the second aspect of the present invention shown in FIG. 4 is a disk-shaped main body 10 made of steel, teeth 11 formed in a predetermined number on the outer peripheral portion, and a central portion of the main body 10. A concave portion 21 that is formed by a discarded hole 12 and a plurality of work holes 13 and that is finely formed on one surface or both surfaces of the main body 10 by etching.
Are formed in a grid pattern.

By forming the concave portion 21, internal residual stress strain generated in the above-mentioned processing step of the carrier 8 can be diverged and external stress strain can be diverged in the same manner, so that the strain during rotation of the carrier 8 is eliminated. Therefore, stable polishing can be performed. In addition, this recess 21
Can uniformly and appropriately adhere the polishing agent aqueous solution supplied during polishing to the surface of the carrier, and improve the mutual familiarity of the carrier 8, the work 7, the upper surface plate 1 and the lower surface plate 2. It is a thing.

The carrier 8 according to the third aspect of the present invention shown in FIG. 5 is a disk-shaped main body 10, a predetermined number of teeth 11 formed on the outer peripheral portion of the main body 10, and the center of the main body 10. , A plurality of work holes 13 (circular in this embodiment) formed in the main body 10 according to the shape of the work 7, and a tooth bottom 14 between the teeth 11.
And a slit 17 having a notch 15 formed in the direction of the center and a roundness 16 formed at the tip of the notch 15, and at the same time one side or both sides of the main body 10 are finely recessed by etching. 21 are formed in a grid pattern.

As a result, the slit 17 and the recess 21 are formed.
The internal residual stress strain and the external stress strain can be more effectively eliminated by the synergistic effect of, and further, the polishing agent aqueous solution supplied at the time of polishing is uniformly and appropriately adhered to the carrier surface by the recesses 21, so that the carrier 8, the work 7, The effect of making the upper surface plate 1 and the lower surface plate 2 compatible with each other is also accompanied. In addition, in this embodiment, the concave portions 21 are formed in a lattice shape, but may be formed in a dot shape, a linear shape, or a radial shape toward the center. Is what you can get.

[0021]

As described above, according to the first aspect of the present invention, since the slits are formed in the root portions between the teeth formed on the outer periphery of the carrier, the external stress generated when the carrier rotates. This slit can absorb the strain caused by the above, and can also absorb the internal residual stress strain generated during carrier molding, so that stable rotation of the carrier can be obtained, and the object to be polished can be prevented from falling off the carrier and uneven polishing. Is.

According to the second aspect of the invention, by forming fine recesses on the surface of the carrier, internal residual stress strain and external stress strain can be absorbed, so that stable rotation of the carrier can be obtained. Is. Further, since the abrasive solution can be uniformly adhered to the surface of the carrier by the recesses, the carrier, the object to be polished, the upper surface plate and the lower surface plate can be made to fit well with each other.

Furthermore, according to the third aspect of the present invention, the internal residual stress strain and the external stress strain can be efficiently eliminated by providing the carrier with the slit and the recess.

[Brief description of drawings]

FIG. 1 is a partial configuration diagram for explaining a configuration of a lapping machine.

FIG. 2 is an explanatory diagram for explaining an operation of a lapping carrier.

FIG. 3 is a plan view of a lapping carrier according to an embodiment of the present invention.

FIG. 4 is a plan view of a lapping carrier of an embodiment according to the invention of claim 2;

FIG. 5 is a plan view of a lapping carrier of an embodiment according to the invention of claim 3;

FIG. 6 is an explanatory diagram of external stress.

FIG. 7 is an explanatory diagram for explaining a conventional lapping carrier.

[Explanation of symbols]

 1 Upper surface plate 2 Lower surface plate 3 Spinning gear 5 Revolution gear 7 Grinding object (work) 8 Lapping carrier 10 Main body 11 Teeth 12 Waste hole 13 Work hole 14 Teeth bottom part 15 Notch 16 Roundness 17 Slit 21 Recess

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[Procedure amendment]

[Submission date] November 27, 1992

[Procedure Amendment 1]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 7

[Correction method] Change

[Correction content]

[Figure 7]

Claims (3)

[Claims] 1. An upper surface plate is pressed against a lower surface plate, and is rotated and revolved between the upper surface plate and the lower surface plate by rotation of an inner peripheral gear and an outer peripheral gear, and an object to be polished held inside is fixed to the upper surface plate. In the lapping carrier that slides and polishes on the platen and the lower surface plate, each tooth formed on the outer peripheral portion and meshing with the inner peripheral gear and the outer peripheral gear, and the center direction from the tooth bottom position between these teeth Lapping characterized by a slit formed in a predetermined length toward and a plurality of work holes formed in accordance with the shape of the object to be polished to hold the object to be polished. For carrier. 2. The upper surface plate is pressed against the lower surface plate and is rotated and revolved between the upper surface plate and the lower surface plate by the rotation of the inner peripheral gear and the outer peripheral gear, and the object to be polished held inside is fixed to the upper surface plate. In a lapping carrier that slides and polishes on a platen and a lower surface plate, each tooth formed on an outer peripheral portion and meshing with the inner peripheral gear and the outer peripheral gear, and a member to be polished for holding the target object to be polished. A lapping carrier characterized by comprising a plurality of work holes formed according to the shape and a plurality of fine recesses formed on one surface or both surfaces. 3. An object to be ground which is pressed against a lower surface plate by an upper surface plate, rotates and revolves between the upper surface plate and the lower surface plate by rotation of an inner peripheral gear and an outer peripheral gear, and is held inside. In the lapping carrier that slides and polishes on the platen and the lower surface plate, each tooth formed on the outer peripheral portion and meshing with the inner peripheral gear and the outer peripheral gear, and the center direction from the tooth bottom position between these teeth Toward the end, a plurality of holes for workpieces formed according to the shape of the object to be held to hold the object to be polished, and fine holes formed on one surface or both surfaces. A carrier for lapping, comprising a plurality of concave portions.